CN204425778U - A kind of buried resistor rigid/flexible combined printed circuit board - Google Patents
A kind of buried resistor rigid/flexible combined printed circuit board Download PDFInfo
- Publication number
- CN204425778U CN204425778U CN201520121719.0U CN201520121719U CN204425778U CN 204425778 U CN204425778 U CN 204425778U CN 201520121719 U CN201520121719 U CN 201520121719U CN 204425778 U CN204425778 U CN 204425778U
- Authority
- CN
- China
- Prior art keywords
- region
- rigid
- circuit board
- printed circuit
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The utility model discloses a kind of buried resistor rigid/flexible combined printed circuit board, comprise rigid region and flexure region, described flexure region comprises flexible central layer, and described flexible central layer comprises pressing region and exposed region; Pressing region as inner core plates through in described rigid region; Exposed region outer surface is pasted with coverlay; Printed circuit board also comprises one or more layers resistance elements; Resistance elements is by being embedded in described rigid region in pressing mode; Upper surface and the lower surface of rigid region are coated with Copper Foil respectively.The buried resistor rigid/flexible combined printed circuit board that the utility model provides changes the shape design of traditional printed circuit board, improves resistance material integrated level on a printed circuit board.
Description
Technical field
The utility model relates to printed circuit board technology field, particularly relates to a kind of buried resistor rigid/flexible combined printed circuit board.
Background technology
In recent years along with smart mobile phone, portable type electronic product universal, continuous promotion electronic product, towards frivolous, multi-functional, the three-dimensional future development installed, makes the correlation techniques such as flexible printed-circuit board, rigid printed circuit boards, rigid/flexible combined printed circuit board obtain flourish.Simultaneously, new demand also means by surface mounting technology (Surface Mount Technology, be called for short SMT) be assembled to printed circuit board (PrintedCircuit Board, being called for short PCB) quantitative proportion also significantly increases surperficial passive component (Passive Component) with active element (Active Component), and the demand direction that this and electronic product develop is conflicting.For addressing this problem, industry also progressively develops to be imbedded (embedding) passive device technology and satisfies the demands; (embedding) passive device technology will be imbedded be applied to rigid printed circuit boards and belonged to global hot issue entered product practical stage.
And the correlation technique of present stage is mostly the technical scheme that the manufacture method, material prescription and the application resistance substrate that disclose resistance material substrate make rigid printed circuit boards.Particularly, rigid printed circuit boards is called for short rigid plate; Flexible printed-circuit board is called for short flex plate; Wherein, flex plate is also called flexible board, FPC (FlexiblePrinted Circuit) or soft board.
In order to the advantage effectively in conjunction with rigid plate and flex plate, prior art proposes produces rigid printed circuit boards, flexible printed-circuit board respectively, is then welded on the pad of printing board surface by SMT technology by the electric capacity of discrete, resistance element in rigid plate; Re-use connector flex plate and rigid plate are linked together.As shown in Figure 1, be a kind of Facad structure figure of rigid/flexible combined printed circuit board that prior art proposes; Referring to Fig. 2, it is the vertical view of the rigid/flexible combined printed circuit board that Fig. 1 provides.Wherein, rigid plate 10 is connected by flex plate 30 with rigid plate 20, and flex plate 30 is provided with connector 40 is fixed between rigid plate 10 and rigid plate 20 by flex plate 30; The resistance 11 of discrete and electric capacity 12 are welded on rigid plate 10 surface by surface mounting technology.The number of layers of rigid plate 10 or rigid plate 20 is generally more than or equal to 3, and the general layers of material using FR4 epoxy glass cloth laminated board sheet material or PTFE (polytetrafluoroethylene) sheet material to make rigid plate; The number of layers of flex plate 30 is generally more than or equal to 1, and flex plate region generally uses PI (polyimides) sheet material to make.Rigidity and flexible material are integrated by pipe sensitive adhesion; Mount capacitors, resistance in rigid plate again after circuit board finished product, as resistance 11 and electric capacity 12.
Because above circuit board structure of the prior art welds the components and parts such as electric capacity, resistance by SMT mode at plate surface, therefore it has multiple intrinsic defect, comprise: the passive devices such as 1) a large amount of electric capacity, resistance occupy the printed circuit board surface area of about more than 50%, cause cannot mounting more active device to realize greater functionality; 2) integrated level is low, and equipment volume is large; 3) can there is a large amount of solder joints in the passive device welded by SMT mode in a large number, circuit board reliability is low; 4), during circuit board work, easily interfere with each other between different components, cause the stability of a system poor.In addition, rigid plate and flex plate carry out UNICOM by the mode of connector, and the cost both having added circuit board also have impact on the communication reliability of rigid plate and flex plate.
