CN104853542A - Manufacturing method of rigid-flex printed circuit board - Google Patents
Manufacturing method of rigid-flex printed circuit board Download PDFInfo
- Publication number
- CN104853542A CN104853542A CN201510184332.4A CN201510184332A CN104853542A CN 104853542 A CN104853542 A CN 104853542A CN 201510184332 A CN201510184332 A CN 201510184332A CN 104853542 A CN104853542 A CN 104853542A
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- Prior art keywords
- rigid line
- rigid
- support plate
- overlay region
- mainboard
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a manufacturing method of a rigid-flex printed circuit board. The manufacturing method comprises manufacturing a rigid circuit main board, N rigid circuit branch boards and N flexible circuit boards, the flexible circuit board comprising a flexible circuit region, a first overlay region and a second overlay region, and one end of the flexible circuit region being connected with the first overlay region while the other end is connected with the second overlay region; laminating the first overlay regions of the N flexible circuit boards and the rigid circuit main board together; laminating the second overlay regions of the N flexible circuit boards and the N rigid circuit branch boards together, such that the second overlay region of one flexible circuit board is connected with one rigid circuit branch board; and performing board processing on the rigid circuit main board and the rigid circuit branch boards, so as to obtain the rigid-flex printed circuit board. With adoption of the technical scheme of the present invention, manufacturing of the rigid-flex printed circuit board with a branched and overlapped structure can be realized, and the size of the printed board is reduced.
Description
Technical field
The present invention relates to circuit board processing technique field, particularly relate to a kind of manufacture method of rigid-flex combined board.
Background technology
Along with PCB (Printed Circuit Board, printed circuit board) little to volume, lightweight, three-dimensionally to install and the future development of high connecting reliability, rigid printed circuit boards and flexible printed-circuit board start to rigid-flex combined board future development, the feature of rigid-flex combined board is that flexible region can bend, installing with solid when realizing follow-up assembling, is one of main growth factor of PCB industry future.
Rigid-flex combined board has rigid layer and flexible layers concurrently, is a kind of multilayer board.If the rigid-flex combined board that need make has multiple flexible stub area, need each flexible stub area to carry out parallel placement according to existing manufacture method, be finally made into rigid-flex combined board as shown in Figure 1.This processing method requires that the rigid-flex combined board produced need possess the consistent flexible stub area of profile, and the unified processing after being beneficial to lamination during sharp processing is cut.It is inconsistent and have the rigid-flex combined board of overlapped structure that prior art cannot make each layer flex plate profile.If adopt existing processing method to process the rigid-flex combined board with multiple flexible branch, the volume of printed board can be made to increase, if this rigid-flex combined board has N number of branch, then the volume of printed board need increase N doubly, and the requirement that this and current electronic product are more and more less to wiring board volume runs in the opposite direction.
Summary of the invention
The embodiment of the present invention proposes a kind of manufacture method of rigid-flex combined board, realizes the making of bifurcated overlay structure rigid-flex combined board, reduces the volume of printed board.
The embodiment of the present invention provides a kind of manufacture method of rigid-flex combined board, comprising:
Make a rigid line mainboard;
Make N number of rigid line and divide support plate; Wherein, N >=2;
Make N number of flex circuit application; Wherein, described flex circuit application comprises: flexible line areas, the first overlay region and the second overlay region; A termination of described flexible line areas connects described first overlay region, and another termination connects described second overlay region;
By the first overlay region of described N number of flex circuit application and described rigid line mainboard laminated together;
Divide support plate pressing with described N number of rigid line respectively by the second overlay region of described N number of flex circuit application, make the second overlay region of a flex circuit application connect a rigid line and divide support plate;
Divide support plate to carry out the processing of plate face to described rigid line mainboard and described rigid line, obtain rigid-flex combined board.
Further, described rigid line mainboard comprises: the first outer rigid line mainboard and the second outer rigid line mainboard;
Described making rigid line mainboard, specifically comprises:
First central layer and the second central layer are provided;
Inner line figure making and sharp processing are carried out to described first central layer, obtains the first outer rigid line mainboard;
Inner line figure making and sharp processing are carried out to described second central layer, obtains the second outer rigid line mainboard.
