CN109195344B - Method for enhancing dry film adhesion of fine circuit printed board - Google Patents
Method for enhancing dry film adhesion of fine circuit printed board Download PDFInfo
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- CN109195344B CN109195344B CN201811114251.7A CN201811114251A CN109195344B CN 109195344 B CN109195344 B CN 109195344B CN 201811114251 A CN201811114251 A CN 201811114251A CN 109195344 B CN109195344 B CN 109195344B
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- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a method for enhancing the dry film adhesion of a fine circuit printed board, which comprises the following steps: pasting a film on the production board; then, an exposure machine is adopted to complete the exposure of the outer layer circuit on the production board; then, carrying out post-pressing treatment on the production board in a pressing mode; forming an outer layer circuit pattern on the production board after development; and then sequentially carrying out pattern electroplating, film stripping, etching and tin stripping on the production board, and etching an outer layer circuit on the production board. The method can greatly enhance the adhesive force between the film and the board surface by carrying out post-pressing treatment after the film is exposed, and effectively reduce the problems of film throwing and diffusion plating, thereby reducing the scrappage of short circuits or open circuit gaps caused by the film throwing and the diffusion plating and improving the yield of the manufactured circuit board.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for enhancing the dry film adhesion of a fine circuit printed board.
Background
At present, when a fine circuit is manufactured on a circuit board, a common method for increasing the adhesive force of the combination of a dry film and a board is to carry out super-roughening pretreatment on the board before film pasting so as to increase the roughness of the board surface, but the method does not greatly improve the adhesive force of the dry film for manufacturing the ultra-fine circuit printed board; namely, when the fine circuit with the line width and the line distance less than or equal to 50um is manufactured on the outer layer, the width of the residual dry film after development is very small due to the small line width and the small line distance, and the problem of film throwing or diffusion plating is often caused due to the insufficient adhesive force between the dry film and the surface of the circuit board, so that the problem of poor quality of the manufactured circuit such as short circuit or open circuit notch is caused, the manufactured circuit board is scrapped, and the production cost of the circuit board is improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for enhancing the dry film adhesion of a fine circuit printed board, which can greatly enhance the adhesion of a film and a board surface and effectively reduce the problems of film throwing and diffusion plating, thereby reducing the scrappage of short circuit or open circuit gaps caused by the film throwing and diffusion plating and improving the yield of manufactured circuit boards.
In order to solve the technical problem, the invention provides a method for enhancing the adhesion of a dry film of a fine circuit printed board, which comprises the following steps:
s1, pasting a film on the production board;
s2, then, an exposure machine is adopted to complete the exposure of the outer layer circuit on the production board;
s3, performing post-pressing treatment on the production board in a pressing mode;
s4, forming an outer layer circuit pattern on the production board after development;
and S5, sequentially carrying out pattern electroplating, film stripping, etching and tin stripping on the production board, and etching an outer layer circuit on the production board.
Preferably, in step S1, the production board is subjected to a pre-roughening treatment before the film is attached.
Preferably, in step S1, the dry film is attached to the surface of the production board by rapid pressing.
Preferably, in step S1, the parameters of the rapid press fit are: the temperature is 110 ℃, the pressure is 0.6MPa, and the speed is 1 m/min.
Preferably, in step S2, the production board after film pasting is exposed by an LDI exposure machine, and a 41-level exposure ruler is used for exposure, and the number of exposure grids is 19-20.
Preferably, in step S3, post-pressing is performed within 3-5min after the outer layer circuit exposure of the production board is completed.
Preferably, in step S3, the stitching parameters are: the temperature is 110 ℃, the pressure is 0.6MPa, the speed is 1m/min, and the time is 20 min.
Preferably, in step S4, the developing point at the time of development is 50 to 55%.
Preferably, the production board is a multilayer board formed by laminating an inner core board and an outer copper foil into a whole through a prepreg, and the multilayer board is subjected to drilling, copper deposition and full-board electroplating in sequence before step S1.
Preferably, the production board is a core board, and the core board has been subjected to drilling, copper deposition and full board electroplating in sequence before step S1.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the production board after film pasting is exposed, and then the exposed production board is subjected to post-pressing treatment, so that the adhesive force between the film and the board surface can be greatly enhanced, and the problems of film throwing and diffusion plating are effectively reduced, thereby reducing the scrappage of short circuit or open circuit gaps caused by film throwing and diffusion plating, and improving the yield of the manufactured circuit board; and the post-pressing treatment is controlled to be carried out within 3-5min after exposure, the cross-linking effect of the film in the period is not complete, and proper temperature and pressure are applied in the post-pressing process, so that the reaction is more thorough, the viscosity of the adhesive film is rapidly increased, the adhesive force between the film and the board surface is further enhanced, and the film and the board surface are attached more tightly.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The embodiment provides a method for manufacturing a circuit board with line width and line distance of 35-50 mu m, which comprises a method for enhancing the adhesion of a dry film of a fine circuit printed board, and the specific process comprises the following steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.2mm, and the thickness of the outer layer copper foil is 12 mu m.
(2) And copper reduction: and reducing the copper thickness of the outer layer on the core plate from 12 mu m to 5-6 mu m by using a belt grinding plate.
(3) And outer layer drilling: according to the drilling data, a mechanical drilling mode is used for drilling holes on the core plate, and the thickness-diameter ratio of the holes is 7.0.
(4) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.
(5) And electroplating the whole plate: according to the principle of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the copper in the hole is ensured to meet the requirement of a product, and the thickness of the copper on the surface of the core plate is plated to 10-12 mu m.
(6) And outer layer pretreatment: and (3) carrying out super-roughening pretreatment on the core board, and removing oil stains on the board surface of the core board and improving the board surface roughness, thereby enhancing the adhesive force between a dry film and the board surface of the core board in the later period.
(7) And manufacturing an outer layer circuit (positive process): the method specifically comprises the following steps:
s1, firstly, pasting a dry film on the core board.
Specifically, the dry film is attached to the surface of the core plate in a quick pressing mode, and the parameters of the quick pressing are as follows: the temperature is 110 ℃, the pressure is 0.6MPa, and the speed is 1 m/min.
And S2, exposing the core plate after film pasting by adopting an LDI exposure machine, and completing outer layer circuit exposure by using 19-20 exposure rulers (41 exposure rulers).
And S3, performing post-pressing treatment on the core board by adopting a pressing mode.
Specifically, post-pressing treatment is carried out within 3-5min after the core board is exposed to the outer layer circuit, and the parameters of pressing are as follows: the temperature is 110 ℃, the pressure is 0.6MPa, the speed is 1m/min, and the time is 20 min.
And S4, forming an outer layer circuit pattern on the core plate after development, wherein the development point is 50-55% during development.
S5, respectively plating copper and tin on the core board by adopting pulse VCP equipment, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is performed for 50min by using a current density of 2.3ASD, the pulse waveform is 7:1, the average copper thickness of the hole copper is more than or equal to 18um, the surface copper thickness is more than or equal to 30um, and the tin plating is performed for 8min by using a current density of 1.0ASD, and the tin thickness is 5-8 mu m; then, sequentially removing the film, etching and removing tin, and etching a fine outer layer circuit with the line width and the line distance of 35-50 mu m on the core plate; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(8) Solder resist and silk screen printing of characters: the green oil layer is manufactured on the outer layer of the core plate and characters are silk-screened, and the green oil thickness is as follows: 10-50 μm, so that the influence of environmental change on the core board can be reduced in the subsequent use process.
(9) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(10) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(11) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(12) FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
(13) And packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
Example 2
The embodiment provides a method for manufacturing a circuit board with line width and line distance of 35-50 mu m, which comprises a method for enhancing the adhesion of a dry film of a fine circuit printed board, and the specific process comprises the following steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.2mm, and the thickness of the outer layer copper foil is 12 mu m.
(2) And copper reduction: and reducing the copper thickness of the outer layer on the core plate from 12 mu m to 5-6 mu m by using a belt grinding plate.
(3) Inner layer circuit manufacturing (negative film process): transferring inner layer patterns, coating a photosensitive film on a core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing inner layer line exposure on the core plate by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(4) And pressing: after the core board and the outer layer copper foil are pre-laminated together by using the prepreg (the copper foil, the prepreg, the core board, the prepreg and the copper foil are arranged in the concrete board arrangement sequence from top to bottom), then the laminated board is pressed by selecting proper laminating conditions according to the Tg of the board material to form the production board.
(5) And outer layer drilling: according to the drilling data, a mechanical drilling mode is used for drilling holes on the production plate (the thickness-diameter ratio of the holes is 7.0).
(6) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.
(7) And electroplating the whole plate: according to the principle of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the hole copper is ensured to meet the requirement of a product, and the thickness of the copper on the surface of a production plate is plated to 10-12 mu m.
(8) And outer layer pretreatment: and carrying out super-roughening pretreatment on the production board for removing oil stains on the board surface of the production board and improving the board surface roughness, thereby enhancing the adhesive force between the dry film and the board surface of the production board in the later period.
(9) And manufacturing an outer layer circuit (positive process): the method specifically comprises the following steps:
s1, firstly, sticking a dry film on the production board.
Specifically, the dry film is attached to the surface of the production board in a quick pressing mode, and the parameters of the quick pressing are as follows: the temperature is 110 ℃, the pressure is 0.6MPa, and the speed is 1 m/min.
And S2, exposing the production board after film pasting by adopting an LDI exposure machine, and completing outer layer circuit exposure by using 19-20 exposure rules (41 exposure rules).
And S3, performing post-pressing treatment on the production board in a pressing mode.
Specifically, post-pressing treatment is carried out within 3-5min after the outer layer circuit exposure of the production board is completed, and the parameters of pressing are as follows: the temperature is 110 ℃, the pressure is 0.6MPa, the speed is 1m/min, and the time is 20 min.
And S4, forming an outer layer circuit pattern on the production board after development, wherein the development point is 50-55% during development.
S5, respectively plating copper and tin on the production plate by adopting pulse VCP equipment, setting plating parameters according to the required finished copper thickness, wherein the copper plating is performed for 50min by using a current density of 2.3ASD, the pulse waveform is 7:1, the average copper thickness of the hole copper is more than or equal to 18um, the surface copper thickness is more than or equal to 30um, the tin plating is performed for 8min by using a current density of 1.0ASD, and the tin thickness is 5-8 mu m; then, sequentially removing the film, etching and removing tin, and etching a fine outer layer circuit with the line width and the line distance of 35-50 mu m on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(10) Solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the production plate and silk-printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process.
(11) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(12) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(13) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(14) FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
(15) And packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (5)
1. A method for enhancing the adhesion of a dry film of a fine circuit printed board is characterized by comprising the following steps:
s1, pasting a film on the production board, and performing super-roughening pretreatment on the production board before pasting the film;
s2, then, an exposure machine is adopted to complete the exposure of the outer layer circuit on the production board; exposing the production plate with the film by using an LDI exposure machine, wherein a 41-level exposure ruler is adopted during exposure, and the number of exposure grids is 19-20;
s3, performing post-pressing treatment on the production board in a pressing mode; post-pressing treatment is carried out within 3-5min after the production board finishes the exposure of the outer layer circuit, and the parameters of pressing are as follows: the temperature is 110 ℃, the pressure is 0.6MPa, the speed is 1m/min, and the time is 20 min;
s4, forming an outer layer circuit pattern on the production board after development; the developing point during development is 50-55%;
and S5, sequentially carrying out pattern electroplating, film stripping, etching and tin stripping on the production board, and etching an outer layer circuit on the production board.
2. The method for enhancing the dry film adhesion of the fine printed circuit board according to claim 1, wherein in step S1, the dry film is attached to the surface of the production board by means of rapid press.
3. The method for enhancing dry film adhesion of a fine wired printed board according to claim 2, wherein in step S1, the parameters of the rapid press are: the temperature is 110 ℃, the pressure is 0.6MPa, and the speed is 1 m/min.
4. The method for enhancing the dry film adhesion of a fine printed circuit board according to any one of claims 1 to 3, wherein the production board is a multi-layer board in which an inner core board and an outer copper foil are laminated into a whole by a prepreg, and the multi-layer board has been subjected to drilling, copper deposition and full-board electroplating in sequence.
5. The method for enhancing dry film adhesion of a fine wired printed board according to any of claims 1-3, wherein the production board is a core board, and the core board has been subjected to drilling, copper plating and full board plating in sequence.
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| CN201811114251.7A CN109195344B (en) | 2018-09-25 | 2018-09-25 | Method for enhancing dry film adhesion of fine circuit printed board |
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| CN110662345A (en) * | 2019-09-26 | 2020-01-07 | 恩达电路(深圳)有限公司 | Signal transmission loss control method of 5G antenna circuit board |
| CN110996566B (en) * | 2019-12-27 | 2023-09-12 | 大连崇达电路有限公司 | Manufacturing method of high-definition multilayer circuit board |
| CN111935916B (en) * | 2020-08-27 | 2023-03-31 | 电子科技大学 | Printed circuit board including fine lines with line width of 30-50 μm and method of manufacturing the same |
| CN112954903A (en) * | 2021-01-19 | 2021-06-11 | 江门崇达电路技术有限公司 | Ultrathin high-density printed board and manufacturing method thereof |
| CN112996265A (en) * | 2021-02-09 | 2021-06-18 | 盐城维信电子有限公司 | Fine circuit board manufacturing method without compensation |
| CN114760771B (en) * | 2022-05-18 | 2023-11-07 | 福莱盈电子股份有限公司 | Method for protecting through hole on circuit board |
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| JP2016224162A (en) * | 2015-05-28 | 2016-12-28 | 日立化成株式会社 | Method for forming resist pattern, method for manufacturing printed wiring board and photosensitive element |
| TWI664497B (en) * | 2017-01-30 | 2019-07-01 | 日商旭化成股份有限公司 | Photosensitive resin composition, photosensitive resin laminated body, substrate on which photoresist pattern is formed, and method for manufacturing circuit board |
| CN106851998A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of fine and closely woven PCB circuits and preparation method |
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