CN112601355B - Buried copper block processing method and structure - Google Patents
Buried copper block processing method and structure Download PDFInfo
- Publication number
- CN112601355B CN112601355B CN202011236422.0A CN202011236422A CN112601355B CN 112601355 B CN112601355 B CN 112601355B CN 202011236422 A CN202011236422 A CN 202011236422A CN 112601355 B CN112601355 B CN 112601355B
- Authority
- CN
- China
- Prior art keywords
- copper
- copper block
- core plate
- inner core
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010949 copper Substances 0.000 title claims abstract description 122
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 115
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 114
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 238000004080 punching Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 5
- 230000008685 targeting Effects 0.000 claims description 7
- 239000012943 hotmelt Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 2
- 238000003801 milling Methods 0.000 abstract 1
- 230000008602 contraction Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a processing method and a structure of a buried copper block, comprising the following steps: step one, positioning the edges of the multi-layer PCB; step two, considering shrinkage in the plate processing process, increasing the pre-placement ratio a 1,b1 of the outermost core plate of the multi-layer PCB in the X and Y directions and the pre-placement ratio a 2,b2 of the inner core plate of the multi-layer PCB in the X and Y directions respectively; thirdly, the inner core plate and the prepreg are subjected to groove milling, copper groove burying and positioning hole punching; fourthly, the outer core plate is grooved to embed copper grooves and positioning holes are drilled; and fifthly, inserting the copper block into the buried copper groove and fixing the copper block with the positioning hole. The invention ensures that each core board is well aligned before lamination, and meets the condition that the shrinkage of the outermost layer after lamination cannot excessively extrude the copper block to cause the deflection of the copper block.
Description
Technical field:
the invention belongs to the field of PCB manufacturing, and particularly relates to a processing method and structure of a buried copper block.
The background technology is as follows:
With the development of 5G high-speed products, PCB is developed towards the directions of high density, high power, high heat dissipation and the like, the requirements for the embedded copper-based products are more and more increased, core+core core board structures are often used during embedded copper block processing (copper foil is pressed on the outer layer of a conventional PCB board, an equal or slightly larger window is formed in the board, then the copper block is plugged into a prefabricated window and is integrated through pressing, in order to enable the embedded copper products to be processed, the copper-clad plate is generally used on the outer layer of the board, the copper-clad plate is affected by PCB processing, particularly in the high-temperature pressing process, the board can be expanded and contracted along with temperature, the copper block is deformed when the plate is expanded and contracted, polishing is not clean due to surface gumming after pressing, particularly when the outer layer of the core board is pressed, the shrinkage is larger than that of the inner layer of the core board, the graph pre-expansion coefficient of the outer layer of the core board is larger than that of the other layers of the inner layer, and the embedded copper block begins to plug into prefabricated slotted holes before pressing, if shrinkage occurs and the window expansion and the side surface of the copper block can be unevenly stressed when expansion occurs.
The invention comprises the following steps:
The invention aims to provide a processing method and a structure of a buried copper block, which ensure that each core plate is well aligned before lamination, and meet the condition that the shrinkage of the outermost layer after lamination cannot excessively extrude the copper block to cause copper block deflection.