Further, described by the first overlay region of described N number of flex circuit application and described rigid line mainboard laminated together, specifically comprise:
By first overlay region of laminar manner by described N number of flex circuit application, be pressed together between described first outer rigid line mainboard and described second outer rigid line mainboard;
Wherein, sticking tablet is provided with between any two adjacent the first overlay regions, between described first outer rigid line mainboard and the first adjacent overlay region, be provided with sticking tablet, and be provided with sticking tablet between described second outer rigid line mainboard and the first adjacent overlay region.
Further, described rigid line divides support plate to comprise: the first outer rigid line divides support plate and the second outer rigid line to divide support plate;
Described first outer rigid line divides on support plate and is manufactured with inner line figure, and/or described second outer rigid line divides on support plate and is manufactured with inner line figure.
Again further, describedly divide support plate pressing with described N number of rigid line respectively by the second overlay region of described N number of flex circuit application, make the second overlay region of a flex circuit application connect a rigid line and divide support plate, specifically comprise:
Second overlay region of a flex circuit application is corresponded to a rigid line and divides support plate;
Seriatim by second overlay region of laminar manner by each flex circuit application, be pressed together on corresponding rigid line and divide first of support plate the outer rigid line to divide support plate and the second outer rigid line to divide between support plate;
Wherein, divide first of support plate the outer rigid line to divide between support plate in the second overlay region of described flex circuit application and the rigid line of correspondence and be provided with sticking tablet; And divide second of support plate the outer rigid line to divide between support plate in the second overlay region of described flex circuit application and the rigid line of correspondence to be provided with sticking tablet.
Further, describedly divide support plate to carry out the processing of plate face to described rigid line mainboard and described rigid line, specifically comprise:
Described rigid line mainboard makes outer-layer circuit figure;
Divide on support plate at described rigid line and make outer-layer circuit figure.
Further, after described rigid line mainboard makes outer-layer circuit figure, also comprise:
Described rigid line mainboard makes conductive hole, the first overlay region of described rigid line mainboard and every layer of flex circuit application is conducted.
Further, after described rigid line divides support plate makes outer-layer circuit figure, also comprise:
Divide on support plate at described rigid line and make conductive hole, make described rigid line divide support plate to conduct with the second overlay region of the flex circuit application of correspondence respectively.
Implement the embodiment of the present invention, there is following beneficial effect:
The embodiment of the present invention provides a kind of manufacture method of rigid-flex combined board, first make rigid line mainboard, a N number of rigid line and divide support plate and N number of flex circuit application, then by the first overlay region of N number of flex circuit application and rigid line mainboard laminated together, support plate pressing is divided with N number of rigid line respectively by the second overlay region of N number of flex circuit application, make the second overlay region of a flex circuit application connect a rigid line and divide support plate, finally divide support plate to carry out the processing of plate face to rigid line mainboard and rigid line, obtain rigid-flex combined board.Make the rigid-flex combined board of multiple flexible stub area compared to prior art, adopt technical solution of the present invention to make the rigid-flex combined board with bifurcated overlay structure.The rigid-flex combined board of bifurcated overlay structure has plural flex circuit application, and each layer flex circuit application has the inconsistent overlapped flexure region of profile.The circuit of each layer flex circuit application is connected respectively to the rigidity branch of different layers, and the circuit of each layer flex circuit application is again by being connected with the rigid region at a center simultaneously, makes the connection of rigid-flexible combination become an entirety.The rigid-flex combined board of the bifurcated overlay structure made according to technical solution of the present invention can reduce the volume of printed board, even if increase N number of branch more also without the need to increasing N printed board volume doubly, for space is saved in follow-up assembling.
In addition, rigid line mainboard of the present invention and rigid line divide support plate according to the demand of client, can be made into single-sided printed board, double-clad board or multilayer printed board, and to meet the different demands of client, applicability is strong.
Accompanying drawing explanation
Fig. 1 is the structural representation of the rigid-flex combined board that prior art provides;
Fig. 2 is the schematic flow sheet of a kind of embodiment of the manufacture method of rigid-flex combined board provided by the invention;
Fig. 3 is the structural representation that rigid line mainboard provided by the invention and rigid line divide a kind of embodiment of support plate;
Fig. 4 is the structural representation of a kind of embodiment of flex circuit application provided by the invention;
Fig. 5 is the structural representation of a kind of embodiment of juxtaposition rigid-flex combined board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See Fig. 2, be the schematic flow sheet of a kind of embodiment of the manufacture method of rigid-flex combined board provided by the invention, the method comprises the following steps:
Step 201: make a rigid line mainboard.
In the present embodiment, rigid line mainboard can be, but not limited to as single or multiple lift rigid line mainboard.Preferably, rigid line mainboard comprises: the first outer rigid line mainboard and the second outer rigid line mainboard.
Then step 201 specifically comprises: provide the first central layer and the second central layer; Inner line figure making and sharp processing are carried out to the first central layer, obtains the first outer rigid line mainboard; Inner line figure making and sharp processing are carried out to the second central layer, obtains the second outer rigid line mainboard rigid line mainboard.
Step 202: make N number of rigid line and divide support plate; Wherein, N >=2.
In the present embodiment, rigid line divides support plate to can be, but not limited to as single or multiple lift rigid line divides support plate.Preferably, rigid line divides support plate to comprise: the first outer rigid line divides support plate and the second outer rigid line to divide support plate.Described first outer rigid line divides on support plate and is manufactured with inner line figure, and/or described second outer rigid line divides on support plate and is manufactured with inner line figure.
Step 203: make N number of flex circuit application; Wherein, flex circuit application comprises: flexible line areas, the first overlay region and the second overlay region; A termination of flexible line areas connects the first overlay region, and another termination connects the second overlay region.
It should be noted that, flex circuit application can be lamina, double sided board or multi-layer sheet.And the Making programme of flex circuit application comprises interior photoimaging and pastes epiphragma etc., be technology well-known to those skilled in the art, in this not go into detail.
Step 204: by the first overlay region of N number of flex circuit application and rigid line mainboard laminated together.
During concrete enforcement, when rigid line mainboard comprises the first outer rigid line mainboard and the second outer rigid line mainboard, this step 204 specifically comprises: by first overlay region of laminar manner by N number of flex circuit application, is pressed together between the first outer rigid line mainboard and the second outer rigid line mainboard.Wherein, between any two adjacent the first overlay regions, sticking tablet is provided with; Between the first outer rigid line mainboard and the first adjacent overlay region, be provided with sticking tablet, and be provided with sticking tablet between the second outer rigid line mainboard and the first adjacent overlay region.Sticking tablet can be, but not limited to as prepreg.
Step 205: divide support plate pressing with N number of rigid line respectively by the second overlay region of N number of flex circuit application, makes the second overlay region of a flex circuit application connect a rigid line and divides support plate.
During concrete enforcement, when rigid line divide support plate comprise the first outer rigid line divide support plate and the second outer rigid line to divide support plate time, this step 205 specifically comprises: the second overlay region of a flex circuit application is corresponded to a rigid line and divides support plate; Seriatim by second overlay region of laminar manner by each flex circuit application, be pressed together on corresponding rigid line and divide first of support plate the outer rigid line to divide support plate and the second outer rigid line to divide between support plate; Wherein, divide first of support plate the outer rigid line to divide between support plate in the second overlay region of flex circuit application and the rigid line of correspondence and be provided with sticking tablet; And divide second of support plate the outer rigid line to divide between support plate in the second overlay region of flex circuit application and the rigid line of correspondence to be provided with sticking tablet.
Step 206: divide support plate to carry out the processing of plate face to rigid line mainboard and rigid line, obtains rigid-flex combined board.
In the present embodiment, divide support plate to carry out the processing of plate face to rigid line mainboard and rigid line, specifically comprise: on rigid line mainboard, make outer-layer circuit figure, divide on support plate at rigid line and make outer-layer circuit figure.
One as the present embodiment is illustrated, when making rigid line mainboard and N number of rigid line divide support plate, directly can carry out internal layer and outer-layer circuit graphic making to rigid line mainboard, support plate is divided to carry out internal layer and outer-layer circuit graphic making to rigid line, thus the plate face processing of saving in step 206, can rigid-flex combined board be obtained after making lamination, optimize manufacture craft.
