CN106231816A - A kind of manufacture method of golden fingerboard without lead wire - Google Patents
A kind of manufacture method of golden fingerboard without lead wire Download PDFInfo
- Publication number
- CN106231816A CN106231816A CN201610807510.9A CN201610807510A CN106231816A CN 106231816 A CN106231816 A CN 106231816A CN 201610807510 A CN201610807510 A CN 201610807510A CN 106231816 A CN106231816 A CN 106231816A
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- Prior art keywords
- copper
- layer
- golden
- gold
- fingerboard
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the manufacture method of a kind of golden fingerboard without lead wire, without making gold finger lead in outer graphics manufacturing process, but take imposite to sink the mode of copper in the outer layer copper foil surface heavy layers of copper of preparation, golden finger and outer-layer circuit graph area is made to realize the conduction of electric current by heavy layers of copper, processing technology is simple, with short production cycle；And heavy layers of copper can be removed easily by the method for microetch, remove thoroughly, no copper layer remains, solve the problem that in prior art, gold finger lead cannot completely remove, easily remain, and the method for microetch will not damage regular link, solve tradition golden fingerboard without lead wire and be snapped the problem of erosion because of pad pasting loosely circuit, improve the qualification rate of product.
Description
Technical field
The invention belongs to printed circuit board and manufacture technical field, relate to the manufacture method of a kind of golden finger, specifically
Say the manufacture method relating to a kind of golden fingerboard without lead wire.
Background technology
Golden finger (edge connector) is structure common on a kind of printed circuit board, is generally disposed at printed circuit
Edges of boards outside plate line areas, are a kind of metal contact pieces obtained by one layer of nickel gold of plating on copper packing, and metal contact piece is rectangle,
Setting in a row at edges of boards, the rear end of contact is typically provided with golden finger wire and is connected with line areas, and the effect of golden finger is mainly made
The outlet externally connected for circuit board, generally individually obtains superior electric conductivity and antioxidation through parcel plating or chemistry turmeric
Property, can ensure that golden finger position plugs frequently at gold face electroplating nickel on surface gold and will not wear the most serious damage to gold.
During use, the golden finger position of printed circuit board is injected in corresponding slot.
The manufacturing process of golden finger generally uses electric plating method, increases plating in the golden finger position needing plating nickel gold and draws
Line, the effect of conducting electric current during to play plating.Electroplate rear electroplate lead wire to remove by the way of milling limit, but this
After the method for kind removes lead-in wire easily there is the problem that lead-in wire remains in golden finger root, and this most special for long and short golden finger
Structure, owing to wire length is different, it is impossible to thoroughly remove lead-in wire.
Along with the electronic product raising to request signal transmission, signal disturbing that the lead-in wire of remaining is brought electronic equipment
Electro Magnetic Compatibility, for solving the problems referred to above, at present by adding lead-in wire in outer graphics manufacturing process as electronickelling gold
Wire, then adds etchant flow, reaches gold finger galvanizing nickel gold and the purpose without lead-in wire, and Making programme comprises the steps:
Front operation → outer-layer circuit graphic making, adds gold finger lead → pattern plating copper nickel gold → outer graphics etching in this operation
→ outer-layer circuit graphic making for the second time, the layout of hard gold of being windowed in golden finger position → golden finger is electroplated → for the third time
Shape makes → etches away operation after lead-in wire → routine.
But said method there is problems in that the mode using etching goes between and still cannot remove completely, golden finger and
Line pattern edge all remains the electric gold wire of 100-150 μm length, for requiring strict golden finger product, it is impossible to meet product
Demand, it addition, in lead-in wire etching process, need to paste dry film, this often causes pad pasting loosely so that circuit is snapped erosion, leads
Cause product yield reduces.
Summary of the invention
To this end, the technical problem to be solved is the method removal effect of existing removal gold finger lead relatively
Difference, easily remain, and easily etch regular link, affect product quality, thus propose a kind of to remove the nothing thorough, product yield is high
The manufacture method of lead-in wire gold finger plate.
