CN108430159A - A kind of oversize printed board method for drilling holes - Google Patents
A kind of oversize printed board method for drilling holes Download PDFInfo
- Publication number
- CN108430159A CN108430159A CN201810161406.6A CN201810161406A CN108430159A CN 108430159 A CN108430159 A CN 108430159A CN 201810161406 A CN201810161406 A CN 201810161406A CN 108430159 A CN108430159 A CN 108430159A
- Authority
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- China
- Prior art keywords
- drilling
- wad cutter
- printed board
- region
- drilling region
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a kind of oversize printed board method for drilling holes, printed board are divided into the first drilling region and the second drilling region by boundary of the center line of long side, the method for drilling holes includes the following steps：When making the circuit in printed board on time lamina rara externa, the quadrangle in corresponding first drilling region and the second drilling region makes a target respectively；Then wad cutter is bored on the edges of boards of printed board；Then using wad cutter as anchor point, the target on time lamina rara externa in the first drilling region and the second drilling region is drilled out respectively with laser；Finally respectively using four targets in the first drilling region and the second drilling region as anchor point, drilling processing is carried out respectively to the first drilling region and the second drilling region.The method of the present invention can solve the problems, such as that size exceeds the printed circuit board laser drill of laser drilling machine mesa dimensions by changing laser drill mode.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of oversize printed board laser drill side
Method.
Background technology
The fabrication processing of printed circuit board is：Sawing sheet → making internal layer circuit → pressing → drilling → heavy copper → full plate
Plating → making outer-layer circuit → making solder mask → surface treatment → molding → FQC；It often needs to swash in above-mentioned drilling operating
Light drilling machine carry out drilling processing, but the production table top stock size of existing laser drilling machine be 550mm × 620mm or
550mm × 650mm, big table top are 640mm × 780mm, when the size of printed circuit board exceeds the size of big table top, laser drilling
Hole machine can not be normally carried out laser drill processing, cause this type printed circuit board order major part producer can not order, restrict
The development of this type printed circuit board laser drilling processes.
Invention content
There is drawbacks described above in the present invention, provide a kind of oversize printed board laser drill for existing line plate
Method, this method can solve the problems, such as that size exceeds the printed circuit board laser drill of laser drilling machine mesa dimensions.
In order to solve the above technical problem, the present invention provides a kind of oversize printed board method for drilling holes, will print
Making sheet is divided into the first drilling region and the second drilling region by boundary of the center line of long side, which is characterized in that the laser drill
Method includes the following steps：
S1, in the circuit on time lamina rara externa in making printed board, corresponding first drilling region and the second drilling region
Quadrangle makes a target respectively；
S2 and then bore wad cutter on the edges of boards of printed board；
S3, then using wad cutter as anchor point, drilled out respectively with laser in the first drilling region and the second drilling region time outer
Target on laminate；
Four targets in S4, the region that finally drilled respectively using the first drilling region and second are bored as anchor point to first
Bore region and the second drilling region carry out drilling processing respectively.
Preferably, in step S1, close to the four of printed board long side center line in the first drilling region and the second drilling region
The distance away from center line is 20mm to a target respectively.
Preferably, in step S1, the line of the target in printed board positioned at same row or column is straight line and intersects vertically.
Preferably, it in step S2, is corresponded in printed board and drills out first respectively on the lateral line or vertical line of target
Wad cutter, the second wad cutter, third wad cutter, the 4th wad cutter, the 5th wad cutter and the 6th wad cutter, wherein the first wad cutter and the second wad cutter are set
It is placed on the vertical line of two targets far from printed board long side center line in the first drilling region；Third wad cutter is set to print
On lateral line on making sheet long side center line and positioned at printed board long side side target；4th wad cutter is set to printed board long side
On the lateral line that center line is turned left or turned right at 5mm and positioned at printed board long side other side target；5th wad cutter and the 6th target
Hole is set in the second drilling region on the vertical line of two targets far from printed board long side center line, and the 5th wad cutter with
First wad cutter is in the same horizontal position, and the 6th wad cutter is located at the 5mm down of the second wad cutter horizontal position.
Preferably, in step S3, using the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter as anchor point, laser is used
Drill out four targets in the first drilling region；Using third wad cutter, the 4th wad cutter, the 5th wad cutter and the 6th wad cutter as anchor point, use
Laser drills out four targets in the second drilling region.