In order to solve the problems, the technical scheme of the invention is as follows:
A processing method of a buried copper block comprises the following steps:
Step one, positioning the edges of the multi-layer PCB; taking the geometric center of the plate as an origin of coordinates, wherein the origin of coordinates is (0, 0), and the coordinates of points (0, 0) corresponding to the center of the actual buried copper block are (x, y); x is an X-direction coordinate, and Y is a Y-direction coordinate; positioning holes are drilled at the edges of the middle parts of four sides of the jointed board frame of the multilayer PCB;
Step two, obtaining shrinkage ratios-a 1,-b1 of the outermost core plates of the multilayer PCB in X and Y directions respectively and shrinkage ratios-a 2,-b2 of the inner core plates of the multilayer PCB in X and Y directions respectively;
Thirdly, when the inner core plate and the prepreg are subjected to grooving, copper groove burying and positioning hole punching, the shrinkage ratio-a 2,-b2 of the inner core plate in the X direction and the Y direction is respectively referred to, and line compensation positioning punching and line compensation targeting are used;
fourthly, when the outer core plate is grooved and embedded with copper grooves and positioning holes are drilled, line compensation positioning punching is used according to the shrinkage ratio-a 1,-b1 of the outer core plate in the X direction and the Y direction respectively, line compensation targeting is carried out, and the copper block size basic direction is obtained, the size of the embedded copper grooves with the size of N x,Ny is increased on one side relative to the windowing size of the inner core plate in the X direction and the Y direction, wherein N x is the size in the X direction, and M y is the size in the Y direction; carrying out stretching and expanding, wherein the expanding and contracting amplitude is [(a1+a2)/2,(b1+b2)/2];Nx＝(x/(2X0)+1)*N0;My＝(y/(2Y0)+1)*M0;X0, the distance between the center of the X-direction positioning hole and the origin is represented, and Y 0 represents the length between the center of the Y-direction positioning hole and the origin; m 0 is between 0.05 and 0.1mm, and N 0 is between 0.15 and 0.2 mm; x represents the coordinate of the center of the copper block in the X direction from the origin, and y represents the coordinate of the center of the copper block in the y direction from the origin O;
And fifthly, inserting the copper block into the buried copper groove and fixing the copper block with the positioning hole.
Further improvements, a 1 and b 1 are between one and twelve parts per million.
Further improved, the multilayer PCB board is in a core+core structure.
Further improved, the copper block is elliptical.
The embedded copper block structure comprises a jointed board frame and a core board positioned in the jointed board frame, wherein the core board comprises an outermost core board positioned at the outermost side and an inner core board positioned at the inner side; the outermost core plate and the inner core plate are respectively provided with a copper-embedded groove, and copper blocks are inserted into the copper-embedded grooves; wherein the size of the copper-embedded groove formed on the outermost core plate is larger than that of the copper-embedded groove formed on the inner core plate.
Further improvement, the middle parts of four sides of the jointed board frame are provided with positioning holes; the upper and lower edges of the jointed board frame are respectively fixed with a hot-melt binding strip
Further improvement, the size of the copper-embedded groove on the outermost core plate is N x in the single side in the X direction, Ny;Nx＝(x/(2X0)+1)*N0;My＝(y/(2Y0)+1)*M0;X0 in the single side in the Y direction represents the distance from the center of the X-direction positioning hole to the origin, and 0 represents the length from the center of the Y-direction positioning hole to the origin on the basis of the size of the copper block; m 0 is between 0.05 and 0.1mm, and N 0 is between 0.15 and 0.2 mm; x represents the coordinate of the center of the copper block in the X direction from the origin, and y represents the coordinate of the center of the copper block in the y direction from the origin O; m 0 represents the inner core plate oversized relative to the copper block edge in the Y direction, and N 0 represents the inner core plate oversized relative to the copper block edge in the X direction.
Further improvement, the copper block is elliptical, the profile curve of the copper block is X Copper (Cu) 2/i2+y Copper (Cu) 2/j2 =1, i represents the length of a major half axis of the profile of the copper block, j represents the length of a minor half axis of the profile of the copper block, X Copper (Cu) represents the coordinate of the profile of the copper block relative to the center point of the copper block in the X direction, and y Copper (Cu) represents the coordinate of the profile of the copper block relative to the center point of the copper block in the y direction; the contour curve of the inner core plate embedded copper groove is x Inner core 2/(i+N0)2+y Inner core 2/(j+M0)2＝1,x Inner core , which represents that the contour of the inner core plate embedded copper groove is in the X-direction coordinate relative to the center point of the copper block, and Y Inner core represents that the contour of the inner core plate embedded copper groove is in the Y-direction coordinate relative to the center point of the copper block; the contour curve of the copper-embedded groove of the outer core plate is x Outer core 2/(i+Nx)2+y Outer core 2/(j+My)2＝1;x Outer core , which represents that the contour of the copper-embedded groove of the outer core plate is in the X-direction coordinate relative to the center point of the copper block, and Y Outer part represents that the contour of the copper-embedded groove of the outer core plate is in the Y-direction coordinate relative to the center point of the copper block.
The invention has the advantages that:
The invention ensures that each core board is well aligned before lamination, and meets the condition that the shrinkage of the outermost layer after lamination cannot excessively extrude the copper block to cause the deflection of the copper block.
Description of the drawings:
fig. 1 is a schematic top view of a multi-layer PCB;
fig. 2 is a schematic view of a vertical cross-section structure of a multi-layer PCB board;
FIG. 3 is a schematic diagram of a coordinate system established with the geometric center of a PCB as the origin;
fig. 4 is a schematic view of an inner core panel fenestration and an outermost core panel fenestration.
The device comprises a core plate, a splicing plate frame, a 111-hot-melt binding strip and a 112-positioning hole, wherein the core plate is 101-and the splicing plate frame is 102-; 120-burying a copper groove; 121-copper block; 401. the size of the original copper block after the expansion and contraction is 402-the inner core plate is windowed; 403-windowing the outermost core plate.
The specific embodiment is as follows:
according to the method and the structure for processing the buried copper block shown in the figure 1, the alignment precision is improved, the window size is reduced, and the copper block deflection caused by pressing shrinkage is avoided mainly through calculation.
1. Positioning the plate edge, positioning and punching by using line compensation, and performing line compensation targeting; as shown in fig. 3, the X direction of the positioning hole is determined to be (X0, 0) and (-X0, 0) by line compensation X, Y direction according to the plate size with the geometric center of the plate as the (0, 0) point; y directions are (0, Y0) and (0, -Y0); the spacing of the line compensation targeting specified positioning holes is unchanged, the spacing in the X direction is 2X0, and the spacing in the Y direction is 2Y0; the actual pattern is compensated with the line compensated center O coordinate.
2. The coordinates of the (0, 0) point relative to the center of the actual buried copper block are (x, y).
3. The pre-discharge coefficients of the material are respectively (a, b) in the X and Y directions, wherein the a, b are generally in the range of one ten thousandth to twelve ten thousandths. Whereas for the core+core structure (the outer layer is the core board and the conventional outer layer is copper foil), the core board of the outermost layer contacts the steel plate of the press with greater shrinkage. Therefore, the X, Y shrinkage ratio of the outermost core plate is (-a 1,-b1) larger than the shrinkage ratio of the other core plates of the inner layer (-a 2,-b2), i.e., a 1>a2,b1>b2.
4. Taking an elliptical copper block as an example, the value of M 0,M0 which is larger than the edge single side of the copper block in general core plate windowing is 0.05-0.1 mm; the value of N 0,N0 which is larger than the edge of the copper block is 0.15-0.2 mm; the relative positions of the expansion and contraction are deviated, and the pre-release values of the core plates at the outermost layer and the other core plates at the inner layer are deviated. The upper copper block is aligned before lamination, and in order to ensure that the copper block is not deflected by the top due to inconsistent shrinkage of the base material after lamination, the windowing of the core plate at the outermost layer needs to be further enlarged and pre-placed.
5. When the inner core plate and the prepreg are grooved and are drilled with positioning holes, the Kong Canzhao 1 st strip is positioned, the line compensation is used for targeting, and the distance between the centers of the targets is unchanged; the slot hole is enlarged on a single side to correspond to the 4 th slot, and the expansion and contraction is carried out on the basis, and the expansion and contraction amplitude refers to the pre-expansion coefficient (a 2,b2) of the inner core plate.
6. When the outer core plate is grooved and is perforated with positioning holes, the 1 st strip is positioned Kong Canzhao, the line compensation is performed, and the distance between the centers of the targets is unchanged; the size of the slot hole is finely adjusted on the basis of unilaterally enlarging the corresponding 4 th slot, the size of the window after fine adjustment is (N x,My), and then the window is pulled, expanded and contracted, and the expansion and contraction amplitude is [ (a 1+a2)/2,(b1+b2)/2 ].
7. In item 6, the magnitude of the fine dimension magnitude (c, d) value can be calculated using the following formula, N x＝(x/2X0+1)*N0;My＝(y/2Y0+1)*M0. Specifically, the copper block is elliptical, the profile curve of the copper block is x 2/i2+y2/j2 =1, the profile curve of the inner core plate fenestration is [ x 2/(i+N0)2+y2/(j+M0)2 =1 ], and the profile curve of the outer core plate fenestration is [ x 2/(i+Nx)2+y2/(j+My)2 =1 ]. i represents the length of the major half shaft and j represents the length of the minor half shaft.
8. Through the above treatment, as shown in fig. 4, the core plates are well aligned before lamination, and the shrinkage of the outermost layer after lamination is satisfied, so that the copper block is not excessively extruded to cause the deflection of the copper block.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (8)
1. The processing method of the buried copper block is characterized by comprising the following steps of:
Step one, positioning the edges of the multi-layer PCB; taking the geometric center of the plate as an origin of coordinates, wherein the origin of coordinates is (0, 0), and the coordinates of points (0, 0) corresponding to the center of the actual buried copper block are (x, y); x is an X-direction coordinate, and Y is a Y-direction coordinate; positioning holes are drilled at the edges of the middle parts of four sides of the jointed board frame of the multilayer PCB;
Step two, obtaining shrinkage ratios-a 1,-b1 of the outermost core plates of the multilayer PCB in X and Y directions respectively and shrinkage ratios-a 2,-b2 of the inner core plates of the multilayer PCB in X and Y directions respectively;
Thirdly, when the inner core plate and the prepreg are subjected to grooving, copper groove burying and positioning hole punching, the shrinkage ratio-a 2,-b2 of the inner core plate in the X direction and the Y direction is respectively referred to, and line compensation positioning punching and line compensation targeting are used;
Fourthly, when the outer core plate is grooved and embedded with copper grooves and positioning holes are drilled, line compensation positioning punching is used according to the shrinkage ratio-a 1,-b1 of the outer core plate in the X direction and the Y direction respectively, line compensation targeting is carried out, and the copper block size basic direction is obtained, and the size of the embedded copper grooves with the size of N x,Ny is increased on one side relative to the window opening size of the inner core plate in the X direction and the Y direction, wherein N x is the size ,My in the X direction and the size in the Y direction; carrying out stretching and expanding, wherein the expanding and contracting amplitude is [（a1+a2）/2, (b1+b2）/2];Nx =(x/（2X0）+1)*N0;My=(y/（2Y0）+1)*M0;X0, the distance between the center of the X-direction positioning hole and the origin is represented, and Y 0 represents the length between the center of the Y-direction positioning hole and the origin; m 0 is between 0.05 and 0.1mm, and N 0 is between 0.15 and 0.2 mm; x represents the coordinate of the center of the copper block in the X direction from the origin, and y represents the coordinate of the center of the copper block in the y direction from the origin O;
And fifthly, inserting the copper block into the buried copper groove and fixing the copper block with the positioning hole.
2. The method of copper block processing according to claim 1, wherein a 1 and b 1 are between one to twelve parts per million.
3. The copper block processing method of claim 1, wherein the multi-layer PCB board is a core+core structure.
4. The method of claim 1, wherein the copper block is oval.
5. The embedded copper block structure is characterized by comprising a jointed board frame and a core board positioned in the jointed board frame, wherein the core board comprises an outermost core board positioned at the outermost side and an inner core board positioned at the inner side; the outermost core plate and the inner core plate are respectively provided with a copper-embedded groove, and copper blocks are inserted into the copper-embedded grooves; wherein the size of the copper-embedded groove formed on the outermost core plate is larger than that of the copper-embedded groove formed on the inner core plate; the buried copper block structure is formed by processing the buried copper block structure according to claim 1.
6. The copper-embedded block structure according to claim 5, wherein positioning holes are formed in the middle parts of four sides of the jointed board frame; the upper and lower ends of the jointed board frame are both fixed with hot-melt binding strips.
7. The copper-embedded block structure according to claim 6, wherein the size of the copper-embedded groove on the outermost core plate is N x,, the single-side increment in X direction is Ny;Nx =(x/（2X0）+1)*N0;My=(y/（2Y0）+1)*M0;X0, the distance from the center of the X-direction positioning hole to the origin is Y 0, and the length from the center of the Y-direction positioning hole to the origin is Y 0; m 0 is between 0.05 and 0.1mm, and N 0 is between 0.15 and 0.2 mm; x represents the coordinate of the center of the copper block in the X direction from the origin, Y represents the coordinate of the center of the copper block in the Y direction from the origin O, M 0 represents the enlarged dimension of the inner core plate relative to the edge of the copper block in the Y direction, and N 0 represents the enlarged dimension of the inner core plate relative to the edge of the copper block in the X direction.
8. The buried copper block structure of claim 7 wherein the copper block is elliptical in shape and the profile curve of the copper block is X Copper (Cu) 2/i2+y Copper (Cu) 2/j2 = 1, i denotes the length of the major half axis of the copper block profile, j denotes the length of the minor half axis of the copper block profile, X Copper (Cu) denotes the coordinate of the copper block profile relative to the center point of the copper block in the X-direction, and y Copper (Cu) denotes the coordinate of the copper block profile relative to the center point of the copper block in the y-direction; the contour curve of the inner core plate embedded copper groove is x Inner core 2/（i+N0）2+y Inner core 2/（j+M0）2=1,x Inner core , which represents that the contour of the inner core plate embedded copper groove is in the X-direction coordinate relative to the center point of the copper block, and Y Inner core represents that the contour of the inner core plate embedded copper groove is in the Y-direction coordinate relative to the center point of the copper block; the contour curve of the copper-embedded groove of the outer core plate is x Outer core 2/（i+Nx）2+y Outer core 2/（j+My）2=1;x Outer core , which represents that the contour of the copper-embedded groove of the outer core plate is in the X-direction coordinate relative to the center point of the copper block, and Y Outer part represents that the contour of the copper-embedded groove of the outer core plate is in the Y-direction coordinate relative to the center point of the copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011236422.0A CN112601355B (en) | 2020-11-07 | 2020-11-07 | Buried copper block processing method and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011236422.0A CN112601355B (en) | 2020-11-07 | 2020-11-07 | Buried copper block processing method and structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112601355A CN112601355A (en) | 2021-04-02 |
| CN112601355B true CN112601355B (en) | 2024-05-17 |
Family