In the present embodiment, after described rigid line mainboard makes outer-layer circuit figure, also comprise: on rigid line mainboard, make conductive hole, the first overlay region of rigid line mainboard and every layer of flex circuit application is conducted.
Further, after rigid line divides support plate makes outer-layer circuit figure, also comprise: divide on support plate at rigid line and make conductive hole, make described rigid line divide support plate to conduct with the second overlay region of the flex circuit application of correspondence respectively.Conductive hole can be, but not limited to as through hole.
Below in conjunction with Fig. 3, Fig. 4 and Fig. 5, the rigid-flex combined board adopted made by the manufacture method of rigid-flex combined board provided by the invention is illustrated.
See Fig. 3, it is the structural representation that rigid line mainboard provided by the invention and rigid line divide a kind of embodiment of support plate.
The rigid-flex combined board made by the manufacture method of rigid-flex combined board provided by the invention is adopted to comprise: rigid line mainboard 7, first rigid line divides that support plate 11, second rigid line divides support plate 21, the 3rd rigid line divides support plate 31, the 4th rigid line divides support plate 41, the 5th rigid line divides support plate 51 and the 6th rigid line divides support plate 61.
See Fig. 4, it is the structural representation of a kind of embodiment of flex circuit application provided by the invention.
It should be noted that, the rigid-flex combined board made by the manufacture method of rigid-flex combined board provided by the invention is adopted to comprise six flex circuit applications, and Fig. 4 is only the structural representation of one of them flex circuit application of rigid-flex combined board, other each flexibility circuit plate structures are similar to Fig. 4, do not describe one by one at the present embodiment.
As shown in Figure 4, flex circuit application comprises the first overlay region 301, flexible line areas 302 and the second overlay region 303.Wherein, a termination of flexible line areas 302 connects described first overlay region 301, and another termination connects described second overlay region 303.
In order to better this citing is described, Fig. 4 additionally provides the projection that rigid line mainboard 7 and the first rigid line divide support plate 11, the dotted portion namely shown in Fig. 4.Visible, rigid line mainboard 7 is overlapping with the first overlay region 301, and the first rigid line divides support plate 11 overlapping with the second overlay region 302.When lamination, first overlay region of six flex circuit applications and rigid line mainboard layer 7 are forced together, support plate pressing is divided by respectively with six, the second overlay region rigid line of six flex circuit applications, and divide support plate to carry out the processing of plate face to rigid line mainboard and rigid line, thus obtain the rigid-flex combined board shown in Fig. 5.
See Fig. 5, it is the structural representation of a kind of embodiment of rigid-flex combined board provided by the invention.The rigid-flex combined board made by the manufacture method of rigid-flex combined board provided by the invention is adopted to comprise a rigid line mainboard 7; Also comprise six rigid line and divide support plate, be respectively: the first rigid line divides that support plate 11, second rigid line divides support plate 21, the 3rd rigid line divides support plate 31, the 4th rigid line divides support plate 41, the 5th rigid line divides support plate 51 and the 6th rigid line divides support plate 61.This rigid-flex combined board also comprises six flex circuit applications, is respectively: the first flex circuit application 1, second flex circuit application 2, the 3rd flex circuit application 3, the 4th flex circuit application 4, the 5th flex circuit application 5 and the 6th flex circuit application 6.
Wherein, the first overlay region of six flex circuit applications is all laminated together with described rigid line mainboard 7, and respectively with six, the second overlay region rigid line of six flex circuit applications divides support plate pressing, make the second overlay region of a flex circuit application connect a rigid line and divide support plate, namely the second overlay region of the first flex circuit application 1 divides support plate 11 to be connected with the first rigid line, second overlay region and second rigid line of the second flex circuit application 2 divide support plate 21 to be connected, second overlay region of the 3rd flex circuit application 3 divides support plate 31 to be connected with the 3rd rigid line, second overlay region of the 4th flex circuit application 4 divides support plate 41 to be connected with the 4th rigid line, second overlay region of the 5th flex circuit application 5 divides support plate 51 to be connected with the 5th rigid line, second overlay region of the 6th flex circuit application 6 divides support plate 61 to be connected with the 6th rigid line.
During concrete enforcement, six rigid line divide support plate can be positioned at same row, also can be divided into multiple row.Fig. 5 only divides support plate to be divided into two row for six rigid line.
In the present embodiment, when making rigid line mainboard and rigid line divide support plate, through following processing technology, can also comprise: boring, Graphic transitions, print welding resistance, surface treatment and take off lid, this technique is prior art, is not described in detail at this.
The embodiment of the present invention provides a kind of manufacture method of rigid-flex combined board, first make rigid line mainboard, a N number of rigid line and divide support plate and N number of flex circuit application, then by the first overlay region of N number of flex circuit application and rigid line mainboard laminated together, support plate pressing is divided with N number of rigid line respectively by the second overlay region of N number of flex circuit application, make the second overlay region of a flex circuit application connect a rigid line and divide support plate, finally divide support plate to carry out the processing of plate face to rigid line mainboard and rigid line, obtain rigid-flex combined board.Make the rigid-flex combined board of multiple flexible stub area compared to prior art, adopt technical solution of the present invention to make the rigid-flex combined board with bifurcated overlay structure.The rigid-flex combined board of bifurcated overlay structure has plural flex circuit application, and it is inconsistent and have overlapped flexure region that each layer flex circuit application has profile.The circuit of each layer flex circuit application is connected respectively to the rigidity branch of different layers, and the circuit of each layer flex circuit application is again by being connected with the rigid region at a center simultaneously, makes the connection of rigid-flexible combination become an entirety.The rigid-flex combined board of the bifurcated overlay structure made according to technical solution of the present invention can reduce the volume of printed board, even if increase N number of branch more also without the need to increasing N printed board volume doubly, for space is saved in follow-up assembling.
Further, rigid line mainboard of the present invention and rigid line divide support plate according to the demand of client, can be made into single-sided printed board, double-clad board or multilayer printed board, and to meet the different demands of client, applicability is strong.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (8)
1. a manufacture method for rigid-flex combined board, is characterized in that, comprising:
Make a rigid line mainboard;
Make N number of rigid line and divide support plate; Wherein, N >=2;
Make N number of flex circuit application; Wherein, described flex circuit application comprises: flexible line areas, the first overlay region and the second overlay region; A termination of described flexible line areas connects described first overlay region, and another termination connects described second overlay region;
By the first overlay region of described N number of flex circuit application and described rigid line mainboard laminated together;
Divide support plate pressing with described N number of rigid line respectively by the second overlay region of described N number of flex circuit application, make the second overlay region of a flex circuit application connect a rigid line and divide support plate;
Divide support plate to carry out the processing of plate face to described rigid line mainboard and described rigid line, obtain rigid-flex combined board.
2. the manufacture method of rigid-flex combined board according to claim 1, is characterized in that, described rigid line mainboard comprises: the first outer rigid line mainboard and the second outer rigid line mainboard;
Described making rigid line mainboard, specifically comprises:
First central layer and the second central layer are provided;
Inner line figure making and sharp processing are carried out to described first central layer, obtains the first outer rigid line mainboard;
Inner line figure making and sharp processing are carried out to described second central layer, obtains the second outer rigid line mainboard.
3. the manufacture method of rigid-flex combined board according to claim 2, is characterized in that, described by the first overlay region of described N number of flex circuit application and described rigid line mainboard laminated together, specifically comprise:
By first overlay region of laminar manner by described N number of flex circuit application, be pressed together between described first outer rigid line mainboard and described second outer rigid line mainboard;
Wherein, sticking tablet is provided with between any two adjacent the first overlay regions, between described first outer rigid line mainboard and the first adjacent overlay region, be provided with sticking tablet, and be provided with sticking tablet between described second outer rigid line mainboard and the first adjacent overlay region.
4. the manufacture method of rigid-flex combined board according to claim 1, is characterized in that, described rigid line divides support plate to comprise: the first outer rigid line divides support plate and the second outer rigid line to divide support plate;
Described first outer rigid line divides on support plate and is manufactured with inner line figure, and/or described second outer rigid line divides on support plate and is manufactured with inner line figure.
5. the manufacture method of rigid-flex combined board according to claim 4, it is characterized in that, describedly divide support plate pressing with described N number of rigid line respectively by the second overlay region of described N number of flex circuit application, make the second overlay region of a flex circuit application connect a rigid line and divide support plate, specifically comprise:
Second overlay region of a flex circuit application is corresponded to a rigid line and divides support plate;
Seriatim by second overlay region of laminar manner by each flex circuit application, be pressed together on corresponding rigid line and divide first of support plate the outer rigid line to divide support plate and the second outer rigid line to divide between support plate;
Wherein, divide first of support plate the outer rigid line to divide between support plate in the second overlay region of described flex circuit application and the rigid line of correspondence and be provided with sticking tablet; And divide second of support plate the outer rigid line to divide between support plate in the second overlay region of described flex circuit application and the rigid line of correspondence to be provided with sticking tablet.
6. the manufacture method of the rigid-flex combined board according to any one of claim 1 to 5, is characterized in that, describedly divides support plate to carry out the processing of plate face to described rigid line mainboard and described rigid line, specifically comprises:
Described rigid line mainboard makes outer-layer circuit figure;
Divide on support plate at described rigid line and make outer-layer circuit figure.
7. the manufacture method of rigid-flex combined board according to claim 6, is characterized in that, after described rigid line mainboard makes outer-layer circuit figure, also comprises:
Described rigid line mainboard makes conductive hole, the first overlay region of described rigid line mainboard and every layer of flex circuit application is conducted.
8. the manufacture method of rigid-flex combined board according to claim 6, is characterized in that, after described rigid line divides support plate makes outer-layer circuit figure, also comprises:
Divide on support plate at described rigid line and make conductive hole, make described rigid line divide support plate to conduct with the second overlay region of the flex circuit application of correspondence respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510184332.4A CN104853542B (en) | 2015-04-17 | 2015-04-17 | A kind of production method of rigid-flex combined board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510184332.4A CN104853542B (en) | 2015-04-17 | 2015-04-17 | A kind of production method of rigid-flex combined board |
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| CN104853542A true CN104853542A (en) | 2015-08-19 |
| CN104853542B CN104853542B (en) | 2018-07-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105491819A (en) * | 2015-11-24 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Rigid-flex board with different flexible appearances and preparation method of rigid-flex board |
| CN111010820A (en) * | 2019-12-27 | 2020-04-14 | 上海嘉捷通电路科技股份有限公司 | Method for manufacturing rigid-flex board with overlapped flexible board area |
| CN112638043A (en) * | 2021-01-27 | 2021-04-09 | 东莞市若美电子科技有限公司 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
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| JP2008034702A (en) * | 2006-07-31 | 2008-02-14 | Sumitomo Bakelite Co Ltd | Rigid flex circuit board and its manufacturing method |
| CN102113425A (en) * | 2008-08-29 | 2011-06-29 | 揖斐电株式会社 | Flex-rigid wiring board and electronic device |
| CN104735923A (en) * | 2015-03-12 | 2015-06-24 | 广州杰赛科技股份有限公司 | Method for manufacturing rigidity and flexibility combined plate |
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2015
- 2015-04-17 CN CN201510184332.4A patent/CN104853542B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034702A (en) * | 2006-07-31 | 2008-02-14 | Sumitomo Bakelite Co Ltd | Rigid flex circuit board and its manufacturing method |
| CN102113425A (en) * | 2008-08-29 | 2011-06-29 | 揖斐电株式会社 | Flex-rigid wiring board and electronic device |
| CN104735923A (en) * | 2015-03-12 | 2015-06-24 | 广州杰赛科技股份有限公司 | Method for manufacturing rigidity and flexibility combined plate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491819A (en) * | 2015-11-24 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Rigid-flex board with different flexible appearances and preparation method of rigid-flex board |
| CN105491819B (en) * | 2015-11-24 | 2019-03-19 | 广州兴森快捷电路科技有限公司 | Rigid-flex board and preparation method thereof with different flexible shapes |
| CN111010820A (en) * | 2019-12-27 | 2020-04-14 | 上海嘉捷通电路科技股份有限公司 | Method for manufacturing rigid-flex board with overlapped flexible board area |
| CN112638043A (en) * | 2021-01-27 | 2021-04-09 | 东莞市若美电子科技有限公司 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
| CN112638043B (en) * | 2021-01-27 | 2022-04-01 | 东莞市若美电子科技有限公司 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104853542B (en) | 2018-07-06 |
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