Preferably, in step S3, fall the dielectric layer under the layers of copper and layers of copper of printing board surface with laser drill machine drill, expose
Target on secondary lamina rara externa.
Preferably, it in step S4, is bored respectively using the drilling region of laser drilling machine pair first and the second drilling region
Hole machined.
Preferably, full-size ＜ 780mm × 1280mm of the printed board.
Compared with prior art, the present invention has the advantages that：
The present invention is bored by the way that the printed board of oversize is divided into the first drilling region and second using long side center line as boundary
Bore region corresponds to the four of the first drilling region and the second drilling region in the circuit in making printed board plate lamina rara externa
Angle makes a target respectively, is then carried out respectively as anchor point using four targets in the first drilling region and the second drilling region
Drilling processing can solve printed circuit board of the size beyond laser drilling machine mesa dimensions and swash by changing laser drill mode
Light drilling problems.
Description of the drawings
Fig. 1 is the schematic diagram for producing target and wad cutter on plate.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment 1
A kind of production method of wiring board shown in the present embodiment, especially one such oversize printed board laser
Boring method includes following treatment process successively：
Sawing sheet：Core plate is outputed by jigsaw size 680mm × 820mm, core plate plate thickness is 1mm, the outer layer copper face thickness of core plate
It is 1OZ；And by core plate with long side center line be divided into the first drilling region and second drill region.
(2), internal layer circuit (negative film technique) is made：According to figure location hole, with the coating sense of vertical application machine on core plate
Light film, 8 μm of the film thickness monitoring of light-sensitive surface complete interior layer line using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Road and the exposure of internal layer target, inner line figure and target patterns are formed after developed；Internal layer etches, by the core after exposure imaging
Plate etches internal layer circuit, and it is 3mil that internal layer line width, which measures, and distinguishes in the quadrangle in the first drilling region and the second drilling region
Etch a target；Then internal layer AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit, has scarce
It falls into and scraps processing, flawless product goes out to downstream.
Wherein, the line of the target on core plate positioned at same row or column is straight line and intersects vertically；And first bore area
Close to four targets of printed board long side center line, the distance away from center line is 20mm respectively in domain and the second drilling region.
(3), it presses：Brown speed carries out brown according to bottom copper copper thickness, by outer copper foil, prepreg, core plate, semi-solid preparation
Piece, outer copper foil overlap successively as required, then select lamination appropriate to be pressed according to plate Tg, form production plate
1, production plate 1 is also divided into the first drilling region 2 and second drilling region 3 with its long side center line 11 for boundary accordingly, such as Fig. 1 institutes
Show.
(4) outer layer wad cutter：Then the pad pasting on production plate passes through the exposed and developed shape on production plate according to design requirement
At wad cutter figure, six wad cutters (as shown in Figure 1) are drilled out in the edges of boards of production plate according to wad cutter figure, including the first wad cutter 4, the
Two wad cutters 5, third wad cutter 6, the 4th wad cutter 7, the 5th wad cutter 8 and the 6th wad cutter 9.
Wherein, as shown in Figure 1, the first wad cutter 4 and the second wad cutter 5 be set in the first drilling region 2 far from production plate it is long
On the vertical line of two targets 10 of side center line (producing plate short side side)；Third wad cutter 6 is set to production plate long side
On center line and on the lateral line of production plate long side side target 10；4th wad cutter 7 is set to production plate long side center
Line is turned left or is turned right at 5mm and on the lateral line of production plate long side other side target 10；5th wad cutter 8 and the 6th wad cutter
9 are set to two targets 10 far from production plate long side center line (producing the plate short side other side) in the second drilling region 3
On vertical line, and the 5th wad cutter 8 and the first wad cutter 4 are in the same horizontal position, and it is horizontal that the 6th wad cutter 9 is located at the second wad cutter 5
At the 5mm down of position.
(5) laser drill：With the first wad cutter 4, the second wad cutter 5, third wad cutter 6 and the 4th wad cutter 7 for anchor point, laser is used
The layers of copper and the dielectric layer (prepreg) under layers of copper that drilling machine burning-off produces plate surface, expose the first drilling region 2 four
Target 10；With third wad cutter 6, the 4th wad cutter 7, the 5th wad cutter 8 and the 6th wad cutter 9 for anchor point, given birth to laser drilling machine burning-off
The layers of copper for producing plate surface and the dielectric layer (prepreg) under layers of copper expose four targets 10 in the second drilling region 3.