Utility model content
Technical problem to be solved in the utility model is, provides a kind of buried resistor rigid/flexible combined printed circuit board, changes the shape design of traditional printed circuit board, improves resistance material integrated level on a printed circuit board.
For solving above technical problem, the utility model embodiment provides a kind of buried resistor rigid/flexible combined printed circuit board, comprising: rigid region and flexure region, and described flexure region comprises flexible central layer, and described flexible central layer comprises pressing region and exposed region; Described pressing region as inner core plates through in described rigid region; Described exposed region outer surface is pasted with coverlay; Described printed circuit board also comprises one or more layers resistance elements; Described resistance elements is by being embedded in described rigid region in pressing mode; Upper surface and the lower surface of described rigid region are coated with Copper Foil respectively.
Preferably, resistance elements described in every one deck respectively in be embedded in any side in the pressing region of described flexible central layer; Be electrically connected by boring of metallizing between the pressing region of the described resistance elements of each layer and described flexible central layer.
Further, described resistance elements etching has composite line and resistive film.
Further, described flexible central layer and described Copper Foil have etched electronic circuit respectively.
Preferably, described Copper Foil is provided with multiple pad and is coated with pad coating; Be electrically connected by described resistance elements between described pad.
Preferably, described printed circuit board comprises multiple rigid region and flexure region described at least one; Be electrically connected by described flexure region between rigid region described in each.
Further, in rigid region described in any one also in be embedded with FR4 material layer or polytetrafluoroethylmaterial material layer; The various material layers of described rigid region are electrically connected by metallization boring.
The buried resistor rigid/flexible combined printed circuit board that the utility model embodiment provides, has following beneficial effect:
Resistance material and flexible material is employed at the rigid region of rigid/flexible combined printed circuit board, the internal layer to rigid region is printed in the pressing region of resistance and flexible central layer, pressing is carried out by adhesive material between the pressing region of resistance elements and flexible central layer, and by realizing the electrical UNICOM of resistance elements and flexible central layer after metallizing to hole after boring, thus achieve resistance material by imbedding the object of printed board inside, the object of traditional surface-mount resistor element function is realized by interior mode of burying, save the space surface of printed circuit board, improve the integrated level of circuit board, and problem when eliminating system works, circuit board interfered with each other between various device, further, due to resistance is imbedded printed circuit inner cord, effectively can reduce the pad needed for printed circuit board, thus improve the interlinking reliability of electronic device.In addition, achieving UNICOM between different rigidity plate region by flexible material subregion directly being pressed to printed circuit inner cord, instead of the mode of conventional wire cable mode and connector, effectively improve the reliability of printed circuit board.
Accompanying drawing explanation
Fig. 1 is the Facad structure figure of a kind of rigid/flexible combined printed circuit board that prior art proposes.
Fig. 2 is the vertical view of the rigid/flexible combined printed circuit board that Fig. 1 provides.
Fig. 3 is the structure cutaway view of an embodiment of the rigid/flexible combined printed circuit board that the utility model provides.
Fig. 4 is the structure cutaway view of another embodiment of the rigid/flexible combined printed circuit board that the utility model provides.
Fig. 5 is a kind of perspective view of the rigid/flexible combined printed circuit board that the utility model Fig. 4 embodiment provides.
Fig. 6 is a kind of inner laminate structure schematic diagram of the rigid region of the rigid/flexible combined printed circuit board that the utility model provides.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
See Fig. 3, it is the structure cutaway view of an embodiment of the rigid/flexible combined printed circuit board that the utility model provides.
In the present embodiment, buried resistor rigid/flexible combined printed circuit board comprises rigid region and flexure region.Preferably, described printed circuit board comprises multiple rigid region and flexure region described at least one; Be electrically connected by described flexure region between rigid region described in each.As shown in Figure 3, this rigid/flexible combined printed circuit board comprises two rigid regions and a flexure region, is respectively the first rigid region 100, second rigid region 200 and the flexure region 300 for being connected two rigid regions.During concrete enforcement, the structure of the first rigid region 100 and the second rigid region 200 can be identical or different, specifically can design according to practical application.