ID=75183394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011236422.0A Active CN112601355B (en) | 2020-11-07 | 2020-11-07 | Buried copper block processing method and structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112601355B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113727517B (en) * | 2021-09-03 | 2022-09-13 | 博敏电子股份有限公司 | Method for improving thickness uniformity of PCB (printed circuit board) and inner-layer circuit board glue flowing groove structure |
| CN113747689A (en) * | 2021-09-17 | 2021-12-03 | 珠海杰赛科技有限公司 | Manufacturing method for solving offset of multilayer circuit board layer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101425566B1 (en) * | 2013-12-26 | 2014-08-01 | 대원이노베이션 주식회사 | A process for forming via hole of core board for PCB |
| JP6417457B1 (en) * | 2017-08-10 | 2018-11-07 | 株式会社フジクラ | Method for producing conductive layer laminated film |
| CN110493963A (en) * | 2019-08-28 | 2019-11-22 | 清远市富盈电子有限公司 | A kind of pcb board intelligence edge sealing setting method |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111491461A (en) * | 2020-05-28 | 2020-08-04 | 苏州欣汇电智能装备技术有限公司 | Automatic embedding device for metal base |
| CN214481506U (en) * | 2020-11-07 | 2021-10-22 | 奥士康科技股份有限公司 | Bury copper billet structure |
-
2020
- 2020-11-07 CN CN202011236422.0A patent/CN112601355B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101425566B1 (en) * | 2013-12-26 | 2014-08-01 | 대원이노베이션 주식회사 | A process for forming via hole of core board for PCB |
| JP6417457B1 (en) * | 2017-08-10 | 2018-11-07 | 株式会社フジクラ | Method for producing conductive layer laminated film |
| CN110493963A (en) * | 2019-08-28 | 2019-11-22 | 清远市富盈电子有限公司 | A kind of pcb board intelligence edge sealing setting method |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111491461A (en) * | 2020-05-28 | 2020-08-04 | 苏州欣汇电智能装备技术有限公司 | Automatic embedding device for metal base |
| CN214481506U (en) * | 2020-11-07 | 2021-10-22 | 奥士康科技股份有限公司 | Bury copper billet structure |
Non-Patent Citations (2)
| Title |
|---|
| 埋嵌式元件共面度测量方法研究;李民善;纪成光;吕红刚;肖璐;任尧儒;;印制电路信息;20130610(第06期);全文 * |
| 埋嵌铜块印制电路板的设计与制造技术;柯勇;张军;蓝春华;谭小林;郝志峰;王成勇;郑李娟;;印制电路信息;20180910(第09期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112601355A (en) | 2021-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112601355B (en) | Buried copper block processing method and structure | |
| CN214481506U (en) | Bury copper billet structure | |
| CN102291949A (en) | Manufacturing method of multi-layer circuit board | |
| CN102917554B (en) | Manufacturing method of multilayer double-copper conductor plate | |
| CN112689380A (en) | Manufacturing method of embedded copper block circuit board structure and circuit board | |
| CN110913586A (en) | Manufacturing method of semi-flexible printed circuit board | |
| US5950305A (en) | Environmentally desirable method of manufacturing printed circuits | |
| CN106714453A (en) | Pseudo rigid-flex board and preparation method thereof | |
| CN110381664B (en) | Manufacturing method of PCB with cavity and PCB | |
| CN112533355A (en) | PCB with embedded copper block and manufacturing method thereof | |
| US6092282A (en) | Method of manufacturing printed circuits | |
| WO2006059925A1 (en) | A printed board assembly with improved heat dissipation | |
| US5876789A (en) | Method and apparatus for manufacturing radio frequency board with curved surface | |
| CN110785012A (en) | Drilling and positioning manufacturing method for ultra-long multilayer board | |
| KR101206289B1 (en) | Method of processing holes for printed circuit board embedded with components | |
| CN112601387B (en) | Manufacturing method of large-size printed multilayer board | |
| JPH09293950A (en) | Manufacture of thick copper circuit board | |
| CN113597124A (en) | Hyperfine FPC circuit manufacturing process suitable for thick copper | |
| CN111757606A (en) | Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material | |
| JP3245231B2 (en) | Manufacturing method of flat cable circuit | |
| CN111132475A (en) | Buried hole manufacturing method | |
| CN104427769B (en) | A kind of CNC scoreboard methods of no hole circuit board | |
| CN114945248B (en) | Processing technology of precise circuit board | |
| JP2003152309A (en) | Method of manufacturing double-sided flexible circuit board | |
| JPS587897A (en) | Method of producing circuit wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |