CN105682348A - Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold - Google Patents
Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold Download PDFInfo
- Publication number
- CN105682348A CN105682348A CN201610129689.7A CN201610129689A CN105682348A CN 105682348 A CN105682348 A CN 105682348A CN 201610129689 A CN201610129689 A CN 201610129689A CN 105682348 A CN105682348 A CN 105682348A
- Authority
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- China
- Prior art keywords
- gold
- bread
- mulch film
- copper
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
Abstract
The invention discloses a fabrication method for a printed circuit board (PCB) with a gold finger of which three surfaces coated with gold. The method comprises the following steps of S1, providing a copper clad plate which is subjected to pre-processing and contains a gold finger region; S2, fabricating an outer-layer pattern on the copper clad plate; S3, carrying out copper deposition on the whole plate; S4, laminating a first cover film on the whole plate, and carrying out first slight etching after windowing at a gold finger position required to be electroplated with gold; S5, laminating a second cover film on the surface of the first cover film, and carrying out nickel and gold electroplating on the gold finger position, wherein the second cover film covers a windowing position by 0.1-0.2 millimeter; and S6, carrying out second slight etching after tearing the first cover film and the second cover film. By the method, a lead is not needed to be separately fabricated, a thin copper layer is fabricated by a thin copper method to be taken as a connection part between the gold finger and the circuit board, and the problems of lead residue existing during fabrication of the lead, influence on the performance of the circuit board and normal circuit etching by a medicinal liquid during lead etching are prevented; and meanwhile, by the method, the fabrication process is simplified, and the production efficiency is improved.
Description
Technical field
The invention belongs to printed circuit board technology field, relate in particular to a kind of PCB making method with three bread gold long and short golden fingers.
Background technology
Golden finger is structure common on a kind of printed circuit board, is usually arranged at the edges of boards outside printed circuit board line areas, and its rear end is provided with golden finger wire and is connected with line areas, and in order to conducted signal, it is gold-plated that tradition golden finger is generally tow sides. But the development and progression along with technology, golden finger is required also strict all the more by user, and the golden finger of traditional two sides gold filled cannot meet the requirement of user gradually, develops the golden finger proposing a kind of front elevational sectional three bread gold also covered with gold leaf thereupon.
The golden finger of three bread gold cannot arrange lead-in wire due to golden finger front end, prior art adopt usually the mode of boring by golden finger and internal layer conducting, or the conducting of golden finger and internal layer is realized by arranging the mode of lead-in wire in circuit board unit, in prior art, the golden finger manufacture craft of three bread gold comprises the following steps: front operation, first time outer graphics makings, graphic plating, first time etching, second time outer graphics make, electronickelling gold, take off film, third time outer graphics make, etch for the second time, take off film and rear operation. Produce, when outer graphics makes, all outer graphics comprising gold finger lead in first time, when second time outer graphics makes, is windowed in golden finger position, rest part dry film covers, during third time outer graphics making, gold finger lead part outer in circuit board unit is windowed, rest part dry film covers, and is etched away by gold finger lead in circuit board unit during second time etching.
There is following problem in aforesaid method: the Edge Distance circuit of windowing made due to third time outer graphics has the distance of 0.1mm, has part lead-in wire and remain in circuit board unit after etching;Owing to circuit copper face and substrate location exist difference of altitude during second time etching, pasting film and cannot cover plate face completely, during etching, liquid medicine is easily infiltrated by subsides film edge and stings the normal circuit of erosion.
Summary of the invention
For this reason, the present invention to be solved the aforementioned problems in the prior just, thus propose a kind of have three bread gold golden finger and without the need to lead-in wire PCB making methods.
For solving the problems of the technologies described above, the technical scheme of the present invention is:
The present invention provides a kind of PCB making method with three bread gold golden fingers, and described method comprises the steps:
S1, provide one through pre-treatment containing the copper-clad plate of golden finger area;
S2, described copper-clad plate is carried out outer graphics making, carry out graphic plating after drawing out outer all figures and etch outer graphics;
S3, whole plate sink copper;
S4, whole plate paste the first mulch film, and carry out first time microetch after needing the golden finger position of electricity gold to window;
S5, paste the 2nd mulch film on described first mulch film surface, the described 2nd monolateral covering windowed regions 0.1-0.2mm of mulch film, then described golden finger position is carried out electronickelling gold process;
S6, remove described first mulch film and carry out after the 2nd mulch film second time microetch.
