CN104717846B - The preparation method of metallization slotted eye in a kind of PCB - Google Patents

The preparation method of metallization slotted eye in a kind of PCB Download PDF

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Publication number
CN104717846B
CN104717846B CN201410784400.6A CN201410784400A CN104717846B CN 104717846 B CN104717846 B CN 104717846B CN 201410784400 A CN201410784400 A CN 201410784400A CN 104717846 B CN104717846 B CN 104717846B
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China
Prior art keywords
slotted eye
hole
pcb
metallization
preparation
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CN201410784400.6A
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Chinese (zh)
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CN104717846A (en
Inventor
翟青霞
林楠
李金龙
刘�东
白会斌
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Dalian Chongda Electronics Co Ltd
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Jiangmen Suntak Circuit Technology Co Ltd
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Priority to CN201410784400.6A priority Critical patent/CN104717846B/en
Publication of CN104717846A publication Critical patent/CN104717846A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854Hole or via having special cross-section, e.g. elliptical
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling

Abstract

The present invention relates to PCB manufacture technology fields, the preparation method of metallization slotted eye in specially a kind of PCB.The present invention bores one in each hole position by needing to make metallization slotted eye on multilayer boards and draws hole, then with milling cutter from drawing at hole along the obtained slotted eye of shape milling of hole position.Draw hole due to only boring one in each hole position, in the absence of drawing the asymmetric problem in hole, so as to avoid the problem of slotted eye made by causing because of the position of institute's drill hole asymmetry is irregularly-shaped hole, and then ensure that the shape of metallization slotted eye and outward appearance meet design requirement, improve PCB quality.

Description

The preparation method of metallization slotted eye in a kind of PCB
Technical field
The present invention relates to a kind of preparation method for the slotted eye that metallized in PCB manufacture technology fields, more particularly to PCB.
Background technology
PCB (Printed Circuit Board), Chinese is printed wiring board, abbreviation printed board, is electronics industry One of important component, be electronic component supporter, the carrier of electrical connection.As electronic equipment is to feature, precision With the continuous improvement of quality requirements, to PCB quality requirements also more and more higher therewith.In PCB making, in order to meet that some are special Different design requirement, metallization slotted eye need to be made on PCB, and the chamfering in the metallization slotted eye made by requirement is well-balanced. During existing PCB makes, generally when making slotted eye, first the surrounding in slotted eye position to be made, which drills out, draws hole, as shown in figure 1, so Cut again at hole with milling cutter with the slotted eye of shape needed for formation drawing afterwards, then handled and be made by heavy copper and electric plating of whole board Metallize slotted eye.The preparation method of existing metallization slotted eye, easily because the position of institute's drill hole is asymmetric cause made by Slotted eye it is in irregular shape, there is irregularly-shaped hole, as shown in Fig. 2 influence product outward appearance and quality.
The content of the invention
When the present invention makes the metallization slotted eye in PCB for prior art, easily because the position of institute's drill hole is asymmetric And cause made slotted eye it is in irregular shape the problem of, there is provided a kind of method for making high-precision metal slotted eye.
To achieve the above object, the present invention uses following technical scheme, a kind of preparation method for the slotted eye that metallized in PCB, Comprise the following steps:
S1, one, brill in each hole position of making metallization slotted eye is needed to draw hole on multilayer boards;The multi-layer sheet includes setting There are the core plate, outer copper foil and prepreg of internal layer circuit, the core plate and outer copper foil are pressed together by prepreg.
S2, with milling cutter from drawing at hole along the shape milling of hole position, obtain slotted eye.
S3, copper-coating and electric plating of whole board processing are carried out to multi-layer sheet successively, slotted eye is metallized, obtain metallization slotted eye.
Preferably, the slotted eye is more than metallization slotted eye, between the hole wall of the slotted eye and the hole wall for the slotted eye that metallizes Minimum range is 0.03mm.
Before the step S1 also include by negative film technique on core plate make internal layer circuit the step of, and by core plate, Prepreg and outer copper foil carry out lamination, and then pressing is formed as one multiple-plate step.
Also include making outer-layer circuit successively on multi-layer sheet after the step S3, make the step of solder mask and surface treatment Suddenly.
Compared with prior art, the beneficial effects of the invention are as follows:The present invention makes metallization groove by needing on multilayer boards One is bored in each hole position in hole and draws hole, then with milling cutter from drawing at hole along the obtained slotted eye of shape milling of hole position.Due to each One is only bored in hole position and draws hole, in the absence of drawing the asymmetric problem in hole, so as to avoiding because the position of institute's drill hole is asymmetric The problem of causing made slotted eye to be irregularly-shaped hole, and then ensured that the shape of metallization slotted eye and outward appearance meet design requirement, Improve PCB quality.
Brief description of the drawings
Fig. 1 is to drill out to draw the schematic diagram in hole in the prior art in the hole position surrounding that need to make slotted eye;
Fig. 2 is in the prior art because of the schematic diagram of the undesirable slotted eye of the asymmetric obtained shape of drawing hole site;
Fig. 3 is that a schematic diagram for drawing hole is drilled out in the hole position of slotted eye need to make in the embodiment of the present invention.
Embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is made with reference to specific embodiment It is further described and illustrates.
Embodiment
The preparation method that the present embodiment provides the slotted eye that metallized in a kind of PCB, specific making step are as follows:
(1) pressing forms multi-layer sheet
Such as PCB of prior art production process first, the raw material progress sawing sheet to PCB obtains core plate, then on core plate Internal layer circuit is made using negative film technique.Detected by internal layer AOI, check internal layer circuit with the presence or absence of open short circuit, circuit breach, The defects of circuit pin hole, flawless product enter pressing flow.
It is preferred that brown processing is carried out to core plate, then core plate, prepreg and outer copper foil are folded by design data Plate, appropriate pressing condition is then selected according to the Tg of plate, folded plate pressing is integrated, forms multi-layer sheet.
(2) groove milling hole
Need to make one, brill in each hole position 1 of metallization slotted eye on multilayer boards and draw hole 2, as shown in Figure 3.Then basis Borehole data, with milling cutter from drawing at hole 2 along the shape milling of hole position, obtain slotted eye.Also, obtained slotted eye is more than the process after Obtained metallization slotted eye, it is 0.03mm, i.e. slotted eye to make the minimum range between the hole wall of the hole wall of slotted eye and the slotted eye that metallizes It is unilateral than metallize slotted eye unilateral big 0.03mm.
(3) outer-layer circuit is made on multilayer boards
Copper-coating is carried out to multi-layer sheet successively and electric plating of whole board is handled, slotted eye is metallized, obtains metallization slotted eye.Then Outer-layer circuit is made using positive blade technolgy on multilayer boards.It is specific as follows:
(a) the heavy copper of outer layer:Slotted eye is set to metallize, backlight tests >=9 grades.
(b) electric plating of whole board:Hole copper thickness >=5 μm of electric plating of whole board extremely metallization slotted eye.
(c) outer graphics:Dry film is coated on multilayer boards, and using Full-automatic exposure machine, with 5-7 lattice exposure guide rule, (21 lattice expose Light chi) it is exposed, then develop, form plating resist layer.
(d) graphic plating:The electro-coppering at windowing, form copper electroplating layer;Then the electrotinning on copper electroplating layer, electricity is formed Tin coating, the thickness for electroplating tin layers are 3-5 μm.Make the hole copper thickness of metallization slotted eye thickening by graphic plating, make metallization The hole copper thickness of slotted eye reaches design requirement.
(e) outer layer etches:Plating resist layer is removed, then etching removes the copper face for not being plated tin layers covering, then removes again Tin layers are electroplated, the outer-layer circuit on multi-layer sheet is exposed completely and comes.
(f) outer layer AOI:Check outer-layer circuit with the presence or absence of the defects of opening short circuit, circuit breach, circuit pin hole, zero defect Product enter downstream.
(g) solder mask:In multilayer plate surface silk-screen welding resistance, character (using the solder mask in white wire mark brush TOP faces, TOP faces Character addition " UL marks "), obtained solder mask.
(h) it is molded:Gong external form, the +/- 0.1mm of external form tolerance.
(i) tested after being molded:The electric property of test-based examination product.
(j)FQC1:Check whether the copper face of product is abnormal.
(k) sink silver-colored:In the uniform silver layer of the heavy last layer in multiple-plate surface.
(l)FQC、FQA:Check outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, groove size and the position of product Degree of putting tolerance etc..
(m) pack:By customer requirement, PCB is packed, and is put into drier and humidity card.Production after packaging Product can shipment.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand, But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this Bright protection.

Claims (3)

1. the preparation method for the slotted eye that metallized in a kind of PCB, it is characterised in that comprise the following steps:
S1, one, brill in each hole position of making metallization slotted eye is needed to draw hole on multilayer boards;The multi-layer sheet is included provided with interior Core plate, outer copper foil and the prepreg of sandwich circuit, the core plate and outer copper foil are pressed together by prepreg;
S2, with milling cutter from drawing at hole along the shape milling of hole position, obtain slotted eye;
S3, copper-coating and electric plating of whole board processing are carried out to multi-layer sheet successively, slotted eye is metallized, obtain metallization slotted eye, it is described Slotted eye is more than metallization slotted eye, and the minimum range between the hole wall of the slotted eye and the hole wall for the slotted eye that metallizes is 0.03mm.
2. the preparation method for the slotted eye that metallized according to claim 1 in a kind of PCB, it is characterised in that after the step S3 Also include made successively on multi-layer sheet outer-layer circuit, make solder mask and surface treatment the step of.
3. the preparation method for the slotted eye that metallized according to claim 2 in a kind of PCB, it is characterised in that before the step S1 Also include by negative film technique internal layer circuit is made on core plate the step of, and core plate, prepreg and outer copper foil entered Row lamination, then pressing are formed as one multiple-plate step.
CN201410784400.6A 2014-12-16 2014-12-16 The preparation method of metallization slotted eye in a kind of PCB Active CN104717846B (en)