(6) outer layer drills：The drill drawing in the first drilling region and the second drilling region is separately designed out according to borehole data
Shape is drilled on production plate to first then using four targets in the first drilling region as anchor point using laser drilling machine
The drillhole pattern in region carries out drilling processing；Using four targets in the second drilling region as anchor point, using laser drilling machine
Drilling processing is carried out to the drillhole pattern in the second drilling region on production plate.
Wherein, when carrying out outer layer drilling processing, the long side phase of table top should be produced with laser drilling machine by producing the long side of plate
It is mutually vertical, it first processes the first drilling region post-processing second drilling region or first processing the second drilling region post-processing first drills
Region.
(7), heavy copper:The hole metallization on production plate, backlight is set to test 10 grades, the heavy copper thickness in hole is 0.5 μm.
(8), electric plating of whole board：According to the prior art and by design requirement to production plate carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(9), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then it moves back film successively again, etch and move back tin,
Outer-layer circuit is etched on production plate；Outer layer AOI, then check outer-layer circuit opens short circuit, circuit notch, circuit pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(10), welding resistance, silk-screen character：Solder mask and silk-screen are made according to the prior art and by design requirement on production plate
Character.
(11), surface treatment (heavy nickel gold)：It is surface-treated, hinders according to the prior art and by design requirement on production plate
The copper face for welding windowing position and the through-hole for needing back drill lead to the principles of chemistry, and uniform deposition centainly requires the nickel layer and gold of thickness in layers of copper
Layer.
(12), it is molded：According to the prior art and design requirement gong shape is pressed, circuit is made in the +/- 0.05mm of external form tolerance
Plate.
(13), electric performance test：The electric property for detecting wiring board detects qualified wiring board and enters next processing
Link；
(14), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of finished product are taken a sample test respectively,
Qualified product can shipment.
In the present embodiment, on the basis of big table top 640mm × 780mm of laser drilling machine, laser drill of the invention
Method is applicable to the wiring board that full-size is less than 780mm × 1280mm.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (8)
1. printed board is divided into the first bore area by a kind of oversize printed board method for drilling holes by boundary of the center line of long side
Domain and the second drilling region, which is characterized in that the method for drilling holes includes the following steps：
S1, in the circuit on time lamina rara externa in making printed board, the quadrangle in corresponding first drilling region and the second drilling region
A target is made respectively；
S2 and then bore wad cutter on the edges of boards of printed board；
S3, then using wad cutter as anchor point, drill out time lamina rara externa in the first drilling region and the second drilling region respectively with laser
On target；
Four targets in S4, the region that finally drilled respectively using the first drilling region and second is anchor points, to the first bore area
Domain and the second drilling region carry out drilling processing respectively.
2. oversize printed board method for drilling holes according to claim 1, which is characterized in that in step S1, first
Close to four targets of printed board long side center line, the distance away from center line is respectively in drilling region and the second drilling region
20mm。
3. oversize printed board method for drilling holes according to claim 1, which is characterized in that in step S1, printing
The line of target on plate positioned at same row or column is straight line and intersects vertically.
4. oversize printed board method for drilling holes according to claim 3, which is characterized in that in step S2, printing
It is corresponded in making sheet and drills out the first wad cutter, the second wad cutter, third wad cutter, the 4th target on the lateral line or vertical line of target respectively
Hole, the 5th wad cutter and the 6th wad cutter, wherein the first wad cutter and the second wad cutter are set in the first drilling region long far from printed board
On the vertical line of two targets of side center line；Third wad cutter is set on printed board long side center line and is located at side target
Lateral line on；4th wad cutter is set to printed board long side center line and turns left or turn right at 5mm and positioned at other side target
On lateral line；5th wad cutter and the 6th wad cutter are set to two targets far from printed board long side center line in the second drilling region
On the vertical line of target, and the 5th wad cutter and the first wad cutter are in the same horizontal position, and the 6th wad cutter is located at the second wad cutter level
At the 5mm down of position.
5. oversize printed board method for drilling holes according to claim 4, which is characterized in that in step S3, with
One wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter are anchor point, and four targets in the first drilling region are burnt with laser；
Using third wad cutter, the 4th wad cutter, the 5th wad cutter and the 6th wad cutter as anchor point, four targets in the second drilling region are burnt with laser
Mark.
