CN113873764A - Method for manufacturing resin jack panel with precise line - Google Patents
Method for manufacturing resin jack panel with precise line Download PDFInfo
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- CN113873764A CN113873764A CN202111129951.5A CN202111129951A CN113873764A CN 113873764 A CN113873764 A CN 113873764A CN 202111129951 A CN202111129951 A CN 202111129951A CN 113873764 A CN113873764 A CN 113873764A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 239000011347 resin Substances 0.000 title claims abstract description 54
- 229920005989 resin Polymers 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 claims abstract description 63
- 239000010949 copper Substances 0.000 claims abstract description 63
- 238000005553 drilling Methods 0.000 claims abstract description 45
- 238000009713 electroplating Methods 0.000 claims abstract description 20
- 238000000151 deposition Methods 0.000 claims abstract description 18
- 230000008021 deposition Effects 0.000 claims abstract description 15
- 238000011049 filling Methods 0.000 claims abstract description 13
- 238000000227 grinding Methods 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 2
- 238000001556 precipitation Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 84
- 238000005530 etching Methods 0.000 description 13
- 238000007747 plating Methods 0.000 description 12
- 230000007547 defect Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005429 filling process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000008685 targeting Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing a resin jack panel with a precise line, which comprises the following steps: drilling a plug hole to be filled with resin on the inner daughter board, and metallizing the plug hole by copper deposition and full-board electroplating; filling resin in the plug holes and curing, and grinding the plate to flatten the surface of the plate; metallizing the resin surface in the plug hole by copper deposition and full-plate electroplating; manufacturing an inner layer circuit on the inner layer daughter board, and forming an inner layer bonding pad at the position of the plug hole; sequentially laminating the inner-layer daughter board and the outer-layer copper foil through prepregs according to the laminating sequence and then pressing to form a production board; drilling a blind hole at a position corresponding to the plug hole on the production plate by adopting laser, wherein the bottom of the blind hole is the surface of the inner-layer bonding pad; and filling the blind holes through copper deposition and hole filling electroplating processes in sequence. The method changes the resin hole plugging into a hole stacking design of 'resin hole plugging + outermost layer laser blind holes', and avoids the problems of line deviation and the like caused by the grinding of a plate between the drilled resin hole plugging and the outer layer through holes.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a resin jack panel with a precise circuit.
Background
In recent years, with the miniaturization of the assembled components, the wiring density of the printed circuit board is continuously improved, the planar density of the original continuously reduced aperture, line width and line distance tends to be a bottleneck, and the increase of the three-dimensional density becomes a new breakthrough point. On the basis, many customers design the via holes or blind buried holes in the connecting discs, which is called as disc inner holes, and the accompanying design is disc inner hole resin hole plugging design, namely, the via holes are plugged by resin, grinding and leveling are carried out by using abrasive belts after curing, redundant resin of the holes is removed, and then copper and board electricity are deposited on the surface of the hole plugging, and circuit patterns are manufactured.
The resin hole plugging plate has two main manufacturing processes, namely a whole plate hole plugging process and a selective hole plugging process, and the specific manufacturing process comprises the following steps:
and (3) a whole plate hole filling process: the former process → pressing → targeting site hole 1 → drilling resin hole → copper deposition 1 → board electric 1 → outer layer plating hole pattern → plating hole → film removal → resin hole → ceramic grinding board → targeting site hole 2 → outer layer drilling → copper deposition 2 → board electric 2 → outer layer pattern → pattern plating → outer layer etching → the latter process.
And (3) selective hole plugging process: the method comprises the steps of a front process → pressing → target position hole hitting → outer layer drilling (including resin hole drilling) → copper deposition 1 → board electronics 1 (plating to the required hole copper thickness in one step) → resin hole plugging → ceramic grinding board → copper deposition 2 → board electronics 2 → outer layer graphics → outer layer etching → a rear process.
