CN102316681B - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN102316681B CN102316681B CN201010213820.0A CN201010213820A CN102316681B CN 102316681 B CN102316681 B CN 102316681B CN 201010213820 A CN201010213820 A CN 201010213820A CN 102316681 B CN102316681 B CN 102316681B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 239000011241 protective layer Substances 0.000 claims abstract description 18
- 238000007639 printing Methods 0.000 claims abstract description 7
- 239000006071 cream Substances 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- -1 PI) Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003544 thiamines Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The invention provides a method for manufacturing a circuit board, and the method comprises the following steps: providing a copper-clad substrate, wherein the copper-clad substrate comprises a base layer and a copper foil layer; enabling the copper foil layer to be formed into a circuit diagram, wherein the circuit diagram comprises a first circuit and a second circuit; forming a covering layer on the circuit diagram, wherein the covering layer is provided with a first through hole and a second through hole, part of the first circuit is exposed to the first through hole, and part of the second circuit is exposed to the second through hole; printing a conductive paste on the covering layer, so that the conductive paste is formed into a first conductive column filled in the first through hole, a second conductive column filled in the second through hole and a first connecting circuit connecting the first conductive column with the second conductive column, thus the first circuit is electrically connected with the second circuit through the first conductive column, the first connecting circuit and the second conductive column; and forming a protective layer on the surface of the first connecting circuit. The invention also provides a circuit board manufactured by using the method for manufacturing the circuit board, and the circuit board is relatively light and thin.
Description
Technical field
The present invention relates to circuit board technology field, relate in particular to a kind of more frivolous circuit board and preparation method thereof.
Background technology
In information, communication and consumer electronics industry, circuit board is the indispensable basic comprising important documents of all electronics and IT products.And in thering is the portable electric appts of light, thin, short, little requirement, for example, in mobile phone, need to use comparatively frivolous circuit board, to realize circuit in narrow space, connect.Along with the raising of people to portable electronic device processes information requirements, the circuit of circuit board is more and more intensive, and, the transmission and the processing that need circuit to cease to realize telecommunications across interconnection.Now, conventionally circuit board need to be made to double-sided PCB or multilayer circuit board, to realize the connection request of circuit.Yet, because double-sided PCB or multilayer circuit board have larger thickness and weight, be therefore difficult to meet the requirement of portable electric appts lightness, miniaturization.
Therefore, be necessary to provide a kind of more frivolous circuit board and preparation method thereof.
Summary of the invention
Below will a kind of circuit board and preparation method thereof be described with embodiment.
A circuit board manufacturing method, comprises step: a copper-clad base plate is provided, and described copper-clad base plate comprises basalis and fits in the copper foil layer of basalis; Described copper foil layer is formed to line pattern, and described line pattern comprises the first circuit and the second circuit; On line pattern, form cover layer, described cover layer has the first through hole and the second through hole, and part the first circuit is exposed in the first through hole, and part the second circuit is exposed in the second through hole; Printing conductive cream on described cover layer, so that conductive paste forms the first conductive pole being filled in the first through hole, the first connection line that is filled in the second conductive pole in the second through hole and connects the first conductive pole and the second conductive pole, so that the first circuit is connected with the second line electricity with the second conductive pole by the first conductive pole, the first connection line; On described the first connection line surface, form protective layer, to protect the first connection line.
A kind of circuit board, comprise basalis, be formed at the line pattern on basalis surface, cover the cover layer of line pattern, the syndeton being formed by conductive paste and the protective layer of insulation, described cover layer has the first through hole and the second through hole, described syndeton comprises the first conductive pole being filled in the first through hole, the first connection line that is filled in the second conductive pole in the second through hole and connects the first conductive pole and the second conductive pole, described the first conductive pole and the first circuit electrically contact, described the second conductive pole contacts with the second line electricity, thereby the first circuit is connected with the second line electricity, described protective layer is coated described the first connection line, for the protection of the first connection line.
In the circuit board manufacturing method of the technical program, by the mode at cover layer perforate filled conductive cream, can be so that the circuit of line pattern realize to intersect across connection, so, can make that thickness is less, the circuit board of small volume.And, when the circuit board of making is soft board, can there is the performance and used life of destroying or force to yield preferably.
Accompanying drawing explanation
The schematic flow sheet of the circuit board manufacturing method that Fig. 1 provides for the technical program embodiment.
The cross-sectional schematic of the copper-clad base plate that Fig. 2 provides for the technical program embodiment.
Fig. 3 forms the copper foil layer of the copper-clad base plate of Fig. 2 the schematic top plan view of line pattern.
Fig. 4 is the cross-sectional schematic along the IV-IV line of Fig. 2.
Fig. 5 for forming tectal schematic diagram on the line pattern of Fig. 3.
Fig. 6 is the cross-sectional schematic along the VI-VI line of Fig. 5.
Fig. 7 for forming the schematic diagram of syndeton on the cover layer of Fig. 5.
Fig. 8 is the cross-sectional schematic along the VIII-VIII line of Fig. 7.
Thereby Fig. 9 for forming the schematic diagram that protective layer is made circuit board in the syndeton of Fig. 7.
Main element symbol description
Copper-clad base plate 10
Basalis 11
The first circuit 121
The second circuit 122
The 4th circuit 124
The 5th circuit 125
The first terminal pad 1210
The first wire 1211
The second terminal pad 1220
The second wire 1221
The 3rd terminal pad 1230
The 4th terminal pad 1240
The first through hole 131
The second through hole 132
Third through-hole 133
Syndeton 14
The first conductive pole 141
The second conductive pole 142
The 3rd conductive pole 143
The 4th conductive pole 144
The first connection line 145
The second connection line 146
Embodiment
Below in conjunction with drawings and Examples, circuit board that the technical program is provided and preparation method thereof is described in further detail.
Refer to Fig. 1, the circuit board manufacturing method that the technical program embodiment provides comprises step:
The first step, refers to Fig. 2, and a copper-clad base plate 10 is provided, and described copper-clad base plate 10 comprises basalis 11 and fits in the copper foil layer 12 of basalis 11.
In the present embodiment, described copper-clad base plate 10 is individual layer copper clad laminate, that is, it only comprises one deck copper foil layer 12.The material of described basalis 11 can be hard material, as epoxy resin, glass-fiber-fabric etc., also can be flexible material, as polyimides (Polyimide, PI), polyethylene terephthalate glycol (Polyethylene Terephthalate, PET), polytetrafluoroethylene (Teflon), poly-thiamines (Polyamide), polymethyl methacrylate (Polymethylmethacrylate), Merlon (Polycarbonate) or polyimides-polyethylene-terephthaldehyde ester copolymer (Polyamide polyethylene-terephthalatecopolymer) etc.Described copper foil layer 12 can be rolled copper foil, can be also electrolytic copper foil.In the present embodiment, the material of basalis 11 is polyimides, and copper foil layer 12 is rolled copper foil.
Second step, refers to Fig. 3 and Fig. 4, and described copper foil layer 12 is made to line pattern 120.The method of copper foil layer 12 being made to line pattern 120 can be chemical etching, can be also laser ablation.When adopting method for chemially etching to make line pattern 120, can be first by image transfer, protect and in copper foil layer 12, do not need etched part, thereby after chemical etching copper foil layer 12, can obtain the line pattern 120 being formed by the part staying.
In the present embodiment, line pattern 120 comprises each interval and substantially parallel the first circuit 121, the second circuit 122, tertiary circuit 123, the 4th circuit 124 and the 5th circuit 125.Described the first circuit 121 is between tertiary circuit 123 and the 5th circuit 125, and described the 5th circuit 125 is between the first circuit 121 and the second circuit 122, and described the second circuit is between the 5th circuit 125 and the 4th circuit 124.That is to say, tertiary circuit 123, the first circuit 121, the 5th circuit 125, the second circuit 122 and the 4th circuit 124 are arranged in order.
