CN110933875A - Manufacturing method of copper-embedded PCB - Google Patents
Manufacturing method of copper-embedded PCB Download PDFInfo
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- CN110933875A CN110933875A CN201911130704.XA CN201911130704A CN110933875A CN 110933875 A CN110933875 A CN 110933875A CN 201911130704 A CN201911130704 A CN 201911130704A CN 110933875 A CN110933875 A CN 110933875A
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- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a PCB (printed circuit board) with a copper block embedded. According to the invention, when the inner layer circuit is manufactured on the inner layer core board, copper used for manufacturing the copper embedding groove area is etched and removed to form the copper removing area with a single side larger than the size of the copper embedding groove, and the copper embedding groove is milled after the inner layer core board and the prepreg form the pre-stacking structure. The side wall of the embedded copper block is a rough surface, and a pit is arranged on the surface of the embedded copper block, which is in contact with the prepreg, so that the position of the embedded copper block is fixed, the problems of excessive glue overflow or cavities caused by poor glue filling at the periphery of the embedded copper block after pressing are effectively avoided, and the quality defects of insufficient binding force between the copper block and the substrate and the like are overcome.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a PCB with a copper block embedded.
Background
With the development of diversification, multifunctionality and high integration of electronic products in the modern society, the high-density and diversified structural design of the PCB is promoted. Particularly, with the advent of the 5G era, high-frequency and high-speed PCBs are increasingly used. High frequency and high speed PCBs need to provide high speed, low loss, low delay, high quality signal transmission, and also need to be adapted to high power consumption environment of high frequency and high power devices. The larger the internal power consumption of the PCB is, the more crowded the heat dissipation channel is, the more rapidly the integral heat rises, and the electrical performance of the PCB is easy to decline and even damage when the PCB works for a long time. Therefore, it is important to solve the heat dissipation problem of the PCB.
At present, various design schemes are provided for solving the heat dissipation problem of the PCB, such as high heat conduction material design, thick copper substrate, metal substrate, dense heat dissipation hole design, embedded copper block design and the like. In contrast, directly embedding a copper metal block in a PCB is one of effective ways to solve the problem of heat dissipation. The embedded copper block integrates small high-heat-conductivity metal copper in a local area of the multilayer PCB in a passive device embedding mode, and the problem of local heat dissipation of the PCB is solved in a targeted mode. The manufacturing process of the copper block embedded PCB product generally comprises the following steps: cutting (copper block, inner core board, prepreg and copper foil) → inner layer pattern → inner layer AOI → OPE punching → inner layer milling board (inner core board milling groove) → milling prepreg → placing copper block behind lamination → pressing → grinding board → targeting → drilling → copper deposition and whole board electroplating → outer layer pattern → post process.
The existing manufacturing method of the PCB product with the embedded copper block generally comprises the steps of directly milling grooves on an inner-layer core board and a prepreg, wherein the shape of a groove hole is consistent with that of the copper block, the size of the groove hole is larger than that of the copper block, each core board and the prepreg which are penetrated through the groove hole are subjected to a groove milling process, and the production efficiency is low. On the other hand, the copper-embedded block penetrates through the whole PCB surface, when the stepped copper block is placed in a laminating mode, due to the influence of factors such as core plate expansion and contraction and lamination, the edges of the stepped groove formed after the inner core plate and the prepreg are pre-laminated are uneven, so that the alignment accuracy of the copper-embedded block and the groove hole is poor, the difficulty of placing the copper-embedded block into the groove hole is high, and particularly for the stepped copper-embedded block, the difficulty of placing the stepped copper-embedded block into the stepped groove is higher. On the other hand, in the pressing process, part of the embedded copper block moves in the slot hole, so that the problems of excessive glue overflow or cavities caused by poor glue filling at the periphery of the copper block and quality defects such as insufficient binding force between the copper block and the substrate are caused.
Disclosure of Invention
Aiming at the problems existing in the manufacture of the copper-embedded PCB product, the invention provides a method for manufacturing the copper-embedded PCB, which can improve the production efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme.
A manufacturing method of a PCB with a copper block embedded comprises the following steps:
and S1, manufacturing an inner layer circuit on the inner layer core board, and etching and removing a copper layer of an area for forming the copper embedding groove on the inner layer core board, wherein the area is called a copper removing area, and the size of the copper removing area is larger than that of a single side of the size of the copper embedding groove.
Preferably, the size of the copper removing region is larger than the size of the copper embedding groove by more than 0.075 mm.
And S2, pre-stacking the inner core board and the prepreg according to the design requirement and fixing the inner core board and the prepreg together to form a pre-stacked structure.
Preferably, the inner core board and the prepreg are pre-stacked according to design requirements and fixed together by means of fusion and riveting.
Preferably, before the inner core board and the prepreg are pre-stacked together according to the design requirement, positioning holes are respectively drilled in the periphery of the inner core board and the middle position of the copper removing area, and in the periphery of the prepreg and the area corresponding to the middle position of the copper removing area; in the next step S3, the copper groove is milled and positioned by the positioning hole.
Further, when the copper-embedded block is a stepped copper-embedded block, and the copper-embedded groove is a stepped groove, in step S2, a milling groove lead hole is respectively drilled at the edge of the copper-removed area of the inner core board and at the edge of the area corresponding to the copper-removed area on the prepreg; in the next step S3, when the stepped groove is milled, the stepped groove is milled from the milling groove lead hole.
And S3, milling a copper embedding groove at the copper removing area of the pre-laminated structure, wherein the size of the copper embedding groove is larger than that of the single side of the copper embedding block.
Preferably, the size of the copper embedding groove is larger than the size of the copper embedding block by more than 0.075 mm.
S4, placing the copper embedding block into the copper embedding groove, and then pressing the pre-stacked structure and the outer-layer copper foil into a whole through a prepreg to form the multilayer production plate.
Preferably, before the copper embedding block is placed in the copper embedding groove, dust on the surface of the multilayer production plate is firstly adhered and removed by a dust adhering roller.
Preferably, the side wall of the copper embedding block is a rough surface, and a pit is arranged on one surface of the copper embedding block, which is in contact with the prepreg.
Preferably, before the copper-embedded block is placed in the copper-embedded groove, the side wall of the copper-embedded block is roughened, so that a rough surface is formed on the side wall of the copper-embedded block; and manufacturing a plurality of pits on the surface of the copper-embedded block, which is in contact with the prepreg, by etching or laser.
And S5, sequentially carrying out plate grinding, drilling, copper deposition, full-plate electroplating, outer-layer circuit manufacturing, solder mask manufacturing, surface treatment and forming on the multilayer production plate to obtain the PCB with the embedded copper blocks.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, when the inner layer circuit is manufactured on the inner layer core board, copper used for manufacturing the copper embedding groove area is etched and removed to form the copper removing area with a single side larger than the size of the copper embedding groove, and the copper embedding groove is milled after the inner layer core board and the prepreg form the pre-stacking structure. The side wall of the embedded copper block is a rough surface, a pit is arranged on the side of the embedded copper block, which is in contact with the prepreg, so that the position of the embedded copper block is favorably fixed when the prepreg starts to be gradually melted in the pressing process, the embedded copper block is not easy to move, the problem of excessive glue overflow or cavity caused by poor glue filling at the periphery of the embedded copper block after pressing is effectively avoided, and the quality defects of insufficient binding force between the copper block and a substrate and the like are effectively overcome. The size in the district that removes copper is more than the unilateral 0.075mm that is big of size that buries the copper groove, can prevent effectively that the gong from milling the piece that forms when burying the copper groove from getting into between the intermediate layer and with the copper face contact of inlayer core. All set up the locating hole that is used for milling to bury the copper groove around panel and in the middle of the district that removes copper, can ensure to bury the position precision of copper groove, work as bury the copper groove and when the ladder groove, still can ensure that the center of the heavy-calibre section slotted hole of ladder groove and the small-bore section slotted hole keeps unanimous, improves the preparation precision of ladder groove.
Drawings
FIG. 1 is a schematic view of an inner core plate in an embodiment in which positioning holes and milling grooves and leading holes are drilled;
fig. 2 is a schematic view of the copper-buried block in the embodiment.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
The embodiment provides a method for manufacturing a copper-embedded PCB, wherein the copper-embedded block is a stepped copper-embedded block, and a copper-embedded groove for placing the copper-embedded block is a stepped groove. The method comprises the following steps:
(1) cutting: and cutting the core board and the prepreg according to the size of the jointed board of 520mm multiplied by 620 mm.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and etching and removing the copper layer in the area for forming the copper embedding groove on the inner-layer core plate, wherein the area is called a copper removing area, and the size of the copper removing area is 0.075mm larger than the size of the single side of the copper embedding groove.
(3) Inner layer AOI: and the inner layer AOI is used for checking the inner layer graph according to design requirements, checking the defects of the inner layer circuit such as open short circuit, circuit notch, circuit pinhole and the like, discarding the defects, and discharging the defect-free product to the next flow.
(4) And (3) OPE punching: a positioning hole is respectively drilled at the periphery of the inner core plate and the middle position of the copper removing area, and a milling groove lead hole is drilled at the edge of the copper removing area of the inner core plate, as shown in figure 1. Respectively drilling a positioning hole in the periphery of the prepreg and the area corresponding to the middle position of the copper removing area; and drilling a milling groove lead hole on the edge of the area of the prepreg corresponding to the copper removing area.
(5) Pre-stacking: and pre-stacking the inner core plate and the prepreg according to the design requirement, and fixing the inner core plate and the prepreg together in a fusion and riveting mode to form a pre-stacked structure.
(6) Milling a copper embedding groove: and milling a copper embedding groove at a copper removing area of the pre-stacked structure, wherein the size of the copper embedding groove is 0.075mm larger than the size of the single side of the copper embedding block. And positioning by using the positioning hole when the copper embedding groove is milled, milling the stepped groove from the lead hole of the milling groove, firstly milling the groove of the large-caliber section, then milling the groove of the small-caliber section, and forming the stepped copper embedding groove by using the groove of the large-caliber section and the groove of the small-caliber section.
(7) And (3) laminating: and adhering dust on the surface of the multilayer production plate by using a dust adhering roller, then placing the copper embedding block into a copper embedding groove, selecting a laminating condition according to the Tg of the plate material, and laminating the pre-laminated structure and the outer copper foil into a whole by using a prepreg to form the multilayer production plate.
The side wall of the copper-embedded block is a rough surface, and a pit is arranged on the surface of the copper-embedded block, which is in contact with the prepreg, as shown in fig. 2. The copper-embedded block with a smooth surface can be processed into the copper-embedded block described in this embodiment by the following method: coating the side wall of the copper-buried block with a microetching solution to microetch the side wall so as to form a rough surface; dropping alkaline etching liquid used for manufacturing an outer layer circuit on the surface of the copper-embedded block, which is in contact with the prepreg, and etching a pit; or adopting a laser copper burning mode to burn a pit on the surface of the copper-embedded block, which is in contact with the prepreg.
(8) Grinding a plate: and removing the overflowing glue formed in the pressing process by grinding the plate.
(9) Drilling: the existing drilling technology is adopted, and drilling is carried out on the production plate according to design requirements.
(10) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(11) Electroplating the whole plate: and (5) performing full-plate electroplating for 60min at the current density of 2.1ASF to thicken the hole copper.
(12) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then, the film is removed, etching and tin removal are carried out in sequence, and an outer layer circuit is etched on the production board.
(13) Outer layer AOI: and using an automatic optical detection system to detect whether the outer layer circuit has defects such as open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(14) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and meanwhile, the effect of beautifying the appearance is achieved.
(15) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(16) Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(17) Molding: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(18) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(19) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(20) Packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (10)
1. A manufacturing method of a PCB with a copper block embedded is characterized by comprising the following steps:
s1, manufacturing an inner layer circuit on the inner layer core board, and etching to remove a copper layer on the inner layer core board in an area for forming the copper embedding groove, wherein the area is called a copper removing area, and the size of the copper removing area is larger than that of a single side of the copper embedding groove;
s2, pre-stacking the inner core board and the prepreg according to design requirements and fixing the inner core board and the prepreg together to form a pre-stacked structure;
s3, milling a copper embedding groove at a copper removing area of the pre-laminated structure, wherein the size of the copper embedding groove is larger than that of a single side of the copper embedding block;
s4, placing the copper embedding block into the copper embedding groove, and then pressing the pre-stacked structure and the outer-layer copper foil into a whole through a prepreg to form a multilayer production board;
and S5, sequentially carrying out plate grinding, drilling, copper deposition, full-plate electroplating, outer-layer circuit manufacturing, solder mask manufacturing, surface treatment and forming on the multilayer production plate to obtain the PCB with the embedded copper blocks.