The whole plate hole filling process comprises a secondary drilling process, a ceramic grinding plate (grinding resin) is arranged between the secondary drilling process and the primary drilling process, the size expansion and contraction coefficients of the production plate are not uniform, and particularly, the secondary drilling process and the outer layer circuit dislocation scrapping are easily caused due to the precise circuit;
the selective hole plugging process has requirements on the distance between the resin hole plugging and the through hole, and simultaneously, because all hole copper and surface copper are plated to the requirements of customers during board electricity, the thickness of bottom copper is very thick (the thickness of pressing starting copper plus the plating layer is 30 microns), incomplete etching is brought to a precise fine line, or no pre-large space is left during etching, so that the line is scrapped.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing a resin plug hole plate with a precise line, which changes the resin plug hole into a hole-overlapping design of 'resin plug hole + outermost layer laser blind hole', and avoids the problems of line deviation and the like caused by plate grinding between the drilled resin plug hole and an outer layer through hole.
In order to solve the technical problem, the invention provides a method for manufacturing a resin plugging plate with a precise line, which comprises the following steps:
s1, drilling a plug hole to be filled with resin on the inner daughter board, and metallizing the plug hole by copper deposition and full-board electroplating in sequence;
s2, filling resin in the plug holes and curing, and then grinding the board to flatten the board surface;
s3, sequentially carrying out copper precipitation and full-plate electroplating to metalize the resin surface in the plug hole;
s4, manufacturing an inner layer circuit on the inner layer daughter board, and forming an inner layer bonding pad at the position of the plug hole;
s5, sequentially laminating the inner-layer daughter board and the outer-layer copper foil through prepregs according to the laminating sequence, and then pressing to form a production board;
s6, drilling a blind hole at a position corresponding to the plug hole on the production board by adopting a laser drilling mode, wherein the bottom of the blind hole is the surface of the inner-layer bonding pad;
and S7, metallizing the blind holes through a copper deposition process, and filling the blind holes through a hole filling electroplating process.
Further, in step S1, the inner daughter board is a multi-layer board formed by laminating an inner core board and a copper foil together by a prepreg, and the inner core board has an inner circuit before lamination.
Further, in step S1, before drilling the plug hole, a first target hole is drilled in the inner daughter board; when drilling the plug hole, the first target position hole is used as a positioning hole.
Further, the following steps are included between steps S5 and S6:
and S51, scraping the secondary outer layer target out by using laser to serve as a positioning target for laser drilling.
Further, the following steps are included between steps S51 and S6:
s52, performing LDD brown processing on the production plate.
Further, step S7 is followed by the following steps:
s8, thinning the copper thickness on the surface of the production plate through microetching;
s9, drilling on the production plate;
and S10, sequentially carrying out copper deposition, full-plate electroplating, outer-layer circuit manufacturing, solder mask manufacturing, surface treatment and molding on the production plate to obtain the resin jack plate.
Further, in step S8, the copper layer is controlled to have a thickness of 20-25 μm after the microetching.
Further, in step S9, before drilling, a third target hole is drilled in the production board, and then drilling is performed using the third target hole as a positioning hole.
Compared with the prior art, the invention has the following beneficial effects:
according to the method, through optimizing a press-fit structure, a resin plug hole is firstly manufactured on an inner-layer sub-board, then a blind hole communicated with the resin plug hole is drilled on a pressed production board by utilizing laser, so that the resin plug hole is changed into a hole-stacking design of 'the resin plug hole and an outermost-layer laser blind hole', the steps of drilling the resin plug hole and grinding the production board are reduced, namely, the expansion and shrinkage coefficient of the board is not changed before drilling the outer layer on the production board, and the problems of line deviation and the like caused by the grinding board existing between the drilling of the resin plug hole and the outer-layer through hole are avoided; the surface of the resin is plated with a copper layer to form an inner-layer bonding pad, and the bonding force and the connection reliability between the copper layer plated in the blind hole and the copper layer plugged in the blind hole are improved by utilizing a mode of electroplating and filling the blind hole; in addition, after the laser blind hole is electroplated and filled with the hole, the copper thickness is controlled by utilizing microetching to reduce copper, the through hole is normally drilled, the copper is deposited and electroplated, and the precise line is manufactured, so that the problems of spacing limitation of resin hole filling and the through hole, unclean line etching, line fineness and the like existing in the selective hole filling process are solved; and the three times of drilling respectively adopt different target position holes or targets as positioning points, so that the deviation caused by expansion and contraction when the same target position hole is adopted is reduced, and the alignment accuracy of the inner layer and the outer layer is improved.