Wherein, described flexure region 300 comprises flexible central layer, and described flexible central layer comprises pressing region and exposed region.Described pressing region as inner core plates through in described rigid region; Described exposed region outer surface is pasted with coverlay (not shown in Fig. 3); Particularly, when being provided with multiple rigid region in printed circuit board, then described flexible central layer comprises multiple pressing region, as shown in Figure 3, the part flexible central layer be pressed together on the first rigid region 100 is pressing region 301, and the part flexible central layer be pressed together on the second rigid region 200 is pressing region 302; The subregion be not pressed together on the flexible central layer in any one rigid region forms described exposed region 303, and the outer surface of exposed region 303 is pasted with coverlay, prevents the circuit on flexible central layer exposed.
During concrete enforcement, described printed circuit board also comprises one or more layers resistance elements; The described resistance elements of each layer is by being embedded in (any one) described rigid region in pressing mode; Upper surface and the lower surface of described rigid region are coated with Copper Foil respectively.As shown in Figure 3, as an embodiment, the top-down each layer component layout of the first rigid region 100 is followed successively by upper surface copper foil 101, first adhesive material layer 102, first resistance elements 103, second adhesive material layer 104, flexible central layer pressing region the 301, the 3rd adhesive material layer 105, second resistance elements 106, the 4th adhesive material layer 107 and lower surface Copper Foil 108.
Particularly, each layer capacitance material layer respectively in be embedded in any side in the pressing region of described flexible central layer; Every one deck resistance elements respectively in be embedded in any side in the pressing region of described flexible central layer.Each layer capacitance material layer, to be electrically connected by boring of metallizing between resistance elements and the pressing region of described flexible central layer.
As shown in Figure 3, first resistance elements 103 and the second resistance elements 106 can be in the both sides up and down in pressing region 301 respectively, also can be in the same side in pressing region 301 simultaneously, and, the number of plies of resistance elements built-in in the first rigid region 100 can adjust according to actual needs, and the structure arrangement of resistance elements built-in in the structure arrangement of resistance elements built-in in the first rigid region 100 and the second rigid region 200 can be identical or different.For example, the first core material 201 and the second core material 202 is built-in with in second rigid region 200, and, first core material 201 can be identical with the arbitrary resistance elements in the first rigid region 100, second core material 202 can be the other materials layer not identical with the arbitrary resistance elements in the first rigid region 100, such as FR4 (glass-epoxy) sheet material or PTFE (polytetrafluoroethylene) sheet material, capacitance material layer etc., to realize integrated more electronic circuit and components and parts on rigid/flexible combined printed circuit board, thus the electronic circuit system that acquisition function is enriched more.
It should be noted that, the laminated layer sequence, the various central layer quantity that are pressed together on each layer central layer on any one rigid region all can set according to actual needs.The both sides, pressing region of flexible central layer can simultaneously Embedded capacitance material, resistance material or wherein any one, the quantity of flexible central layer, capacitance material layer, resistance elements can be one or more layers.
Referring to Fig. 4, it is the structure cutaway view of another embodiment of the rigid/flexible combined printed circuit board that the utility model provides.
Particularly, rigid region 400 between upper surface copper foil 401 and lower surface Copper Foil 412 in be embedded with the pressing region 601 of multilayer material layer 402 ~ 411 and flexure region 600, similarly, rigid region 500 between upper surface copper foil 501 and lower surface Copper Foil 512 in be embedded with the pressing region 602 of multilayer material layer 502 ~ 511 and flexure region 600, wherein, the material layer 403 of rigid region 400 inside, material layer 405, the material that material layer 410 adopts is different, to build different electronic devices and components or electronic circuit, be adhesive material layer between each layer central layer, as adhesive material layer 404, 406, 407, 409 and 411 etc.In the diagram, the internal structure of rigid region 500 is different from the internal structure of rigid region 400, and rigid region 500 is connected with the exposed region 603 of rigid region 400 by flexure region, to realize the integrated level of more function and raising circuit board.In the present embodiment, in rigid region described in any one also in be embedded with FR4 (glass-epoxy) material layer or polytetrafluoroethylmaterial material layer; The various material layers of described rigid region are electrically connected by metallization boring.
Referring to Fig. 5, it is a kind of perspective view of the rigid/flexible combined printed circuit board that the utility model Fig. 4 embodiment provides.