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Application Number Priority Date Filing Date Title
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105430917A (en) * 2015-11-30 2016-03-23 江门崇达电路技术有限公司 Method for fabricating connected slot in PCB
CN106961795B (en) * 2017-03-24 2019-02-12 江门崇达电路技术有限公司 A kind of PCB forming method
CN108391378B (en) * 2018-04-03 2019-11-22 江门崇达电路技术有限公司 The production method of minute grooves on a kind of improvement wiring board
CN109121307A (en) * 2018-09-30 2019-01-01 广州兴森快捷电路科技有限公司 The processing method of the through slot of circuit board
CN109926798B (en) * 2019-03-18 2021-04-02 昆山苏杭电路板有限公司 Method for machining short slot hole with L-shaped abnormal shape
CN111417260B (en) * 2020-04-07 2021-07-30 信丰祥达丰电子有限公司 Production process of PCB bevel edge metallization copper clad

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EP0642861A1 (en) * 1993-09-10 1995-03-15 International Business Machines Corporation Apparatus and method for drilling
US5533841A (en) * 1993-09-10 1996-07-09 International Business Machines Corporation Apparatus and method of drilling
CN101115355A (en) * 2006-07-28 2008-01-30 宇滕自动控制有限公司 Method for tool machine to drill slotted hole of circuit board
CN102009198A (en) * 2010-10-14 2011-04-13 惠州中京电子科技股份有限公司 Method for manufacturing PCB short slot
CN102833949A (en) * 2012-09-11 2012-12-19 厦门爱谱生电子科技有限公司 Method for milling groove in FPC (Flexible Printed Circuit)
CN102883558A (en) * 2012-10-17 2013-01-16 无锡江南计算技术研究所 Manufacturing method of single plating hole copper
CN102946696A (en) * 2012-11-07 2013-02-27 东莞生益电子有限公司 Method for improving slotting reliability of metalized footstep in PCB (Printed Circuit Board)
CN102962861A (en) * 2012-11-12 2013-03-13 大连太平洋电子有限公司 Method for processing super short groove printed board
CN103068170A (en) * 2012-12-24 2013-04-24 景旺电子科技(龙川)有限公司 Method of preparing aluminum base board short groove holes

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JP2007098502A (en) * 2005-10-04 2007-04-19 Elna Co Ltd Oblong hole-machining method for printed circuit board

Patent Citations (9)

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Publication number Priority date Publication date Assignee Title
EP0642861A1 (en) * 1993-09-10 1995-03-15 International Business Machines Corporation Apparatus and method for drilling
US5533841A (en) * 1993-09-10 1996-07-09 International Business Machines Corporation Apparatus and method of drilling
CN101115355A (en) * 2006-07-28 2008-01-30 宇滕自动控制有限公司 Method for tool machine to drill slotted hole of circuit board
CN102009198A (en) * 2010-10-14 2011-04-13 惠州中京电子科技股份有限公司 Method for manufacturing PCB short slot
CN102833949A (en) * 2012-09-11 2012-12-19 厦门爱谱生电子科技有限公司 Method for milling groove in FPC (Flexible Printed Circuit)
CN102883558A (en) * 2012-10-17 2013-01-16 无锡江南计算技术研究所 Manufacturing method of single plating hole copper
CN102946696A (en) * 2012-11-07 2013-02-27 东莞生益电子有限公司 Method for improving slotting reliability of metalized footstep in PCB (Printed Circuit Board)
CN102962861A (en) * 2012-11-12 2013-03-13 大连太平洋电子有限公司 Method for processing super short groove printed board
CN103068170A (en) * 2012-12-24 2013-04-24 景旺电子科技(龙川)有限公司 Method of preparing aluminum base board short groove holes

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Effective date of registration: 20210809

Address after: 116000 the Great Wall Road, Changxing Island Economic Zone, Dalian, Liaoning 108

Patentee after: DALIAN SUNTAK ELECTRONICS Co.,Ltd.

Address before: 529000 No. 363, Lianhai Road, high tech Development Zone, Jiangmen City, Guangdong Province

Patentee before: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY Co.,Ltd.