2. The method of claim 1, wherein the size of the copper removal region is greater than the size of the copper embedding groove by more than 0.075 mm.
3. The method as claimed in claim 1, wherein the size of the copper embedding groove is larger than the size of the copper embedding block by more than 0.075 mm.
4. The method of claim 1, wherein in step S2, the inner core board and the prepreg are pre-stacked according to design requirements and fixed together by fusing and riveting.
5. The method for manufacturing the PCB with the embedded copper blocks as claimed in claim 1, wherein in step S2, before the inner core board and the prepreg are pre-laminated together according to design requirements, positioning holes are respectively drilled at the periphery of the inner core board and the middle position of the copper removing area, and at the periphery of the prepreg and the area corresponding to the middle position of the copper removing area; in step S3, when the copper groove is milled, the positioning hole is used for positioning.
6. The method of claim 5, wherein the copper-embedded PCB is a stepped copper-embedded block, the copper-embedded groove is a stepped groove, and in step S2, a milled-groove via hole is drilled on the edge of the copper-removed area of the inner core and the edge of the area corresponding to the copper-removed area of the prepreg respectively; in step S3, when the stepped groove is milled, the stepped groove is milled from the milling groove lead hole.
7. The method of claim 1, wherein in step S4, before the copper-embedded block is placed in the copper-embedded slot, a dust roller is used to remove dust on the surface of the multi-layer production board.
8. The method of claim 1, wherein in step S4, before the copper-buried block is placed in the copper-buried groove, the side wall of the copper-buried block is roughened to form a rough surface.
9. The method of claim 1, wherein before the copper-embedded PCB is placed in the copper-embedded groove, a plurality of pits are formed on a surface of the copper-embedded PCB, which is in contact with the prepreg, by etching or laser in step S4.
10. The method as claimed in claim 1, wherein the side wall of the copper-embedded block is rough, and a surface of the copper-embedded block contacting the prepreg is provided with a concave pit.
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| CN201911130704.XA CN110933875A (en) | 2019-11-18 | 2019-11-18 | Manufacturing method of copper-embedded PCB |
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| CN201911130704.XA CN110933875A (en) | 2019-11-18 | 2019-11-18 | Manufacturing method of copper-embedded PCB |
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| CN111901966A (en) * | 2020-07-20 | 2020-11-06 | 深圳崇达多层线路板有限公司 | Communication PCB backboard and pressing and arranging method of buried copper plate |
| CN111954390A (en) * | 2020-08-17 | 2020-11-17 | 龙岩金时裕电子有限公司 | Method for manufacturing thick copper circuit board |
| CN112235956A (en) * | 2020-11-06 | 2021-01-15 | 惠州市盈帆实业有限公司 | Production and manufacturing process of copper-embedded circuit board based on PVC material |
| CN112601355A (en) * | 2020-11-07 | 2021-04-02 | 奥士康科技股份有限公司 | Processing method and structure of copper-embedded block |
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| CN112601355A (en) * | 2020-11-07 | 2021-04-02 | 奥士康科技股份有限公司 | Processing method and structure of copper-embedded block |
| CN112601355B (en) * | 2020-11-07 | 2024-05-17 | 奥士康科技股份有限公司 | Buried copper block processing method and structure |
| CN113473716A (en) * | 2021-06-29 | 2021-10-01 | 景旺电子科技(龙川)有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN113453434A (en) * | 2021-07-08 | 2021-09-28 | 深圳市企鹅网络科技有限公司 | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board |
| CN113660780A (en) * | 2021-08-04 | 2021-11-16 | 深圳崇达多层线路板有限公司 | Copper-buried circuit board and manufacturing method thereof |
| CN113905506A (en) * | 2021-10-11 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving bonding force between copper-embedded block and circuit board |
| CN115866880A (en) * | 2023-02-28 | 2023-03-28 | 上海安理创科技有限公司 | Test board for testing semiconductor and manufacturing process thereof |
| CN115866880B (en) * | 2023-02-28 | 2023-04-28 | 上海安理创科技有限公司 | Test board for semiconductor test and manufacturing process thereof |
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| CN117042305B (en) * | 2023-10-09 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Manufacturing method for improving flatness of copper-clad laminate |
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Application publication date: 20200327 |