CN110678011A - Manufacturing method of rigid-flex printed circuit board - Google Patents
Manufacturing method of rigid-flex printed circuit board Download PDFInfo
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- CN110678011A CN110678011A CN201911103763.8A CN201911103763A CN110678011A CN 110678011 A CN110678011 A CN 110678011A CN 201911103763 A CN201911103763 A CN 201911103763A CN 110678011 A CN110678011 A CN 110678011A
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- flexible
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a rigid-flex printed circuit board. According to the invention, by changing the pressing structure, pp windowing is not required to be formed on the prepreg in the pressing process, and meanwhile, the PI protective film is adhered to the precut area, so that the prepreg in the pressing structure is not required to be arranged in a retracted manner, sufficient glue flow can be provided to ensure the combination effect of the rigid-flex layer, and the problem that the excessive glue flow overflows to the pp windowing part (namely, is adhered to the flexible area) is avoided. On the other hand, because of not needing to set up PP and windowing, avoid among the prior art because of PP windowing causes the high drop of windowing position, lead to pressfitting surface to form smoothness problems such as protruding or sunken.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a rigid-flex printed circuit board.
Background
The rigid-flex board is also called a soft-hard board and is formed by selectively laminating a rigid board and a flexible board, and the rigid-flex board is compact in structure and is in conductive connection with a metalized hole. The printed circuit board combined by rigid and flexible materials fully utilizes the characteristics of the flexible board, solves the problem of electrical connection with the rigid board, takes account of the regularity and toughness of the conventional rigid board and the flexibility and smallness of the flexible board, can move, bend, fold and twist the rigid-flexible combined board, realizes three-dimensional wiring, greatly saves the installation space of electronic components, conforms to the development trend of light, thin, short and small electronic products, is widely applied in various fields of military industry, aerospace, automotive electronics, medical electronics, civil consumer electronics and the like in recent decades, becomes the most rapidly developed PCB product at present, and is also one of the main development directions of future PCBs.
The rigid-flex bonded panel includes a rigid layer and a flexible layer, the region of the flexible layer exposed is referred to as the flexible region, and the region of the rigid layer opposite the flexible region during fabrication is referred to as the cut-out region. The core step of manufacturing the rigid-flex combined board is to press and manufacture the window so that the flexible layer is partially exposed to form the flexible area, the window is manufactured in various modes, and the most widely applied mode is mechanical depth control milling. The mechanical depth control milling is to cut a certain depth on the rigid plate around the edge of the cut-off region by a mechanical or laser method in advance to form a blind groove in the cut-off region of the rigid plate, and cut off the region corresponding to the flexible region on the prepreg (PP) to form a PP windowing; and then combining the rigid layer and the flexible layer with the cover film adhered to the flexible region into a whole through a prepreg, then normally performing other post processes, finally cutting the edge of the cut-off region surrounding the rigid layer in a mechanical depth control milling mode and butting the cut-off region with the pre-cut blind groove to take out the plate of the cut-off region so as to expose the flexible layer, completing the manufacturing of a window and forming the flexible region. The specific process flow comprises the following steps:
1. flexible plate portion: cutting → inner layer pattern → inner layer etching → inner layer AOI → browning → cover film windowing → cover film laminating → cover film pressing → OPE punching → browning;
2. rigid plate portion: cutting → inner layer pattern → inner layer etching → OPE punching → inner layer AOI → rigid plate gong blind groove → browning;
3. bonding layer portion: PP cutting → OPE punching → PP windowing;
4. main flow: pressing → X-Ray drilling target hole → milling plate edge → drilling hole → copper deposition, plate electric → outer layer pattern → pattern plating → outer layer etching → outer layer AOI → resistance welding, character → surface treatment → electric test → shaping → window opening after shaping → FQC → FQA → packaging and shipment.
When the rigid layer and the flexible layer are laminated together, as shown in fig. 1, in order to ensure the laminating effect between the flexible layer and the rigid layer, the size of the cover film needs to be larger than that of the flexible region, i.e. the edge of the cover film needs to enter between the interlayers, generally 0.5-1.0mm, meanwhile, in order to prevent the PP from overflowing to the flexible region to affect the product performance and appearance, the PP needs to be designed to be retracted, the size of the opening window of the PP is larger than that of the flexible region, and the design method has the following defects: 1. the pp windowing is arranged in the pressing structure, when in pressing, the glue continuously flows to the gap position, if the excessive glue overflow is too large, the plate surface is easy to bulge, and if the excessive glue overflow is too small, the depression is caused, so that the manufacturing and the appearance smoothness of the outer layer circuit are influenced; 2. the cover film and the PP do not have the overlapped part and are difficult to ensure the bonding effect of the flexible layer and the rigid layer, the bending performance of the product is influenced, and the rigid-flexible combination position is easy to tear in the subsequent use process.