Flexure region (flexible central layer) 600 runs through whole product (i.e. rigid/flexible combined printed circuit board) as inner core plates, and capacitance material, resistance material etc. only exist at the internal layer of rigid region 400 and rigid region 500; In flexure region, except flexible central layer 600, other material all can be removed.Because flexible material has the feature of unique removable, bending, torsion, therefore, the rigid/flexible combined printed circuit board that the present embodiment provides can realize bent performance between two rigid regions, and has excellent electrical property, dielectric property and heat resistance.
In the present embodiment, when specifically processing and manufacturing being carried out to rigid/flexible combined printed circuit board, further, be electrically connected by boring of metallizing between the pressing region of the described resistance elements of each layer and described flexible central layer.
As shown in Figure 6, it is a kind of inner laminate structure schematic diagram of the rigid region of the rigid/flexible combined printed circuit board that the utility model embodiment provides.Schematically depict the structure of three layers of central layer of the inside of rigid region in Fig. 6, comprise the first central layer 61, second central layer 62 and the 3rd central layer 63, each layer central layer can be any one in resistance elements, flexible central layer, capacitance material layer.Particularly, every one deck central layer all can arrange pad, wherein, the first central layer 61 is in the upper surface of a certain rigid region, therefore the first central layer 61 is provided with one or more pad.Particularly, the first central layer 61 is upper surface copper foil, and Copper Foil is provided with multiple pad and is coated with pad coating; Further, in the middle of pad on each layer central layer, boring communicates to connect respectively, and in pad 64, carry out boring to go forward side by side row metal process, form metallization boring 65, this hole 65 is through each layer central layer of rigid region inside.In implementation, can be electrically connected by described resistance elements between described pad, such as, between two pads in the second central layer 62, be filled with resistance 66 (i.e. resistance elements) in plate in one.In implementation, can be electrically connected by described capacitance material layer between described pad, such as, between two pads in the 3rd central layer 63, be filled with electric capacity 67 (i.e. capacitance material layer) in plate at another.
During concrete enforcement, design of electronic circuits can be carried out to each layer central layer further, to realize the circuit board of various function.Preferably, described resistance elements (in plate resistance 66) etching has composite line and resistive film.Further, flexible central layer 600 and Copper Foil 61 etch respectively electronic circuit.
When manufacturing the rigid/flexible combined printed circuit board that the present embodiment provides, following flow and method can be adopted to carry out processing and fabricating to the different material layer on circuit board, comprising:
1) electric capacity central layer Making programme: sawing sheet; To capacitance core board to explosure (Graphic transitions), circuit etching on electric capacity central layer, then carries out melanism or brown, to promote the engaging force of multilayer circuit board when pressing between Copper Foil and epoxy resin, to be laminated after completing the making of electric capacity central layer.
2) resistance central layer Making programme: sawing sheet; To resistor core board to explosure (Graphic transitions), resistance central layer etches composite line (compound pattern of resistance+circuit); Further etched resistor film (removing unwanted electric resistance alloy layer); Resistance central layer is exposed (Graphic transitions) again; Etched resistor (resistance is etched out); Chemical cleaning resistance central layer plate face; To be laminated after completing the making of resistance central layer; Be applied in and imbed the resistance material in printed circuit board and realize mainly through the mode of alloy-layer, even, fine and close alloy-layer is formed at the hair side of Copper Foil by sputter (Sputtering) mode, the unit resistance of the resistance material that different-thickness alloy-layer is corresponding different, the Copper Foil of this kind of band film resistor is referred to as resistance Copper Foil, can be directly used in and make multilayer rigid printed circuit boards; Also Copper Foil and the circuit board substrate such as epoxy resin, polytetrafluoroethylene material can be pressed together after being made into resistance substrate and be used further to make rigid printed circuit boards.In addition, realize the resistance of different size by the pattern imaging mode of printed circuit board and obtain the resistance of different resistance accordingly, can be used as radio frequency (Radio Frequency, be called for short RF) isolation in circuit, absorption resistance, also can as the coupling in digital circuit, up/down pull-up resistor.
3) flexible central layer Making programme: sawing sheet; To flexible core board to explosure (Graphic transitions); Circuit etching on flexible central layer; Chemical cleaning is carried out to flexible central layer; Flexible central layer surface mount coverlay (not last laminating area pastes epiphragma); Carry out fast pressure and melanism or brown; To be laminated after completing the making of flexible central layer.
