CN110545633A - Manufacturing method of circuit board of blind hole plug-in - Google Patents
Manufacturing method of circuit board of blind hole plug-in Download PDFInfo
- Publication number
- CN110545633A CN110545633A CN201910768226.9A CN201910768226A CN110545633A CN 110545633 A CN110545633 A CN 110545633A CN 201910768226 A CN201910768226 A CN 201910768226A CN 110545633 A CN110545633 A CN 110545633A
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- Prior art keywords
- hole
- manufacturing
- board
- blind
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
the invention discloses a method for manufacturing a circuit board of a blind hole plug-in, which comprises the following steps: drilling a through hole at a position, corresponding to the blind hole for the plug-in, on the production board, wherein the aperture of the through hole is smaller than that of the blind hole; and the inner layer circuit is not exposed in the through hole; back drilling holes with the hole diameters larger than that of the through holes at the positions of the through holes through depth control, wherein the depth of the back drilling holes is the same as that of the blind holes; sequentially carrying out copper deposition and full-plate electroplating to metalize the through hole and the back drill hole; and then sequentially manufacturing an outer layer circuit, a solder mask layer, surface treatment and molding on the production board to obtain the circuit board. The method is suitable for manufacturing the circuit board with the plate thickness of more than or equal to 4mm or the thickness-diameter ratio of the blind hole of more than 1, and the bottom of the blind hole is made into the through hole in a large-hole and small-hole mode, so that the quality of the electroplated copper in the hole can be effectively ensured, and the connection reliability of the blind hole plug-in is ensured.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a circuit board of a blind hole plug-in.
Background
With the rapid development of the electronic technology, the PCB is also developing in a short, compact and light direction,
The assembly of the PCBA also becomes more spatially three-dimensional in the vertical direction. In order to meet different assembly requirements of a printed circuit board of a client, a PCB plate is provided with a local plug-in design; the specific requirements are as follows: the blind holes in the existing plate thickness (the plate thickness is more than or equal to 4mm) need to be manufactured into compression joint inserts, copper is arranged in the blind holes, the tolerance of the hole diameter is +/-0.05mm, and the blind holes do not need to penetrate through the whole plate (namely the design of the blind holes).
The main methods and defects of the prior art local insert are as follows:
1. the method is designed to press back and drill to form blind holes and then carry out blind hole electroplating, and the method in the industry requires that copper can be electroplated on the bottoms of the blind holes only when the thickness-diameter ratio of the blind holes is less than or equal to 1, namely the method is not suitable for being used when the plate thickness is more than or equal to 4mm or the thickness-diameter ratio of the blind holes is more than 1.
2. the design is a secondary pressing structure, the part needing to be provided with the blind hole is pressed for the first time, and the copper plate is electrically plated in a sub-plate mode so as to ensure copper plating in the hole; however, the secondary design process is high in cost, and when the copper plate is deposited in the through hole after the secondary pressing, the liquid medicine is hidden in the blind hole of the sub plate, so that the quality risk is high.
disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing a circuit board of a blind hole plug-in unit, which is suitable for manufacturing the circuit board with the thickness of more than or equal to 4mm or the thickness-diameter ratio of the blind hole of more than 1, and the bottom of the blind hole is made into a through hole by a mode of big holes and small holes, so that the good quality of electroplated copper in the hole can be effectively ensured, and the connection reliability of the blind hole plug-in unit is ensured.
In order to solve the technical problem, the invention provides a manufacturing method of a circuit board of a blind hole plug-in, which comprises the following steps:
S1, drilling a through hole at the position, corresponding to the blind hole for the plug-in, on the production board, wherein the aperture of the through hole is smaller than that of the blind hole; and the inner layer circuit is not exposed in the through hole;
S2, back drilling holes with the hole diameters larger than those of the through holes at the positions of the through holes through depth control, wherein the depth of the back drilling holes is the same as that of the blind holes;
S3, sequentially carrying out copper precipitation and full-plate electroplating to metalize the through hole and the back drilling hole;
and S4, sequentially manufacturing an outer layer circuit, a solder mask layer, surface treatment and molding on the production board to obtain the circuit board.
furthermore, the production board is a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg.
furthermore, the inner layer core board is manufactured with inner layer circuits before lamination, and the inner layer circuits are arranged to avoid the through holes.
Furthermore, the distance between the hole wall of the through hole and the inner layer circuit on the production board is controlled to be more than or equal to 0.5 mm.
Furthermore, the aperture of the through hole is controlled to be more than or equal to 0.25 mm.
Furthermore, the aperture of the back drilling hole is controlled to be more than or equal to 0.45 mm.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the small hole without exposing the inner layer circuit is drilled at the position corresponding to the blind hole, then the depth control back drilling is carried out to form the large small hole, and the bottom of the blind hole is made into the through hole, so that the electroplating liquid medicine can flow up and down through the through hole when the copper is electroplated, thus the good quality of the electroplating copper in the hole can be effectively ensured, the condition that the copper and the liquid medicine is not plated at the bottom of the blind hole is avoided, and the connection reliability of the blind hole plug-in unit is ensured.
drawings
FIG. 1 is a schematic illustration of an embodiment after drilling through holes in a production plate;
FIG. 2 is a schematic illustration of an embodiment after back drilling a hole in a production board;
FIG. 3 is a schematic diagram of the production plate in the example after copper deposition and full plate electroplating.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the circuit board of the blind via plug-in (taking 12 layers of boards with thickness greater than 4mm and 1-6 layers of plugs as examples) shown in this embodiment sequentially includes the following processing steps:
(1) Cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring inner layer pattern, coating photosensitive film with vertical coating machine, controlling film thickness of the photosensitive film to 8 μm, and completing inner layer circuit exposure with 6-8 exposure rulers (21 exposure rulers) by using full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3mil, and the inner layer circuit avoids the position of a blind hole plug-in unit at the later stage in the design process; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at a brown-oxidizing speed according to the thickness of the bottom copper, sequentially laminating a plurality of core plates, prepregs and outer copper foils according to requirements, and then laminating the laminated plates by selecting proper laminating conditions according to the Tg of the plates to form a 12-layer production plate.
(4) Drilling: according to the existing drilling technology, drilling a through hole 1 (shown in figure 1) at the position of a blind hole corresponding to a later plug-in unit on a production board according to the design requirement, wherein the aperture of the through hole 1 is smaller than that of the required blind hole; the inner layer circuit is not exposed in the through hole, namely the through hole is ensured not to be drilled to the surrounding inner layer circuit when being drilled, the inner layer circuit without the plug-in is prevented from being connected with the plug-in, the distance between the hole wall of the through hole and the inner layer circuit on the production board is controlled to be more than or equal to 0.5mm, and the problem that the inner layer circuit is exposed due to the influence of processing errors or deviation during drilling is avoided; under the condition of meeting the conditions, the through holes are enlarged as much as possible, the aperture of the through holes is generally controlled to be more than or equal to 0.25mm, and the processing procedure and the up-and-down circulation of electroplating liquid medicine at the later stage are facilitated.
(5) Back drilling: a back drilling hole 2 (shown in figure 2) with the aperture larger than that of the through hole 1 is drilled at the position of the through hole 1 in a depth control mode, so that a large hole is formed in the through hole, the depth of the back drilling hole 2 is the same as that of a blind hole required by the plug-in unit (namely, 1-6 layers of circuits are communicated), the aperture of the back drilling hole is generally controlled to be larger than or equal to 0.45mm in order to achieve the purpose of plug-in unit in the later period, and the connection reliability of the plug-in unit in the later period.
(6) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(7) electroplating the whole plate: the thickness of the via copper 3 was increased by performing full plate plating at a current density of 18ASF (see fig. 3).
(8) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(9) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(10) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(11) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(12) and forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(13) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(14) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(15) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (6)
1. a manufacturing method of a circuit board of a blind hole plug-in is characterized by comprising the following steps:
S1, drilling a through hole at the position, corresponding to the blind hole for the plug-in, on the production board, wherein the aperture of the through hole is smaller than that of the blind hole; and the inner layer circuit is not exposed in the through hole;
S2, back drilling holes with the hole diameters larger than those of the through holes at the positions of the through holes through depth control, wherein the depth of the back drilling holes is the same as that of the blind holes;
S3, sequentially carrying out copper precipitation and full-plate electroplating to metalize the through hole and the back drilling hole;
And S4, sequentially manufacturing an outer layer circuit, a solder mask layer, surface treatment and molding on the production board to obtain the circuit board.
2. The method for manufacturing a circuit board of a blind via package according to claim 1, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil together by a prepreg.
3. The method of manufacturing a circuit board with a blind via package as claimed in claim 2, wherein the inner layer core board has an inner layer circuit formed thereon before the press-fitting, and the inner layer circuit is disposed avoiding the through hole.
4. The method for manufacturing a circuit board of a blind via package according to claim 3, wherein the distance between the wall of the through hole and the inner layer circuit on the production board is controlled to be not less than 0.5 mm.
5. the method for manufacturing a circuit board of a blind via package according to claim 1, wherein the diameter of the through hole is controlled to be not less than 0.25 mm.
6. The method for manufacturing a circuit board of a blind via package according to claim 1, wherein the diameter of the back-drilled hole is controlled to be not less than 0.45 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768226.9A CN110545633A (en) | 2019-08-20 | 2019-08-20 | Manufacturing method of circuit board of blind hole plug-in |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768226.9A CN110545633A (en) | 2019-08-20 | 2019-08-20 | Manufacturing method of circuit board of blind hole plug-in |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110545633A true CN110545633A (en) | 2019-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910768226.9A Pending CN110545633A (en) | 2019-08-20 | 2019-08-20 | Manufacturing method of circuit board of blind hole plug-in |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112601342A (en) * | 2020-11-20 | 2021-04-02 | 惠州市三强线路有限公司 | Method for manufacturing embedded cavity of multilayer circuit board |
| CN113133206A (en) * | 2021-03-17 | 2021-07-16 | 东莞联桥电子有限公司 | Burr-free circuit board manufacturing process |
| CN114430609A (en) * | 2020-10-29 | 2022-05-03 | 深南电路股份有限公司 | Battery protection plate, processing method and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN102348337A (en) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | Method for producing circuit board containing stepped blind hole |
| CN103002674A (en) * | 2012-09-03 | 2013-03-27 | 杭州华三通信技术有限公司 | PCB (printed circuit board) back drilling method and PCB through hole structure |
| CN109874229A (en) * | 2017-12-04 | 2019-06-11 | 北大方正集团有限公司 | The manufacturing method and pcb board of pcb board stepped hole |
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2019
- 2019-08-20 CN CN201910768226.9A patent/CN110545633A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN102348337A (en) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | Method for producing circuit board containing stepped blind hole |
| CN103002674A (en) * | 2012-09-03 | 2013-03-27 | 杭州华三通信技术有限公司 | PCB (printed circuit board) back drilling method and PCB through hole structure |
| CN109874229A (en) * | 2017-12-04 | 2019-06-11 | 北大方正集团有限公司 | The manufacturing method and pcb board of pcb board stepped hole |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430609A (en) * | 2020-10-29 | 2022-05-03 | 深南电路股份有限公司 | Battery protection plate, processing method and electronic equipment |
| CN112601342A (en) * | 2020-11-20 | 2021-04-02 | 惠州市三强线路有限公司 | Method for manufacturing embedded cavity of multilayer circuit board |
| CN113133206A (en) * | 2021-03-17 | 2021-07-16 | 东莞联桥电子有限公司 | Burr-free circuit board manufacturing process |
| CN113133206B (en) * | 2021-03-17 | 2022-06-17 | 东莞联桥电子有限公司 | Burr-free circuit board manufacturing process |
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Application publication date: 20191206 |