Drawings
FIG. 1 is a schematic view of a resin plugging plate in the example.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the resin jack panel with the precise circuit shown in this embodiment includes a variegated ink solder-resist process, and sequentially includes the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 oz.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film with a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 μm, completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming the inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at a speed of brown-oxidizing according to the thickness of the copper of the bottom copper, sequentially laminating the core plate, the prepreg and the copper foil according to requirements, and then laminating the laminated plate by selecting proper laminating conditions according to the Tg of the plate material to form the four-layer inner-layer sub-plate.
(4) Drilling a target position hole; according to the existing drilling technology, a first target position hole is drilled on the inner layer sub-plate according to the design requirement.
(5) Drilling: according to the existing drilling technology, the first target position hole is used as a positioning hole, and a plug hole to be filled with resin is drilled on the inner daughter board according to the design requirement.
(6) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(7) Electroplating the whole plate: and performing full-plate electroplating for 120min at the current density of 18ASF, thickening the thicknesses of the hole copper and the plate surface copper layer, and plating the hole copper of the plug hole to the thickness required by the design at one time.
(8) Resin hole plugging: and filling resin in the plug holes and curing, and then removing the resin protruding out of the board surface through a ceramic grinding board to enable the board surface to be flat and avoid the influence of resin residue on the board surface on the electrical conductivity.
(9) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film with a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 μm, completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming the inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed inner layer daughter board to form an inner layer circuit, measuring the line width of the inner layer to be 3mil, and forming an inner layer bonding pad at the position of the plug hole; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(10) And (3) laminating: the brown oxidation speed is that brown oxidation is carried out according to the thickness of the bottom copper, the inner layer sub-board, the prepreg and the outer layer copper foil are sequentially overlapped according to requirements, and then the laminated board is pressed by selecting proper lamination conditions according to the Tg of the board material to form a production board; the specific stacking sequence is as follows: outer copper foil, prepreg, inner daughter board, prepreg and outer copper foil.
(11) Drilling out a target; and scraping the secondary outer layer target by using laser to serve as a positioning target for laser drilling.
(12) LDD brown oxidation: the production plate is subjected to LDD (laser-induced Drain diode) browning treatment, and the copper surface formed after the LDD browning treatment has a uniform honeycomb structure, so that the laser energy can be absorbed, and the laser drilling at the later stage is facilitated.
(13) Laser drilling: and drilling a blind hole at a position corresponding to the plug hole on the production plate by using the secondary outer layer target as a positioning target and according to design requirements in a laser drilling mode, wherein the bottom of the blind hole is the surface of the inner layer bonding pad.
(14) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the wall of the blind hole by using a chemical copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(15) Hole filling and electroplating: the blind via is then filled by a via-fill electroplating process (as shown in fig. 1).
(16) Micro-etching: the copper thickness of the surface of the production board is reduced through microetching, so that the thickness of the board copper layer is controlled to be 20-25 mu m, and the situation that the board copper layer is too thick to influence the manufacturing of a fine circuit is avoided.
(17) Drilling a target position hole; according to the prior art, a third target site hole is drilled in the production board according to design requirements.
(18) Drilling an outer layer: according to the existing drilling technology, the third target position hole is used as a positioning hole, and drilling processing is carried out on the production plate according to design requirements.
(19) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(20) Electroplating the whole plate: and performing full-plate electroplating for 120min at the current density of 18ASF to increase the thickness of the hole copper and the plate surface copper layer.
(21) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board, wherein the copper thickness of the outer layer circuit is more than or equal to 70 mu m; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(22) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, the TOP surface solder resist ink is added with a UL mark on the TOP surface character, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need welding, and the protective layer plays a role in beautifying the appearance.
