CN113179596B - Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board - Google Patents
Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board Download PDFInfo
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- CN113179596B CN113179596B CN202110428596.5A CN202110428596A CN113179596B CN 113179596 B CN113179596 B CN 113179596B CN 202110428596 A CN202110428596 A CN 202110428596A CN 113179596 B CN113179596 B CN 113179596B
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- rigid
- circuit board
- bearing part
- release film
- prepreg
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000003801 milling Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000003475 lamination Methods 0.000 claims abstract description 24
- 239000010408 film Substances 0.000 claims description 84
- 239000013039 cover film Substances 0.000 claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000003825 pressing Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 74
- 239000011229 interlayer Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 13
- 239000003292 glue Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Abstract
The invention discloses a manufacturing method of a rigid-flex printed circuit board and the rigid-flex printed circuit board, wherein the method comprises the following steps: providing a flexible circuit board with a pattern manufactured; attaching a first covering film and a first release film on two sides of the flexible circuit board for quick lamination process treatment; the first covering film and the first release film are positioned on the flexible part of the rigid-flex printed circuit board; attaching the prepreg and the first circuit layer on two sides of the flexible circuit board after the rapid lamination, and carrying out lamination procedure treatment; the prepreg covers the periphery of the first release film and is subjected to groove milling process treatment; manufacturing a first rigid bearing part on the pressed flexible circuit board; manufacturing a second rigid bearing part on the first rigid bearing part; and carrying out the process of controlling the depth of the milling plate on the second rigid bearing part to obtain the rigid-flex printed circuit board. The problems of poor uncovering and interlayer pulling in the prior art are effectively solved, the reliability of products is improved, the productivity of rigid-flex boards is improved, and the production cost is saved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a rigid-flex printed circuit board and the rigid-flex printed circuit board.
Background
The rigid-flex printed circuit board is a special circuit board which is formed by combining a flexible circuit board (also called a flexible board and a flexible board) and a rigid circuit board (also called a rigid board) through pressing and other processes, and has the characteristics of a flexible board (FPC) and a rigid board (PCB); the rigid-flex printed circuit board utilizes a single component to replace a complex composite printed circuit board formed by connecting a plurality of connectors, a plurality of cables and a ribbon cable, has stronger performance and higher stability, and simultaneously limits the product structure in one component, thereby realizing the purpose of optimizing the available space by bending and folding circuits.
For a rigid-flex board applied to communication and medical treatment, higher structural precision, signal transmission precision and anti-interference capability are required, when designing, the effect of different rigid areas with different layers can be realized by adopting different thicknesses of different rigid areas, for example: one rigid region is used as a main bearing part, the number of layers is designed to be 6 layers, and the other rigid region connected through the flexible region is used as a secondary bearing part, and the number of layers is designed to be 4 layers; the main bearing part is communicated with the complex circuit, and the secondary bearing part plays a role of bearing the electronic module with high structural precision, high signal transmission precision, high anti-interference capability and the like, so that the function partitioning is realized.
Aiming at the same rigid-flex board, products with different layers are manufactured by adopting the traditional pressing, uncovering and other processes, as the number of uncovering layers between the main bearing part and the secondary bearing part is different, the acceptance mode is also different, the problems of breakage of the secondary bearing part, poor uncovering, interlayer pulling and the like are easily generated, the reliability of the products is affected, and even the processing failure of the products is caused.
Therefore, for processing the same rigid-flex printed circuit board product with different layers, a novel processing method which can not only realize effective production of the product, but also improve the reliability of the product and has good operability and convenience needs to be explored.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a high-heat-dissipation aluminum-based circuit board and the high-heat-dissipation aluminum-based circuit board, and aims to solve the technical problems of board bending, board warping, glue overflow in holes and the like in the manufacturing process of the heat-dissipation aluminum-based circuit board in the prior art.
