CN104582309A - Rigid-flex circuit board and production method thereof - Google Patents
Rigid-flex circuit board and production method thereof Download PDFInfo
- Publication number
- CN104582309A CN104582309A CN201310479511.1A CN201310479511A CN104582309A CN 104582309 A CN104582309 A CN 104582309A CN 201310479511 A CN201310479511 A CN 201310479511A CN 104582309 A CN104582309 A CN 104582309A
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- Prior art keywords
- rigid
- circuit board
- flexible circuit
- manufacture method
- prepreg
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Abstract
The invention provides a production method of a rigid-flex circuit board as well as the rigid-flex circuit board. The production method of the rigid-flex circuit board comprises the following steps: a flexible board is provided; a strippable protection film is attached to a to-be-exposed area of the flexible board; a copper foil layer, a prepreg and the flexible board, or a rigid board, the prepreg and the flexible board are laminated and compressed according to a stacking requirement; the circuit board after compression is subjected to production processing, and a semi-finished rigid-flex circuit board product with well-produced graphics and lines is obtained; and depth-control cutting is performed on the board surface of the semi-finished rigid-flex circuit board product along boundary lines corresponding to the exposed area, and off-cut materials and the protection film are taken out. According to the production method of the rigid-flex circuit board, windowing on the prepreg or the rigid board is not required during production of the rigid-flex circuit board, and the process is simple; the method is applied to production of the rigid-flex circuit board with thicker or thinner dielectric layer, and the application range is wide; and a gasket is not required during production of the rigid-flex circuit board with the thinner dielectric layer, and the cost is low.
Description
Technical field
The present invention relates to circuit board manufacture field, in particular to a kind of manufacture method of rigid-flexible circuit board and the rigid-flexible circuit board with the method making.
Background technology
Rigid-flexible circuit board plate refers to and comprise one or more stiffened area and one or more soft region on one piece of printed circuit board, is selectively laminated together to form in certain sequence, connects with plated-through hole conducting by hardboard and soft board.Rigid-flexible circuit board has the durability of hardboard and the flexibility of soft board concurrently, be characterized in miniaturized, Installation Flexibility and can the requirement of meeting requirements on three-dimensional assembling, be particularly suitable for the application in the precise electronics such as portable type electronic product, medical electronics product, military equipment.
The manufacture craft of Rigid Flex is very complicated, according to different designing requirements, its manufacture craft is obviously different, but total mentality of designing can distinguish two kinds: the first is at the hardboard and the prepreg uplifting window that need to expose soft board region (bent area), put into that hold successfully in advance from code name that the is different FR4(glass-epoxy copper-clad plate flame resistant material grades of bent area formed objects, thickness when lamination pressing) base material or other pads fill, finally pad is taken out, expose bent area; The second is the prepreg using low fluidity, and at prepreg uplifting window, prepreg and CCL pressing.Manufacture craft can be summarized as following steps: first, makes flexible circuit base board and rigid circuit substrate respectively; Then, opening is formed in the presumptive area of rigid circuit substrate; Finally, by flexible circuit base board and the pressing of rigid circuit substrate, part flexible circuit base board can expose from the opening rigid circuit substrate thus form flex region, and the flexible circuit base board of remainder forms rigid region together with rigid circuit substrate, thus form the Rigid Flex with flex region and rigid region.
Known by above-mentioned analysis, existing manufacture craft all needs process of windowing, and must use pad for the rigid-flexible circuit board that dielectric layer is thin in manufacturing process, its work flow and the equal more complicated of operability.Therefore, be necessary to provide a kind of without the need to window and the scope of application is wide, the simple method of work flow makes Rigid Flex.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.
For this reason, the object of one aspect of the present invention is, a kind of manufacture method of rigid-flexible circuit board is provided, without the need to windowing in the process making rigid-flexible circuit board, and when the rigid-flexible circuit board that making dielectric layer is thin without the need to using pad, manufacture craft is simple, and cost is low, be applicable to the making of the rigid-flexible circuit board that dielectric layer is very thick or dielectric layer is thin, applied range.
The object of another aspect of the present invention is, provides the rigid-flexible circuit board that a kind of manufacture method of this rigid-flexible circuit board is made.
For achieving the above object, the embodiment of one aspect of the invention provides a kind of manufacture method of rigid-flexible circuit board, comprises the following steps:
Step 102, provides and is provided with line pattern and the soft board being pasted with coverlay;
Step 104, attaches strippable diaphragm at the exposed area place that needs of described soft board;
Step 106, by folded structure requirement, by copper foil layer, prepreg and described soft board, or hardboard, prepreg and described soft board carry out lamination and pressing;
Step 108, carries out making process to the circuit board after pressing, obtains the rigid-flexible circuit board semi-finished product making figure circuit;
Step 110, described rigid-flexible circuit board half-finished plate face carries out controlling profoundly cutting along the boundary line corresponding with described exposed area, will cut thing and take out together with described diaphragm, and expose the described exposed area on described soft board.
The manufacture method of the rigid-flexible circuit board that the above embodiment of the present invention provides, first soft board is made, then strippable diaphragm is attached in the exposed area that needs of soft board, the thickness of this diaphragm is very little, at copper foil layer (or hardboard), when prepreg and soft board carry out pressing, prepreg softens under the effect of the pressure, there is micro-deformation in the semi-solid preparation sector-meeting of the side contacted with diaphragm, prepreg can be covered on diaphragm and coverlay uniformly, after pressing, circuit board making flow process routinely makes, obtain the rigid-flexible circuit board semi-finished product making figure circuit, finally carry out controlling profoundly cutting, and take off cut copper foil layer (or hardboard) and prepreg, and utilize the bonding force between diaphragm and prepreg, diaphragm is peeled off mutually with soft board, takes out diaphragm in the lump, expose the exposed area on soft board, wherein, formation flex region, exposed area on soft board, remainder forms rigid region, thus forms the rigid-flexible circuit board with flex region and rigid region.
The manufacture method of the rigid-flexible circuit board that the above embodiment of the present invention provides, because the diaphragm thickness used is less, in bonding processes, prepreg is softening, deformation under the effect of the pressure, then be pressed together on equably on diaphragm and coverlay, like this before pressing without the need to windowing in advance on prepreg, save procedure of processing, process is simple; When preparing the thinner rigid-flexible circuit board of dielectric layer (between two copper foil layers for dielectric layer), as: with copper foil layer, prepreg (dielectric layer) and soft board pressing time, without the need to using pad, manufacture method is simply and reduce cost; The manufacture method of the rigid-flexible circuit board that the embodiment of the present invention provides is applicable to prepare the thicker rigid-flexible circuit board of dielectric layer (as with the obtained rigid-flexible circuit board of hardboard, prepreg and soft board pressing) and the thinner rigid-flexible circuit board (rigid-flexible circuit board as obtained with copper foil layer, prepreg and soft board pressing) of dielectric layer simultaneously, and the scope of application is wide.
The embodiment of another aspect of the present invention provides a kind of rigid-flexible circuit board, adopts the manufacture method of above-mentioned rigid-flexible circuit board to make.
In sum, the manufacture method of rigid-flexible circuit board provided by the invention, without the need to windowing in advance in the process making rigid-flexible circuit board, and when the rigid-flexible circuit board that making dielectric layer is thin without the need to using pad, manufacture craft is simple, save process time, reduce the cost of manufacture of rigid-flexible circuit board, improve the competitiveness of product.
Accompanying drawing explanation
Fig. 1 is the flow process chart of the rigid-flexible circuit board manufacture method according to one embodiment of the invention;
The manufacture method that Fig. 2 a to Fig. 2 e is the rigid-flexible circuit board provided by one embodiment of the invention makes the schematic diagram in each process segment of rigid-flexible circuit board;
The manufacture method that Fig. 3 a to Fig. 3 e is the rigid-flexible circuit board provided by another embodiment of the present invention makes the schematic diagram in each process segment of rigid-flexible circuit board.
Wherein, the corresponding relation in Fig. 2 a to Fig. 3 e between Reference numeral and component names is:
1 soft board, 11 flexible circuit base boards, 12 coverlays, 2 diaphragms, 3 prepregs,
4 copper-clad plates, 41 substrates, 51 copper foil layers, 52Ad glue-line, 53PI layer
Embodiment
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from mode described here to implement, and therefore, protection scope of the present invention is not by the restriction of following public specific embodiment.
As shown in Figure 1, the manufacture method of a kind of rigid-flexible circuit board that embodiment according to an aspect of the present invention provides, when making the thinner rigid-flexible circuit board of dielectric layer, comprises the following steps:
Step 102, provides and is provided with line pattern and the soft board being pasted with coverlay;
Step 104, attaches strippable diaphragm at the exposed area place that needs of described soft board;
Step 106, by folded structure requirement, carries out lamination and pressing by copper foil layer, prepreg and described soft board;
Step 108, carries out making process to the circuit board after pressing, obtains the rigid-flexible circuit board semi-finished product making figure circuit;
Step 110, described rigid-flexible circuit board half-finished plate face carries out controlling profoundly cutting along the boundary line corresponding with described exposed area, will cut thing and take out together with described diaphragm, and expose the described exposed area on described soft board.
The manufacture method of the rigid-flexible circuit board provided by the above embodiment of the present invention, when making the thinner rigid-flexible circuit board of dielectric layer, first soft board is made, then strippable diaphragm is attached in the exposed area that needs of soft board, the thickness of this diaphragm is very little, at copper foil layer, when prepreg and soft board carry out pressing, prepreg softens under the effect of the pressure, there is micro-deformation in the semi-solid preparation sector-meeting of the side contacted with diaphragm, prepreg can be covered on diaphragm and coverlay uniformly, after pressing, circuit board making flow process routinely makes, obtain the rigid-flexible circuit board semi-finished product making figure circuit, finally carry out controlling profoundly cutting, and take off cut copper foil layer and prepreg, and utilize the bonding force between diaphragm and prepreg, diaphragm is peeled off mutually with soft board, takes out diaphragm in the lump, expose the exposed area on soft board, wherein, formation flex region, exposed area on soft board, remainder forms rigid region, thus forms the rigid-flexible circuit board with flex region and rigid region.
Certainly, the rigid-flexible circuit board manufacture method that can also provide by the embodiment of the present invention makes the thicker rigid-flexible circuit board of dielectric layer, and its process is as follows:
Step 102, provides and is provided with line pattern and the soft board being pasted with coverlay;
Step 104, attaches strippable diaphragm in the exposed area that needs of described soft board;
Step 106, by folded structure requirement, carries out lamination and pressing by hardboard, prepreg and described soft board;
Step 108, carries out making process to the circuit board after pressing, obtains the rigid-flexible circuit board semi-finished product making figure circuit;
Step 110, described rigid-flexible circuit board half-finished plate face carries out controlling profoundly cutting along the boundary line corresponding with described exposed area, will cut thing and take out together with described diaphragm, and expose the described exposed area on described soft board.
When the manufacture method of the rigid-flexible circuit board provided by the above embodiment of the present invention makes rigid-flexible circuit board, because the diaphragm thickness used is less, in bonding processes, prepreg is softening, deformation under the effect of the pressure, then be pressed together on equably on diaphragm and coverlay, like this before pressing without the need to windowing in advance on prepreg, save procedure of processing, process is simple; When preparing the thinner rigid-flexible circuit board of dielectric layer, as: with copper foil layer, prepreg (dielectric layer) and soft board pressing time, without the need to using pad, manufacture method is simply and reduce cost; The manufacture method of this rigid-flexible circuit board is applicable to prepare the thicker rigid-flexible circuit board of dielectric layer and the thinner rigid-flexible circuit board of dielectric layer simultaneously, and the scope of application is wide.
According to a preferred embodiment of the invention, in described step 104, described diaphragm is polyester film or high temperature gummed tape or peelable glue.
Diaphragm is polyester film or high temperature gummed tape or peelable glue, makes diaphragm have certain viscosity, can be attached on coverlay, and after control is profoundly cut, diaphragm can be peeled off from coverlay, and noresidue on coverlay.
Particularly, the thickness of described diaphragm is 12 μm to 30 μm.
The thickness of diaphragm is 12 μm to 30 μm; very thin thickness; like this before pressing without the need to windowing in advance on prepreg; in bonding processes; prepreg softens under the effect of the pressure and deformation occurs; can be pressed together on equably on diaphragm and coverlay, prepreg, without the need to windowing in advance, saves manufacturing procedure.
It should be noted that, thickness is the diaphragm of 12 μm to 30 μm is the concrete scope that the present invention provides, and in actual production process, operating personnel can the thickness of sets itself diaphragm according to actual needs, is not limited to above-mentioned scope.
According in a specific embodiment of the present invention, carry out controlling when profoundly cutting in described step 110, to the described rigid-flexible circuit board semi-finished product that described copper foil layer, prepreg and soft board are made, depth of cut is apart from described diaphragm 5-15 μm of place.
According in another specific embodiment of the present invention, carry out controlling when profoundly cutting in described step 110, to the described rigid-flexible circuit board semi-finished product that described hardboard, prepreg and soft board are made, depth of cut is apart from described coverlay 15-40 μm of place.
Carry out controlling when profoundly cutting, be cut to distance coverlay or diaphragm predeterminable range place, in order to avoid damage the coverlay on soft board.Certainly, depth of cut can according to controlling the mode, the practical condition sets itself that profoundly cut.
Preferably, described control be deeply cut into machinery control dark milling or laser control profoundly cut.
Particularly, the deep steamed sandwich of described laser control draw together carbon dioxide control profoundly cut or ultraviolet (UV) control profoundly cut.
The dark milling of machinery control can be controlled the rigid-flexible circuit board that dielectric layer is thicker and profoundly cuts, and the dark cutting accuracy of laser control is high, can control and profoundly cut by the rigid-flexible circuit board thinner to dielectric layer.
According to of the present invention one concrete example, in described step 102, described coverlay comprises polyimides (PI) film and Ad glue (one of glue) layer.
According to of the present invention one concrete example, in described step 108, described making process comprises that the described circuit board after to pressing is holed, electroplated, Graphic transitions and anti-welding process.
The manufacture method of the rigid-flexible circuit board according to one embodiment of the invention, also comprises after step 110:
Step 112, carries out sharp processing to the rigid-flexible circuit board obtained after described step 110 process.
Preferably, milling sharp processing can be carried out to rigid-flexible circuit board.
The present invention on the other hand embodiment still provides a kind of rigid-flexible circuit board, adopt the manufacture method of above-mentioned rigid-flexible circuit board to make.
The process making rigid-flexible circuit board by the manufacture method of rigid-flexible circuit board provided by the invention is specifically introduced below in conjunction with two embodiments:
Embodiment one:
1) on flexible circuit base board 11, line pattern is made, and on flexible circuit base board 11, make contraposition wad cutter and target (not shown), and paste epiphragma 12, complete the making of soft board 1, as shown in Figure 2 a, wherein, in the present embodiment, flexible circuit base board 11 comprises PI layer 53, is arranged at the Ad glue-line 52 of PI layer 53 both sides, be arranged at the copper foil layer 51 on Ad glue-line 52, coverlay 12 comprises Ad glue-line 52 and PI layer 53;
2) get out diaphragm 2, can select the diaphragm of 12 μm or 25 μm thickness, the present embodiment preferably diaphragm 2 of 25 μm, cuts into small pieces by the shape of exposed area that needs of soft board 1 by diaphragm 2, and is attached on exposed area by diaphragm 2, as shown in Figure 2 b;
3) by folded structure requirement, the soft board 1 of coated with protective film 2, prepreg 3, copper foil layer 51 are folded in order, and pressing, as shown in Figure 2 c;
4) undertaken holing by normal flow, electroplate, Graphic transitions, anti-welding, change gold, as shown in Figure 2 d;
5) the dark cutting mode of UV laser control is adopted to cut, because now dielectric layer (i.e. prepreg 3) is thinner, be about 40-75 μm, must the higher UV laser control of service precision profoundly cut, and depth of cut is 5-15 μm of place on distance protection film 2, avoids the coverlay 12 of laser damage soft board 1;
Then take off cut copper foil layer 51 and prepreg 3, and utilize the bonding force between diaphragm 2 and prepreg 3, diaphragm 2 is peeled off with soft board 1 phase, take out diaphragm 2 in the lump, expose the exposed area on soft board 1, as shown in Figure 2 e;
6) milling profile, obtained rigid-flexible circuit board.
Embodiment two:
1) as shown in Figure 3 a, flexible circuit base board 11 makes line pattern, and paste epiphragma 12, complete soft board 1 and make;
2) diaphragm 2 is got out, can select the diaphragm 2 of 12 μm or 25 μm thickness, preferred 25 μm of thick diaphragms 2 in the present embodiment, cut into small pieces by the shape of exposed area that needs of soft board 1 by diaphragm 2, and diaphragm 2 is attached on exposed area, as shown in Figure 3 b;
3) prepare certain thickness copper-clad plate 4(copper-clad plate 4 and comprise copper foil layer 51 and substrate 41), one side makes contraposition wad cutter and target;
4) by folded structure requirement, the soft board 1 of coated with protective film 2, prepreg 3, the copper-clad plate 4 of making alignment target are folded in order, and pressing, as shown in Figure 3 c;
5) by normal flow boring, plating, Graphic transitions, anti-welding, change gold, as shown in Figure 3 d;
6) adopt machinery to control the mode of profoundly cutting to cut, now dielectric layer (comprising substrate 41 and prepreg 3) is thicker, and being greater than is 150 μm, and control is cut to 15-40 μm of place on coverlay 12 deeply, avoids damaging coverlay 12;
Then take off cut copper-clad plate 4 and prepreg 3, and utilize the bonding force between diaphragm 2 and prepreg 3, diaphragm 2 is peeled off with soft board 1 phase, take out diaphragm 2 in the lump, expose the exposed area on soft board 1, as shown in Figure 3 e;
7) milling profile, obtained rigid-flexible circuit board.
In sum, the manufacture method of the rigid-flexible circuit board that the embodiment of the present invention provides, when making rigid-flexible circuit board without the need to windowing in advance, saving manufacturing procedure, making technological process simple; Be applicable to the making of the very thick and thinner rigid-flexible circuit board of dielectric layer, applied widely; Without the need to using pad when making the thinner rigid-flexible circuit board of dielectric layer, the course of processing is simple, provides cost savings.
In the description of this specification, specific features, structure, material or feature that the description of term " embodiment ", " specific embodiment ", " example ", " concrete example " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a manufacture method for rigid-flexible circuit board, is characterized in that, comprises the following steps:
Step 102, provides and is provided with line pattern and the soft board being pasted with coverlay;
Step 104, attaches strippable diaphragm at the exposed area place that needs of described soft board;
Step 106, by folded structure requirement, by copper foil layer, prepreg and described soft board, or hardboard, prepreg and described soft board carry out lamination and pressing;
Step 108, carries out making process to the circuit board after pressing, obtains the rigid-flexible circuit board semi-finished product making figure circuit;
Step 110, on the half-finished plate face of described rigid-flexible circuit board, carries out controlling profoundly cutting along the boundary line corresponding with described exposed area, will cut thing and take out together with described diaphragm, and expose the described exposed area on described soft board.
2. the manufacture method of rigid-flexible circuit board according to claim 1, is characterized in that,
In described step 104, described diaphragm is polyester film or high temperature gummed tape or peelable glue.
3. the manufacture method of rigid-flexible circuit board according to claim 2, is characterized in that,
The thickness of described diaphragm is 12 μm to 30 μm.
4. the manufacture method of rigid-flexible circuit board according to claim 1, is characterized in that,
Carry out controlling when profoundly cutting in described step 110, to the described rigid-flexible circuit board semi-finished product that described copper foil layer, prepreg and soft board are made, depth of cut is apart from described diaphragm 5-15 μm of place; To the described rigid-flexible circuit board semi-finished product that described hardboard, prepreg and soft board are made, depth of cut is apart from described coverlay 15-40 μm of place.
5. the manufacture method of rigid-flexible circuit board according to claim 4, is characterized in that,
Described control is cut into the machinery dark milling of control deeply or laser control is profoundly cut.
6. the manufacture method of rigid-flexible circuit board according to claim 5, is characterized in that,
The deep steamed sandwich of described laser control is drawn together carbon dioxide control and profoundly to be cut or ultraviolet line traffic control is profoundly cut.
7. the manufacture method of rigid-flexible circuit board according to any one of claim 1 to 6, is characterized in that,
In described step 102, described coverlay comprises polyimide film and Ad glue-line.
8. the manufacture method of rigid-flexible circuit board according to claim 7, is characterized in that,
In described step 108, described making process comprises that the described circuit board after to pressing is holed, electroplated, Graphic transitions and anti-welding process.
9. the manufacture method of rigid-flexible circuit board according to claim 8, is characterized in that, also comprises after described step 110:
Step 112, carries out sharp processing to the rigid-flexible circuit board obtained after described step 110 process.
10. a rigid-flexible circuit board, is characterized in that, adopts the manufacture method of rigid-flexible circuit board as claimed in any one of claims 1-9 wherein to make.
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| CN201310479511.1A CN104582309A (en) | 2013-10-14 | 2013-10-14 | Rigid-flex circuit board and production method thereof |
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| CN201310479511.1A CN104582309A (en) | 2013-10-14 | 2013-10-14 | Rigid-flex circuit board and production method thereof |
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| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
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| CN113382536A (en) * | 2021-07-27 | 2021-09-10 | 生益电子股份有限公司 | PCB preparation method and PCB |
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