CN114206023A - Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application - Google Patents
Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application Download PDFInfo
- Publication number
- CN114206023A CN114206023A CN202111494074.1A CN202111494074A CN114206023A CN 114206023 A CN114206023 A CN 114206023A CN 202111494074 A CN202111494074 A CN 202111494074A CN 114206023 A CN114206023 A CN 114206023A
- Authority
- CN
- China
- Prior art keywords
- manufacturing
- rigid
- board
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 62
- 238000003825 pressing Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 29
- 238000005530 etching Methods 0.000 claims description 19
- 238000005553 drilling Methods 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005261 decarburization Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000001125 extrusion Methods 0.000 abstract description 3
- 230000037303 wrinkles Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 13
- 238000003801 milling Methods 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000013039 cover film Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000004880 explosion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to the technical field of printed circuit board manufacturing, and discloses a rigid-flex printed circuit board, a manufacturing method, a PCB electronic product and application. Step one, manufacturing a flexible plate part; step two, manufacturing a PP part; step three, pressing for the first time to form a flexible layer; step four, manufacturing the hard board part: making a hard board window and browning; step five, pressing for the second time; and (3) carrying out secondary pressing on the flexible layer, PP and copper foil to obtain a multilayer board, and manufacturing the rigid-flexible combined board through depth control gong. After the rigid-flex printed circuit board is manufactured, the following steps are carried out: electrical testing, FQC, FQA, and packaging. According to the invention, the flexible layer, common PP and copper foil are laminated for the second time to obtain the multilayer board, the conventional PP is used, and a coating material is not used, so that the problems that the subsequent outer layer circuit manufacturing is influenced, resin plugging is not cleanly polished, a base material is damaged and the like due to the fact that the coating material is used for extrusion and unevenness, wrinkles and the like are inevitably caused are avoided.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a rigid-flex printed circuit board, a manufacturing method, a PCB electronic product and application.
Background
The rigid-flex board is commonly called a soft-hard board and is formed by selectively laminating a rigid substrate and a flexible substrate together, and the rigid-flex board is compact in structure and is in conductive connection with a metalized hole. The printed circuit board combined by rigid and flexible materials fully utilizes the characteristics of the flexible board, solves the problem of electrical connection with a hard board, considers the rule and toughness of the conventional rigid board and the flexibility and smallness of the flexible board, can move, bend, fold and twist, realizes three-dimensional wiring, greatly saves the installation space of electronic components, conforms to the development trend of light, thin, short and small electronic products, is widely applied in various fields such as military industry, aerospace, automotive electronics, medical electronics, civil consumer electronics and the like in recent decades, becomes the most rapidly developed PCB product at present, and is also one of the main development directions of future PCBs.
The pressing and windowing are core steps of the rigid-flex printed circuit board, the conventional windowing process has multiple processes, wherein the most widely applied process is mechanical depth control milling, a blind groove is formed by reversely cutting a rigid board close to a windowing region and a flexible layer in advance by a mechanical or laser method to a certain depth, PP is cut through and windowed, and a protection tape is attached to the windowing position for filling; then, the rigid layer and the flexible layer are pressed, the subsequent processes are normally performed, finally, a mechanical depth control milling mode is adopted to be in butt joint with a blind groove formed by precutting the rigid plate, the rigid layer and the protective adhesive tape at the window position are taken out to expose the flexible plate, and therefore the rigid-flex combined plate is obtained, and the conventional process flow comprises the following steps:
1. flexible plate portion: cutting, inner layer pattern etching, inner layer AOI, browning, cover film windowing, cover film laminating, cover film pressing, OPE punching and browning;
2. rigid plate portion: cutting, inner layer pattern etching, inner layer etching, OPE punching, inner layer AOI, rigid plate milling blind groove milling and browning;
3. bonding layer portion: cutting PP, punching OPE and windowing PP;
4. main flow: pressing, X-Ray drilling of target position holes, plate edge milling, drilling, copper deposition, plate electroplating, outer layer pattern electroplating, outer layer etching, outer layer AOI, resistance welding, character processing, surface processing, electric testing, molding, windowing after molding, FQC, FQA, packaging and shipment.
In the prior art, the manufacturing difficulty of the rigid-flex printed circuit board is as follows: the lamination needs to use No-flow prepreg (No-flow PP), ordinary PP because its high flow nature, easily overflow glues to the regional influence outward appearance and bending property of soft board, soft board substrate is easily by the problem that PP flows to glue and drive to produce fold and layer and scrap partially between having copper and No copper region simultaneously, but based on No-flow PP's low flow characteristic, must use the cover type to assist the material (buffer material) among the lamination process, promote No-flow PP to flow gluey abundant, because there is the high drop that multilayer PP formed in the position of windowing, the face is pressed by the cover type material and must appear unevenness, influence the dry film laminating of subsequent outer circuit preparation, procedures such as exposure, development etching, the consent that has the resin still can lead to appearing polishing the unclean and polish the quality problem of damage substrate.
In order to solve the problem, the patent 'a soft-hard combined board and a manufacturing method thereof 202111168401.4' designs a secondary laminating process for a soft board, firstly, the soft board and a No-flow PP are laminated for the first time to form a flexible layer with partial rigidity, and then the flexible layer, a common PP and a hard board are laminated for the second time to obtain the rigid-flexible combined board. The soft board and the flexible layer after the first lamination of the No-flow PP can be used as a conventional common hard board, compared with a common soft board, the hardness is increased, the expansion and shrinkage stability is improved, and the problem of layer deviation in the conventional PP lamination can be solved; and then the second pressing is completed with the common fluidity PP and the hard board, a molding material is not needed, the smoothness of the board surface can be ensured, and the quality problems that the subsequent outer layer circuit manufacturing is influenced, resin plugging is not clean, the base material is damaged and the like due to the warping and the unevenness of the board during the high-fall pressing of the No-flow PP are solved.
Through the above analysis, the problems and defects of the prior art are as follows: the method comprises the following steps of firstly laminating a soft board and No-flow PP to form a flexible layer with partial rigidity, and specifically laminating the soft board core board and the No-flow PP into the flexible layer by utilizing a laminating structure of a steel plate, a three-in-one auxiliary material, a release film, the No-flow PP, a flexible core board, the No-flow PP, the release film, the three-in-one auxiliary material and the steel plate, wherein the method has the following defects and shortcomings: silicone oil for isolation is coated on the release film, the No-flow PP directly contacts with the release film in the first pressing process, so that silicone oil is remained on the surface of the PP, and when the PP is pressed with common PP and a hard board for the second time, the silicone oil is remained between the PP, and the risk of layered board explosion is caused when the PP is heated at high temperature.
The significance of solving the problems and the defects is as follows: the invention provides a rigid-flex printed circuit board, a manufacturing method, a PCB electronic product and application, and solves the quality problems that the conventional laminating method of the rigid-flex printed circuit board has the defects that the production of an outer layer circuit is influenced by the warping and the unevenness of a board bent plate, resin plug holes cannot be polished completely, a base material is damaged by polishing and the like; the problem that a soft board core board and No-flow PP are pressed into a flexible layer by a pressing structure of 'a soft and hard combined board and a manufacturing method 202111168401.4' of the soft and hard combined board is solved, and the problem that the board is layered and exploded due to high-temperature heating in the PP pressing process is caused by silicone oil on a release film.
Disclosure of Invention
In order to overcome the problems in the related art, the disclosed embodiment of the invention provides a rigid-flex printed circuit board, a manufacturing method, a PCB electronic product and an application.
The technical scheme is as follows: a method of manufacturing a rigid-flex printed circuit board, comprising:
step one, manufacturing a flexible plate part;
step two, manufacturing a PP part;
step three, pressing for the first time to form a flexible layer;
step four, manufacturing the hard board part: making a hard board window and browning;
step five, pressing for the second time; and (3) carrying out secondary pressing on the flexible layer, PP and copper foil to obtain a multilayer board, and manufacturing the rigid-flexible combined board through depth control gong.
In one embodiment, the step of partially manufacturing the flexible board comprises the following steps in sequence: cutting a soft board, pretreating the soft board, carrying out inner layer dry film, carrying out inner layer exposure, developing, etching the inner layer, carrying out AOI (argon oxygen decarburization), browning, false splicing of No-flow PP, pressing of No-flow PP, false splicing of high-temperature adhesive tape, pressing of high-temperature adhesive tape and PE (polyethylene) punching.
In one embodiment, the step two PP part making includes: cutting No flow PP and manufacturing No flow PP by windowing; cutting PP materials and making PP windows.
In one embodiment, the third press-fitting sequentially includes the following steps: firstly, laminating the flexible core board and the No-flow PP by utilizing a laminating structure of a steel plate, a three-in-one overlay type auxiliary material, a copper foil, the No-flow PP, the flexible core board, the No-flow PP, the copper foil, the three-in-one overlay type auxiliary material and the steel plate which are sequentially arranged from top to bottom, and then, acid etching away the surface copper foil to form a flexible layer; and the No-flow PP windowing position is filled with a high-temperature-resistant adhesive tape.
In one embodiment, the step four hard plate part fabrication sequentially comprises the following steps: cutting a hard board, pretreating the hard board, patterning an inner layer, etching the inner layer, punching an OPE (optical phase etching), AOI (automatic optical inspection), manufacturing a hard board window and browning; and in the manufacturing process of the hard board window, the hard board window is opposite to the soft board position routing groove.
In one embodiment, the second pressing sequentially comprises the following steps: pressing, removing glue, drilling resin hole plugging, plasma removing drilling dirt, outer layer copper deposition, full-plate electroplating, outer layer hole plating graphics, hole plating, film stripping, resin hole plugging, abrasive belt grinding plate, target position hole drilling, outer layer drilling, plasma removing drilling dirt, copper/plate electroplating, outer layer graphics, graphics electroplating, outer layer etching, AOI, resistance welding, character, surface treatment, forming and mechanical depth control gong to obtain the rigid-flex printed circuit board.
In an embodiment, after the rigid-flex printed circuit board is manufactured in the fifth step, the following steps are further performed: electrical testing, finished product visual inspection full check (FQC), finished product visual spot check (FQA), and packaging.
Another object of the present invention is to provide a flex-rigid board manufactured by the method for manufacturing a flex-rigid board.
Another object of the present invention is to provide a PCB electronic product manufactured according to the method for manufacturing a rigid-flex printed circuit board.
The invention also aims to provide an application of the manufacturing method of the rigid-flex printed circuit board in the manufacturing of electronic equipment in the fields of military industry, aerospace, automotive electronics, medical electronics and civil consumer electronics.
By combining all the technical schemes, the invention has the advantages and positive effects that: the invention solves the problem that a soft board core board and No-flow PP are laminated into a flexible layer by a pressing structure of 'a soft and hard combined board and a manufacturing method 202111168401.4' of the soft and hard combined board, and the problem of layering and board explosion caused by high-temperature heating in the PP pressing process due to silicone oil on a release film exists.
According to the invention, the flexible layer, common PP and copper foil are laminated for the second time to obtain the multilayer board, the conventional PP is used, and a coating material is not used, so that the problems that the subsequent outer layer circuit manufacturing is influenced, resin plugging is not cleanly polished, a base material is damaged and the like due to the fact that the coating material is used for extrusion and unevenness, wrinkles and the like are inevitably caused are avoided.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a flowchart of a method for manufacturing a rigid-flex printed circuit board according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
The technical scheme of the application is described in detail below by taking a rigid-flexible combined plate designed to include a single layered flexible plate and a disc inner hole resin plug hole structure as an example.
As shown in fig. 1, a method for manufacturing a rigid-flex printed circuit board according to an embodiment of the present invention includes:
s101, manufacturing a flexible board part;
s102, manufacturing a PP part;
s103, pressing for the first time to form a flexible layer;
s104, manufacturing a hard board part;
and S105, pressing for the second time to obtain the rigid-flex board.
Step S101 specifically includes: a soft plate part: cutting a soft board, preprocessing, inner layer dry film, inner layer exposure, developing, inner layer etching, AOI, browning, No-flow PP false joint, No-flow PP pressing, high-temperature adhesive tape false joint, high-temperature adhesive tape pressing and PE punching.
Step S102 specifically includes: cutting and windowing No flow PP; and cutting materials and windowing the PP.
Step S103 specifically includes: the method comprises the steps of firstly utilizing a press-fit structure of a steel plate, a three-in-one covering type auxiliary material, a copper foil, No-flow PP, a flexible core plate, No-flow PP, a copper foil, a three-in-one covering type auxiliary material and a steel plate to press the flexible core plate and the No-flow PP (a high-temperature resistant adhesive tape is filled in a PP windowing position), and then, carrying out acid etching to remove a surface copper foil to form a flexible layer.
Step S104 specifically includes: cutting, pre-processing, inner layer pattern etching, OPE punching, AOI, hard board window manufacturing (opposite groove milling corresponding to the position of a soft board) and browning;
step S105 specifically includes: the flexible layer, common PP and copper foil are pressed for the second time by utilizing the structures of a steel plate, a release film, copper foil, PP, a flexible layer, PP, copper foil, a release film and a steel plate to obtain a multilayer board, and the problems of incomplete polishing, substrate damage caused by subsequent resin plug hole and the like caused by the fact that the conventional PP is used and a covering material is not used are avoided due to the fact that the covering material is used for extrusion and the unevenness is inevitable; and finally, manufacturing the rigid-flex printed circuit board through depth control gong.
The fifth specific process comprises the following steps: pressing, removing flow glue, drilling resin hole plugging, plasma removing drilling dirt, outer layer copper deposition, full-plate electroplating, outer layer hole plating graph, hole plating, film stripping, resin hole plugging, abrasive belt grinding plate, target site hole drilling, outer layer drilling, plasma removing drilling dirt, copper/plate deposition, outer layer graph, graph electroplating, outer layer etching, AOI, resistance welding, character, surface treatment, forming, mechanical depth control gong, electrical testing, FQC, FQA and packaging.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure should be limited only by the attached claims.
Claims (10)
1. A method for manufacturing a rigid-flex printed circuit board, characterized by comprising:
step one, manufacturing a flexible plate part;
step two, manufacturing a PP part;
step three, pressing for the first time to form a flexible layer;
step four, manufacturing the hard board part: making a hard board window and browning;
step five, pressing for the second time; and (3) carrying out secondary pressing on the flexible layer, PP and copper foil to obtain a multilayer board, and manufacturing the rigid-flexible combined board through depth control gong.
2. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein said step of partially manufacturing the flexible board includes the steps of:
cutting a soft board, pretreating the soft board, carrying out inner layer dry film, carrying out inner layer exposure, developing, etching the inner layer, carrying out AOI (argon oxygen decarburization), browning, false splicing of No-flow PP, pressing of No-flow PP, false splicing of high-temperature adhesive tape, pressing of high-temperature adhesive tape and PE (polyethylene) punching.
3. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein the second step of manufacturing the PP part includes:
cutting No flow PP and manufacturing No flow PP by windowing;
cutting PP materials and making PP windows.
4. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein the third press-fitting step sequentially comprises the following steps:
firstly, laminating the flexible core plate and the No-flow PP by utilizing a laminating structure of a steel plate, a three-in-one overlay type auxiliary material, a copper foil, the No-flow PP, the flexible core plate, the No-flow PP, the copper foil, the three-in-one overlay type auxiliary material and the steel plate which are sequentially arranged from top to bottom;
then, acid etching is carried out to remove the surface copper foil to form a flexible layer; and the No-flow PP windowing position is filled with a high-temperature-resistant adhesive tape.
5. The method of manufacturing a rigid-flex printed circuit board according to claim 1, wherein the step of partially manufacturing the four rigid boards sequentially comprises the steps of: cutting a hard board, pretreating the hard board, patterning an inner layer, etching the inner layer, punching an OPE (optical phase etching), AOI (automatic optical inspection), manufacturing a hard board window and browning;
and in the manufacturing process of the hard board window, the hard board window is opposite to the soft board position routing groove.
6. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein the step of pressing for the fifth time sequentially comprises the following steps:
pressing, removing glue, drilling resin hole plugging, plasma removing drilling dirt, outer layer copper deposition, full-plate electroplating, outer layer hole plating graphics, hole plating, film stripping, resin hole plugging, abrasive belt grinding plate, target position hole drilling, outer layer drilling, plasma removing drilling dirt, copper/plate electroplating, outer layer graphics, graphics electroplating, outer layer etching, AOI, resistance welding, character, surface treatment, forming and mechanical depth control gong to obtain the rigid-flex printed circuit board.
7. The method for manufacturing a flex-rigid board according to claim 1, wherein after the flex-rigid board is manufactured in the fifth step, the method further comprises: electrical testing, finished product appearance inspection and full inspection, finished product appearance spot inspection and packaging.
8. A rigid-flex printed circuit board, characterized in that the rigid-flex printed circuit board is manufactured by the method for manufacturing a rigid-flex printed circuit board according to any one of claims 1 to 7.
9. A PCB electronic product, characterized in that the PCB electronic product is manufactured according to the manufacturing method of the rigid-flex printed circuit board of any one of claims 1 to 7.
10. Use of the method of manufacturing a rigid-flex printed circuit board according to any one of claims 1 to 7 in the manufacture of electronic devices in the fields of military industry, aerospace, automotive electronics, medical electronics, and consumer electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111494074.1A CN114206023A (en) | 2021-12-08 | 2021-12-08 | Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111494074.1A CN114206023A (en) | 2021-12-08 | 2021-12-08 | Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114206023A true CN114206023A (en) | 2022-03-18 |
Family
ID=80651388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111494074.1A Pending CN114206023A (en) | 2021-12-08 | 2021-12-08 | Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114206023A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686916A (en) * | 2017-02-27 | 2017-05-17 | 深圳市仁创艺电子有限公司 | Method for laminating high-density ultra-thin rigid-flex laminated panels |
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN111935921A (en) * | 2020-08-19 | 2020-11-13 | 深圳市景旺电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN113286454A (en) * | 2021-05-06 | 2021-08-20 | 深圳崇达多层线路板有限公司 | Method for improving Air-gap structure bonding of FPC (Flexible printed Circuit) board |
-
2021
- 2021-12-08 CN CN202111494074.1A patent/CN114206023A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686916A (en) * | 2017-02-27 | 2017-05-17 | 深圳市仁创艺电子有限公司 | Method for laminating high-density ultra-thin rigid-flex laminated panels |
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN111935921A (en) * | 2020-08-19 | 2020-11-13 | 深圳市景旺电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN113286454A (en) * | 2021-05-06 | 2021-08-20 | 深圳崇达多层线路板有限公司 | Method for improving Air-gap structure bonding of FPC (Flexible printed Circuit) board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103124472B (en) | A kind of rigid/flexible combined printed circuit board manufacture method and rigid/flexible combined printed circuit board | |
| CN110139505B (en) | Manufacturing method of rigid-flex board with local flexible board layering | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN111683457A (en) | Manufacturing method of rigid-flex board | |
| CN111741618B (en) | Processing method for depositing nickel and gold on bottom of PCB step groove | |
| KR101572916B1 (en) | Method of manufacturing rigid-flexible circuit board | |
| TW200410621A (en) | Flexible rigid printed circuit board and method of fabricating the board | |
| CN113923899A (en) | Rigid-flex board and manufacturing method thereof | |
| CN106211638A (en) | A kind of processing method of ultra-thin multilayer printed circuit board | |
| JP2004319962A (en) | Flex rigid printed wiring board and its manufacturing method | |
| CN110913586B (en) | Manufacturing method of semi-flexible printed circuit board | |
| WO2020220680A1 (en) | High-precision forming method for rigid-flex printed circuit board | |
| CN113613415A (en) | Printed circuit board and non-metallized step groove processing technology thereof | |
| CN103717014B (en) | Method for manufacturing substrate structure | |
| CN105307425A (en) | Blind and buried via rigid-flex board production process | |
| CN114206023A (en) | Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application | |
| CN115243478A (en) | Manufacturing method of butterfly-shaped rigid-flex board | |
| CN113179596B (en) | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board | |
| KR101180355B1 (en) | Manufacturing method of dual side multi layer typed flexible printed circuit board and dual side multi layer typed flexible printed circuit board manufactured by the method thereof | |
| CN110572957B (en) | Method and device for manufacturing multilayer rigid-flex printed circuit board | |
| JP2014078705A (en) | Method for manufacturing rigid flexible printed circuit board | |
| US9521754B1 (en) | Embedded components in a substrate | |
| KR100571726B1 (en) | Rigid flexible printed circuit board and manufacturing method thereof | |
| TWI442844B (en) | Embedded flex circuit board and method of fabricating the same | |
| CN112752443A (en) | Processing method of printed circuit board with step position containing bonding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220318 |