CN103249264A - Method for manufacturing multi-layer circuit board with internal connecting finger - Google Patents
Method for manufacturing multi-layer circuit board with internal connecting finger Download PDFInfo
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- CN103249264A CN103249264A CN2013101124083A CN201310112408A CN103249264A CN 103249264 A CN103249264 A CN 103249264A CN 2013101124083 A CN2013101124083 A CN 2013101124083A CN 201310112408 A CN201310112408 A CN 201310112408A CN 103249264 A CN103249264 A CN 103249264A
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- golden finger
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- circuit board
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Abstract
The invention discloses a method for manufacturing a multi-layer circuit board with an internal connecting finger. The method comprises the following steps: first, manufacturing an inner layer boards, laminating the inner layer boards into a multilayer board, making a pattern on the multilayer board to form the connecting finger, and performing electrogilding treatment on the connecting finger; and then forming a window, which is wider than the connecting finger, in a non-flowing prepreg, enabling the window of the non-flowing prepreg to correspond to the connecting finger of the multilayer board in position, covering the upper surface and the lower surface of the non-flowing prepreg with copper foil, laminating the non-flowing prepreg and the connecting finger together, cutting off copper foil in a position corresponding to the connecting finger on the multilayer board to form the stepped multi-layer circuit board with the internal connecting finger. The connecting finger part of the multi-layer circuit board with the internal connecting finger is stepped and therefore can be used on slots which are staggered and are not on the same straight line, thus meeting assembly requirements under complex assembly situations and greatly reducing assembly difficulty.
Description
Technical field
Sheet of the present invention belongs to the printed wiring board manufacture technology field, and what be specifically related to is a kind of manufacturing method of multi-layer circuit board of built-in golden finger.
Background technology
Golden finger is used for relevant device and the contacted positions of other substrates such as computer display card, memory bar, USB interface, have good wear resistance and low contact resistance, can satisfy the requirement of repeatedly plug, in printed wiring board manufacturing process, all clamps all need the electrogilding finger.
Currently Goldfinger PCB production process is as follows: The first step of electroless copper → → → outer pattern transfer board pattern plating → → → AOI detection alkaline etching solder protection → Screen → Goldfinger Goldfinger leads Window Graphics (non-electric gold with dry film protection zone lines, revealing Goldfinger) → electric Goldfinger (Goldfinger line production use only) → Stripping (retired dry film solder mask ink wash +) → screen → Goldfinger lead solder window graphics (non-electric gold with dry film protection zone lines, exposing Goldfinger lead) → etching → Stripping → Goldfinger process lead tape (protection Goldfinger bit) → surface treatment → after the process.
But above-mentioned golden finger production method only is suitable for the outer-layer circuit golden finger, be that golden finger is made on the outer-layer circuit, and along with the difficulty of the complicated various of PCB kind of design and electronic product golden finger plug assembly structure increases, also having higher requirement in position to golden finger on the wiring board, makes the requirement that golden finger can't satisfy present wiring board development at the skin of wiring board.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of manufacturing method of multi-layer circuit board of built-in golden finger, be made on the outer-layer circuit the big and problem that can not satisfy complicated various PCB designing requirement of existing complex manufacturing technology, assembly difficulty to solve present golden finger.
The objective of the invention is to be achieved through the following technical solutions.
A kind of manufacturing method of multi-layer circuit board of built-in golden finger comprises step:
A, substrate is made film picture, and substrate is carried out interior layer pattern shift, carry out acid etching then and form the internal layer circuit plate, then the inner plating pressing is made a multi-layer sheet, then this multi-layer sheet is carried out graphic making, and be formed with line pattern, golden finger part and golden finger lead-in wire at this multi-layer sheet, then paste dry film in multi-layer sheet line pattern zone afterwards, expose golden finger, golden finger is carried out electrogilding handle;
B, to windowing, and make described width of windowing than the wide 2mm of golden finger on the multi-layer sheet with multi-layer sheet shape, the identical prepreg that do not flow of size;
C, partly paste red gummed paper at golden finger, then multi-layer sheet is carried out brown and handle, and after brown is handled, the red gummed paper of tearing;
D, cover the prepreg that do not flow of windowing described in the step C at multi-layer sheet, cover Copper Foil again on the prepreg windowing not flow, carry out pressing;
E, the Copper Foil of the multi-layer sheet golden finger corresponding region after the pressing is cut away; and partly paste protective tapes at multiple-plate golden finger; lamina rara externa is carried out outer graphics to be shifted and graphic plating; and lamina rara externa carried out alkali etching; form the outer-layer circuit plate, and form the outer-layer circuit figure on this outer-layer circuit plate.