Disclosure of Invention
Aiming at the problems existing in the prior art for manufacturing the rigid-flex board, the invention provides the method for manufacturing the rigid-flex board, which can avoid the problems that a product forms a bulge or a depression, the rigid-flex board is not firmly bonded, the bonding position is easy to tear and the like.
In order to achieve the purpose, the invention adopts the following technical scheme.
A method for manufacturing a rigid-flex printed circuit board comprises the following steps,
s1: manufacturing a rigid layer: manufacturing a circuit on the rigid core board, and routing blind grooves around the edge of the cut-off area on the rigid core board;
manufacturing a flexible layer: manufacturing a circuit on a flexible board, and pasting a cover film on a flexible area of the flexible board, wherein the size of the cover film is larger than that of a single side of the flexible area;
manufacturing a bonding layer: adhering a PI protective film on one surface of the prepreg, which is opposite to the flexible layer, wherein the area of the prepreg, which corresponds to the flexible area, is called a precut area, cutting along the edge of the precut area to separate the precut area from the prepreg, and tearing off the PI protective film on the prepreg except the precut area;
s2: laminating and pressing the flexible layer, the bonding layer and the rigid layer into a whole to form a multilayer production plate;
s3: sequentially drilling a multilayer production board, depositing copper, electroplating the whole board, manufacturing an outer layer circuit, manufacturing a solder mask and performing surface treatment on the multilayer production board;
s4: and carrying out forming treatment on the multilayer production plate, cutting the rigid layer side of the multilayer production plate around the edge of the cutting area through depth control milling and butting the rigid layer side with the blind groove, and taking out the cutting area, the precutting area and the PI protective film on the precutting area from the multilayer production plate to expose the flexible area of the flexible layer.
Preferably, in step S1, the cover film has a size 0.5 to 1.0mm larger than a single side of the flexible region.
Preferably, the precut area is separated from the prepreg by laser cutting along the edge of the precut area in step S1.
Preferably, in step S2, the flexible layer and the rigid layer are browned before the flexible layer, the adhesive layer and the rigid layer are laminated together.
More preferably, in the step S1 of manufacturing the flexible layer, after the wiring is formed on the flexible board, the flexible board is browned, the cover film is attached to the flexible area, and then the flexible board is browned again.
Compared with the prior art, the invention has the beneficial effects that:
the PI protective film is pasted on the prepreg, and the prepreg is cut around the edge of the precut area by laser to form the independent precut area with one surface pasted with the PI protective film, the precut area is still remained in the laminating structure during laminating, and the precut area and the cut-off area are removed together to expose the flexible area during final molding. Because the precut area is cut from the prepreg before lamination, the fiber yarns at the cut are cut off, even if the cut is filled by glue flow during lamination, the cut can be directly cut off to take out the precut area due to no fiber yarn support.
According to the invention, by changing the pressing structure, pp windowing is not required to be formed on the prepreg in the pressing process, and meanwhile, the PI protective film is adhered to the precut area, so that the prepreg in the pressing structure is not required to be arranged in a retracted manner, sufficient glue flow can be provided to ensure the combination effect of the rigid-flex layer, and the problem that the excessive glue flow overflows to the pp windowing part (namely, is adhered to the flexible area) is avoided. On the other hand, because of not needing to set up PP and windowing, avoid among the prior art because of PP windowing causes the high drop of windowing position, lead to pressfitting surface to form smoothness problems such as protruding or sunken.
Drawings
FIG. 1 is a schematic view of a rigid layer, a flexible layer, and a prepreg stacked together in a prior art rigid-flex printed circuit board manufacturing process;
fig. 2 is a schematic view of the flexible layer, the adhesive layer, and the rigid layer laminated together in the example.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
The embodiment provides a method for manufacturing a rigid-flex printed circuit board, which comprises the following steps:
(1) separately fabricating a rigid layer, a flexible layer, and an adhesive layer
Manufacturing a rigid layer: as in the prior art PCB production process, the raw material of the PCB is cut to obtain a rigid core board with the required dimensions. And sequentially carrying out film coating, exposure, development, etching and film stripping to manufacture an inner layer circuit on the rigid core board. And (3) carrying out OPE punching processing and inner layer AOI inspection on the rigid core board with the inner layer circuit manufactured, wherein the qualified product enters the next procedure, namely, routing a blind groove on the edge of the rigid core board around the cutting area, wherein the opening of the blind groove is arranged on one surface opposite to the flexible board, and then carrying out brown oxidation treatment on the rigid core board.
Manufacturing a flexible layer: as in the production process of the Flexible Printed Circuit (FPC) in the prior art, the raw material of the FPC is cut to obtain a flexible board with the required size, and the flexible board is divided into a soft and hard combining area and a flexible area. And sequentially carrying out film coating, exposure, development, etching and film stripping to manufacture the inner layer circuit on the flexible board. And (4) carrying out inner layer AOI inspection on the flexible board with the inner layer circuit, and enabling the qualified product to enter the next procedure, namely cleaning the surface of the flexible board and carrying out browning treatment. And sticking a covering film on the surface of the soft core plate and forming a window, reserving the covering film in the flexible area, and enabling the size of the covering film to be 0.5-1.0mm larger than the single side of the flexible area. Then, the flexible board is processed by hot pressing (rapid pressing) to make the covering film and the flexible board tightly bonded together. And performing the palm processing again after performing OPE punching processing on the flexible plate.
Manufacturing a bonding layer: and a PI protective film (polyimide film) is pasted on one surface of the prepreg, which is opposite to the flexible layer, and the OPE punching processing is carried out on the prepreg, wherein the area of the prepreg, which corresponds to the flexible area, is called a precut area, the precut area can be separated from the prepreg by cutting laser along the edge of the precut area, and the PI protective film on the prepreg except the precut area is torn off.
(2) Pressing together
The flexible layer, adhesive layer and rigid layer are laminated together as shown in fig. 2. And then selecting lamination conditions according to the Tg of the plate material, and integrating the flexible layer, the bonding layer and the rigid layer into a whole to form the multilayer production plate.
(3) Sequentially drilling a multilayer production board, depositing copper, electroplating the whole board, manufacturing an outer layer circuit, manufacturing a solder mask and performing surface treatment on the multilayer production board
Drilling: the existing drilling technology is adopted, and drilling is carried out on the production plate according to design requirements.
Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
Electroplating the whole plate: and (5) performing full-plate electroplating for 60min at the current density of 2.1ASF to thicken the hole copper.
Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then, the film is removed, etching and tin removal are carried out in sequence, and an outer layer circuit is etched on the production board.
Outer layer AOI: and using an automatic optical detection system to detect whether the outer layer circuit has defects such as open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and meanwhile, the effect of beautifying the appearance is achieved.
Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
Electrical testing: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(4) Shaping of
According to the prior art and according to the design requirement, the shape tolerance is +/-0.05 mm.
(5) Uncovering cover
And cutting the rigid layer of the multilayer production plate around the edge of the cutting area by depth control milling and butting the rigid layer with the blind groove, and taking out the cutting area, the precutting area and the PI protective film on the precutting area from the multilayer production plate to expose the flexible area of the flexible layer.
(6) fQC, FQA, packaging and shipment
FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
Packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (5)
1. A method for manufacturing a rigid-flex printed circuit board is characterized by comprising the following steps,
s1: manufacturing a rigid layer: manufacturing a circuit on the rigid core board, and routing blind grooves around the edge of the cut-off area on the rigid core board;
manufacturing a flexible layer: manufacturing a circuit on a flexible board, and pasting a cover film on a flexible area of the flexible board, wherein the size of the cover film is larger than that of a single side of the flexible area;
manufacturing a bonding layer: adhering a PI protective film on one surface of the prepreg, which is opposite to the flexible layer, wherein the area of the prepreg, which corresponds to the flexible area, is called a precut area, cutting along the edge of the precut area to separate the precut area from the prepreg, and tearing off the PI protective film on the prepreg except the precut area;
s2: laminating and pressing the flexible layer, the bonding layer and the rigid layer into a whole to form a multilayer production plate;
s3: sequentially drilling a multilayer production board, depositing copper, electroplating the whole board, manufacturing an outer layer circuit, manufacturing a solder mask and performing surface treatment on the multilayer production board;
s4: and carrying out forming treatment on the multilayer production plate, cutting the rigid layer side of the multilayer production plate around the edge of the cutting area through depth control milling and butting the rigid layer side with the blind groove, and taking out the cutting area, the precutting area and the PI protective film on the precutting area from the multilayer production plate to expose the flexible area of the flexible layer.
2. The method of manufacturing a rigid-flex printed circuit board according to claim 1, wherein in step S1, the size of the cover film is 0.5 to 1.0mm larger than the single side of the flexible region.
3. The method of manufacturing a flex-rigid board according to claim 1, wherein the precut section is separable from the prepreg by laser cutting along the edge of the precut section in step S1.
4. The method of manufacturing a rigid-flex printed circuit board according to claim 1, wherein in step S2, the flexible layer and the rigid layer are browned before the flexible layer, the adhesive layer and the rigid layer are laminated together.
5. The method of manufacturing a rigid-flex printed circuit board according to claim 4, wherein in the manufacturing of the flexible layer in step S1, after the wiring is formed on the flexible board, the flexible board is browned, a cover film is attached to the flexible area, and then the flexible board is browned again.
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| CN201911103763.8A CN110678011A (en) | 2019-11-12 | 2019-11-12 | Manufacturing method of rigid-flex printed circuit board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698833A (en) * | 2020-06-19 | 2020-09-22 | 珠海杰赛科技有限公司 | Uncapping method of rigid-flex board |
| CN112040639A (en) * | 2020-09-01 | 2020-12-04 | 深圳市景旺电子股份有限公司 | Manufacturing method of floating rigid-flex combined rigid-rigid combined board |
| CN112654179A (en) * | 2020-12-07 | 2021-04-13 | 高德（无锡）电子有限公司 | Processing technology for rear cover opening of printed circuit soft and hard combined board |
| CN113179596A (en) * | 2021-04-21 | 2021-07-27 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN113891584A (en) * | 2021-09-28 | 2022-01-04 | 深圳明阳电路科技股份有限公司 | Manufacturing method of copper block-embedded PCB |
| CN113905542A (en) * | 2021-09-30 | 2022-01-07 | 信丰迅捷兴电路科技有限公司 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
| CN114173484A (en) * | 2021-12-15 | 2022-03-11 | 生益电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN114390787A (en) * | 2021-12-30 | 2022-04-22 | 安捷利电子科技（苏州）有限公司 | Manufacturing process of flexible circuit board |
| CN115038244A (en) * | 2022-05-06 | 2022-09-09 | 江门崇达电路技术有限公司 | Method for improving steel sheet reinforcing and laminating process of rigid-flex combined plate |
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| CN111698833A (en) * | 2020-06-19 | 2020-09-22 | 珠海杰赛科技有限公司 | Uncapping method of rigid-flex board |
| CN111698833B (en) * | 2020-06-19 | 2023-04-28 | 珠海杰赛科技有限公司 | Uncovering method of rigid-flex printed circuit board |
| CN112040639A (en) * | 2020-09-01 | 2020-12-04 | 深圳市景旺电子股份有限公司 | Manufacturing method of floating rigid-flex combined rigid-rigid combined board |
| CN112654179A (en) * | 2020-12-07 | 2021-04-13 | 高德（无锡）电子有限公司 | Processing technology for rear cover opening of printed circuit soft and hard combined board |
| CN113179596A (en) * | 2021-04-21 | 2021-07-27 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN113179596B (en) * | 2021-04-21 | 2023-11-28 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
| CN113891584A (en) * | 2021-09-28 | 2022-01-04 | 深圳明阳电路科技股份有限公司 | Manufacturing method of copper block-embedded PCB |
| CN113905542A (en) * | 2021-09-30 | 2022-01-07 | 信丰迅捷兴电路科技有限公司 | Rigid-flexible circuit board for solving air expansion of cavity during plasma cleaning and processing technology thereof |
| CN114173484A (en) * | 2021-12-15 | 2022-03-11 | 生益电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN114390787A (en) * | 2021-12-30 | 2022-04-22 | 安捷利电子科技（苏州）有限公司 | Manufacturing process of flexible circuit board |
| CN115038244A (en) * | 2022-05-06 | 2022-09-09 | 江门崇达电路技术有限公司 | Method for improving steel sheet reinforcing and laminating process of rigid-flex combined plate |
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Application publication date: 20200110 |