Described the first circuit 121 comprises the first terminal pad 1210 and is connected to the first wire 1211 of first terminal pad 1210 at least one sides, and described the first terminal pad 1210 is for being electrically connected to other element, and described the first wire 1211 is for transmission of electric signals.Described the second circuit 122 comprises the second terminal pad 1220 and is connected to the second wire 1221 of second terminal pad 1220 at least one sides, and described the second terminal pad 1220 is for being electrically connected to other element, and described the second wire 1221 is for transmission of electric signals.Described tertiary circuit 123 comprises the 3rd terminal pad 1230 and is connected to the privates 1231 of the 3rd terminal pad 1230 at least one sides, and described the 3rd terminal pad 1230 is for being electrically connected to other element, and described privates 1231 is for transmission of electric signals.Described the 4th circuit 124 comprises the 4th terminal pad 1240 and is connected to the privates 1241 of the 4th terminal pad 1240 at least one sides, and described the 4th terminal pad 1240 is for being electrically connected to other element, and described privates 1241 are for transmission of electric signals.In the present embodiment, the first wire 1211 is connected to the relative both sides of the first terminal pad 1210, and the diameter of the first terminal pad 1210 is greater than the live width of the first wire 1211.The second wire 1221 is connected to the relative both sides of the second terminal pad 1220, and the diameter of the second terminal pad 1220 is greater than the live width of the second circuit 122.Privates 1231 is connected to the relative both sides of the 3rd terminal pad 1230, and the diameter of the 3rd terminal pad 1230 is greater than the live width of privates 1231.Privates 1241 are also connected to the relative both sides of the 4th terminal pad 1240, and the diameter of the 4th terminal pad 1240 is greater than the live width of privates 1241.And described the first terminal pad 1210 is corresponding with the second terminal pad 1220, the 3rd terminal pad 1230 is corresponding with the 4th terminal pad 1240.
In the present embodiment, a part that only shows five circuits in Fig. 3 is as signal.Certainly, it will be understood by those skilled in the art that in the circuit board of actual production, line pattern 120 can comprise five above circuits, and the shape of five above circuits and distribution can design according to actual needs.
The 3rd step, sees also Fig. 4 to 6, forms cover layer 13 on line pattern 120.Described cover layer 13 can form by the mode of press mold, also can form by the mode applying.
Described cover layer 13 has the first through hole 131, the second through hole 132, third through-hole 133 and fourth hole 134, all or part of first through hole 131 that is exposed to of described the first terminal pad 1210, all or part of second through hole 132 that is exposed to of described the second terminal pad 1220, the all or part of third through-hole 133 that is exposed to of described the 3rd terminal pad 1230, all or part of fourth hole 134 that is exposed to of described the 4th terminal pad 1240.In the present embodiment, the first terminal pad 1210 of middle body is exposed to the first through hole 131, the second terminal pad 1220 of middle body is exposed to the second through hole 132, the 3rd terminal pad 1230 of middle body is exposed to third through-hole 133, and the 4th terminal pad 1240 of middle body is exposed to fourth hole 134.The aperture of the first through hole 131, the second through hole 132, third through-hole 133 and fourth hole 134 is less than respectively the diameter of the first terminal pad 1210, the second terminal pad 1220, the 3rd terminal pad 1230 and the 4th terminal pad 1240.That is to say, except the first terminal pad 1210 of middle body,, the 3rd terminal pad 1230 of the second terminal pad 1220 of middle body, middle body and the 4th terminal pad 1240 of middle body, cover layer 13 has covered the part exposing from line pattern 120 in the surface of remaining line pattern 120 and surface that basalis 11 is fitted with copper foil layer 12 these sides.
The 4th step, refers to Fig. 7 and Fig. 8, and printing conductive cream on described cover layer 13, so that conductive paste forms syndeton 14, to be electrically connected to line pattern 120.
Described conductive paste can have the paste electric conducting material of low-resistivity for copper conductive paste, silver-colored conductive paste or other, generally comprises resin, curing agent and is mixed in the conductive powder in resin.Due to conductive paste thickness comparatively, there is certain mobility, therefore can conductive paste be printed on to predetermined place by screen painting, thereby can form solid-state electric conducting material by curing conductive cream.In the present embodiment, on described cover layer 13 during printing conductive cream, conductive paste is fully filled in the first through hole 131, the second through hole 132, third through-hole 133 and fourth hole 134, and be printed between first through hole 131 and the second through hole 132 on cover layer 13 surfaces, be also printed between the third through-hole 133 and fourth hole 134 on cover layer 13 surfaces.That is to say, in the present embodiment, syndeton 14 comprises that formation is filled in the first conductive pole 141 in the first through hole 131, be filled in the second conductive pole 142 in the second through hole 132, be filled in the 3rd conductive pole 143 in third through-hole 133, be filled in the 4th conductive pole 144 in fourth hole 134, on cover layer 13 surface and connect the first connection line 145 of the first conductive pole 141 and the second conductive pole 142, and on cover layer 13 surfaces and connect the second connection line 146 of the 3rd conductive pole 143 and the 4th conductive pole 144.Described the first connection line 145 is substantially parallel with the second connection line 146, and the first connection line 145 is substantially vertical with the first circuit 121.So, the first circuit 121 is electrically connected to the second circuit 122 with the second conductive pole 142 by the first conductive pole 141, the first connection line 145, and tertiary circuit 123 is electrically connected to the 4th circuit 124 with the 4th conductive pole 144 by the 3rd conductive pole 143, the second connection line 146.
In the present embodiment, for guaranteeing the connection reliability of the first conductive pole 141 and the second conductive pole 142, the surface that the first conductive pole 141 exposes cover layer 13 is all covered by the first connection line 145, and the surface that the second conductive pole 142 exposes cover layer 13 is also all covered by the first connection line 145.That is to say, the length of the first connection line 145 is more than or equal to the ultimate range between the first conductive pole 141 and the second conductive pole 142.For guaranteeing the connection reliability of the 3rd conductive pole 143 and the 4th conductive pole 144, the surface that the 3rd conductive pole 143 exposes cover layer 13 is all covered by the second connection line 146, and the surface that the 4th conductive pole 144 exposes cover layer 13 is also all covered by the second connection line 146.That is to say, the length of the second connection line 146 is more than or equal to the ultimate range between the 3rd conductive pole 143 and the 4th conductive pole 144.
The 5th step, refers to Fig. 9, on surface and the surface of the second connection line 146 of the first connection line 145, forms protective layer 15, to protect the first connection line 145 and the second connection line 146, so can obtain circuit board 100.The material of described protective layer 15 can for epoxy resin, PI, PET, Teflon, etc.In the present embodiment, protective layer 15 is dielectric ink, is formed on the surface of the first connection line 145 and the second connection line 146 by printing.Fully coated the first connection line 145 of described protective layer 15 and the second connection line 146, that is to say, the first connection line 145 and the second connection line 146 are not all exposed to the external world.
See also Fig. 1 to Fig. 9, the circuit board 100 making by above step comprises basalis 11, is formed at the line pattern 120 on basalis 11 surfaces, covers the protective layer 15 of cover layer 13, the syndeton 14 being formed by conductive paste and the coated syndeton 14 of line pattern 120.Described line pattern 120 comprises the first circuit 121, the second circuit 122, tertiary circuit 123, the 4th circuit 124 and the 5th circuit 125 of each interval.Described the first circuit 121 has the first terminal pad 1210 for being electrically connected to other element, described the second circuit 122 has the second terminal pad 1220, the second terminal pad 1220 is also for being electrically connected to other element, described tertiary circuit 123 has the 3rd terminal pad 1230 for being electrically connected to other element, and described the 4th circuit 124 has the 4th terminal pad 1240 for being electrically connected to other element.Described cover layer 13 have first through hole 131 corresponding with the first terminal pad 1210, with corresponding the second through hole 132 of the second terminal pad 1220, with the corresponding third through-hole 133 of the 3rd terminal pad 1230 and the fourth hole 134 corresponding with the 4th terminal pad 1240.Described syndeton 14 comprises the first conductive pole 141 being filled in the first through hole 131, be filled in the second conductive pole 142 in the second through hole 132, be filled in the 3rd conductive pole 143 in third through-hole 133, be filled in the 4th conductive pole 144 in fourth hole 134, on cover layer 13 surface and connect the first connection line 145 of the first conductive pole 141 and the second conductive pole 142, and on cover layer 13 surfaces and connect the second connection line 146 of the 3rd conductive pole 143 and the 4th conductive pole 144.Thereby the first circuit 121 is electrically connected to the second circuit 122 with the second conductive pole 142 by the first conductive pole 141, the first connection line 145, and tertiary circuit 123 is electrically connected to the 4th circuit 124 with the 4th conductive pole 144 by the 3rd conductive pole 143, the second connection line 146.Described protective layer 15 is coated on the surface of the first connection line 145 and the second connection line 146; for the protection of the first connection line 145 and the second connection line 146; avoid its oxidation and affect the connection status of the first circuit 121 and the second circuit 122, and the connection status of tertiary circuit 123 and the 4th circuit 124.
Certainly, it will be understood by those skilled in the art that when circuit in line pattern 120 has other shape and distributes, syndeton 14 can change according to actual needs.While having more circuit to connect in line pattern 120, syndeton 14 can comprise six and above conductive pole and three and above connection line, and these connection lines can be parallel to each other, vertical or acutangulate, only need not to be in contact with one another between these connection lines.
In the circuit board manufacturing method of the technical program, by the mode at cover layer 13 perforates filled conductive cream, formed syndeton 14, thereby the circuit that makes line pattern 120 has been realized and having been intersected across connection, so, with simple effective method, made the circuit board 100 of the less and better performances of thickness.Particularly, generally speaking, the thickness of basalis 11 is 25 microns; the thickness of copper foil layer 12 is 18 microns, and tectal thickness is 60 microns, and the thickness of the first connection line 145 is 18 microns; the thickness of protective layer 15 is 12 microns, that is to say, the maximum ga(u)ge of circuit board 100 is probably 133 microns.Circuit board 100 has advantages of frivolous, can be used in the electronic equipment of miniaturization.And, when circuit board 100 is soft board, can there is the performance of destroying or force to yield preferably.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (8)
1. a circuit board manufacturing method, comprises step:
A copper-clad base plate is provided, and described copper-clad base plate comprises basalis and fits in the copper foil layer of basalis;
Described copper foil layer is formed to line pattern, and described line pattern comprises the first circuit and the second circuit;
On line pattern, form cover layer, described cover layer has the first through hole and the second through hole, and part the first circuit is exposed in the first through hole, and part the second circuit is exposed in the second through hole;
Printing conductive cream on described cover layer, so that conductive paste forms the first conductive pole being filled in the first through hole, the first connection line that is filled in the second conductive pole in the second through hole and connects the first conductive pole and the second conductive pole, so that the first circuit is connected with the second line electricity with the second conductive pole by the first conductive pole, the first connection line, the length that adds and be less than or equal to described the first connection line of the diameter of the spacing of described the first conductive pole and the second conductive pole, the diameter of described the first conductive pole and described the second conductive pole; And
On described the first connection line surface, form protective layer, to protect the first connection line.
2. circuit board manufacturing method as claimed in claim 1, it is characterized in that, described line pattern also comprises tertiary circuit and the 4th circuit, and described the first circuit is between tertiary circuit and the 4th circuit, and described the second circuit is also between tertiary circuit and the 4th circuit; While forming cover layer on line pattern, described cover layer also has third through-hole and fourth hole, and part tertiary circuit is exposed in third through-hole, and part the 4th circuit is exposed in fourth hole; On described cover layer during printing conductive cream, also make conductive paste formation be filled in the 3rd conductive pole in third through-hole, the second connection line that is filled in the 4th conductive pole in fourth hole and connects the 3rd conductive pole and the 4th conductive pole, so that tertiary circuit is connected with the 4th line electricity with the 4th conductive pole by the 3rd conductive pole, the second connection line; Described protective layer is also formed on the second connection line surface.
3. circuit board manufacturing method as claimed in claim 1, it is characterized in that, described line pattern also comprises the 5th circuit between the first circuit and the second circuit, and the first circuit, the second circuit and the 5th circuit are parallel to each other, and described the first connection line is vertical with the first circuit.
4. circuit board manufacturing method as claimed in claim 1, it is characterized in that, the first wire that described the first circuit comprises the first terminal pad and is at least connected in the first terminal pad one side, described the first terminal pad is all or part of to be exposed in the first through hole, the second wire that described the second circuit comprises the second terminal pad and is at least connected in the second terminal pad one side, described the second terminal pad is all or part of to be exposed in the second through hole, the diameter of described the first terminal pad is greater than the live width of the first wire, and the diameter of described the second terminal pad is greater than the live width of the second wire.
5. a circuit board, comprise basalis, be formed at the line pattern on basalis surface and the cover layer that covers line pattern, described line pattern comprises the first circuit and the second circuit, it is characterized in that, described cover layer has the first through hole and the second through hole, described circuit board also comprises syndeton and protective layer, described syndeton is formed by conductive paste, and comprise the first conductive pole being filled in the first through hole, the first connection line that is filled in the second conductive pole in the second through hole and connects the first conductive pole and the second conductive pole, described the first conductive pole and the first circuit electrically contact, described the second conductive pole contacts with the second line electricity, thereby the first circuit is connected with the second line electricity, the spacing of described the first conductive pole and the second conductive pole, the length that adds and be less than or equal to described the first connection line of the diameter of the diameter of described the first conductive pole and described the second conductive pole, described protective layer is coated described the first connection line, for the protection of the first connection line.
6. circuit board as claimed in claim 5, is characterized in that, described line pattern also comprises tertiary circuit and the 4th circuit, and described the first circuit is between tertiary circuit and the 4th circuit, and described the second circuit is also between tertiary circuit and the 4th circuit; Described cover layer also has third through-hole and fourth hole, and part tertiary circuit is exposed in third through-hole, and part the 4th circuit is exposed in fourth hole; Described syndeton also comprises the 3rd conductive pole being filled in third through-hole, the second connection line that is filled in the 4th conductive pole in fourth hole and connects the 3rd conductive pole and the 4th conductive pole, so that tertiary circuit is connected with the 4th line electricity with the 4th conductive pole by the 3rd conductive pole, the second connection line; Described protective layer is also formed on the second connection line surface.
7. circuit board as claimed in claim 5, it is characterized in that, described line pattern also comprises the 5th circuit between the first circuit and the second circuit, and the first circuit, the second circuit and the 5th circuit are parallel to each other, and described the first connection line is vertical with the first circuit.
8. circuit board as claimed in claim 5, it is characterized in that, the first wire that described the first circuit comprises the first terminal pad and is at least connected in the first terminal pad one side, described the first terminal pad is all or part of to be exposed in the first through hole, the second wire that described the second circuit comprises the second terminal pad and is at least connected in the second terminal pad one side, described the second terminal pad is all or part of to be exposed in the second through hole, the diameter of described the first terminal pad is greater than the live width of the first wire, and the diameter of described the second terminal pad is greater than the live width of the second wire.
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| CN201010213820.0A CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
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| CN201010213820.0A CN102316681B (en) | 2010-06-30 | 2010-06-30 | Circuit board and manufacturing method thereof |
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| CN102316681B true CN102316681B (en) | 2014-04-09 |
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| CN102711371A (en) * | 2012-06-08 | 2012-10-03 | 王定锋 | Double-sided lead wire circuit board with mutually-crossed lead wire circuits on two sides |
| CN103582321B (en) * | 2012-07-19 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and preparation method thereof |
| CN108076581A (en) * | 2016-11-17 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN110797183B (en) * | 2018-08-01 | 2021-10-19 | 宏启胜精密电子(秦皇岛)有限公司 | Wireless charging coil and manufacturing method thereof |
| CN113054087A (en) * | 2021-03-19 | 2021-06-29 | 幂光新材料科技（上海）有限公司 | LED lamp bead packaging mode and circuit structure for improving electro-optic conversion efficiency |
| CN113225924A (en) * | 2021-05-10 | 2021-08-06 | 幂光新材料科技（上海）有限公司 | Manufacturing method of high-luminous-efficiency LED lamp |
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|---|---|---|---|---|
| CN101031982A (en) * | 2005-05-30 | 2007-09-05 | 住友电气工业株式会社 | Conductive paste and multilayer printed wiring board using same |
| CN101304636A (en) * | 2007-05-11 | 2008-11-12 | 比亚迪股份有限公司 | Method for preparing flexibility printed circuit board using PET as base material |
| CN101466205A (en) * | 2007-12-19 | 2009-06-24 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
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|---|---|
| CN102316681A (en) | 2012-01-11 |
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