4) overall flow: lamination is carried out to different material layers or central layer according to practical application; Rigid region is holed, is metallized in hole; The outer-layer circuit of etching upper and lower surface Copper Foil; Anti-welding and carry out the coating of pad coating to circuit, stamp mark of correlation character on circuit boards, circuit board is tested and sharp processing, test by rear acquisition finished product.
It should be noted that, the making of above electric capacity central layer, resistance central layer and flexible central layer does not have inevitable sequence requirement, can first process electric capacity central layer or resistance central layer as required, reprocess flexible central layer, or first process the reprocessing of flexible central layer electric capacity central layer or resistance central layer etc., also can process the material layer except above listed three kinds of central layers according to actual needs and adjust corresponding processing sequence.
The utility model is because at the rigid region internal layer embedding resistance material of rigid/flexible combined printed circuit board, flexible material and/capacitance material, get up to realize the UNICOM of electrical property by plated-through hole interconnection mode by its integrated connection, in printed circuit board, realize attachment in printed circuit board traditional handicraft arrive the function of the passive device such as electric capacity, resistance in plate face; And by flexible material two pieces or more blocks being buried electric capacity and/or buried resistor rigid printed circuit boards couples together, the printed circuit board that the present embodiment is provided becomes that function is many, integrated level is high, can the three-dimensional rigid-flexible printed circuit board installed.
During concrete enforcement, use electric capacity and/or resistance substrate material, and produce on electric capacity and/or resistance substrate material and require that the figure of size is to realize electric capacity and/or the resistance of difference in functionality demand, realize electric capacity and/or the network interconnection between resistance and circuit by metal aperture interconnection technique again, thus instead of electric capacity and/or the resistance element of surface soldered; Imbed flexible printed-circuit board at printed circuit intralamellar part, get the flex plate welded by connector for tradition, the height of realizing circuit plate is integrated simultaneously.
The integrated rigid/flexible combined printed circuit board of the height that the present embodiment provides, under the condition of identical table area, can install other active device, to realize more function on more vacant surface area; Or realizing under identical functional conditions, the rigid/flexible combined printed circuit board in the present embodiment can obtain less surface area, reduce integral installation size, realize more miniaturized, decrease solder joint simultaneously, improve the reliability of system.
The buried resistor rigid/flexible combined printed circuit board that the utility model embodiment provides, resistance material and flexible material is employed at the rigid region of rigid/flexible combined printed circuit board, the internal layer to rigid region is printed in the pressing region of resistance and flexible central layer, pressing is carried out by adhesive material between the pressing region of resistance elements and flexible central layer, and by realizing the electrical UNICOM of resistance elements and flexible central layer after metallizing to hole after boring, thus the mode of burying in passing through by resistance material by imbedding printed board inside, realize the object of traditional surface-mount resistor element function, save the space surface of printed circuit board, improve the integrated level of circuit board, and problem when eliminating system works, circuit board interfered with each other between various device, further, due to resistance is imbedded printed circuit inner cord, effectively can reduce the pad needed for printed circuit board, thus improve the interlinking reliability of electronic device.In addition, achieving UNICOM between different rigidity region by flexible material subregion directly being pressed to printed circuit inner cord, instead of the mode of conventional wire cable mode and connector, effectively improve the reliability of printed circuit board.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.
Claims (7)
1. a buried resistor rigid/flexible combined printed circuit board, comprises rigid region and flexure region, it is characterized in that, described flexure region comprises flexible central layer, and described flexible central layer comprises pressing region and exposed region;
Described pressing region as inner core plates through in described rigid region; Described exposed region outer surface is pasted with coverlay;
Described printed circuit board also comprises one or more layers resistance elements;
Described resistance elements is by being embedded in described rigid region in pressing mode; Upper surface and the lower surface of described rigid region are coated with Copper Foil respectively.
2. buried resistor rigid/flexible combined printed circuit board as claimed in claim 1, is characterized in that, resistance elements described in every one deck respectively in be embedded in any side in the pressing region of described flexible central layer;
Be electrically connected by boring of metallizing between the pressing region of the described resistance elements of each layer and described flexible central layer.
3. buried resistor rigid/flexible combined printed circuit board as claimed in claim 1, is characterized in that, described resistance elements etching has composite line and resistive film.
