CN105228371B - A kind of method for making ladder golden finger circuit board - Google Patents
A kind of method for making ladder golden finger circuit board Download PDFInfo
- Publication number
- CN105228371B CN105228371B CN201510546806.5A CN201510546806A CN105228371B CN 105228371 B CN105228371 B CN 105228371B CN 201510546806 A CN201510546806 A CN 201510546806A CN 105228371 B CN105228371 B CN 105228371B
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- CN
- China
- Prior art keywords
- golden finger
- circuit board
- protective film
- ladder
- copper bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Abstract
The present invention provides a kind of method for making ladder golden finger circuit board, includes the following steps, makes golden finger on at least one side of substrate and surrounds the copper bar of golden finger；The top covering protection film in region is enclosed, and protective film is made to be fixedly connected with the top surface of copper bar in copper bar；It is laminated on substrate upper strata and closes prepreg and copper foil；It removes part prepreg, copper foil and protective film and forms stepped groove, make golden finger exposed, so as to make to obtain ladder golden finger circuit board.The method that the present invention makes ladder golden finger circuit board can not only accurately control the installation position of golden finger, moreover it is possible to protect golden finger not contaminated, and can all be completed using machinery, thus have the advantages that making precision is high, producing efficiency is high.
Description
Technical field
The present invention relates to circuit board manufacturing method technical fields, and in particular to a kind of side for making ladder golden finger circuit board
Method.
Background technology
The golden yellow conductive sheet that golden finger (Gold Finger) is provided on circuit board and is arranged in rows, for grafting
It electrically conducts in the slot of another component with another component.Golden finger is because of its surface gold-plating and conductive sheet arrangement is such as finger-shaped,
Therefore referred to as golden finger.The existing circuit board with golden finger, golden finger are typically fabricated on the surface of plate circuit board, and adjacent
Connect board edge.However according to the market demand, need to make with stepped groove and ladder groove bottom is provided with golden finger
Circuit board namely ladder golden finger circuit board.
A kind of production method of ladder golden finger circuit board is disclosed in the prior art, is made in ladder groove bottom first
Go out golden finger figure, then paste High temperature-resistanadhesive adhesive tape in golden finger patterned surface, then in High temperature-resistanadhesive adhesive tape surface laminated multi-layer
Plate, press multilayer plate after, then by above High temperature-resistanadhesive adhesive tape plate milling remove, finally remove High temperature-resistanadhesive adhesive tape,
And to golden finger graphic plating, so as to which golden finger circuit board be prepared.There are following skills for production method in the patent document
Art defect：1) (for platen temperature at 180 DEG C, more than 60min, pressure is in 350PSI, English at high temperature under high pressure for a long time for High temperature-resistanadhesive adhesive tape
Pound/square inch), easy aging is tacky, is not easy to remove from golden finger surface, easily golden finger is polluted, leads to gold
Finger is of poor quality；2) it needs that High temperature-resistanadhesive adhesive tape manually is covered in golden finger surface, precision is low, low production efficiency.
Invention content
Therefore, the technical problem to be solved in the present invention is to overcome of the prior art for making ladder golden finger circuit
The method of plate, easily pollutes golden finger, causes golden finger of poor quality and the technological deficiency of low production efficiency, so as to provide
One kind will not pollute golden finger, thus the making ladder golden finger method that golden finger quality is high and production efficiency is high.
For this purpose, the present invention provides a kind of method for making ladder golden finger circuit board, include the following steps
Golden finger is made on at least one side of substrate and surrounds the copper bar of the golden finger；
The top covering protection film in region is enclosed, and fix the top surface of the protective film and the copper bar in the copper bar
Connection；
Pressing prepreg and copper foil are stacked gradually on the substrate one side covered with the protective film；
The removal part prepreg, the metal foil and the protective film expose the gold to form stepped groove
Finger.
As a preferred embodiment, it further includes：In the substrate with making the side that have a side of the golden finger opposite
Pressing prepreg and copper foil are stacked gradually on face.
As a preferred embodiment, the substrate has the core of at least one layer of prepreg and copper foil for core plate or pressing
Plate.
As a preferred embodiment, the width G T.GT.GT 20mil of the copper bar.
As a preferred embodiment, it before the top covering protection film in region is enclosed to the copper bar, further includes：
Through-hole and/or blind hole are made on the substrate, and copper facing is carried out to the through-hole and/or blind hole, so as to make
State the step of golden finger is electrically connected with other conductive layers of the substrate.
As a preferred embodiment, the step of resin filling is carried out to the through-hole or blind hole is further included.
As a preferred embodiment, the golden finger is common golden finger, appointing in grading connecting finger and long and short golden finger
Meaning is one or more of.
As a preferred embodiment, the protective film is copper foil, towards the one side of the protective film of the golden finger
Smooth surface for copper foil.
As a preferred embodiment, the thickness ＜ 15um of the protective film.
As a preferred embodiment, the protective film is fixedly connected with the top surface of the copper bar the step of, including：
Solder mask is coated in the copper bar top surface；
The solder mask is exposed, so that the solder mask is tacky；
Protective film pressing is fixed on the copper bar top surface.
As a preferred embodiment, it carries out that pressing half is laminated in the one side covered with the protective film to the substrate
Before cured sheets and copper foil, further include：
The protective film is cut along the outer rim of the copper bar, area periphery is enclosed so as to which the copper bar will be located at
The protective film removal.
As a preferred embodiment, using the mode of controlled depth milling or laser cutting the ladder is formed on the circuit board
Slot.
The method provided by the invention for making ladder golden finger circuit board, has the following advantages：
1. the method for the making ladder golden finger circuit board of the present invention, makes golden finger, then in base on substrate first
Plate upper strata, which laminates, closes multilayer prepreg and copper foil, finally removes part prepreg, copper foil and protective film and forms stepped groove, makes
Golden finger is exposed, and this production method can accurately control the installation position of golden finger, overcomes conventionally used controlled depth milling plate side
Method processes to obtain that stepped groove basal surface position is inaccurate, so that the technological deficiency that golden finger installation position is inaccurate, so as to
Making obtains golden finger position and puts the higher circuit board with ladder golden finger of precision；In addition, copper bar and protective film can be to gold
Finger is protected, when pressing prepreg on substrate top surface, prepreg may not flow into golden finger area to golden finger
It pollutes, it is thus possible to ensure golden finger quality, and be covered in the protective film at the top of golden finger and also facilitate opening for stepped groove
If；Finally, production method of the invention, Overall Steps can use machinery to complete, it is thus possible to improve producing efficiency, reduce
Human cost.
2. the method for the making ladder golden finger circuit board of the present invention, golden finger can be produced on core plate, can also make
Making the pressing on surface has on the core plate surface of at least one layer of prepreg and copper foil, because being that golden finger is first made on substrate,
Then prepreg is pressed again and circuit board is made, therefore still pressing has prepreg and copper foil either on core plate in copper foil
Surface on make golden finger be quite convenient to, and can ensure production quality.
3. the method for the making ladder golden finger circuit board of the present invention, protective film is preferably copper foil, copper foil and golden finger it
Between will not be bonded, because without being polluted to golden finger；The one side towards golden finger of protective film is the smooth surface of copper foil,
When pressing prepreg above protective film and copper foil makes circuit board, smooth surface will not cause to damage to golden finger surface.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, letter is made to the attached drawing needed for description specific embodiment below
Unitary declaration.
Fig. 1 is the structural representation for forming golden finger and copper bar metacoxal plate in embodiment on substrate one side through step S1
Figure.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation for the top covering protection film metacoxal plate for enclosing region in embodiment in copper bar through step S2
Figure.
Fig. 4 is to laminate unification layer prepreg in embodiment on the substrate one side upper strata covered with protective film through step S3
With the structure diagram of circuit board after copper foil.
Fig. 5 is the structure diagram of the circuit board after step S4 opens up stepped groove on circuit boards in embodiment.
Reference numeral：1- substrates, 11- core plates, 12- blind holes, 2- golden fingers, 3- copper bars, 4- protective films, 5- prepregs,
6- copper foils, 7- solder masks.
Specific embodiment
Technical scheme of the present invention is described with reference to the accompanying drawings of the specification, it is clear that following embodiments are not
Whole embodiment of the invention.Based on following embodiments described in the invention, those of ordinary skill in the art are not doing
Go out under the premise of other creative works the extension or deformation obtained, belong to protection scope of the present invention.
It should be noted that in the description of the present invention, term " first ", " second " are only used for describing, not should understand that
To indicate or implying relative importance.In addition, as long as technical characteristic involved in different embodiments of the present invention is each other
Not forming conflict can be combined with each other.
The present embodiment provides a kind of method for making ladder golden finger circuit board, using have the circuit board of 6 layers of conductive layer as
Example, includes the following steps：
Step S1 as shown in Figs. 1-2, L3 conductive layers and L4 conductive layers, Ran Hou is respectively formed on 11 two sides of core plate
Prepreg 5 and copper foil 6 are sequentially laminated on L3 and L4 conductive layers respectively, forms L2 conductive layers and L5 conductive layers, so as to which base be made
Then plate 1 makes golden finger 2 on 1 top surface of substrate and surrounds the copper bar 3 of golden finger 2；
Step S2 as shown in figure 3, enclosing the top covering protection film 4 in region in copper bar 3, and makes protective film 4 and copper bar 3
Top surface be fixedly connected；
Step S3 as shown in figure 4, pressing prepreg 5 and copper foil 6 are laminated respectively in the two sides of substrate 1, form L1 and leads
Electric layer and L6 conductive layers；
Step S4 as shown in figure 5, removal part prepreg 5, copper foil 6 and protective film 4 form stepped groove, makes golden finger 2
It is exposed, so as to make to obtain ladder golden finger circuit board.
The method of the making ladder golden finger circuit board of the present embodiment, makes golden finger 2, Ran Hou on substrate 1 first
1 upper strata of substrate, which laminates, closes multilayer prepreg 5 and copper foil 6, finally removes 4 shape of part prepreg 5, copper foil 6 and protective film again
Into stepped groove, make golden finger 2 exposed, this production method can accurately control the installation position of golden finger 2, and overcoming traditionally makes
Process to obtain that stepped groove basal surface position is inaccurate with controlled depth milling plate method, so that the inaccurate technology in golden finger installation position lacks
It falls into, the higher circuit board with ladder golden finger of precision is put so as to make to obtain golden finger position；In addition, copper bar 3 and guarantor
Cuticula 4 can protect golden finger 2, when pressing prepreg 5 on 1 top surface of substrate, prepreg 5 may not flow into gold
Finger areas pollutes golden finger 2, it is thus possible to ensure 2 mass of golden finger, and be covered in the protection at 2 top of golden finger
Film 4 also facilitates opening up for stepped groove；Finally, production method provided in this embodiment, Overall Steps can use machinery to complete,
Producing efficiency can be thus improved, reduces human cost.
In above-mentioned steps S1, substrate 1 is the printed circuit board with 4 layers of conductive layer, in fact, according to demand, substrate 1 is also
Can be the printed circuit board with more layers or fewer layers conductive layer or an individual core plate 11, and by golden hand
Refer to 2 to be set up directly on L3 conductive layers and/or L4 conductive layers that Fig. 1 shows.Because it is first to make golden finger 2 on substrate 1, then
Prepreg 5 is pressed again and circuit board is made, therefore still pressing has prepreg 5 and copper either on core plate 11 in copper foil 6
Golden finger 2 is made on the surface of foil 6 to be quite convenient to, and can ensure production quality.
In the step, golden finger 2 is common golden finger, and according to demand, golden finger 2 can also be designed as common gold by people
Any one or a few in finger, grading connecting finger and long and short golden finger；The width of copper bar 3 be 25mil, the technology of this field
Copper bar 3 can also be set as other width by personnel, as long as ＞ 20mil can.
Furthermore it is also possible on substrate 1 setting through the through-hole of substrate 1 or by L2 layers to L3 layers, L4 layers blind
Hole 12 (as shown in Figure 2) then carries out copper facing so that golden finger 2 and L3 layers, L4 layers or L5 layers is electrically connected to the through-hole or blind hole 12
It is logical.In the case of with requirement, resin filling can also be carried out to through-hole or blind hole 12, to meet actual requirement.
In above-mentioned steps S2, protective film 4 is the copper foil that thickness is 14um, and protective film 4 towards 2 side of golden finger
Side is the smooth surface of copper foil.The thickness of copper foil can be met the requirements there are many selection as long as ＜ 15um.Copper foil and golden finger
It will not be bonded between 2, because without being polluted to golden finger 2；The one side towards golden finger 2 of protective film 4 is copper foil
Smooth surface, when pressing prepreg 5 and copper foil 6 above protective film 4 and making circuit board, smooth surface will not be to 2 table of golden finger
It causes to damage in face.
It is by the mode that protective film 4 is fixed on 3 top surface of copper bar：As shown in figure 3, in 3 applied on top surface welding resistance of copper bar oil
Ink 7, and it is tacky to expose solder mask 7, and then copper foil is covered on copper bar 3, copper foil is pressed together on copper bar 3 using pressure pushes up
On face so that copper foil covers all golden finger 2.When being pressed together on copper foil on 3 top surface of copper bar, preferably in 150 DEG C of environment
Lower operation, can improve pressing quality.
As an improvement after copper foil is pressed together on 3 top surface of copper bar, along 3 surrounding of copper bar using laser to protection
Film 4 is cut, and 4 complete resection of protective film of area periphery will be enclosed positioned at copper bar 3.In this step, it is preferable to use UV types
Laser, and control aperture size be 5mil.
In above-mentioned steps S3, as shown in figure 4, pressing prepreg 5 and copper foil 6 simultaneously in the two sides up and down of substrate 1, make
It is made the circuit board with 6L layers of conductive layer.It is clear that when the number of plies for the circuit board to be made is more layers, Ren Menke
To continue to press the prepreg 5 of more layers and copper foil 6 on this basis, so as to which the electricity with more layers conductive layer be prepared
Road plate.
In above-mentioned steps S4, as shown in figure 5, forming ladder on circuit boards using the method for controlled depth milling or laser cutting
Slot comes so as to expose outside golden finger 2.Preferably, the lower cutter position of two methods is all the position of corresponding copper bar 3, it would be desirable to
The copper bar 3 cut away and the filler removal on copper bar 3, protective film 4, and then the electricity with ladder golden finger is prepared
Road plate.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (12)
- A kind of 1. method for making ladder golden finger circuit board, it is characterised in that：Include the following stepsGolden finger (2) is made on at least one side of substrate (1) and surrounds the copper bar (3) of the golden finger (2)；The top covering protection film (4) in region is enclosed, and make the protective film (4) and the copper bar (3) in the copper bar (3) Top surface is fixedly connected；Pressing prepreg (5) and copper foil are stacked gradually on the substrate (1) one side covered with the protective film (4) (6)；The part prepreg (5), the copper foil (6) and the protective film (4) are removed to form stepped groove, and described in exposure Golden finger (2).
- 2. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：It further includes：In the base Having with making for plate (1) stacks gradually pressing prepreg (5) and copper foil on the opposite side in the side of the golden finger (2) (6)。
- 3. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：The substrate (1) is core Plate (11) or pressing have the core plate (11) of at least one layer of prepreg (5) and copper foil (6).
- 4. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：The width of the copper bar (3) Spend ＞ 20mil.
- 5. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：To the copper bar (3) Before the top covering protection film (4) for enclosing region, further include：Through-hole and/or blind hole (12) are made on the substrate (1), and copper facing is carried out to the through-hole and/or blind hole (12), from And the step of golden finger (2) is made to be electrically connected with other conductive layers of the substrate (1).
- 6. the method for ladder golden finger circuit board is made according to claim 5, it is characterised in that：It further includes to the through-hole Or blind hole (12) carries out the step of resin filling.
- 7. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：The golden finger (2) is Common golden finger, any one or a few in grading connecting finger and long and short golden finger.
- 8. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：The protective film (4) is Copper foil, the one side towards the protective film (4) of the golden finger (2) are the smooth surface of copper foil.
- 9. the method for ladder golden finger circuit board is made according to claim 8, it is characterised in that：The protective film (4) Thickness ＜ 15um.
- 10. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：By the protective film (4) the step of being fixedly connected with the top surface of the copper bar (3), including：In the copper bar (3) top surface coating solder mask (7)；The solder mask (7) is exposed, so that the solder mask (7) is tacky；The protective film (4) pressing is fixed on the copper bar (3) top surface.
- 11. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：To the substrate (1) The one side covered with the protective film (4) carry out be laminated pressing prepreg (5) and copper foil (6) before, further include：The protective film (4) is cut along the outer rim of the copper bar (3), region is enclosed so as to which the copper bar (3) will be located at The protective film (4) removal of periphery.
- 12. the method for ladder golden finger circuit board is made according to claim 1, it is characterised in that：Using controlled depth milling or swash The mode of light cutting forms the stepped groove on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510546806.5A CN105228371B (en) | 2015-08-31 | 2015-08-31 | A kind of method for making ladder golden finger circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510546806.5A CN105228371B (en) | 2015-08-31 | 2015-08-31 | A kind of method for making ladder golden finger circuit board |
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| CN105228371A CN105228371A (en) | 2016-01-06 |
| CN105228371B true CN105228371B (en) | 2018-07-06 |
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| CN201510546806.5A Active CN105228371B (en) | 2015-08-31 | 2015-08-31 | A kind of method for making ladder golden finger circuit board |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792538B (en) * | 2016-03-31 | 2019-01-15 | 胜宏科技（惠州）股份有限公司 | A kind of internal layer copper sheet dew copper production method of power battery wiring board |
| CN107580412A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | Stepped circuit board and preparation method thereof |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108463058B (en) * | 2018-04-16 | 2022-03-29 | 惠州市纬德电路有限公司 | Production process of stepped gold finger PCB |
| CN108811310A (en) * | 2018-09-04 | 2018-11-13 | 苏州工业园区杰智汇电子材料有限公司 | Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board |
| CN110139504B (en) * | 2019-05-24 | 2020-07-10 | 深圳市景旺电子股份有限公司 | Soft and hard combined circuit board and manufacturing method thereof |
| CN110312370A (en) * | 2019-06-11 | 2019-10-08 | 江西弘高科技有限公司 | A kind of production method of printed wiring board memory bar |
| CN114096059B (en) * | 2020-08-25 | 2023-10-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN112739005B (en) * | 2020-11-16 | 2022-06-17 | 淮安特创科技有限公司 | Golden finger circuit board processing method and golden finger circuit board |
| CN112738979A (en) * | 2020-12-10 | 2021-04-30 | 西安易朴通讯技术有限公司 | PCB, chip and electronic equipment |
| CN113543484B (en) * | 2021-06-29 | 2022-12-30 | 生益电子股份有限公司 | Circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012862A (en) * | 2005-06-30 | 2007-01-18 | Giga-Byte Technology Co Ltd | Sli adapter card, mother board for packaging the same, and packaging method of the sli adapter card to the mother board |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103249264A (en) * | 2013-04-01 | 2013-08-14 | 深圳崇达多层线路板有限公司 | Method for manufacturing multi-layer circuit board with internal connecting finger |
-
2015
- 2015-08-31 CN CN201510546806.5A patent/CN105228371B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012862A (en) * | 2005-06-30 | 2007-01-18 | Giga-Byte Technology Co Ltd | Sli adapter card, mother board for packaging the same, and packaging method of the sli adapter card to the mother board |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103249264A (en) * | 2013-04-01 | 2013-08-14 | 深圳崇达多层线路板有限公司 | Method for manufacturing multi-layer circuit board with internal connecting finger |
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Effective date of registration: 20220620 Address after: No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai, Guangdong 519070 Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee after: New founder holdings development Co., Ltd Address before: No. 107 Baishi Road, Qianshan, Zhuhai, Guangdong 519070 Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee before: Peking University Founder Group Corp |