For solving above-mentioned technical problem, the technical scheme is that
The present invention provides the manufacture method of a kind of golden fingerboard without lead wire, and it comprises the steps:
S1, inner figure make, it is provided that a core material, described core material surface has internal layer circuit region and internal layer
Golden finger area, covers dry film on core material surface, by exposure, inner figure is transferred to described core material surface, and
Etch inner line figure and internal layer golden finger after development；
S2, ectonexine pressing, carry out pressing by described core material and outer copper foil after brown copper face；
S3, outer layer are holed, and then sink copper by outer layer and make hole metallization, will turn between layers, and electric by full plate
In plating makes hole, thickness reaches requirement；
S4, outer graphics make, and described outer copper foil surface configuration has outer-layer circuit region and outer layer golden finger area, mill
By exposure imaging, the line pattern of the film is transferred to wiring board outer surface after plate, graphic plating meet in hole, circuit
Copper is thick, etches outer-layer circuit figure and outer layer golden finger afterwards；
S5, imposite sink copper, in the heavy layers of copper of outer layer copper foil surface preparation, make described outer layer golden finger area and described outer layer line
Region, road connects；
S6, paste protecting film, in addition to golden finger area, paste protecting film on described outer copper foil surface；
S7, for the first time microetch, remove the heavy layers of copper between golden finger；
S8, electricity outer layer golden finger, will carry out electrogilding process, and be formed and have Gold plated Layer described outer layer golden finger area
Golden finger, then second time microetch, remove heavy layers of copper, by golden finger district and outer-layer circuit graphical demarcation every.
As preferably, in described step S8, electricity outer layer golden finger includes operation and the operation of the hard gold of plating of electronickelling gold；
The operation of described electronickelling gold includes electroless nickel layer and plating layer gold.
As preferably, in described step S3, electric plating of whole board processes metapore, copper layer thickness is 7-12 μm.
As preferably, described protecting film is blue glue.
As preferably, after described step S8, also include that the operation of post processing, described post processing include silk-screen solder mask, printing
Character, heavy nickel gold and sharp processing.
As preferably, include before described step S1 requiring to cut sheet material, the operation of roughening copper face according to design.
As preferably, in the operation of described electronickelling gold, the nickel layer thickness of plating is 3-5 μm, and layer gold thickness is 0.05-
0.127μm；Electroplating the hard gold layer thickness after hard gold is 0.76-1.0 μm.
As preferably, in described step S5, imposite sinks the heavy copper layer thickness after copper is 1-2 μm.
The technique scheme of the present invention has the advantage that compared to existing technology
The manufacture method of golden fingerboard without lead wire of the present invention, without making gold hands in outer graphics manufacturing process
Index wire, but take imposite to sink the mode of copper in the outer layer copper foil surface heavy layers of copper of preparation, make golden finger with outer by heavy layers of copper
Sandwich circuit graph area realizes the conduction of electric current, and processing technology is simple, with short production cycle；And heavy layers of copper can be light by the method for microetch
Easily removing, remove thoroughly, no copper layer remains, solve gold finger lead in prior art cannot completely remove, asking of easily remaining
Topic, and the method for microetch will not damage regular link, solves tradition golden fingerboard without lead wire and is snapped because of pad pasting loosely circuit
The problem of erosion, improves the qualification rate of product.
Accompanying drawing explanation
In order to make present disclosure be more likely to be clearly understood, below according to the specific embodiment of the present invention and combine
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the flow chart of the manufacture method of the golden fingerboard without lead wire described in the embodiment of the present invention.
Detailed description of the invention
Embodiment
The present embodiment provides the manufacture method of a kind of golden fingerboard without lead wire, and it comprises the steps:
Front operation: open greatly supplied materials by one and be cut into the sheet material of moderate dimensions according to different plate size design demands, pass through
Plate face oily matter oxide-film is removed by conventional method, and carries out chemistry microetch, makes copper surface redox reaction occur, by copper
Rough surface.
S1, inner figure make, it is provided that one cut and be roughened after core material, described core material has positive and negative two bronze medals
Face, the front copper face of described core material has internal layer circuit region and internal layer golden finger area；Make the film, by required
After line pattern is made on film, cover dry film on core material surface, make the light-sensitive surface in dry film occur by exposure
Reaction, selective local crane span structure hardens, and the dry film of unexposed portion is removed, and photosensitive part is retained, thus by the film
Figure is transferred to described core material surface, and in exposure, exposure energy is 6 lattice exposure guide rules, and after development according to core material
Copper thickness adjust etching condition, etch inner line figure and internal layer golden finger；Inner figure carries out AOI after completing
(automatic visual inspection instrument) checks, the defect such as checks for out, short-circuit, ill-exposed；
S2, ectonexine pressing, carry out pressing by described core material and outer copper foil after brown copper face, uses common process
Copper face is carried out micro-roughening, on copper surface by reacting the organic metal layer knot that formation is a kind of uniformly, have excellent bonds characteristic
Structure, is then connected as one with prepreg by pressing between outer copper foil and core material and core material and core material whole
Body, brown speed during brown is carried out according to core material copper thickness, and during pressing, the vitrification point according to plate determines lamination bar
Part, outer copper foil thickness is selected by assembled watch copper thickness；
Need to arrange outer copper foil, prepreg, core material in order plate before pressing, during row's plate, require that dust quantity is little
In 100K, granularity of dust is less than 0.5 μm.
S3, outer layer are holed, and then sink copper by outer layer and make hole metallization, will turn between layers, and use electric plating of whole board
Method make hole in thickness reach requirement；Getting out required hole according to borehole data on plate, the position in hole and size need to expire
Foot requirement, boring is for realizing conducting between layers and the slotting weldering of electronic component, and outer layer sinks copper backlight in copper metapore and surveys
Examination is 9.5 grades, and in electric plating of whole board metapore, copper thickness is 7-12 μm, is 9 μm, makes circuit be turned in the present embodiment.
S4, outer-layer circuit graphic making, described outer copper foil surface configuration has outer-layer circuit region and outer layer golden finger district
Territory, nog plate, remove copper foil surface oxide layer and boring burr, use machinery nog plate mode nog plate, then ultrasonic waves for cleaning,
Washing post-drying, utilizes the technique of conventional bulking agents and washing to remove hole hose lining slag, prevents each interlayer from connecting unreliable；At nog plate
After copper face cover one layer of sensitive material, by exposure imaging, the line pattern of the film is transferred to wiring board outer surface, by qualified
, the semi-finished product plate completing the film figure transfering process acid copper plating mode carry out graphic plating, make circuit copper and
Hole inwall copper thickeies the copper thickness met in circuit, hole, and tin coating also can be used as the protective layer of subsequent etch；Lose afterwards
Carve copper face, retained owing to line pattern surface is covered with resistance layer against corrosion, take off except tin layers, obtain outer-layer circuit figure and outer layer gold
Finger.
S5, imposite sink copper, prepare, at outer layer copper foil surface, the heavy layers of copper that thickness is 1-2 μm, are 1.5 μm in the present embodiment,
Make described outer layer golden finger area be connected with described outer-layer circuit region, during follow-up electricity gold, play the work of conducting electric current
With；
S6, pasting protecting film, paste protecting film on described outer copper foil surface in addition to golden finger area, described protecting film is
Blue glue, uses blue glue laminated to live plate face, only reserves golden finger area.
S7, for the first time microetch, remove the heavy layers of copper between golden finger, uses the golden finger district that conventional micro-corrosion liquid microetch is exposed
Territory, removes the heavy layers of copper between golden finger.
S8, electricity outer layer golden finger, will carry out electrogilding process, and be formed and have Gold plated Layer described outer layer golden finger area
Golden finger, electrogilding includes operation and the operation of the hard gold of plating of electronickelling gold；The operation of described electronickelling gold includes again plating
Layer and plating layer gold, first plate the nickel dam that a layer thickness is 3-5 μm in the layers of copper of golden finger, be 4 μm in the present embodiment, nickel dam
Upper plating thickness is the layer gold of 0.05-0.127 μm, is 0.08 μm in the present embodiment, and this step is to ensure that the color and luster of golden finger,
Avoiding copper to be diffused in layer gold, in layer gold, re-plating a layer thickness is the hard gold of 0.76-1.0 μm, is 0.9 μ in the present embodiment
M, to strengthen the wearability at golden finger position, damage gold face after preventing from repeatedly plugging；Then conventional micro-corrosion liquid is used to carry out second
Secondary microetch, removes heavy layers of copper, by golden finger district and outer-layer circuit graphical demarcation every.
Post processing: silk-screen solder mask, in one layer of green oil layer of PCB surface silk-screen, protects surface circuit, is specially
Have on the silk screen of negative pattern and scrape, with scraper, the green oil ink that extrusion is appropriate, form orthomorphic chart case through silk screen, be imprinted on wiring board
Surface；Specifying the characters such as region printed element symbol, explanation；Chemical nickel plating, then chemistry turmeric is carried out at wiring board copper face,
To protect copper face and to obtain good welding performance；Sharp processing, as requested by contours profiles processing and fabricating out, packs out
Goods.
The manufacture method of the golden fingerboard without lead wire described in the present embodiment, without making gold in outer graphics manufacturing process
Finger goes between, but takes imposite to sink the mode of copper in the outer layer copper foil surface heavy layers of copper of preparation, by heavy layers of copper make golden finger with
Outer-layer circuit graph area realizes the conduction of electric current, and processing technology is simple, with short production cycle；And heavy layers of copper can be by the method for microetch
Remove easily, remove thoroughly, no copper layer remains, and solves gold finger lead in prior art and cannot completely remove, easily remain
Problem, and the method for microetch will not damage regular link, solves tradition golden fingerboard without lead wire because of pad pasting loosely circuit quilt
The problem stinging erosion, improves the qualification rate of product.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among still in the protection domain of the invention.
Claims (8)
1. the manufacture method of a golden fingerboard without lead wire, it is characterised in that comprise the steps:
S1, inner figure make, it is provided that a core material, described core material surface has internal layer circuit region and internal layer gold hands
Refer to region, cover dry film on core material surface, by exposing, inner figure is transferred to described core material surface, and aobvious
Movie queen etches inner line figure and internal layer golden finger；
S2, ectonexine pressing, carry out pressing by described core material and outer copper foil after brown copper face；
S3, outer layer are holed, and then sink copper by outer layer and make hole metallization, will turn between layers, and be made by electric plating of whole board
In hole, thickness reaches requirement；
S4, outer graphics make, and described outer copper foil surface configuration has outer-layer circuit region and outer layer golden finger area, after nog plate
By exposure imaging, the line pattern of the film being transferred to wiring board outer surface, graphic plating meets in hole, the copper of circuit thick, it
After etching goes out outer-layer circuit figure and outer layer golden finger；
S5, imposite sink copper, in the heavy layers of copper of outer layer copper foil surface preparation, make described outer layer golden finger area and described outer-layer circuit district
Territory connects；
S6, paste protecting film, in addition to golden finger area, paste protecting film on described outer copper foil surface；
S7, for the first time microetch, remove the heavy layers of copper between golden finger；
S8, electricity outer layer golden finger, will carry out electrogilding process, form the golden hands with Gold plated Layer described outer layer golden finger area
Refer to, then second time microetch, remove heavy layers of copper, by golden finger district and outer-layer circuit graphical demarcation every.
The manufacture method of golden fingerboard without lead wire the most according to claim 1, it is characterised in that in described step S8 outside electricity
Layer golden finger includes operation and the operation of the hard gold of plating of electronickelling gold；The operation of described electronickelling gold includes electroless nickel layer and electricity
Gold plated Layer.
The manufacture method of golden fingerboard without lead wire the most according to claim 2, it is characterised in that full plate in described step S3
In electroplating processes metapore, copper layer thickness is 7-12 μm.
The manufacture method of golden fingerboard without lead wire the most according to claim 3, it is characterised in that described protecting film is blue
Glue.
The manufacture method of golden fingerboard without lead wire the most according to claim 4, it is characterised in that also wrap after described step S8
Including the operation of post processing, described post processing includes silk-screen solder mask, print character, heavy nickel gold and sharp processing.
The manufacture method of golden fingerboard without lead wire the most according to claim 5, it is characterised in that wrap before described step S1
Include and require to cut sheet material, the operation of roughening copper face according to design.
The manufacture method of golden fingerboard without lead wire the most according to claim 6, it is characterised in that the work of described electronickelling gold
In sequence, the nickel layer thickness of plating is 3-5 μm, and layer gold thickness is 0.05-0.127 μm；Electroplating the hard gold layer thickness after hard gold is
0.76-1.0μm。
The manufacture method of golden fingerboard without lead wire the most according to claim 7, it is characterised in that imposite in described step S5
Heavy copper layer thickness after heavy copper is 1-2 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610807510.9A CN106231816A (en) | 2016-09-06 | 2016-09-06 | A kind of manufacture method of golden fingerboard without lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610807510.9A CN106231816A (en) | 2016-09-06 | 2016-09-06 | A kind of manufacture method of golden fingerboard without lead wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231816A true CN106231816A (en) | 2016-12-14 |
Family
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|---|---|---|---|
| CN201610807510.9A Pending CN106231816A (en) | 2016-09-06 | 2016-09-06 | A kind of manufacture method of golden fingerboard without lead wire |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323037A (en) * | 2018-01-17 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of PCB processing technologys of two-sided ladder position electricity gold |
| CN108966512A (en) * | 2018-07-30 | 2018-12-07 | 生益电子股份有限公司 | A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN110324979A (en) * | 2018-03-29 | 2019-10-11 | 欣强电子（清远）有限公司 | A kind of manufacture craft of the gold-plated printed wiring board of no conducting wire |
| CN110572949A (en) * | 2019-08-23 | 2019-12-13 | 鹤山市中富兴业电路有限公司 | Gold plating process method and printed circuit board |
| CN110678004A (en) * | 2019-09-19 | 2020-01-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB for charging pile |
| CN110856364A (en) * | 2019-11-21 | 2020-02-28 | 珠海市凯诺微电子有限公司 | Immersion gold plating method for manufacturing rigid-flex board |
| CN112188750A (en) * | 2020-10-09 | 2021-01-05 | 广州添利电子科技有限公司 | Selective electro-nickel gold process without gold surface overhang |
| CN114698256A (en) * | 2020-12-30 | 2022-07-01 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN114745870A (en) * | 2022-04-28 | 2022-07-12 | 开平依利安达电子第三有限公司 | PCB (printed circuit board) leadless golden finger processing equipment and technology thereof |
| CN115023063A (en) * | 2022-07-05 | 2022-09-06 | 博敏电子股份有限公司 | Optical module printed circuit board and anti-scratch method thereof |
| CN115052429A (en) * | 2022-08-13 | 2022-09-13 | 四川英创力电子科技股份有限公司 | Circuit board production method |
| CN116721926A (en) * | 2023-05-30 | 2023-09-08 | 珠海妙存科技有限公司 | Manufacturing method of packaging substrate, NAND Flash packaging substrate and storage particles |
| WO2024040888A1 (en) * | 2022-08-25 | 2024-02-29 | 苏州元脑智能科技有限公司 | Method for plating edge connectors on circuit board with gold, and circuit board |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323037A (en) * | 2018-01-17 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of PCB processing technologys of two-sided ladder position electricity gold |
| CN110324979A (en) * | 2018-03-29 | 2019-10-11 | 欣强电子（清远）有限公司 | A kind of manufacture craft of the gold-plated printed wiring board of no conducting wire |
| CN108966512A (en) * | 2018-07-30 | 2018-12-07 | 生益电子股份有限公司 | A kind of internal layer surface processing method reducing High-Speed PCB signal insertion loss |
| CN109788662B (en) * | 2019-02-26 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of golden finger circuit board |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN110572949A (en) * | 2019-08-23 | 2019-12-13 | 鹤山市中富兴业电路有限公司 | Gold plating process method and printed circuit board |
| CN110678004A (en) * | 2019-09-19 | 2020-01-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB for charging pile |
| CN110856364A (en) * | 2019-11-21 | 2020-02-28 | 珠海市凯诺微电子有限公司 | Immersion gold plating method for manufacturing rigid-flex board |
| CN112188750A (en) * | 2020-10-09 | 2021-01-05 | 广州添利电子科技有限公司 | Selective electro-nickel gold process without gold surface overhang |
| CN114698256A (en) * | 2020-12-30 | 2022-07-01 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN114745870A (en) * | 2022-04-28 | 2022-07-12 | 开平依利安达电子第三有限公司 | PCB (printed circuit board) leadless golden finger processing equipment and technology thereof |
| CN115023063A (en) * | 2022-07-05 | 2022-09-06 | 博敏电子股份有限公司 | Optical module printed circuit board and anti-scratch method thereof |
| CN115052429A (en) * | 2022-08-13 | 2022-09-13 | 四川英创力电子科技股份有限公司 | Circuit board production method |
| WO2024040888A1 (en) * | 2022-08-25 | 2024-02-29 | 苏州元脑智能科技有限公司 | Method for plating edge connectors on circuit board with gold, and circuit board |
| CN116721926A (en) * | 2023-05-30 | 2023-09-08 | 珠海妙存科技有限公司 | Manufacturing method of packaging substrate, NAND Flash packaging substrate and storage particles |
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Application publication date: 20161214 |