To achieve the above objective, an embodiment of the present invention provides a method for manufacturing a rigid-flex board, where the rigid-flex board includes a first rigid bearing portion and a second rigid bearing portion, and the method includes:
providing a flexible circuit board with a pattern manufactured;
attaching a first covering film and a first release film on two sides of the flexible circuit board for quick lamination process treatment; the first covering film and the first release film are positioned at the flexible part of the rigid-flex printed circuit board;
attaching the prepreg and the first circuit layer on two sides of the flexible circuit board after the rapid lamination, and performing lamination procedure treatment; the prepreg covers the periphery of the first release film and is subjected to groove milling process treatment;
manufacturing the first rigid bearing part on the pressed flexible circuit board, including:
manufacturing a first solder mask layer on the pressed flexible circuit board;
attaching a second release film and a second covering film on the first solder mask layer to form a first rigid bearing part to be treated;
wherein the second release film and the second cover film are positioned on the first rigid bearing part and extend to the flexible part;
performing pressing treatment on the first rigid bearing part to be treated to obtain a first rigid bearing part;
fabricating the second rigid carrier on the first rigid carrier, comprising:
attaching a double-layer prepreg and a second circuit layer to two sides of the first rigid bearing part, and performing pressing procedure treatment; wherein the double-layer prepreg is positioned between the first circuit layer and the second circuit layer;
the double-layer prepreg comprises a thick prepreg and a thin prepreg, the thin prepreg is covered on the first circuit layer, the second covering film layer and the second release film, the thickness of the thin prepreg is equal to that of the first solder mask layer, and the thin prepreg covers the periphery of the second release film to perform groove milling process treatment;
manufacturing a second solder mask layer on the second circuit layer to obtain a second rigid bearing part;
the circuit layers of the first rigid bearing part and the second rigid bearing part are different;
and performing depth-control milling process on the second rigid bearing part to obtain a rigid-flex printed circuit board, wherein the depth-control milling process comprises the following steps of:
performing a first depth control plate milling process on the second rigid bearing part to uncover the first release film to obtain the flexible part;
and carrying out a second forming and plate milling process on the second rigid bearing part so as to uncover the second release film to obtain the first rigid bearing part and obtain the rigid-flex printed circuit board.
Further, the groove milling process is to adopt laser to perform groove milling.
Further, the width of the groove body in the laser groove milling process is in the range of 0.05 mm-0.3 mm.
Further, the first and second release films have a thickness of less than 10 μm.
The embodiment of the invention also provides a rigid-flex printed circuit board, which is manufactured by the manufacturing method, and comprises the following steps: a flexible portion; a first rigid carrier and a second rigid carrier electrically connected to the flexible portion; the circuit layers of the first rigid bearing part and the second rigid bearing part are different.
Compared with the prior art, in the technical scheme provided by the invention, the release film and the corresponding position of the release film are arranged for carrying out laser milling, so that a one-time uncovering and one-time forming basis is provided for the subsequent uncovering and deep milling process, the problems of poor uncovering and interlayer pulling in the prior art are solved, the reliability of products is improved, the productivity of rigid-flex boards is improved, and the production cost is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a rigid-flex board according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of an embodiment of a method for manufacturing a rigid-flex printed circuit board according to the present invention;
FIG. 3 is a schematic diagram of a structure of the step S200 in FIG. 2;
FIG. 4 is a schematic diagram of the structure of the step S300 in FIG. 2;
FIG. 5 is a schematic diagram of a structure of the step S400 in FIG. 2;
FIG. 6 is a schematic diagram of a structure of the step S500 in FIG. 2;
fig. 7 is a schematic diagram of a manufacturing structure of step S600 in fig. 2.
Reference numerals illustrate:
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the present invention without making any inventive effort, are intended to be within the scope of the embodiments of the present invention.
In order to better understand the above technical solutions, the following describes the above technical solutions in detail with reference to the accompanying drawings.