As preferably, in described step S3, the copper layer thickness of the heavy copper of whole plate is 1-2 μm.
As preferably, described microetch adopt concentration be the sulfuric acid of 3-5% as micro-etching solution, etching speed is 2.5-3m/min.
As preferably, described pre-treatment comprises the operation of internal layer graphic making, interior outer pressing, boring, heavy copper and electric plating of whole board.
As preferably, the processing condition of described second time microetch are adopt the sulfuric acid of 3-5% as micro-etching solution, and etching speed is 2.5-3m/min.
As preferably, described first mulch film is blue glue, and described 2nd mulch film is masking tape.
As preferably, described golden finger is connected with the work area outer-layer circuit of printed circuit board.
As preferably, after described step S5 electronickelling gold process, described golden finger pros and cons and front end face all form layer gold.
As preferably, also comprising making group weldering layer, rear operation after described step S6.
The technique scheme of the present invention has the following advantages compared to existing technology:
The method for manufacturing gold finger of three bread gold of the present invention, without the need to making separately lead-in wire, thin copper legal system is adopted to make thin copper layer as the connection section of golden finger and circuit card, when there is lead-in wire residual when avoiding making lead-in wire, affect wiring board performance and etch lead-in wire, the problem losing normal circuit stung by liquid medicine, simultaneously present method simplifies manufacture craft, it is to increase production efficiency.
Embodiment
In order to make the content of the present invention be more likely to be clearly understood, the present invention is further detailed explanation according to a particular embodiment of the invention below.
Embodiment 1
The present embodiment provides a kind of PCB making method with three bread gold golden fingers, and described method comprises the steps:
S1, provide one through pre-treatment containing the copper-clad plate of golden finger area, described pre-treatment is specially: carry out core material, outer copper foil sawing sheet according to desired size, make core material line pattern, interior outer pressing, then hole, and carry out heavy copper and electric plating of whole board, make copper layer thickness in hole reach requirement;
S2, described copper-clad plate is carried out outer graphics making, carry out graphic plating after drawing out outer all line patterns and etch outer-layer circuit figure;
S3, whole plate sink copper, make the thin copper layer that thickness is 1.5 μm;
S4, whole plate paste the first mulch film, described first mulch film is blue glue, and needing the golden finger position of electricity gold to window, exposes the golden finger area needing electrogilding, then adopt concentration be 4% sulfuric acid micro-etching solution carry out first time microetch, etching speed is 2.8m/min;
S5, paste the 2nd mulch film on described blue glue surface, described 2nd mulch film is red masking tape, the described red monolateral covering of masking tape described windowed regions position 0.15mm, then described golden finger position carries out electronickelling gold process, and described golden finger pros and cons and front end face all electroplate layer gold;
S6, remove described first mulch film and carry out after the 2nd mulch film second time microetch, etch the part thin copper layer sheltered from by red masking tape, produce the connection section of golden finger and outer-layer circuit, described golden finger is connected with outer-layer circuit, the processing condition of second time microetch are adopt the sulfuric acid of 4.5% as micro-etching solution, and etching speed is 2.7m/min.
After making connection section, adopt ordinary method to make solder mask, then pack shipment through AOI detection, outward appearance after detecting.
The PCB making method with three bread gold golden fingers described in the present embodiment, without the need to making separately lead-in wire, thin copper legal system is adopted to make thin copper layer as the connection section of golden finger and circuit card, when there is lead-in wire residual when avoiding making lead-in wire, affect wiring board performance and etch lead-in wire, the problem losing normal circuit stung by liquid medicine, simultaneously present method simplifies manufacture craft, it is to increase production efficiency.
Embodiment 2
The present embodiment provides a kind of PCB making method with three bread gold golden fingers, and described method comprises the steps:
S1, provide one through pre-treatment containing the copper-clad plate of golden finger area, described pre-treatment is specially: carry out core material, outer copper foil sawing sheet according to desired size, make core material line pattern, interior outer pressing, then hole, and carry out heavy copper and electric plating of whole board, make copper layer thickness in hole reach requirement;
S2, described copper-clad plate is carried out outer graphics making, carry out graphic plating after drawing out outer all line patterns and etch outer-layer circuit figure;
S3, whole plate sink copper, make the thin copper layer that thickness is 1 μm;
S4, whole plate paste the first mulch film, described first mulch film is blue glue, and needing the golden finger position of electricity gold to window, exposes the golden finger area needing electrogilding, then adopt concentration be 3% sulfuric acid micro-etching solution carry out first time microetch, etching speed is 2.5m/min;
S5, paste the 2nd mulch film on described blue glue surface, described 2nd mulch film is red masking tape, the described red monolateral covering of masking tape described windowed regions position 0.1mm, then described golden finger position carries out electronickelling gold process, and described golden finger pros and cons and front end face all electroplate layer gold;
S6, remove described first mulch film and carry out after the 2nd mulch film second time microetch, etch the part thin copper layer sheltered from by red masking tape, produce the connection section of golden finger and outer-layer circuit, described golden finger is connected with outer-layer circuit, the processing condition of second time microetch are adopt the sulfuric acid of 3% as micro-etching solution, and etching speed is 2.5m/min.
After making connection section, adopt ordinary method to make solder mask, then pack shipment through AOI detection, outward appearance after detecting.
Embodiment 3
The present embodiment provides a kind of PCB making method with three bread gold golden fingers, and described method comprises the steps:
S1, provide one through pre-treatment containing the copper-clad plate of golden finger area, described pre-treatment is specially: carry out core material, outer copper foil sawing sheet according to desired size, make core material line pattern, interior outer pressing, then hole, and carry out heavy copper and electric plating of whole board, make copper layer thickness in hole reach requirement;
S2, described copper-clad plate is carried out outer graphics making, carry out graphic plating after drawing out outer all line patterns and etch outer-layer circuit figure;
S3, whole plate sink copper, make the thin copper layer that thickness is 2 μm;
S4, whole plate paste the first mulch film, described first mulch film is blue glue, and needing the golden finger position of electricity gold to window, exposes the golden finger area needing electrogilding, then adopt concentration be 5% sulfuric acid micro-etching solution carry out first time microetch, etching speed is 3m/min;
S5, paste the 2nd mulch film on described blue glue surface, described 2nd mulch film is red masking tape, the described red monolateral covering of masking tape described windowed regions position 0.2mm, then described golden finger position carries out electronickelling gold process, and described golden finger pros and cons and front end face all electroplate layer gold;
S6, remove described first mulch film and carry out after the 2nd mulch film second time microetch, etch the part thin copper layer sheltered from by red masking tape, produce the connection section of golden finger and outer-layer circuit, described golden finger is connected with outer-layer circuit, second time microetch processing condition be the sulfuric acid of 5% as micro-etching solution, etching speed is 3m/min.
After making connection section, adopt ordinary method to make solder mask, then pack shipment through AOI detection, outward appearance after detecting.
Obviously, above-described embodiment is only for example is clearly described, and not to the restriction of the mode of enforcement. For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description. Here without the need to also cannot all enforcement modes be given exhaustive. And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (9)
1. one kind has the PCB making method of three bread gold golden fingers, it is characterised in that, described method comprises the steps:
S1, provide one through pre-treatment containing the copper-clad plate of golden finger area;
S2, described copper-clad plate is carried out outer graphics making;
S3, whole plate sink copper;
S4, whole plate paste the first mulch film, and carry out first time microetch after needing the golden finger position of electricity gold to window;
S5, paste the 2nd mulch film on described first mulch film surface, the described 2nd monolateral covering windowed regions 0.1-0.2mm of mulch film, then described golden finger position is carried out electronickelling gold process;
S6, remove described first mulch film and carry out after the 2nd mulch film second time microetch.
2. the PCB making method with three bread gold golden fingers according to claim 1, it is characterised in that, in described step S3, the copper layer thickness of the heavy copper of whole plate is 1-2 μm.
3. according to claim 1 and 2 have three bread gold golden fingers PCB making method, it is characterised in that, described microetch adopt concentration be the sulfuric acid of 3-5% as micro-etching solution, etching speed is 2.5-3m/min.
4. the PCB making method with three bread gold golden fingers according to claim 3, it is characterized in that, described pre-treatment comprises internal layer graphic making, interior outer pressing, boring, heavy copper and electric plating of whole board, outer graphics, graphic plating, the operation of outer etching.
5. the PCB making method with three bread gold golden fingers according to claim 4, it is characterised in that, the processing condition of described second time microetch are adopt the sulfuric acid of concentration 3-5% as micro-etching solution, and etching speed is 2.5-3m/min.
6. the PCB making method with three bread gold golden fingers according to claim 5, it is characterised in that, described first mulch film is blue glue, and described 2nd mulch film is masking tape.
7. the PCB making method with three bread gold golden fingers according to claim 6, it is characterised in that, described golden finger is connected with the work area outer-layer circuit of printed circuit board.
8. the PCB making method with three bread gold golden fingers according to claim 7, it is characterised in that, after described step S5 electronickelling gold process, described golden finger pros and cons and front end face all form layer gold.
9. the PCB making method with three bread gold golden fingers according to claim 8, it is characterised in that, also comprise making group weldering layer, rear operation after described step S6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610129689.7A CN105682348A (en) | 2016-03-08 | 2016-03-08 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610129689.7A CN105682348A (en) | 2016-03-08 | 2016-03-08 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
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| Publication Number | Publication Date |
|---|---|
| CN105682348A true CN105682348A (en) | 2016-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610129689.7A Pending CN105682348A (en) | 2016-03-08 | 2016-03-08 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211633A (en) * | 2016-06-29 | 2016-12-07 | 深圳崇达多层线路板有限公司 | The manufacture method of the four sides gold filled golden finger of printed substrate |
| CN107635356A (en) * | 2017-09-26 | 2018-01-26 | 深圳市迅捷兴科技股份有限公司 | Circuit board side wall gold filled nickel-gold electroplating process |
| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110678004A (en) * | 2019-09-19 | 2020-01-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB for charging pile |
| CN110809357A (en) * | 2019-10-21 | 2020-02-18 | 鹤山市世安电子科技有限公司 | High-temperature-resistant PCB and manufacturing method thereof |
| CN112384005A (en) * | 2020-11-03 | 2021-02-19 | 珠海杰赛科技有限公司 | Wire etching method for full-plate gold-plated printed circuit board |
| CN113532336A (en) * | 2020-04-17 | 2021-10-22 | 中铝洛阳铜加工有限公司 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
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| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN102036506A (en) * | 2010-11-12 | 2011-04-27 | 北大方正集团有限公司 | Manufacturing method of golden fingers |
| CN105228372A (en) * | 2015-09-25 | 2016-01-06 | 深圳崇达多层线路板有限公司 | The manufacture method of a kind of wiring board local golden finger |
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Patent Citations (3)
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| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN102036506A (en) * | 2010-11-12 | 2011-04-27 | 北大方正集团有限公司 | Manufacturing method of golden fingers |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211633A (en) * | 2016-06-29 | 2016-12-07 | 深圳崇达多层线路板有限公司 | The manufacture method of the four sides gold filled golden finger of printed substrate |
| CN107635356A (en) * | 2017-09-26 | 2018-01-26 | 深圳市迅捷兴科技股份有限公司 | Circuit board side wall gold filled nickel-gold electroplating process |
| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
| CN109788662A (en) * | 2019-02-26 | 2019-05-21 | 江门崇达电路技术有限公司 | A kind of production method of golden finger circuit board |
| CN109788662B (en) * | 2019-02-26 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of golden finger circuit board |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110678004A (en) * | 2019-09-19 | 2020-01-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB for charging pile |
| CN110809357A (en) * | 2019-10-21 | 2020-02-18 | 鹤山市世安电子科技有限公司 | High-temperature-resistant PCB and manufacturing method thereof |
| CN113532336A (en) * | 2020-04-17 | 2021-10-22 | 中铝洛阳铜加工有限公司 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
| CN113532336B (en) * | 2020-04-17 | 2024-01-30 | 中铝洛阳铜加工有限公司 | Method for testing flatness of copper strip of high-precision lead frame material for etching |
| CN112384005A (en) * | 2020-11-03 | 2021-02-19 | 珠海杰赛科技有限公司 | Wire etching method for full-plate gold-plated printed circuit board |
| CN112384005B (en) * | 2020-11-03 | 2022-04-29 | 珠海杰赛科技有限公司 | Lead etching method for gold-plated printed circuit board |
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Application publication date: 20160615 |