6. oversize printed board method for drilling holes according to claim 5, which is characterized in that in step S3, with swash
The layers of copper and the dielectric layer under layers of copper that drill finish hole machine drill falls printing board surface expose the target on time lamina rara externa.
7. oversize printed board method for drilling holes according to claim 1, which is characterized in that in step S4, use
The drilling region of laser drilling machine pair first and the second drilling region carry out drilling processing respectively.
8. oversize printed board method for drilling holes according to claim 1, which is characterized in that the printed board is most
Large scale ＜ 780mm × 1280mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810161406.6A CN108430159A (en) | 2018-02-27 | 2018-02-27 | A kind of oversize printed board method for drilling holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810161406.6A CN108430159A (en) | 2018-02-27 | 2018-02-27 | A kind of oversize printed board method for drilling holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108430159A true CN108430159A (en) | 2018-08-21 |
Family
ID=63157172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810161406.6A Pending CN108430159A (en) | 2018-02-27 | 2018-02-27 | A kind of oversize printed board method for drilling holes |
Country Status (1)
| Country | Link |
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| CN (1) | CN108430159A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548292A (en) * | 2018-12-12 | 2019-03-29 | 东莞市若美电子科技有限公司 | The high multi-layer PCB drilling production technology of overlength size |
| CN110785012A (en) * | 2019-10-10 | 2020-02-11 | 惠州市金百泽电路科技有限公司 | Drilling and positioning manufacturing method for ultra-long multilayer board |
| CN110896594A (en) * | 2019-09-30 | 2020-03-20 | 宜兴硅谷电子科技有限公司 | Pin-positioning-free automatic expansion and contraction drilling production method |
| CN112069762A (en) * | 2020-09-17 | 2020-12-11 | 北京华大九天软件有限公司 | Method for determining direction of slotted hole based on cartoon shape |
| CN112261787A (en) * | 2020-10-22 | 2021-01-22 | 江门崇达电路技术有限公司 | Drilling method for large-size printed board |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN112969287A (en) * | 2021-01-14 | 2021-06-15 | 大连崇达电子有限公司 | Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material |
| CN113099615A (en) * | 2021-04-01 | 2021-07-09 | 深圳市祺利电子有限公司 | Large-size circuit board drilling positioning method |
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| CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
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| CN103313517A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Drilling positioning method for PCB (printed circuit board) |
| CN103369848A (en) * | 2013-07-11 | 2013-10-23 | 东莞市五株电子科技有限公司 | High-density interconnection printed circuit board laser alignment system and method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548292A (en) * | 2018-12-12 | 2019-03-29 | 东莞市若美电子科技有限公司 | The high multi-layer PCB drilling production technology of overlength size |
| CN109548292B (en) * | 2018-12-12 | 2021-06-01 | 东莞市若美电子科技有限公司 | Super-long high multilayer PCB drilling production process |
| CN110896594A (en) * | 2019-09-30 | 2020-03-20 | 宜兴硅谷电子科技有限公司 | Pin-positioning-free automatic expansion and contraction drilling production method |
| CN110785012A (en) * | 2019-10-10 | 2020-02-11 | 惠州市金百泽电路科技有限公司 | Drilling and positioning manufacturing method for ultra-long multilayer board |
| WO2021068400A1 (en) * | 2019-10-10 | 2021-04-15 | 惠州市金百泽电路科技有限公司 | Method for manufacturing ultra-long multilayer board by drilling and positioning |
| CN112069762A (en) * | 2020-09-17 | 2020-12-11 | 北京华大九天软件有限公司 | Method for determining direction of slotted hole based on cartoon shape |
| CN112261787A (en) * | 2020-10-22 | 2021-01-22 | 江门崇达电路技术有限公司 | Drilling method for large-size printed board |
| CN112969287A (en) * | 2021-01-14 | 2021-06-15 | 大连崇达电子有限公司 | Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN112911791B (en) * | 2021-01-29 | 2022-12-06 | 南通强达电路科技有限公司 | Printed circuit board for detecting deviation of drilling hole |
| CN113099615A (en) * | 2021-04-01 | 2021-07-09 | 深圳市祺利电子有限公司 | Large-size circuit board drilling positioning method |
| CN113099615B (en) * | 2021-04-01 | 2022-09-06 | 深圳市祺利电子有限公司 | Drilling positioning method for large-size circuit board |
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Application publication date: 20180821 |