Referring to fig. 1 to fig. 7, fig. 1 is a schematic structural diagram of an embodiment of a rigid-flex printed circuit board according to the present invention; FIG. 2 is a schematic flow chart of an embodiment of a method for manufacturing a rigid-flex printed circuit board according to the present invention; FIG. 3 is a schematic diagram of a structure of the step S200 in FIG. 2; FIG. 4 is a schematic diagram of the structure of the step S300 in FIG. 2; FIG. 5 is a schematic diagram of a structure of the step S400 in FIG. 2; FIG. 6 is a schematic diagram of a structure of the step S500 in FIG. 2; fig. 7 is a schematic diagram of a manufacturing structure of step S600 in fig. 2. As shown in fig. 1, the rigid-flex board 10 includes a flexible portion 300, a first rigid carrier portion 100 and a second rigid carrier portion 200 electrically connected to the flexible portion 300; wherein the number of circuit layers of the first rigid carrier part 100 and the second rigid carrier part 200 is different. In this embodiment, the number of circuit layers of the first rigid carrier portion 100 is four, and the number of circuit layers of the second rigid carrier portion 200 is six, which is taken as an example, and the number of circuit layers of the first rigid carrier portion 100 and the second rigid carrier portion 200 of the rigid-flex board 10 is not limited.
As shown in fig. 2 to 6, the method steps of the manufacturing method of the rigid-flex printed circuit board 10 are as follows:
s100: a flexible circuit board 400 is provided with a completed pattern.
A flexible circuit board 400 is provided and patterning is performed on the flexible circuit board 400. In this embodiment, a specific example is illustrated by using a double-sided flexible circuit board, and reference is made to flexible circuit boards with other layers.
S200: attaching a first cover film 310 and a first release film 320 on both sides of the flexible circuit board 400 to perform a rapid lamination process; wherein, the first cover film 310 and the first release film 320 are located on the flexible portion 300 of the flex-rigid board.
The first cover films 310 and the first release films 320 are attached to two sides of the flexible circuit board 400 of the circuit pattern, namely, two first cover films 310 and two first release films 320 are arranged, and the two first cover films 310 and the two first release films 320 are located on the flexible part 300 of the rigid-flex printed circuit board. The two first cover films 310 and the two first release films 320 and the flexible circuit board 400 are subjected to a rapid lamination process so as to be integrated.
Specifically, the first cover film 310 is located between the first release film 320 and the flexible circuit board 400. The first cover film 310 is a cover film with a glue layer, and the glue layer of the first cover film 310 is attached towards the direction of the circuit layer of the flexible circuit board 400. The first release film 320 is a release film without an adhesive layer, and the first release film label 320 is attached to the first cover film 310. The size of the first release film 320 is smaller than the size of the first cover film 310, the size of the first release film 320 is equal to the size of the flexible portion 400 (the first cover opening area) of the rigid-flex printed circuit board, and the thickness of the first release film 320 is smaller than 10 μm, wherein the first release film 320 is made of a PTFE film or a silicone oil release agent.
S300: attaching the prepreg 510 and the first circuit layer 520 to two sides of the flexible circuit board after the rapid lamination, and performing lamination process treatment; the prepreg 510 covers the periphery of the first release film 320 for a slot milling process.
The prepreg 510 and the first circuit layer 520 are attached to two sides of the flexible circuit board after the rapid lamination, namely, two prepregs 510 and the first circuit layer 520 are provided, wherein the prepreg 510 is located between the first circuit layer 520 and the circuit layer of the flexible circuit board 400, and the prepreg 510 performs a groove milling process on the periphery of the first release film 320. In this embodiment, the groove milling process is performed by using a laser to form the groove 511.
Specifically, the prepreg is manufactured into a groove body 511 by adopting a laser groove milling process, the contour of the groove body 511 is the edge contour of the first release film 320, wherein the width range of the laser groove body in the laser groove milling process is 0.05 mm-0.3 mm, and the depth in the laser groove milling process is 1/3-1/2 of the thickness of the prepreg.
And carrying out lamination working procedure treatment on the flexible circuit board after the rapid lamination, the prepregs on the two sides and the first circuit layer to obtain the laminated flexible circuit board.
In the embodiment, the effect of attaching the release film is that the release film is strong in inertia, and can not be adhered to the cover film or the prepreg during pressing, so that a good isolation or separation effect is provided for subsequent uncovering. Specifically, the first release film 320 is attached to isolate the first cover film 320 from the prepreg 510, so as to prevent the first cover film 320 from adhering to the prepreg 520 during the subsequent uncovering process, which results in the problem of tearing and pulling of the uncovering.
S400: the first rigid carrier 100 is fabricated on the laminated flexible circuit board.
With specific reference to steps S410-S430.
S500: a second rigid carrier 200 is fabricated on the first rigid carrier 100.
With specific reference to steps S510-S520.
S600: the second rigid bearing part 200 is subjected to a depth-controlled milling process to obtain the rigid-flex printed circuit board 10.
With specific reference to steps S610-S620.
According to the manufacturing method of the rigid-flex printed circuit board, the release film is arranged and the laser milling groove is formed in the position corresponding to the release film, so that a one-time uncovering and one-time forming basis is provided for the subsequent uncovering and deep milling process, the problems of poor uncovering and interlayer pulling in the prior art are solved, the reliability of products is improved, the productivity of the rigid-flex printed circuit board is improved, and the production cost is saved.
As shown in fig. 5, step S400 specifically includes:
s410: a first solder resist layer 630 is formed on the flexible circuit board 400 after lamination.
The first solder mask layer 630 is patterned according to the solder mask pattern requirements of the first rigid carrier 100.
S420: attaching a second release film 620 and a second cover film 610 on the first solder resist layer 630 to form a first rigid carrier 100 to be processed; wherein the second release film 620 and the second cover film 610 are located on the first rigid carrier portion 100 and extend to the flexible portion 300.
Specifically, a second release film 620 is attached to the first solder mask 630 pattern, the thickness of the second release film 620 is smaller than 10 μm, and the size of the second release film 620 is the same as the size of the first solder mask 630 pattern.
The second release film 620 is attached to the second cover film 610, and the second cover film 610 wraps the second release film 620, so that the size of the second cover film 610 is larger than that of the second release film 610, each single side is at least 0.2mm, and the total is larger than 0.4mm, and the second cover film 610 covers the first solder resist layer 630 together to form the first rigid carrier 100 to be processed. Wherein the second cover film 610 and the second release film 620 are located on the first rigid carrier portion 100, and the second cover film 610 extends to the flexible portion 300 near the edge of the flexible portion 300. The second release film 320 is made of a PTFE film or a silicone oil release agent.
In this embodiment, the second release film 620 is located between the first solder mask 630 and the second cover film 610. Similarly, the second release film 620 is a release film without a glue layer, and the second release film 620 is attached to the first solder mask 630. The second cover film 610 is a cover film with a glue layer, and the glue layer of the second cover film 610 is attached towards the direction of the second release film 620 and the first solder mask 630. The second release film 620 in the present embodiment is used to isolate the first solder mask layer 630 from the second cover film 610, so as to prevent the second cover film 610 from adhering to the first solder mask layer 630 during the subsequent uncovering process, thereby damaging the first solder mask layer 630.
S430: the first rigid carrier 100 to be processed is subjected to press-fit processing, and the first rigid carrier 100 is obtained.
After the second release film 620 and the second cover film 610 are bonded to the first solder resist layer 630, they are rapidly laminated to form a whole, thereby forming the first rigid carrier 100.
As shown in fig. 6, step S500 specifically includes:
s510: attaching a double-layer prepreg 710 and a second circuit layer 720 to two sides of the first rigid bearing part 100, and performing a lamination process; wherein the dual-layer prepreg 710 is located between the first circuit layer 520 and the second circuit layer 720.
The two-layer prepreg 710 and the second circuit layer 720 are attached to two sides of the first rigid carrier 100, and in this embodiment, the two-layer prepreg 710 includes a thick prepreg 712 and a thin prepreg 711. Firstly, attaching a thin prepreg 711 to a circuit board of the first rigid bearing part 100, wherein the thickness of the thin prepreg 711 after lamination is equal to the thickness of the first solder mask 630 of the first rigid bearing part 100, so that in order to achieve the effect of buffering due to consistency of lamination thickness, the thin prepreg 712 is used for manufacturing a laser groove body through a laser groove milling process to form a groove body 511, and the contour of the laser groove body is the edge contour uncovered by the first rigid bearing part 100; then, a thick prepreg 712 is attached to the thin prepreg 711, wherein the thick prepreg 712 serves to meet the thickness requirement of the product, meet the requirement of covering the first rigid supporting portion 100, and give the second rigid bearing portion 200 reliable rigid supportability; finally, a second circuit layer 720 copper layer is attached to the thick prepreg. Fig. 6 is a schematic structural diagram after lamination, and in the actual operation process, before lamination, the first rigid carrier 100, the thin prepreg 712, the thick prepreg 712, and the second circuit layer 720 need to be aligned and stacked, that is, the layers with the laser grooves and the patterns manufactured are aligned and stacked, and then are partially combined by fusing, riveting, fusing and riveting to form an aligned and stacked structure.
The first rigid carrier 100, the thin prepreg 711, the thick prepreg 712 and the second circuit layer 720 are subjected to a lamination process together to form a preliminary second rigid carrier 200, and an outer layer pattern of the second rigid carrier 200 is formed on the preliminary second rigid carrier 200.
S520: a second solder mask layer 730 is fabricated on the second circuit layer, so as to obtain a second rigid carrier 200.
A second solder resist layer 730 is formed on the second circuit layer outer layer pattern of the second rigid carrier 200, whereby the second rigid carrier 200 is completed.
As shown in fig. 7, step S600 specifically includes:
s610: the second rigid bearing part 200 is subjected to a first depth-controlling milling process to uncover the first release film 320, so as to obtain a flexible part 300.
Performing first-time depth control milling on the second rigid bearing part 200 refers to performing first-time depth control milling on the rigid-flex printed circuit board, wherein the first-time depth control milling is performed by controlling the depth of the depth control milling to be the edge of a first uncovering area B (namely the flexible part of the rigid-flex printed circuit board), and the depth of the depth control milling is performed by milling through the first circuit layer 520; when the cover is uncovered, the cover uncovering area and the cover uncovering layer are separated according to the graph of the control milling plate, so that the first release film 320 is uncovered, and the flexible part 300 of the rigid-flex printed circuit board is obtained.
S620: the second rigid carrier 200 is subjected to a second forming milling process to uncover the second release film 620 to obtain the first rigid carrier 100, so as to obtain the rigid-flex printed circuit board 10.
The second shaping milling process of the second rigid bearing part 200 refers to shaping milling according to the appearance requirement of the rigid-flex printed circuit board product.
In this embodiment, the first cover area B has "isolation" of the release layer, so that the first cover film 310 is not adhered to the prepreg, and a depth-controlling milling plate is adopted, so that the depth-controlling milled area can be directly broken off to form a flexible area; see first depth-controlling milling cutter a and first uncovering area B in fig. 7. The second uncovering area D is formed after forming due to the "isolation" of the release layer and the edges of the second uncovering area D are milled away, see the second forming mill C and the second uncovering area D in fig. 7.
In a word, the second rigid bearing part and the first bearing part are separately pressed by adopting the secondary pressing, so that the product precision can be better improved, and the problems of sliding plates, layering and the like caused by primary pressing are prevented; the uncovering area of the second rigid bearing part and the uncovering area of the first rigid bearing part are made of reverse laser grooves, a one-time uncovering and one-time forming basis is provided for the depth control milling and forming milling plate of the subsequent uncovering, and the problems of secondary bearing part breakage, poor uncovering, interlayer pulling and the like of a product caused by adopting the secondary uncovering are avoided; the method that the cover-removing area of the second rigid bearing part and the cover-removing area of the first rigid bearing part are separated by the release layer is adopted, so that the quality of cover removing can be effectively improved, and the problem that the cover is difficult to remove due to adhesion between the cover film and the prepreg layer caused by secondary lamination is prevented; the overall manufacturing process is high in operability, and the product processing precision and the product reliability can be effectively improved.
In summary, it is easy to understand by those skilled in the art that in the method for manufacturing a rigid-flex printed circuit board provided by the invention, the release film is arranged and the laser milling groove is formed at the corresponding position of the release film, so that a one-time uncovering and one-time forming basis is provided for the subsequent uncovering and deep milling process, the problems of poor uncovering and interlayer pulling in the prior art are solved, the reliability of products is improved, the productivity of the rigid-flex printed circuit board is improved, and the production cost is saved.
The foregoing description is only the preferred embodiments of the present invention, and is not intended to limit the scope of the embodiments of the present invention, and all the equivalent structural changes made by the descriptions of the embodiments of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the embodiments of the present invention.
Claims (4)
1. The manufacturing method of the rigid-flex printed circuit board is characterized in that the rigid-flex printed circuit board comprises a first rigid bearing part and a second rigid bearing part, and the manufacturing method comprises the following steps:
providing a flexible circuit board with a pattern manufactured;
attaching a first covering film and a first release film on two sides of the flexible circuit board for quick lamination process treatment;
the first covering film and the first release film are positioned at the flexible part of the rigid-flex printed circuit board;
the first release film is made of PTFE film or silicone oil release agent;
attaching the prepreg and the first circuit layer on two sides of the flexible circuit board after the rapid lamination, and performing lamination procedure treatment; the prepreg covers the periphery of the first release film and is subjected to groove milling process treatment;
manufacturing the first rigid bearing part on the pressed flexible circuit board, including:
manufacturing a first solder mask layer on the pressed flexible circuit board;
attaching a second release film and a second covering film on the first solder mask layer to form a first rigid bearing part to be treated;
wherein the second release film and the second cover film are positioned on the first rigid bearing part and extend to the flexible part;
the second release film is made of PTFE film or silicone oil release agent;
performing pressing treatment on the first rigid bearing part to be treated to obtain a first rigid bearing part;
fabricating the second rigid carrier on the first rigid carrier, comprising:
attaching a double-layer prepreg and a second circuit layer to two sides of the first rigid bearing part, and performing pressing procedure treatment; wherein the double-layer prepreg is positioned between the first circuit layer and the second circuit layer;
the double-layer prepreg comprises a thick prepreg and a thin prepreg, the thin prepreg is covered on the first circuit layer, the second covering film and the second release film, the thickness of the thin prepreg is equal to that of the first solder mask, and the thin prepreg covers the periphery of the second release film to perform groove milling process treatment;
manufacturing a second solder mask layer on the second circuit layer to obtain a second rigid bearing part;
the circuit layers of the first rigid bearing part and the second rigid bearing part are different;
and performing depth-control milling process on the second rigid bearing part to obtain a rigid-flex printed circuit board, wherein the depth-control milling process comprises the following steps of:
performing a first depth control plate milling process on the second rigid bearing part to uncover the first release film to obtain the flexible part;
and carrying out a second forming and plate milling process on the second rigid bearing part so as to uncover the second release film to obtain the first rigid bearing part and obtain the rigid-flex printed circuit board.
2. The method of claim 1, wherein the milling step is performed by laser.
3. The method according to claim 2, wherein the width of the groove body in the laser groove milling process is in a range of 0.05mm to 0.3mm.
4. The method of claim 3, wherein the first and second release films have a thickness of less than 10 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110428596.5A CN113179596B (en) | 2021-04-21 | 2021-04-21 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
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| CN202110428596.5A CN113179596B (en) | 2021-04-21 | 2021-04-21 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
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| CN113179596A CN113179596A (en) | 2021-07-27 |
| CN113179596B true CN113179596B (en) | 2023-11-28 |
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Citations (10)
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