4. buried resistor rigid/flexible combined printed circuit board as claimed in claim 1, it is characterized in that, described flexible central layer and described Copper Foil have etched electronic circuit respectively.
5. buried resistor rigid/flexible combined printed circuit board as claimed in claim 4, it is characterized in that, described Copper Foil is provided with multiple pad and is coated with pad coating; Be electrically connected by described resistance elements between described pad.
6. the buried resistor rigid/flexible combined printed circuit board as described in any one of Claims 1 to 5, is characterized in that, described printed circuit board comprises multiple rigid region and flexure region described at least one; Be electrically connected by described flexure region between rigid region described in each.
7. buried resistor rigid/flexible combined printed circuit board as claimed in claim 6, is characterized in that, is embedded with FR4 material layer or polytetrafluoroethylmaterial material layer in going back in rigid region described in any one; The various material layers of described rigid region are electrically connected by metallization boring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520121719.0U CN204425778U (en) | 2015-03-02 | 2015-03-02 | A kind of buried resistor rigid/flexible combined printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520121719.0U CN204425778U (en) | 2015-03-02 | 2015-03-02 | A kind of buried resistor rigid/flexible combined printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204425778U true CN204425778U (en) | 2015-06-24 |
Family
ID=53476102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520121719.0U Active CN204425778U (en) | 2015-03-02 | 2015-03-02 | A kind of buried resistor rigid/flexible combined printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204425778U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517343A (en) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | Method for resistor integration on microwave printed circuit board |
| CN108307581A (en) * | 2017-01-12 | 2018-07-20 | 奥特斯奥地利科技与系统技术有限公司 | Electronic equipment with embedded components load-bearing part |
| CN108575049A (en) * | 2017-03-08 | 2018-09-25 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
-
2015
- 2015-03-02 CN CN201520121719.0U patent/CN204425778U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517343A (en) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | Method for resistor integration on microwave printed circuit board |
| CN108307581A (en) * | 2017-01-12 | 2018-07-20 | 奥特斯奥地利科技与系统技术有限公司 | Electronic equipment with embedded components load-bearing part |
| US11410965B2 (en) | 2017-01-12 | 2022-08-09 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic device with embedded component carrier |
| CN108575049A (en) * | 2017-03-08 | 2018-09-25 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
| CN108575049B (en) * | 2017-03-08 | 2021-03-23 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8052881B2 (en) | Method of manufacturing multilayer printed circuit board having buried holes | |
| KR101241544B1 (en) | The printed circuit board and the method for manufacturing the same | |
| WO2012030299A1 (en) | A rigid-flex circuit board and manufacturing method | |
| KR100499008B1 (en) | Two-sided PCB without via hole and the manufacturing method thereof | |
| US10531569B2 (en) | Printed circuit board and method of fabricating the same | |
| CN103635036A (en) | Flexible multilayer circuit board and method of manufacturing same | |
| CN103108491A (en) | Circuit board and manufacture method thereof | |
| CN103857209A (en) | Multi-layer circuit board and manufacture method for the same | |
| CN204425778U (en) | A kind of buried resistor rigid/flexible combined printed circuit board | |
| TWI402008B (en) | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof | |
| US8112880B2 (en) | Method for manufacturing multilayer printed circuit boards | |
| CN102316681B (en) | Circuit board and manufacturing method thereof | |
| CN104254213A (en) | Multi-layer circuit board and manufacturing method thereof | |
| CN105210462A (en) | Method for manufacturing component-embedded substrate, and component-embedded substrate | |
| CN103857176A (en) | Circuit board and manufacture method for the same | |
| CN103578804A (en) | Method for manufacturing rigidity and flexibility combined printed circuit board | |
| CN204425789U (en) | One buries electric capacity rigid/flexible combined printed circuit board | |
| KR20180112977A (en) | Printed circuit board and manufacturing method thereof | |
| CN101184363B (en) | Printed circuit board having embedded resistors and method of manufacturing the same | |
| CN204425779U (en) | One buries electric capacity buried resistor rigid/flexible combined printed circuit board | |
| CN104853542A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN104661428A (en) | Double-sided flexible circuit board and manufacturing method thereof | |
| CN104582265A (en) | Implementation method of embedded capacitor and circuit board | |
| CN106341945B (en) | A kind of flexible circuit board and preparation method thereof | |
| CN105307387A (en) | Large size high multilayer rigid-flexible impedance board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |