CN108990317B - Method for improving interlayer alignment degree of rigid-flex board - Google Patents
Method for improving interlayer alignment degree of rigid-flex board Download PDFInfo
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- CN108990317B CN108990317B CN201810771289.5A CN201810771289A CN108990317B CN 108990317 B CN108990317 B CN 108990317B CN 201810771289 A CN201810771289 A CN 201810771289A CN 108990317 B CN108990317 B CN 108990317B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for improving the interlayer alignment degree of a rigid-flex board, which comprises the following steps: manufacturing an inner layer circuit on the soft board core board; in the finished product of the soft and hard combined board, the soft board core board comprises a soft board area and a soft and hard combined area; aligning and laminating a cover film in a soft board area on a soft board core board, and then measuring the expansion and contraction coefficient of the soft board core board; manufacturing an inner layer circuit on the hard board core board, and carrying out exposure compensation according to the expansion and contraction coefficient of the soft board core board when manufacturing the inner layer circuit; respectively drilling rivet holes at the positions, corresponding to the riveting positions, on the soft board core board and the hard board core board by using the same OPE punching machine; the soft board core board and the hard board core board are pre-overlapped together by using no-flow glue PP, riveted by using rivets and pressed into a production board. The method solves the problem of deviation of the pressing alignment holes caused by pressing the cover film, improves the pressing quality of the rigid-flexible board and reduces the deviation rejection rate of the rigid-flexible board layer.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for improving the interlayer alignment degree of a rigid-flexible printed circuit board.
Background
In the rigid-flex board manufacturing process, the pressfitting of rigid board and flexible board needs to be carried out, and the traditional manufacturing flow of the flexible board part before the pressfitting is: cutting, inner layer pattern, OPE punching, inner layer AOI, browning, coating film adhering, fast pressing, browning and post-processing; the purpose of the OPE punching is to punch out a rivet hole and a slotted hole of a plate edge for pressing and positioning a hard plate and a soft plate in a later process so as to control accurate alignment between layers.
According to above-mentioned traditional flow way, carry out the OPE earlier and punch a hole, like this at the in-process of the quick pressfitting of follow-up cover film, the soft board can take place the harmomegathus under high temperature to lead to OPE hole partially that punches a hole, and then there is the inclined problem in layer after leading to soft board and hard board pressfitting, and the soft board makes the while division simultaneously when soft board and hard board preparation inlayer circuit, also can have the harmomegathus before the pressfitting and cause the pressfitting back layer to incline, and then cause the soft and hard combined board to scrap.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for improving the interlayer alignment degree of a rigid-flexible printed circuit board.
In order to solve the technical problem, the invention provides a method for improving the interlayer alignment degree of a rigid-flex board, which comprises the following steps:
s1, manufacturing an inner layer circuit on the soft board core board; in the finished product of the soft and hard combined board, the soft board core board comprises a soft board area and a soft and hard combined area;
s2, aligning and laminating the cover film in the soft board area on the soft board core board, and then measuring the expansion and contraction coefficient of the soft board core board;
s3, manufacturing an inner layer circuit on the hard board core board, and carrying out exposure compensation according to the expansion and contraction coefficient of the soft board core board when manufacturing the inner layer circuit;
s4, using the same OPE punching machine to drill rivet holes at the positions corresponding to the riveting positions on the soft board core board and the hard board core board respectively;
and S5, pre-laminating the soft board core board, the hard board core board and the no-flow rubber PP together, riveting by using rivets, and pressing to obtain the production board.
Preferably, in step S2, the cover film is one side 1mm larger than the flexible board area.
Preferably, in step S2, the cover film is completely bonded to the flexible board core by rapid press, and then the flexible board core is baked to cure the cover film.
Preferably, in step S3, the parameters of the rapid press fit are: the temperature is 180 ℃, the pressure is 80KG, and the pressing time is 60 s.
Preferably, in step S5, the soft board core board and the hard board core board are subjected to brown oxidation treatment together before riveting.
Preferably, in step S5, before riveting, a window is opened on the non-flowing glue PP corresponding to the soft board area, and cleaning is performed after the window is opened.
Preferably, in step S3, one side of the window is 0-0.35mm larger than the soft board area.
Preferably, step S5 is followed by the following steps:
s6, sequentially carrying out outer layer drilling, copper deposition and whole board electroplating on the production board;
s7, sequentially manufacturing an outer layer circuit and a solder mask layer on the production board, and then carrying out surface treatment;
and S8, performing depth control cutting on the production board at the position corresponding to the periphery of the soft board area by adopting a laser cutting or grooving mode, and removing the part of the hard board core board corresponding to the soft board area after uncovering to obtain the rigid-flexible board.
Preferably, in step S8, after the cover is uncovered, a dispensing process is performed at the joint of the exposed edge of the soft board area and the hard board core board.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, after the cover film is laminated in the soft board area, the expansion and contraction coefficient of the soft board core board is measured firstly, then exposure compensation is carried out according to the expansion and contraction coefficient when the inner layer circuit of the hard board core board is manufactured, the interlayer alignment degree of the soft board core board and the hard board core board is ensured, rivet holes are drilled in the corresponding positions of the soft board core board and the hard board core board respectively by adopting the same OPE punching machine, the drilled rivet holes are uniform, the alignment accuracy of the rivet holes on the two boards is improved, the problem of OPE hole deviation caused by laminating the cover film is solved, and the soft board core board and the hard board core board are punched simultaneously, so that the alignment degree of the rivet holes is ensured, the laminating quality of the soft and hard combined board is improved, and the partial rejection rate of the soft and; and after the rivet hole is drilled, the soft board core board and the hard board core board are subjected to browning treatment together, namely, the browning treatment is simultaneously performed under the same condition environment, so that the interlayer alignment degree between the two boards is further improved, and the problem of layer deviation caused by the separate browning treatment is prevented.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The embodiment provides a method for manufacturing a rigid-flex board, which includes a method for improving the alignment between layers of the rigid-flex board, and the specific process includes the following steps:
(1) cutting: cutting a soft board core board and a hard board core board according to the size of a jointed board, wherein the soft board core board is 0.1mm thick, the outer layer copper foil is 0.5OZ thick, and the soft board core board comprises a soft board area and a soft and hard combination area; the thickness of the hard board core board is 0.18mm, and the thickness of the outer layer copper foil is 0.5 OZ.
(2) And inner layer circuit manufacturing (negative film process): transferring inner layer patterns, coating a photosensitive film on the core board of the soft board by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing inner layer circuit exposure on the core board of the soft board by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed flexible printed circuit board core to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And brown oxidation: through a chemical reaction mode, a brown oxide layer is generated on the surface of the copper layer of the core plate of the flexible printed circuit board, so that the roughness of the copper surface is increased, and the bonding force with the covering film during pressing is enhanced.
(4) And pasting a covering film: aligning and attaching a cover film to a soft board area on a soft board core board, wherein one side of the cover film is 1mm larger than the soft board area; the cover film is a polyimide (PI material).
Before the lamination, windowing is carried out on the cover film with the same size as the soft board core board corresponding to the soft and hard combination area according to the shape of the soft board area.
(5) And quick pressing: the glue layer (epoxy resin) of the cover film is completely bonded with the soft board area of the soft board core board in a short time in a high-temperature and high-pressure mode, so that the effect of protecting the soft board area is achieved; the parameters of the rapid pressing are as follows: the temperature is 180 ℃, the pressure is 80KG, and the pressing time is 60 s.
(6) And baking the plate: baking the soft board core board for 1h at 150 ℃ to completely cure the covering film.
(7) And inner layer circuit manufacturing (negative film process): measuring the expansion and shrinkage coefficient of a soft board core plate, coating a photosensitive film on the hard board core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, carrying out exposure compensation according to the expansion and shrinkage coefficient of the soft board core plate, and completing the exposure of an inner layer circuit on the hard board core plate by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed hard board core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(8) And OPE punching: and punching rivet holes for pressing and positioning at the positions corresponding to the riveting positions on the soft board core board and the hard board core board respectively by using the same OPE punching machine.
(9) And windowing: selecting the non-flowing glue PP with the size of 520mm multiplied by 620mm, windowing the non-flowing glue PP at the position corresponding to the soft board area, wherein the unilateral opening size is 0-0.35mm larger than that of the soft board area, and removing the non-flowing glue PP at the position corresponding to the rivet hole during windowing.
(10) And cleaning: and cleaning the windowed non-flowing glue PP to remove dirt on the surface of the non-flowing glue PP and ensure the binding force during later pressing.
(11) And brown oxidation: the soft board core board and the hard board core board are subjected to brown oxidation treatment under the same conditions and environment, and a brown oxidation layer is generated on the surfaces of the copper layers of the soft board core board and the hard board core board in a chemical reaction mode, so that the roughness of the copper surface is increased, and the bonding force with the no-flow adhesive PP during pressing is enhanced.
According to the method, after the cover film is laminated in the soft board area, the expansion and shrinkage coefficient of the soft board core board is measured firstly, exposure compensation is carried out according to the expansion and shrinkage coefficient when the inner layer circuit of the hard board core board is manufactured, the interlayer alignment degree of the soft board core board and the hard board core board is ensured, the soft board core board and the hard board core board are aligned and laminated and then rivet holes are drilled in the soft board core board and the hard board core board together, the problem of OPE hole deviation caused by laminating the cover film is solved, the soft board core board and the hard board core board are punched simultaneously, the alignment degree of the rivet holes is guaranteed, the laminating quality of the soft and hard combined board is improved, and the partial rejection rate of the; and after the rivet hole is drilled, the soft board core board and the hard board core board are subjected to browning treatment at the same time in the same environment, namely, the interlayer alignment degree between the two boards is further improved, and the problem of layer deviation caused by the separate browning treatment is prevented.
(12) And pressing: after the soft board core board and the hard board core board are pre-laminated together by using the no-flow adhesive PP (the hard board core board, the no-flow adhesive PP, the soft board core board, the no-flow adhesive PP and the hard board core board are arranged in sequence from top to bottom), riveting is firstly carried out by using rivets through rivet holes, and then the laminated board is pressed by selecting proper lamination conditions according to the Tg of the board material to form the production board.
In the above, the hard board core board corresponding to the soft board area is not subjected to windowing treatment before pressing, but is removed in a laser cutting or groove milling mode after the later forming process, so that the soft board area can be effectively protected from being bitten by liquid medicine and rubbed by mechanical abrasion.
In the aforesaid, through the window size on the no-flow adhesive PP and the size cooperation of covering the membrane make the edge that covers the membrane after the pressfitting push down by no-flow adhesive PP, cover the membrane and be taken off in the lump when further preventing the later stage to take off the lid, and adopt no-flow adhesive PP to carry out the pressfitting, there is not the flow adhesive in the department of windowing, makes things convenient for the later stage accuse deep cutting and takes off the lid.
(13) And outer layer drilling: and drilling holes on the production plate by using a mechanical drilling mode according to the drilling data.
(14) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.
(15) And electroplating the whole plate, namely electroplating a layer of copper on the basis of copper deposition according to the mechanism of electrochemical reaction to ensure that the thickness of the hole copper meets the product requirement, and setting electroplating parameters according to the thickness of the finished hole copper.
(16) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(17) Solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the production plate and silk-printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process.
(18) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(19) And forming: according to the prior art and according to the design requirement, the shape tolerance is +/-0.05 mm.
(20) Laser cutting (gong platform): and performing depth control cutting on the production board at the position corresponding to the periphery of the soft board area by adopting a laser cutting mode, stripping the waste material corresponding to the soft board area on the production board from the product by uncovering (removing the part corresponding to the soft board area on the hard board core board after uncovering), exposing the inner soft board area part, forming a platform, and thus obtaining the rigid-flexible board.
In the above, the laser cutting method is suitable for manufacturing a 2-6 layer board, and the thickness of the hard board core board adjacent to the soft board core board is less than 0.2 mm; because of not having the flowing glue in the department of windowing on the flowing glue PP, thereby there is not the quality that laser firing flowing glue caused the production board to go wrong, consequently can adopt laser cutting's mode to control deep cutting, and can guarantee to take off the edge in the platform that forms behind the lid through laser cutting's mode and can not produce the burr, guarantee that the edge is neat slick and sly, improve the quality of finished product board, and the mode of relative control deep gong blind groove, can effectively improve the efficiency of cutting, and then improve the production efficiency of soft and hard combination board.
(21) Dispensing: and dispensing is carried out at the joint of the exposed platform edge (namely glue is applied to the joint of the soft board core board and the hard board core board at the platform edge), so that the strength of the joint is enhanced, and the phenomenon that the joint cracks when being bent or pulled is prevented.
(22) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(23) FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
(24) And packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (9)
1. A method for improving the interlayer alignment degree of a rigid-flex board is characterized by comprising the following steps:
s1, manufacturing an inner layer circuit on the soft board core board; in the finished product of the soft and hard combined board, the soft board core board comprises a soft board area and a soft and hard combined area;
s2, aligning and laminating the cover film in the soft board area on the soft board core board, and then measuring the expansion and contraction coefficient of the soft board core board;
s3, manufacturing an inner layer circuit on the hard board core board, and carrying out exposure compensation according to the expansion and contraction coefficient of the soft board core board when manufacturing the inner layer circuit;
s4, using the same OPE punching machine to drill rivet holes at the positions corresponding to the riveting positions on the soft board core board and the hard board core board respectively;
and S5, pre-laminating the soft board core board, the hard board core board and the no-flow rubber PP together, riveting by using rivets, and pressing to obtain the production board.
2. The method for improving the interlayer alignment of the rigid-flex board according to claim 1, wherein in step S2, the cover film is one side 1mm larger than the flexible board area.
3. The method of claim 1, wherein in step S2, the cover film is completely bonded to the core board by rapid bonding, and then the core board is baked to cure the cover film.
4. The method of claim 3, wherein in step S2, the parameters of the rapid bonding are: the temperature is 180 ℃, the pressure is 80KG, and the pressing time is 60 s.
5. The method of claim 1, wherein the soft core plate and the hard core plate are browned together before riveting in step S5.
6. The method of claim 1, wherein in step S5, before riveting, a window is opened on the non-flowing glue PP corresponding to the soft board area, and after the window is opened, a cleaning process is performed.
7. The method for improving the interlayer alignment of rigid-flexible printed circuit boards of claim 6, wherein the single edge of the window is 0-0.35mm larger than the area of the flexible printed circuit board.
8. The method for improving the interlayer alignment of the rigid-flex board as claimed in claim 1, wherein the step S5 is further followed by the steps of:
s6, sequentially carrying out outer layer drilling, copper deposition and whole board electroplating on the production board;
s7, sequentially manufacturing an outer layer circuit and a solder mask layer on the production board, and then carrying out surface treatment;
and S8, performing depth control cutting on the production board at the position corresponding to the periphery of the soft board area by adopting a laser cutting or grooving mode, and removing the part of the hard board core board corresponding to the soft board area after uncovering to obtain the rigid-flexible board.
9. The method of claim 8, wherein in step S8, after uncovering, a dispensing process is performed at the joint between the exposed edge of the flexible board area and the hard board core.
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| CN201810771289.5A CN108990317B (en) | 2018-07-13 | 2018-07-13 | Method for improving interlayer alignment degree of rigid-flex board |
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| CN201810771289.5A CN108990317B (en) | 2018-07-13 | 2018-07-13 | Method for improving interlayer alignment degree of rigid-flex board |
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| CN108990317B true CN108990317B (en) | 2021-05-28 |
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| CN110139505B (en) * | 2019-04-10 | 2021-06-25 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex board with local flexible board layering |
| CN109905976A (en) * | 2019-04-11 | 2019-06-18 | 信丰迅捷兴电路科技有限公司 | A kind of local laminating type of Rigid Flex cover film |
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| CN110933839A (en) * | 2019-12-03 | 2020-03-27 | 欣强电子（清远）有限公司 | Method for opening cover by mechanically forming soft and hard plates |
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
| CN114630509A (en) * | 2020-12-08 | 2022-06-14 | 深南电路股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN112839453B (en) * | 2021-01-20 | 2022-05-31 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN113179595B (en) * | 2021-03-25 | 2022-11-08 | 江西红板科技股份有限公司 | One-time plate milling and forming processing technology for soft and hard combined plate |
| CN116321683A (en) * | 2023-03-03 | 2023-06-23 | 江西景旺精密电路有限公司 | Semi-rigid-flex circuit board capable of realizing bidirectional and multidirectional bending and processing method thereof |
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