Preferably, mobile prepreg windowed regions is corresponding with golden finger regional location on the multi-layer sheet among the described step B.
Preferably, described step D comprises: adopt the mode of riveted will have the multi-layer sheet of golden finger and the mobile prepreg of windowing to rivet together, cover Copper Foil more then on the mobile prepreg of windowing, form wiring board.
Preferably, described step D also comprises: during pressing, descend the two sides to cover respectively in the circuit board and two-layerly cover type film and one deck release film, and cover steel plate at release film, carry out pressing.
Preferably, described step e also comprises: the lamina rara externa line pattern pastes protective tapes again in golden finger part on the multi-layer sheet after moving back film and etching, before moving back tin, tears protective tapes after moving back tin.
The present invention compared with prior art, beneficial effect is: the manufacturing method of multi-layer circuit board of built-in golden finger provided by the invention, at first make inner plating, and with multi-layer sheet of inner plating pressing formation, then multi-layer sheet is carried out graphic making, form golden finger, and golden finger is partly carried out electrogilding handle; Afterwards the prepreg that do not flow is windowed, and make the position of windowing wideer than golden finger, press together by the prepreg that do not flow Copper Foil is corresponding with multi-layer sheet then, cut away on the multi-layer sheet Copper Foil with the golden finger corresponding position at last, form step-like built-in golden finger multilayer circuit board.Because the multilayer line edge connector of the built-in golden finger of the present invention partly has ladder to exist, therefore can dislocation and not the slot on same straight line use, it can satisfy the matching requirements under the complicated assembling situation, can greatly reduce the difficulty of assembling.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
The present invention is to provide a kind of manufacturing method of multi-layer circuit board of built-in golden finger, comprise step:
A, to substrate manufacture internal layer film picture, layer pattern shifts in carrying out, acid etching forms the internal layer circuit plate then, then the inner plating pressing is made a multi-layer sheet, then this multi-layer sheet is holed, heavy copper coin, make time outer graphics woods picture then, and multi-layer sheet is carried out outer graphics shift and graphic plating, and be formed with line pattern, golden finger part and golden finger lead-in wire at this multi-layer sheet, then paste dry film in multi-layer sheet line pattern zone afterwards, expose golden finger, golden finger is carried out electrogilding handle;
Produce inner plating according to normal making flow process, the inner plating correspondence is pressed together make a multi-layer sheet then.
When multi-layer sheet carries out graphic making, golden finger is made then, then golden finger is carried out electrogilding, and behind electrogilding, remove the golden finger lead-in wire.
B, to windowing, and make described width of windowing than the wide 2mm of golden finger on the multi-layer sheet with multi-layer sheet shape, the identical prepreg that do not flow of size;
The semi-solid preparation sector-meeting is partly flowed to golden finger owing to do not flow during pressing, therefore can be corresponding with prepreg window and arrange bigger slightly than golden finger zone, when preventing pressing, the prepreg gummosis is to golden finger.
C, partly paste red gummed paper at golden finger, then multi-layer sheet is carried out brown and handle, and after brown is handled, the red gummed paper of tearing;
Liquid medicine in the time of can effectively preventing brown by pasting red gummed paper is attacked golden finger.
D, cover the prepreg that do not flow of windowing described in the step C at multi-layer sheet, cover Copper Foil again on the prepreg windowing not flow, carry out pressing;
Can be with multi-layer sheet central layer corresponding press together of outer field Copper Foil with internal layer by pressing, and by windowing of prepreg golden finger is uncovered to block.
Before the pressing, at first adopt the mode of riveted internal layer to be had the multi-layer sheet of golden finger and the mobile prepreg of windowing rivet together, on the mobile prepreg of windowing, cover Copper Foil more then, form the outer-layer circuit plate after the pressing.
During pressing, descend the two sides to cover respectively in the circuit board and two-layerly cover type film and one deck release film, and cover steel plate at release film, carry out pressing.
E, the Copper Foil of multi-layer sheet golden finger corresponding region is cut away; and partly paste protective tapes at multiple-plate golden finger, lamina rara externa is carried out outer graphics shift and graphic plating, and carry out alkali etching; form the outer-layer circuit plate, and form the outer-layer circuit figure on this outer-layer circuit plate.
The outer-layer circuit plate is carried out before outer graphics shifts; need hole, electroplate, and need to carry out microetch and nog plate after electroplating; in microetch and nog plate process, golden finger is caused scuffing, need be on inner plating golden finger part pasting protective film (high temperature resistant adhesive tape).
Because etching liquid medicine can not attack golden finger, but in moving back the tin process, liquid medicine can produce golden finger and attack, and therefore after moving back film and etching, need paste protective tapes again in the golden finger part before moving back tin, then tears protective tapes after moving back tin.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. the manufacturing method of multi-layer circuit board of a built-in golden finger is characterized in that comprising step:
A, to substrate manufacture internal layer film picture, layer pattern shifts in carrying out, acid etching forms the internal layer circuit plate then, then the inner plating pressing is made a multi-layer sheet, then this multi-layer sheet is holed, heavy copper coin, make outer graphics then, be formed with line pattern, golden finger part and golden finger lead-in wire at this multi-layer sheet, then paste dry film in multi-layer sheet line pattern zone afterwards, expose golden finger, golden finger is carried out electrogilding handle;
B, to windowing, and make described width of windowing than the wide 2mm of golden finger on the multi-layer sheet with multi-layer sheet shape, the identical prepreg that do not flow of size;
C, partly paste red gummed paper at golden finger, then multi-layer sheet is carried out brown and handle, and after brown is handled, the red gummed paper of tearing;
D, cover the prepreg that do not flow of windowing described in the step C at multi-layer sheet, cover Copper Foil again on the prepreg windowing not flow, carry out pressing;
E, the Copper Foil of the multi-layer sheet golden finger corresponding region after the pressing is cut away; and partly paste protective tapes at multiple-plate golden finger; lamina rara externa is carried out outer graphics to be shifted and graphic plating; and lamina rara externa carried out alkali etching; form the outer-layer circuit plate, and form the outer-layer circuit figure on this outer-layer circuit plate.
2. the manufacturing method of multi-layer circuit board of built-in golden finger according to claim 1 is characterized in that mobile prepreg windowed regions is corresponding with golden finger regional location on the multi-layer sheet among the described step B.
3. the manufacturing method of multi-layer circuit board of built-in golden finger according to claim 1, it is characterized in that described step D comprises: adopt the mode of riveted will have the multi-layer sheet of golden finger and the not mobile prepreg of windowing to rivet together, on the not mobile prepreg of windowing, cover Copper Foil more then, form wiring board.
4. the manufacturing method of multi-layer circuit board of built-in golden finger according to claim 1, it is characterized in that described step D also comprises: during pressing, descend in the circuit board the two sides to cover respectively and two-layerly cover type film and one deck release film, and cover steel plate at release film, carry out pressing.
5. the manufacturing method of multi-layer circuit board of built-in golden finger according to claim 1; it is characterized in that described step e also comprises: the lamina rara externa line pattern is after moving back film and etching on the multi-layer sheet; move back before the tin golden finger part is pasted protective tapes again, tear protective tapes after moving back tin.
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| CN201310112408.3A CN103249264B (en) | 2013-04-01 | 2013-04-01 | A kind of manufacturing method of multi-layer circuit board of built-in golden finger |
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| CN201310112408.3A CN103249264B (en) | 2013-04-01 | 2013-04-01 | A kind of manufacturing method of multi-layer circuit board of built-in golden finger |
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| CN103249264A true CN103249264A (en) | 2013-08-14 |
| CN103249264B CN103249264B (en) | 2015-08-19 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687322A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for manufacturing lead-free printed circuit board partially plated with hard gold |
| CN104168711A (en) * | 2014-08-29 | 2014-11-26 | 广州美维电子有限公司 | Pressing structure of cavity circuit board and pressing method of cavity circuit board |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN105228371A (en) * | 2015-08-31 | 2016-01-06 | 珠海方正科技多层电路板有限公司 | A kind of method making ladder golden finger circuit board |
| CN105611751A (en) * | 2015-09-07 | 2016-05-25 | 瑞华高科技电子工业园(厦门)有限公司 | Processing method of multilayer flexible circuit board |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN109991451A (en) * | 2019-04-19 | 2019-07-09 | 南京微桥检测技术有限公司 | Display module Precision measurement crimps probe |
| CN110022651A (en) * | 2019-05-21 | 2019-07-16 | 安捷利（番禺）电子实业有限公司 | A kind of processing method and equipment of multiple-plate internal layer golden finger |
| CN111542179A (en) * | 2020-05-15 | 2020-08-14 | 深圳市实锐泰科技有限公司 | Flexible plate uncovering method |
| CN112738979A (en) * | 2020-12-10 | 2021-04-30 | 西安易朴通讯技术有限公司 | PCB, chip and electronic equipment |
| CN114025513A (en) * | 2022-01-05 | 2022-02-08 | 昆山龙雨智能科技有限公司 | Novel PCB and preparation method thereof |
| CN114916142A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method of multi-press stepped golden finger circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0883084A2 (en) * | 1997-06-04 | 1998-12-09 | Sony Corporation | Memory card, and receptacle for same |
| US20060213955A1 (en) * | 2005-03-22 | 2006-09-28 | Konica Minolta Holdings, Inc. | Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads |
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
| CN202005067U (en) * | 2011-04-11 | 2011-10-05 | 深圳市中软信达电子有限公司 | Multilayer flexible circuit board gold finger installing structure |
| TW201232931A (en) * | 2011-01-20 | 2012-08-01 | Hon Hai Prec Ind Co Ltd | Motherboard and memory connector thereof |
| CN202565573U (en) * | 2012-04-27 | 2012-11-28 | 深圳市国明顺电子技术有限公司 | Structure for installing multi-layer soft circuit board gold fingers |
-
2013
- 2013-04-01 CN CN201310112408.3A patent/CN103249264B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0883084A2 (en) * | 1997-06-04 | 1998-12-09 | Sony Corporation | Memory card, and receptacle for same |
| US20060213955A1 (en) * | 2005-03-22 | 2006-09-28 | Konica Minolta Holdings, Inc. | Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads |
| CN101355856A (en) * | 2008-08-13 | 2009-01-28 | 东莞生益电子有限公司 | Method for preparing hierarchical and grading gold finger plate using method of selecting wet film |
| TW201232931A (en) * | 2011-01-20 | 2012-08-01 | Hon Hai Prec Ind Co Ltd | Motherboard and memory connector thereof |
| CN202005067U (en) * | 2011-04-11 | 2011-10-05 | 深圳市中软信达电子有限公司 | Multilayer flexible circuit board gold finger installing structure |
| CN202565573U (en) * | 2012-04-27 | 2012-11-28 | 深圳市国明顺电子技术有限公司 | Structure for installing multi-layer soft circuit board gold fingers |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN103687322A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for manufacturing lead-free printed circuit board partially plated with hard gold |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN104768332B (en) * | 2014-01-08 | 2017-10-10 | 深圳崇达多层线路板有限公司 | Printed wiring board with long and short golden finger and preparation method thereof |
| CN104168711A (en) * | 2014-08-29 | 2014-11-26 | 广州美维电子有限公司 | Pressing structure of cavity circuit board and pressing method of cavity circuit board |
| CN105228371B (en) * | 2015-08-31 | 2018-07-06 | 珠海方正科技多层电路板有限公司 | A kind of method for making ladder golden finger circuit board |
| CN105228371A (en) * | 2015-08-31 | 2016-01-06 | 珠海方正科技多层电路板有限公司 | A kind of method making ladder golden finger circuit board |
| CN105611751B (en) * | 2015-09-07 | 2019-02-19 | 瑞华高科技电子工业园(厦门)有限公司 | A kind of processing method of multi-layer flexible circuit board |
| CN105611751A (en) * | 2015-09-07 | 2016-05-25 | 瑞华高科技电子工业园(厦门)有限公司 | Processing method of multilayer flexible circuit board |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108463058B (en) * | 2018-04-16 | 2022-03-29 | 惠州市纬德电路有限公司 | Production process of stepped gold finger PCB |
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN109991451A (en) * | 2019-04-19 | 2019-07-09 | 南京微桥检测技术有限公司 | Display module Precision measurement crimps probe |
| CN109991451B (en) * | 2019-04-19 | 2022-01-18 | 南京微桥检测技术有限公司 | Display module precision detection crimping testing device |
| CN110022651A (en) * | 2019-05-21 | 2019-07-16 | 安捷利（番禺）电子实业有限公司 | A kind of processing method and equipment of multiple-plate internal layer golden finger |
| CN111542179A (en) * | 2020-05-15 | 2020-08-14 | 深圳市实锐泰科技有限公司 | Flexible plate uncovering method |
| CN112738979A (en) * | 2020-12-10 | 2021-04-30 | 西安易朴通讯技术有限公司 | PCB, chip and electronic equipment |
| CN114025513A (en) * | 2022-01-05 | 2022-02-08 | 昆山龙雨智能科技有限公司 | Novel PCB and preparation method thereof |
| CN114025513B (en) * | 2022-01-05 | 2022-06-28 | 昆山龙雨智能科技有限公司 | PCB and preparation method thereof |
| CN114916142A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method of multi-press stepped golden finger circuit board |
| CN114916142B (en) * | 2022-06-01 | 2024-04-12 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method of multi-press-fit stepped golden finger circuit board |
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