CN214481506U - Bury copper billet structure - Google Patents
Bury copper billet structure Download PDFInfo
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- CN214481506U CN214481506U CN202022553546.3U CN202022553546U CN214481506U CN 214481506 U CN214481506 U CN 214481506U CN 202022553546 U CN202022553546 U CN 202022553546U CN 214481506 U CN214481506 U CN 214481506U
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Abstract
The utility model discloses a bury copper billet structure, including following step: firstly, positioning the edges of a multilayer PCB; step two, considering the shrinkage of the plate processing process, and respectively increasing the pre-amplification ratio a of the outermost core plate of the multilayer PCB in the X and Y directions1,b1And the pre-amplification ratio a of the inner core plate of the multilayer PCB board in the X and Y directions is increased respectively2,b2(ii) a Thirdly, routing grooves, burying copper grooves and punching positioning holes on the inner core board and the prepregs; step four, burying copper grooves and punching positioning holes in routing grooves of the outer-layer core plate; and step five, inserting the copper block into the copper embedding groove and fixing the copper block with the positioning hole. The utility model discloses guaranteed that each core counterpoints well before the pressfitting, and satisfied outmost shrink behind the pressfitting can not excessively extrude the copper billet and cause the incline of copper billet to incline。
Description
Technical Field
The utility model belongs to PCB board preparation field especially relates to a bury copper billet structure.
Background
With the development of 5G high-speed products, PCBs are developing towards high density, high power, high heat dissipation and the like, the demand on copper-embedded products is increasing, when copper-embedded products are processed, core plate structures of core and core are often used (a conventional PCB uses an outer laminated copper foil, a window with equal size or slightly large size is firstly opened in the PCB, then a copper block is plugged into the prefabricated window and is integrated into a whole by pressing, for the processability of the copper-embedded products, a copper-clad plate is generally used as the outer layer on the surface smoothness, the outer layer is affected by the processing of the PCBs, particularly, in the high-temperature pressing process, the plate can expand and contract along with the drastic change of temperature, the large-opening window can deform during expansion and contraction of the plate to cause deflection of the copper block, the surface glue flows to cause incomplete polishing after pressing, particularly, when the outer layer core plate is pressed, the graphic pre-amplification factor of the outer layer core plate is two to five ten thousandths of the other layers of the inner layer, and the copper block is plugged into a prefabricated slotted hole before pressing, if expansion and contraction occur and the window is too large, the side surface of the copper block is unevenly stressed and deflects.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a bury copper billet processing method and structure, the utility model discloses guaranteed that each core counterpoints well before the pressfitting, and satisfied outmost shrink behind the pressfitting can not excessively extrude the copper billet and cause the copper billet incline.
In order to solve the above problem, the technical scheme of the utility model is that:
the copper block embedding structure comprises a jointed board frame and a core board positioned in the jointed board frame, wherein the core board comprises an outermost core board positioned on the outermost side and an inner core board positioned on the inner side; copper embedding grooves are formed in the outermost core plate and the inner core plate, and copper blocks are inserted into the copper embedding grooves; wherein the size of the copper-embedded groove arranged on the outermost core plate is larger than that of the copper-embedded groove arranged on the inner core plate.
In a further improvement, positioning holes are formed in the middles of four edges of the jointed board frame; the upper and lower ends of the frame of the jigsaw are fixed with hot melting binding strips.
The further improvement is that the size of the copper groove embedded in the outermost core plate is N in the single side of x on the basis of the size of the copper blockx,One-sided addition in the y direction of Ny;Nx =(x/(2X0)+1)*N0;My=(y/(2Y0)+1)*M0;X0Indicating the distance from the center of the X-direction locating hole to the origin, Y0Showing the distance between the center of the Y-direction positioning hole and the origin; m0Between 0.05 and 0.1mm, N0Between 0.15 mm and 0.2 mm; x represents the coordinate of the center of the copper block from the origin in the X direction, y represents the coordinate of the center of the copper block from the origin in the y direction, M0Indicates that the inner core board is enlarged relative to the edge of the copper block in the Y direction, N0Indicating that the inner core plate is oversized in the X direction relative to the edges of the copper block.
In a further improvement, the copper block is in an ellipse shape, and the contour curve of the copper block is xCopper (Cu) 2/i2+ yCopper (Cu) 2/j2=1, i represents the length of the major axis of the copper block profile, j represents the length of the minor axis of the copper block profile, xCopper (Cu)Representing the coordinate of the contour of the copper block in the X direction, y, relative to the center point of the copper blockCopper (Cu)Representing the coordinate of the outline of the copper block relative to the central point of the copper block in the y direction; the profile curve of the copper-embedded groove of the inner core plate is xInner core 2/(i+N0)2+ yInner core 2/(j+M0)2=1,xInner coreRepresents the coordinate of the contour of the copper-buried groove of the inner core plate relative to the central point of the copper block in the X direction, yInner coreRepresenting the coordinate of the outline of the copper-buried groove of the inner core plate relative to the central point of the copper block in the Y direction; the profile curve of the copper-embedded groove of the outer core plate is xOuter core 2/(i+Nx)2+ yOuter core 2/(j+My)2=1;xOuter coreRepresents the coordinate of the profile of the copper-embedded groove of the outer core plate relative to the central point of the copper block in the X direction, yOuter coverAnd the coordinate of the outline of the copper embedding groove of the outer core plate relative to the central point of the copper block in the Y direction is shown.
The utility model has the advantages that:
the utility model discloses guaranteed that each core counterpoints well before the pressfitting, and satisfied the pressfitting back outmost shrink can not excessively extrude the copper billet and cause the copper billet incline.
Description of the drawings:
FIG. 1 is a schematic top view of a multi-layer PCB;
FIG. 2 is a schematic diagram of a vertical cross-section structure of a multi-layer PCB;
FIG. 3 is a schematic diagram of a coordinate system established with the geometric center of a PCB as an origin;
fig. 4 is a schematic view of an inner core fenestration and an outermost core fenestration.
Wherein, 101-core plate, 102-jointed plate frame, 111-hot melting binding strip and 112-positioning hole; 120-copper groove burying; 121-copper blocks; 401. the size of the original copper block after stretching and shrinking is 402-the inner layer core board is windowed; 403-outermost core fenestration.
The specific implementation mode is as follows:
as shown in figure 1, the utility model discloses a bury copper billet processing method and structure, the utility model discloses mainly through calculating, improve the counterpoint precision, reduce the windowing size, avoid the pressfitting shrink to cause the copper billet incline.
Positioning the plate edges, punching by using line compensation positioning, and performing line compensation target shooting; as shown in fig. 3, with the geometric center of the plate as the point (0, 0), the positioning holes X direction is determined to be (X0, 0) and (-X0, 0) by the line compensation X, Y direction according to the size of the plate; y directions are (0, Y0) and (0, -Y0); the distance between the designated position holes of the line compensation target shooting is unchanged, the distance in the X direction is 2X0, the distance in the Y direction is 2Y0, and the actual graph is compensated by the center O coordinate of the line compensation.
The center of the actual copper-clad block is (x, y) in relation to the (0, 0) point coordinate.
The pre-discharge coefficients of the material are (a, b) in the X and Y directions, wherein a and b are generally in the range of one ten thousandth to twelve ten thousandth. For a core + core structure (core for the outer layer, copper foil for the conventional outer layer), the outermost core contacts the steel plates of the press and shrinks more. Thus, the outermost core sheet has an X, Y shrinkage ratio of (-a)1,-b1) The shrinkage ratio (-a) of the core board is lower than that of other core boards in the inner layer2,-b2) Large, i.e. a1> a2, b1> b2。
Taking an oval copper block as an example, the window of a general core plate is M larger than the edge of the copper block at a single side0 , M0The value is between 0.05 and 0.1 mm; the PP sheet is larger than the copper block edge single side by N0 , N0The value is between 0.15 and 0.2 mm; because of the deviation of the relative position of the expansion and contraction, the preset values of the outermost core plate and the other inner core plates are deviated. The upper copper block is aligned before lamination, and in order to ensure that the copper block is not jacked and deflected due to inconsistent shrinkage of the base material after lamination, the window of the core plate at the outermost layer needs to be further enlarged and preset.
When the inner core plate and the prepreg are grooved and provided with positioning holes, the positioning holes refer to the 1 st strip, line compensation is performed for target practice, and the target center distance is unchanged; the slot hole is enlarged on a single side corresponding to the 4 th strip, and stretching and expanding are carried out on the basis, and the expansion and contraction amplitude is referred to the pre-expansion coefficient (a) of the core plate of the inner layer2,b2)。
When the outer layer core plate is subjected to groove milling and positioning hole punching, the positioning hole refers to the 1 st strip, line compensation is performed for target punching, and the target center distance is unchanged; the size of the slot is finely adjusted on the basis of increasing the size of the corresponding 4 th strip on one side, and the window size after fine adjustment is (N)x,My) Then, the expansion and contraction are performed, the expansion and contraction amplitude is [ (a)1+a2)/2, (b1+b2)/2]。
In item 6, the magnitude of the fine tuning dimension magnitude (c, d) value can be calculated by the following equation, Nx =(x/2X0+1)*N0;My=(y/2Y0+1)*M0。Specifically, the copper block is elliptical, and the contour curve of the copper block is x2/i2+ y2/j2If not less than 1, the profile curve of the inner core plate is [ x ]2/(i+N0)2+ y2/(j+M0)2=1]The outline curve of the outer layer core plate window is [ x ]2/(i+Nx)2+ y2/(j+My)2=1]. i denotes a major-axis length, and j denotes a minor-axis length.
After the above processing, as shown in fig. 4, it is ensured that each core board is well aligned before lamination, and it is satisfied that the outermost layer shrinks after lamination and the copper block is not excessively extruded to cause deflection of the copper block.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (4)
1. The copper block embedding structure is characterized by comprising a jointed board frame and a core board positioned in the jointed board frame, wherein the core board comprises an outermost core board positioned on the outermost side and an inner core board positioned on the inner side; copper embedding grooves are formed in the outermost core plate and the inner core plate, and copper blocks are inserted into the copper embedding grooves; wherein the size of the copper-embedded groove arranged on the outermost core plate is larger than that of the copper-embedded groove arranged on the inner core plate.
2. The copper embedded block structure as claimed in claim 1, wherein the middle parts of the four sides of the frame of the jointed board are provided with positioning holes; the upper and lower ends of the frame of the jigsaw are fixed with hot melting binding strips.
3. The copper-embedded bulk structure of claim 2, wherein the size of the copper-embedded groove on the outermost core is N, the x-direction single edge is increased by N, based on the size of the copper bulkx,One-sided addition in the y direction of Ny;Nx =(x/(2X0)+1)*N0;My=(y/(2Y0)+1)*M0;X0Indicating the distance from the center of the X-direction locating hole to the origin, Y0Showing the distance between the center of the Y-direction positioning hole and the origin; m0Between 0.05 and 0.1mm, N0Between 0.15 mm and 0.2 mm; x represents the coordinate of the center of the copper block from the origin in the X direction, y represents the coordinate of the center of the copper block from the origin in the y direction, M0Indicates that the inner core board is enlarged relative to the edge of the copper block in the Y direction, N0Indicating that the inner core plate is oversized in the X direction relative to the edges of the copper block.
4. The copper segment damascene structure of claim 3 wherein the copper segment has an oval shape and the copper segment has a profile curve of xCopper (Cu) 2/i2+ yCopper (Cu) 2/j2=1, i represents the length of the major axis of the copper block profile, j represents the length of the minor axis of the copper block profile, xCopper (Cu)Representing the coordinate of the contour of the copper block in the X direction, y, relative to the center point of the copper blockCopper (Cu)Representing the coordinate of the outline of the copper block relative to the central point of the copper block in the y direction; the profile curve of the copper-embedded groove of the inner core plate is xInner core 2/(i+N0)2+ yInner core 2/(j+M0)2=1,xInner coreRepresents the coordinate of the contour of the copper-buried groove of the inner core plate relative to the central point of the copper block in the X direction, yInner coreRepresenting the coordinate of the outline of the copper-buried groove of the inner core plate relative to the central point of the copper block in the Y direction; the profile curve of the copper-embedded groove of the outer core plate is xOuter core 2/(i+Nx)2+ yOuter core 2/(j+My)2=1;xOuter coreRepresents the coordinate of the profile of the copper-embedded groove of the outer core plate relative to the central point of the copper block in the X direction, yOuter coverAnd the coordinate of the outline of the copper embedding groove of the outer core plate relative to the central point of the copper block in the Y direction is shown.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112601355A (en) * | 2020-11-07 | 2021-04-02 | 奥士康科技股份有限公司 | Processing method and structure of copper-embedded block |
CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Board milling method and board milling machine for PCB |
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2020
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112601355A (en) * | 2020-11-07 | 2021-04-02 | 奥士康科技股份有限公司 | Processing method and structure of copper-embedded block |
CN112601355B (en) * | 2020-11-07 | 2024-05-17 | 奥士康科技股份有限公司 | Buried copper block processing method and structure |
CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Board milling method and board milling machine for PCB |
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