CN109788662A - A kind of production method of golden finger circuit board - Google Patents
A kind of production method of golden finger circuit board Download PDFInfo
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- CN109788662A CN109788662A CN201910142472.3A CN201910142472A CN109788662A CN 109788662 A CN109788662 A CN 109788662A CN 201910142472 A CN201910142472 A CN 201910142472A CN 109788662 A CN109788662 A CN 109788662A
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Abstract
The present invention relates to printed wiring board technical field, specially a kind of production method of golden finger circuit board.The present invention by before outer-layer circuit figure is electroplated first in golden finger area pressing adhesive tape, to enhance the sealing groove ability of dry film, when preventing electro-coppering and electrotinning liquid medicine penetrate into and on golden finger plated with copper, tin；Golden finger area figure covering golden finger area is not only made before moving back tin, also in golden finger area pressing adhesive tape, to enhance the sealing groove ability of dry film, anti-retaining tin liquid medicine penetrates into and sting the golden face of erosion golden finger；Before carrying out heavy nickel gold on PAD, golden finger sidewall channels are enclosed in golden finger area pressing adhesive tape, cause golden finger to form double layer nickel gold to prevent heavy nickel gold liquid medicine from penetrating into, to realize the gold-plated golden finger in existing three face, and has the production of the circuit board of heavy nickel gold PAD.
Description
Technical field
The present invention relates to printed wiring board technical field more particularly to a kind of production methods of golden finger circuit board.
Background technique
In printed circuit board field, golden finger is often designed in a kind of clamping electronics member device of such as memory bar, video card, network interface card
On the circuit board of part, as the connecting component between such circuit board and slot.Golden finger is by numerous consistent golden yellow of arrangement
Conductive contact blade composition, because of its surface gold-plating and conductive contact blade is arranged in finger-shaped, so it is known as " golden finger ", and it is this in plate
Design has the circuit board of golden finger to be then referred to as golden finger circuit board in side or plate.
The conventional fabrication process of golden finger circuit board, including designing the lead connecting with metal edges of boards in golden finger outer end,
Pass sequentially through electric nickel gold and local electric thick gold technique formed on golden finger surface it is certain thickness gold-plated, then using gong machine will be golden
Finger lead gong is gone, and recycles bevelling machine that golden finger is processed into the inclined-plane for being easy grafting, to obtain golden finger circuit
Plate.
In addition, there are also a kind of golden finger circuit boards to require golden finger side wall (three sides) gold-plated, i.e., golden finger is exposed
Three faces be both needed to gold-plated, such golden finger circuit board, which can not pass through, makes golden hand in the method that metal edges of boards design gold finger lead
Refer to, such golden finger, golden finger circuit as shown in Figure 1 need to be made by way of first gong golden finger sidewall channels again electric nickel gold
Plate, the schematic diagram of the production plate after gong golden finger sidewall channels is as shown in Fig. 2, the production process of such golden finger circuit board mainly wraps
It includes: preceding process → pressing → drilling → gong golden finger sidewall channels → gong bevel edge → heavy copper → 1 (dry film of electric plating of whole board → outer graphics
Cover other plate faces outside golden finger position) → electronickelling gold → electric thick gold → move back film → outer graphics 2 (production line pattern,
Golden finger position dry film covers) → graphic plating copper and tin → outer layer etching (only etching, do not move back tin) (dry film lid of → outer graphics 3
Firmly golden finger position, the golden face of anti-retaining tin liquid medicine pollution golden finger) → moving back tin → move back film → outer layer AOI → rear process.The system
Make to cover golden finger using dry film and protect, prevent the golden face of golden finger after method key is that golden finger completes
Plated with copper and moved back tin liquid medicine pollution.But it is less than the production plate of 1.0mm for plate thickness, when the size of golden finger sidewall channels is greater than
When 2.5mm × 9mm, because the sealing groove ability of dry film is limited, golden finger sidewall channels can not be sealed by dry film, therefore can not use
This method makes such golden finger circuit board.
Now be less than 1.0mm for a plate thickness, golden finger side wall require it is gold-plated, gap between golden finger up to 3mm ×
The golden finger circuit board that heavy nickel gold PAD is further related in 10mm and plate, using the above method because dry film sealing of hole ability can not meet
It is required that will lead to golden finger position there are the quality problems such as copper facing, pollution, double nickel gold.
Summary of the invention
The present invention is mentioned for the above problem existing for the gold-plated golden finger circuit board in prior art production three face of golden finger
A kind of production method of the golden finger circuit board of the heavy nickel gold of and plate face PAD gold-plated for achievable three face of golden finger, this method can fit
It is less than 1.0mm for plate thickness and the production of golden finger circuit board of the golden finger sidewall channels greater than 2.5mm × 9mm, the gold of golden finger
Face is without quality problems such as copper facing, pollution, double nickel gold.
To achieve the above object, the present invention uses following technical scheme.
The present invention provides a kind of production method of golden finger circuit board, and the plate face for the production plate processed in production process is drawn
It is divided into line areas and golden finger area, the golden finger area includes golden finger position for making golden finger and for making golden finger
The side wall slot position of sidewall channels, comprising the following steps:
S1, along the groove milling of side wall slot position and milling oblique surface machining is carried out on production plate, forms golden finger sidewall channels；Then to life
It produces plate and successively carries out heavy copper and electric plating of whole board processing, make 5-8 μm of thickness of hole wall copper that produces hole on plate.
Preferably, production plate described in step S1 is press-fitted together as one more by core material, prepreg, outer copper foil
Laminate, and produce plate outer layer drilling processing processing.
S2, the production golden finger figure on production plate, make golden finger position windowing and other regions are covered by dry film, then exist
Electric nickel gold and electric thick gold processing are successively carried out on golden finger position, dry film of then decorporating completes the production of golden finger on production plate.
Preferably, in step S2, in the electricity nickel gold processing, nickel coating with a thickness of 5-7 μm, gold plate with a thickness of
0.025-0.05μm；In the electric thick gold processing, gold plate thickness is increased to no more than 1.2 μm.
S3, outer-layer circuit figure is made on production plate, making to produce needs to be formed the windowing of the region of outer-layer circuit and it on plate
Its region is covered by dry film, and covers golden finger area by adhesive tape in golden finger area pressing adhesive tape；Then electricity is carried out to production plate
Copper facing and electrotinning processing.
Preferably, in step S3, in the plating Copper treatment, current density 0.4ASD, electroplating time 60min.
S4, it removes the adhesive tape on production plate and decorporates to form the dry film of outer-layer circuit figure, alkali then is carried out to production plate
Property etching process.
S5, golden finger area figure is made on production plate, covers golden finger area and the windowing of other regions by dry film, and
Pressing adhesive tape in golden finger area covers golden finger area by adhesive tape；Then production plate is carried out moving back tin processing.
S6, it removes the adhesive tape on production plate and decorporates to form the dry film in golden finger area, complete outer-layer circuit on production plate
Production.
S7, solder mask production, surface treatment, molding are successively carried out to production plate, the gold-plated route in three face of golden finger is made
Plate.
The production method of above-described golden finger circuit board further includes that the PAD produced on plate is fabricated to heavy nickel gold
PAD；Surface treatment described in step S7 the following steps are included:
S71, it silk-screen anti-ization bronze ink and is dried on production plate, makes anti-ization bronze ink covering golden finger；Then in golden hand
Refer to that pressing adhesive tape in area's covers golden finger area by adhesive tape.
S72, heavy nickel gold processing is carried out on PAD, then tearing-off adhesive tape and anti-ization bronze ink of decorporating.
Compared with prior art, the beneficial effects of the present invention are:
The present invention by before outer-layer circuit figure is electroplated first in golden finger area pressing adhesive tape, to enhance the sealing groove energy of dry film
Power, when preventing electro-coppering and electrotinning liquid medicine penetrate into and on golden finger plated with copper, tin；Golden finger area is not only made before moving back tin
Figure covers golden finger area, also in golden finger area pressing adhesive tape, to enhance the sealing groove ability of dry film, anti-retaining tin liquid medicine penetrate into and
Sting the golden face of erosion golden finger；Before after the anti-electric bronze ink of silk-screen and carrying out heavy nickel gold on PAD, make gold in golden finger area pressing adhesive tape
Finger sidewall channels are enclosed, and cause golden finger to form double layer nickel gold to prevent heavy nickel gold liquid medicine from penetrating into, to realize existing three
The gold-plated golden finger in face, and have the production of the circuit board of heavy nickel gold PAD.The present invention is by optimization production process and makes
Technological parameter in journey, make the method for the present invention can be used for making plate thickness less than 1.0mm and golden finger sidewall channels be greater than 2.5mm ×
9mm, and there is the production of the golden finger circuit board of heavy nickel gold PAD simultaneously, the golden face of golden finger is without copper facing, pollution, double nickel gold etc.
Quality problem.
Detailed description of the invention
Fig. 1 is the schematic diagram of the gold-plated golden finger circuit board in three face of golden finger；
Fig. 2 is the schematic diagram of the production plate after gong golden finger sidewall channels.
Fig. 3 is the schematic diagram of golden finger circuit board described in embodiment；
Fig. 4 is the schematic diagram produced on plate after production golden finger after golden finger position is taped in embodiment.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides a kind of production method of golden finger circuit board, the plate thickness of made golden finger circuit board is less than
1mm, three face of golden finger is gold-plated, and golden finger sidewall channels are greater than 2.5mm × 9mm, carries out heavy nickel golden watch surface treatment to the PAD of plate face.
The plate face for the production plate processed in production process is divided into line areas and golden finger area, golden finger area includes being used for
The golden finger position of golden finger and the side wall slot position for making golden finger sidewall channels are made, the production method is as follows:
(1) sawing sheet: core material is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit being made on core material using negative film technique, obtains inner layer circuit board.
After internal layer circuit is made in etching on core material, routinely process successively carries out OPE punching and internal layer AOI.
(3) it presses: core material, prepreg, housing copper foil is stacked in advance, and by way of fusion or riveted
It is pre-fixed, each layer is pre-fixed together, form pre- stack structure.Then select lamination appropriate will according to plate Tg
Pre- stack structure is press-fitted together as one, and forms production plate.
(4) outer layer drills: being drilled on production plate according to borehole data using the mode of machine drilling.
(5) it sinks copper and electric plating of whole board: along the groove milling of side wall slot position and carrying out milling oblique surface machining on production plate, form golden finger
Sidewall channels.Then one layer of copper is deposited on production plate with the method for chemistry, is electroplated with the current density of 18ASF to thicken copper
Layer produces the hole metallization on plate, forms plated through-hole to design requirement (the hole wall copper thickness in hole is 5-8 μm).
(6) make golden finger: production plate on make golden finger figure, make golden finger position open a window and other regions by dry film
Covering, then successively carries out electric nickel gold and electric thick gold processing on golden finger position, and dry film of then decorporating completes gold on production plate
The production of finger.In electric nickel gold processing, the thickness control of nickel coating is at 5-7 μm, and the thickness control of gold plate is in 0.025-0.05 μ
m；In electric thick gold processing, gold plate thickness is increased to no more than 1.2 μm.
(7) outer-layer circuit is made:
Outer-layer circuit figure is made on production plate, making to produce needs to be formed the windowing of the region of outer-layer circuit and other areas on plate
Domain is covered by dry film；Then the whole plate moulding band on production plate, the adhesive tape at golden finger area is only retained using laser windowing, makes gold
Finger area is covered by adhesive tape, and adhesive tape is using blue adhesive tape common in the production of PCB in the industry；Then electro-coppering and electricity are carried out to production plate
Tin plating processing.In the plating Copper treatment, current density 0.4ASD, electroplating time 60min.
It removes the adhesive tape on production plate and decorporates to form the dry film of outer-layer circuit figure, alkaline erosion then is carried out to production plate
Quarter processing.
Golden finger area figure is made on production plate, makes the other regions windowing by dry film covering of golden finger area；Then
The whole plate moulding band on production plate, the adhesive tape at golden finger area is only retained using laser windowing, makes golden finger area quilt
Adhesive tape covering, adhesive tape is using blue adhesive tape common in the production of PCB in the industry；Then production plate is carried out moving back tin processing.
It removes the adhesive tape on production plate and decorporates to form the dry film in golden finger area, the system of outer-layer circuit is completed on production plate
Make.
(8) outer layer AOI: using automatic optical detecting system, by the comparison with CAM data, whether detects outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
(9) welding resistance, silk-screen character: by making green oil layer and silk-screen character, green oil thickness are as follows: 10- in production plate outer layer
50 μm, so as to so that production plate can reduce influence of the environmental change to it in the subsequent use process.
(10) it sinks nickel golden watch surface treatment (heavy nickel gold PAD):
It silk-screen anti-ization bronze ink and is dried on production plate, makes anti-ization bronze ink covering golden finger；Then in golden finger area
Pressing adhesive tape covers golden finger area by adhesive tape, and adhesive tape is using the not red adhesive tape of gummosis of common high temperature in the production of PCB in the industry.
Heavy nickel gold processing is carried out on PAD, then tearing-off adhesive tape and anti-ization bronze ink of decorporating, heavy nickel gold PAD is made.
(11) it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(12) electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(13) FQC: appearance, hole wall copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(14) it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and put
Desiccant and humidity card, then shipment.
The present embodiment by before outer-layer circuit figure is electroplated first in golden finger area pressing adhesive tape, to enhance the sealing groove of dry film
Ability, when preventing electro-coppering and electrotinning liquid medicine penetrate into and on golden finger plated with copper, tin；Golden finger is not only made before moving back tin
Area's figure covers golden finger area, and also in golden finger area pressing adhesive tape, to enhance the sealing groove ability of dry film, anti-retaining tin liquid medicine penetrates into
And sting the golden face of erosion golden finger；Before after the anti-electric bronze ink of silk-screen and carrying out heavy nickel gold on PAD, make in golden finger area pressing adhesive tape
Golden finger sidewall channels are enclosed, and cause golden finger to form double layer nickel gold to prevent heavy nickel gold liquid medicine from penetrating into, to realize existing
The gold-plated golden finger in three faces, and have the production of the circuit board of heavy nickel gold PAD.
The present embodiment can be used for the method for the present invention by the technological parameter in optimization production process and control manufacturing process
Plate thickness is made less than 1.0mm and golden finger sidewall channels are greater than 2.5mm × 9mm, and there is the golden finger circuit of heavy nickel gold PAD simultaneously
The production of plate, the golden face of golden finger is without quality problems such as copper facing, pollution, double nickel gold.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (5)
1. a kind of production method of golden finger circuit board, by the plate face for the production plate processed in production process be divided into line areas and
Golden finger area, the golden finger area include the golden finger position for making golden finger and the side wall for making golden finger sidewall channels
Slot position, which comprises the following steps:
S1, along the groove milling of side wall slot position and milling oblique surface machining is carried out on production plate, forms golden finger sidewall channels；Then to production plate
Heavy copper and electric plating of whole board processing are successively carried out, makes 5-8 μm of thickness of hole wall copper that produces hole on plate；
S2, the production golden finger figure on production plate, make golden finger position windowing and other regions are covered by dry film, then in golden hand
Refer to and successively carry out electric nickel gold and electric thick gold processing on position, dry film of then decorporating completes the production of golden finger on production plate；
S3, outer-layer circuit figure is made on production plate, making to produce needs to be formed the windowing of the region of outer-layer circuit and other areas on plate
Domain is covered by dry film, and covers golden finger area by adhesive tape in golden finger area pressing adhesive tape；Then electro-coppering is carried out to production plate
With electrotinning processing；
S4, it removes the adhesive tape on production plate and decorporates to form the dry film of outer-layer circuit figure, alkaline erosion then is carried out to production plate
Quarter processing；
S5, golden finger area figure is made on production plate, makes the other regions windowing by dry film covering of golden finger area, and in golden hand
Refer to that pressing adhesive tape in area's covers golden finger area by adhesive tape；Then production plate is carried out moving back tin processing；
S6, it removes the adhesive tape on production plate and decorporates to form the dry film in golden finger area, the system of outer-layer circuit is completed on production plate
Make；
S7, solder mask production, surface treatment, molding are successively carried out to production plate, the gold-plated wiring board in three face of golden finger is made.
2. the production method of golden finger circuit board according to claim 1, which is characterized in that further include that will produce on plate
PAD is fabricated to heavy nickel gold PAD；Surface treatment described in step S7 the following steps are included:
S71, it silk-screen anti-ization bronze ink and is dried on production plate, makes anti-ization bronze ink covering golden finger；Then in golden finger area
Pressing adhesive tape covers golden finger area by adhesive tape；
S72, heavy nickel gold processing is carried out on PAD, then tearing-off adhesive tape and anti-ization bronze ink of decorporating.
3. the production method of golden finger circuit board according to claim 1, which is characterized in that in step S2, the electricity nickel
In gold processing, nickel coating with a thickness of 5-7 μm, gold plate with a thickness of 0.025-0.05 μm；It, will be golden in the electric thick gold processing
Thickness of coating is increased to no more than 1.2 μm.
4. the production method of golden finger circuit board according to claim 1, which is characterized in that in step S3, the plating
In Copper treatment, current density 0.4ASD, electroplating time 60min.
5. the production method of golden finger circuit board according to claim 1-4, which is characterized in that institute in step S1
The multi-layer board that the production plate stated is press-fitted together as one by core material, prepreg, outer copper foil, and produce plate outer layer drilling
Working process.
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| CN201910142472.3A CN109788662B (en) | 2019-02-26 | 2019-02-26 | Manufacturing method of golden finger circuit board |
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|---|---|---|---|
| CN201910142472.3A CN109788662B (en) | 2019-02-26 | 2019-02-26 | Manufacturing method of golden finger circuit board |
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| CN109788662A true CN109788662A (en) | 2019-05-21 |
| CN109788662B CN109788662B (en) | 2021-06-04 |
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| CN110579845A (en) * | 2019-09-20 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | forming method of optical module board |
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| CN110579845A (en) * | 2019-09-20 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | forming method of optical module board |
| CN110579846A (en) * | 2019-09-26 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN110579846B (en) * | 2019-09-26 | 2021-07-06 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN111278228A (en) * | 2020-02-12 | 2020-06-12 | 大连崇达电子有限公司 | Method for improving local tin stripping unclean of outer layer etching |
| CN111263525B (en) * | 2020-03-23 | 2021-04-20 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN111263525A (en) * | 2020-03-23 | 2020-06-09 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN111465191A (en) * | 2020-04-01 | 2020-07-28 | 江苏苏杭电子有限公司 | Method for manufacturing winding connection printed circuit board for automobile |
| CN111465191B (en) * | 2020-04-01 | 2022-12-02 | 江苏苏杭电子有限公司 | Method for manufacturing winding connection printed circuit board for automobile |
| CN112312665A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
| CN112996247A (en) * | 2021-01-26 | 2021-06-18 | 广州广合科技股份有限公司 | Method for manufacturing stepped PCB |
| CN113518514A (en) * | 2021-03-17 | 2021-10-19 | 东莞联桥电子有限公司 | Manufacturing process of high-frequency circuit board |
| CN113518514B (en) * | 2021-03-17 | 2022-06-17 | 东莞联桥电子有限公司 | Manufacturing process of high-frequency circuit board |
| CN113438816A (en) * | 2021-06-25 | 2021-09-24 | 竞华电子(深圳)有限公司 | PCB processing method |
| CN113411978A (en) * | 2021-07-06 | 2021-09-17 | 全成信电子（深圳）股份有限公司 | Method for testing adhesive force of electroless nickel layer of electroless gold plate on copper PAD |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
| CN114916157B (en) * | 2022-06-01 | 2024-04-12 | 东莞森玛仕格里菲电路有限公司 | Soft region finger or PAD protection method for soft and hard combined plate |
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