(23) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(24) Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(25) Molding: according to the prior art and according to the design requirement, the shape is milled, the tolerance of the shape is +/-0.05mm, and the resin plugging plate is prepared.
(26) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(27) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(28) Packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (8)
1. A method for manufacturing a resin jack panel with a precise line is characterized by comprising the following steps:
s1, drilling a plug hole to be filled with resin on the inner daughter board, and metallizing the plug hole by copper deposition and full-board electroplating in sequence;
s2, filling resin in the plug holes and curing, and then grinding the board to flatten the board surface;
s3, sequentially carrying out copper precipitation and full-plate electroplating to metalize the resin surface in the plug hole;
s4, manufacturing an inner layer circuit on the inner layer daughter board, and forming an inner layer bonding pad at the position of the plug hole;
s5, sequentially laminating the inner-layer daughter board and the outer-layer copper foil through prepregs according to the laminating sequence, and then pressing to form a production board;
s6, drilling a blind hole at a position corresponding to the plug hole on the production board by adopting a laser drilling mode, wherein the bottom of the blind hole is the surface of the inner-layer bonding pad;
and S7, metallizing the blind holes through a copper deposition process, and filling the blind holes through a hole filling electroplating process.
2. The method of claim 1, wherein in step S1, the inner daughter board is a multi-layer board formed by laminating an inner core board and a copper foil together by a prepreg, and the inner core board has an inner circuit formed thereon before lamination.
3. The method for manufacturing a resin jack panel with a precision line according to claim 1, wherein in step S1, before the jack is drilled, a first target hole is drilled in the inner daughter panel; when drilling the plug hole, the first target position hole is used as a positioning hole.
4. The method for manufacturing the resin jack panel with the precise circuit according to claim 1, wherein the steps between S5 and S6 further comprise the following steps:
and S51, scraping the secondary outer layer target out by using laser to serve as a positioning target for laser drilling.
5. The method for manufacturing the resin jack panel with the precise circuit according to claim 4, wherein the steps between S51 and S6 further comprise the following steps:
s52, performing LDD brown processing on the production plate.
6. The method for manufacturing the resin jack panel with the precise circuit according to claim 1, wherein the step S7 is followed by the following steps:
s8, thinning the copper thickness on the surface of the production plate through microetching;
s9, drilling on the production plate;
and S10, sequentially carrying out copper deposition, full-plate electroplating, outer-layer circuit manufacturing, solder mask manufacturing, surface treatment and molding on the production plate to obtain the resin jack plate.
7. The method of claim 6, wherein the step S8 is carried out by microetching to reduce the thickness of the copper layer on the board surface to 20-25 μm.
8. The method of claim 6, wherein in step S9, before drilling, a third target hole is drilled on the production board, and then drilling is performed using the third target hole as a positioning hole.
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| CN202111129951.5A CN113873764A (en) | 2021-09-26 | 2021-09-26 | Method for manufacturing resin jack panel with precise line |
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| CN202111129951.5A CN113873764A (en) | 2021-09-26 | 2021-09-26 | Method for manufacturing resin jack panel with precise line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501817A (en) * | 2022-02-16 | 2022-05-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing blind hole plate by chemical etching |
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| CN106455368A (en) * | 2016-11-25 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
| CN112752435A (en) * | 2020-11-25 | 2021-05-04 | 珠海崇达电路技术有限公司 | Method for improving pad removal of blind holes of multi-order circuit board and multi-order circuit board |
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2021
- 2021-09-26 CN CN202111129951.5A patent/CN113873764A/en active Pending
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| US20050251997A1 (en) * | 2004-05-12 | 2005-11-17 | Advanced Semiconductor Engineering Inc. | Method for forming printed circuit board |
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| CN106455368A (en) * | 2016-11-25 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501817A (en) * | 2022-02-16 | 2022-05-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing blind hole plate by chemical etching |
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Application publication date: 20211231 |