CN108076581A - Multi-layer flexible circuit board and preparation method thereof - Google Patents
Multi-layer flexible circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN108076581A CN108076581A CN201611027500.XA CN201611027500A CN108076581A CN 108076581 A CN108076581 A CN 108076581A CN 201611027500 A CN201611027500 A CN 201611027500A CN 108076581 A CN108076581 A CN 108076581A
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- China
- Prior art keywords
- layer
- circuit board
- basal
- separation
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Abstract
The invention discloses a kind of multi-layer flexible circuit boards and preparation method thereof.Multi-layer flexible circuit board includes opposite the first basal layer and the second basal layer being arranged in parallel；At least two conductive circuit layers being formed between the first basal layer and the second basal layer are mutually parallel between at least two conductive circuit layers, and each conductive circuit layer includes multiple spaced conducting wires；Separation layer, between being arranged at per two neighboring conductive circuit layer, wherein, separation layer offers through hole, so that the conducting wire of isolation board both sides is electrically connected by through hole.The present invention, as the first basal layer, the second basal layer and separation layer, is prepared conducting wire using graphical printing technology, is bonded between multilayer isolation board by adhesive layer using fexible film.Therefore, flexible multi-layer circuit board of the invention has the characteristics that flatness is high, flexible, thickness is thin, more preferable around folding endurance, heat expansion stress performance, suitable for flexible and slimming equipment.
Description
Technical field
The invention belongs to multilayer circuit board technical fields, specifically, are related to a kind of multi-layer flexible circuit board and its preparation
Method.
Background technology
Multilayer circuit board is electronic unit most basic in modern electronic equipment, plays connection and carries electronic component
Effect.With the continuous development of electronic technology, circuit board gradually develops to high density and flexibility direction.(1) high density
Change, the line width of conducting wire, line-spacing constantly reduce, and cabling is constantly encrypted, and the number of plies of wiring board is also being on the increase；(2) it is flexible
Change, using fexible film as board substrate, realize conducting wire around performances such as bending songs.
But current flexible PCB substantially using polyimides as base material, is carried out using traditional circuit technology of preparing
Production waits processing steps comprising covering dry film-exposure-and remove photoresist-corrode-remove photoresist in production process.Not only complex process, original
Material waste is more, and easily pollutes environment, this has caused the common concern of people.Meanwhile using polyimides as base material
Flexible circuit, due to the technological problems in preparation process, it is impossible to realize the preparation of very thin circuits, general thickness requirement exists
More than 50um.And modern electronic equipment increasingly pursues slimming and lightness, is particularly ordinary persons' consumer products pair such as mobile phone
The sensibility of thickness and weight makes all big enterprises constantly pursue the lightening of wiring board, therefore flexible PCB is also just a large amount of
Use, such as the flexible board used in the products such as apple iphone, ipad, Google glass.Secondly, flexible PCB is due to it
Body has folding property and around folding endurance, wiring in product can be made more flexible and convenient, small product size and shape design also have
There is the degree of freedom of bigger, this causes flexible PCB in the electronic device by more and more extensive use.
Due to the technique of current flexible PCB, equipment and some technical limitations, frivolous layer flexible electricity is prepared
Also there are certain difficulty, this constrains the development of lightening product to a certain extent on road.And with electronic component in recent years
Development, component is constantly miniaturized, and and the combination of flexible circuit come that development intensity is high, pliability is good, perfect heat-dissipating
Flexible circuitry has become the important research direction in this field.
The content of the invention
It is high, soft it is an object of the invention to provide a kind of flatness in order to solve above-mentioned problems of the prior art
The characteristics of property is good, thickness is thin, around folding endurance, the better multi-layer flexible circuit board of heat expansion stress performance extremely preparation method.
The present invention provides a kind of multi-layer flexible circuit board, including：Opposite the first basal layer and the second base being arranged in parallel
Bottom；At least two conductive circuit layers being formed between first basal layer and second basal layer, described at least two
It is mutually parallel between a conductive circuit layer, each conductive circuit layer includes multiple spaced conducting wires；Separation layer is set
Between every two neighboring conductive circuit layer, wherein, the separation layer offers through hole, so that the conduction of the isolation board both sides
Circuit is electrically connected by the through hole.
Further, the thickness of the separation layer is 1 μm~50 μm.
Further, the surface of the separation layer is formed with easy adhesion layer, and the surface tension of the easy adhesion layer is more than
45dyn, thickness are less than 1um.
Further, a diameter of 0.1mm~5mm of the through hole.
Further, the line width of the conducting wire is 1um~2000um.
Further, the material of the conducting wire is nanogold, and/or nano silver, and/or Nanometer Copper, and/or nanometer
Aluminium and/or metal alloy compositions.
Further, the material of first basal layer, the second basal layer and separation layer is polyimides, and/or poly- pair
Ethylene terephthalate, and/or polyethylene naphthalate, and/or polypropylene, and/or makrolon and/or THIN COMPOSITE
Membrane material.
Further, between first substrate and separation layer, between each two separation layer, second substrate and isolation
It is fixed between layer by adhesive layer, the adhesive layer is UV glue or heat-curable glue.
The present invention also provides a kind of preparation method of multi-layer flexible circuit board described above, including：
A conductive circuit layer is formed on the first basal layer；
The conductive unit that multiple laminations successively are set is formed in the conductive circuit layer, each conductive unit includes
It separation layer with through hole and is formed on the separation layer back in another conducting wire of the first basal layer one side
Layer；
In the last one conductive circuit layer the second basal layer is formed back in the one side of the separation layer.
Further, the conductive circuit layer is directly graphically formed in first basal layer or institute using mode of printing
It states on separation layer, the mode of printing is silk-screen printing or intaglio printing or ink jet printing or flexographic printing or transfer print
Brush or aerosol printing.
Beneficial effects of the present invention：The present invention using fexible film as the first basal layer, the second basal layer and separation layer,
Conducting wire is prepared using graphical printing technology, is bonded between multilayer isolation board by adhesive layer.Therefore, this hair
Bright flexible multi-layer circuit board has the characteristics that flatness is high, flexible, thickness is thin, more preferable around folding endurance, heat expansion stress performance,
Suitable for flexible and slimming equipment.
Description of the drawings
What is carried out in conjunction with the accompanying drawings is described below, above and other aspect, features and advantages of the embodiment of the present invention
It will become clearer, in attached drawing：
Fig. 1 is the sectional view of the multi-layer flexible circuit board of present pre-ferred embodiments；
Fig. 2 is the step flow chart of the preparation method of the multi-layer flexible circuit board of present pre-ferred embodiments；
Fig. 3~Fig. 8 is the preparation flow figure of the multi-layer flexible circuit board of present pre-ferred embodiments.
Specific embodiment
Hereinafter, with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to come in many different forms real
The present invention is applied, and the present invention should not be construed as limited to the specific embodiment illustrated here.On the contrary, provide these implementations
Example be in order to explain the principle of the present invention and its practical application, so as to others skilled in the art it will be appreciated that the present invention
Various embodiments and the various modifications for being suitable for specific intended application.Identical label can be used in flood specification and drawings
Represent identical element.
In the accompanying drawings, in order to which component is made clearly to show, the thickness of layer and region is exaggerated.In addition, identical label is whole
It can be used to represent identical element in layer specification and drawings.
Fig. 1 is the sectional view of the multi-layer flexible circuit board of present pre-ferred embodiments.
With reference to Fig. 1, multi-layer flexible circuit board according to embodiments of the present invention includes：First basal layer 101, conductive circuit layer
102nd, adhesive layer 103, separation layer 104, the second basal layer 106.The multi-layer flexible circuit board is conductive according to the first basal layer 101-
Line layer 102- adhesive layer 103- separation layer 104- conductive circuit layer 102- adhesive layer 103- separation layer 104- conductive circuit layers
The order of 102 ... second basal layers 106 stacks to be formed.
First basal layer 101 and the second basal layer 106 are arranged in parallel relatively.At least two conductive circuit layers 102 are formed in
Between first basal layer 101 and second basal layer 106.Conductive circuit layer 102 is directly graphical using mode of printing
It is formed on the first basal layer 101 or separation layer 104.The mode of printing can be silk-screen printing or intaglio printing or ink-jet print
Brush or flexographic printing or trans-printing and aerosol printing etc..But the present invention is not restricted to this.The material of conducting wire can
Think nanogold, and/or nano silver, and/or Nanometer Copper, and/or nano aluminum or metal alloy compositions.In the present embodiment
In, conductive circuit layer 102 is prepared using ink jet printing mode, and inkjet materials are nano silver conductive ink, line width scope
For 20um~2000um, thickness range is 0.5um~10um.Nano silver material after ink-jet is graphical, after drying and sintering
Form conducting wire, it is preferable that conducting wire thickness is 5um.But the present invention is not restricted to this.
Between separation layer 104 is arranged at per two neighboring conductive circuit layer 102.Arbitrary two layers of separation layer 104 is mutually parallel.
The quantity of separation layer 104 can be two layers, three layers, four layers etc..Preferably, the quantity of separation layer 104 is no more than 20 layers.But this hair
It is bright to be not restricted to this.Separation layer 104 is with fine and close structure and with electrical insulating property.Separation layer 104 has uniform thickness,
And its thickness is 1 μm~50 μm, preferred thickness is 8 μm~25 μm, and preferred thickness is less than 15um.In the present embodiment
In, the thickness of separation layer 104 is 10 μm.Further, the surface of separation layer 104 is coated with easy adhesion layer.The easy adhesion layer
Material be specially polyester coatings, surface tension is more than 45dyn, and thickness is less than 1um.But the present invention is not restricted to this.
First basal layer 101, the second basal layer 106 and separation layer 104 are formed using same thin polymer film.Or the
One basal layer 101 is formed using thin polymer film, and 104 and second basal layer 106 of separation layer is formed using composite film material.
The material of first basal layer 101, the second basal layer 106 and separation layer 104 is polyimides (PI), and/or poly terephthalic acid
Glycol ester (PET), and/or polyethylene naphthalate (PEN), and/or polypropylene (PP), and/or makrolon (PC)
Wait thin-film materials or composite film material.But the present invention is not restricted to this.
In the present embodiment, the first basal layer 101, the second basal layer 106 and separation layer 104 use polymer thin-film material
Polyethylene terephthalate (PET film).The thickness of first basal layer 101 is 2um~40um, it is preferred that thickness is less than
25um, it is further preferred that thickness is less than 15um.The thickness of second basal layer 106 is identical with the thickness of separation layer 104.
Through hole 105 is offered on separation layer 104, so that two layers adjacent of conducting wire is electrically connected by the through hole 105
Connect conducting.In the present embodiment, using machinery or laser mode drilling, a diameter of 0.1mm of the through hole 105 on separation layer 104
~10mm, through hole 105 need interconnection to conduct place between being opened in adjacent conducting wire.
Adhesive layer 103 is filled between first substrate and separation layer 104, between each two separation layer 104, described
Between two substrates and separation layer 104.Adhesive layer 103 is for two adjacent separation layers 104,104 and first basal layer of separation layer
101st, being adhesively fixed between 104 and second basal layer 106 of separation layer, so as to form multilayer circuit board.It should be noted that every
103 substance of adhesion without adhesiver layer is to prevent the covering of adhesive layer 103 from needing the conducting wire that interconnects at the through hole 105 of absciss layer 104.The glue
Adhesion coating 103 is UV glue or heat-curable glue, and thickness is less than 5um.But the present invention is not restricted to this.It should be noted that gluing
The thickness of layer 103 is thinner, is more conducive to the flexibility of flexible PCB, the thickness of adhesive layer 103 can pass through technology controlling and process.
The preparation method of the multi-layer flexible circuit board will be specifically introduced below.
Wherein, Fig. 2 is the step flow chart of the preparation method of the multi-layer flexible circuit board of present pre-ferred embodiments.Fig. 3
~Fig. 8 is the preparation flow figure of the multi-layer flexible circuit board of present pre-ferred embodiments.The preparation side of the multi-layer flexible circuit board
Method specifically includes following steps：
In step 210, a conductive circuit layer is formed on the first basal layer.Specifically, as shown in figure 3, the first substrate
Layer 201 is using PET film, thickness 15um.Pass through the side of ink jet printing (Dimatix 2831) on the first basal layer 201
Formula pattern sedimentation nano-silver conductive material, material deposition thickness are controlled by the number of spray printing.Cure by convection oven and burn
The first conductive circuit layer 202 is formed after knot, 202 sintered thickness of the first conductive circuit layer is 5um.
In a step 220, the conductive unit that multiple laminations successively are set is formed in the conductive circuit layer, it is each described
Conductive unit includes the separation layer with through hole and is formed on the separation layer back in the first basal layer one side
Another conductive circuit layer.Specifically, as shown in figure 4, by coating the first adhesive layer 303, by the first separation layer 304 and the first base
Bottom 201 bonds, while the place for needing unicom in adjacent first conductive circuit layer 202 on separation layer offers through hole in advance,
Through hole is prepared using laser cutting technique, through hole edge neatly and orderly impulse- free robustness.Wherein, the thickness of the first separation layer 304 is
10um.It should be noted that the uncoated gluing layer material in the through hole of the first separation layer 304, to prevent the first adhesive layer 303 from covering
Lid electrode causes electrical isolation.First adhesive layer 303 cures glue material using UV, and thickness is less than 5um, with the first basal layer 201
And the first separation layer 304 has strong combination power, will not cause delamination phenomenon in circuit plate benging and folding process.
As shown in figure 5, the second conductive circuit layer 405 is printed on the first separation layer 304 again by ink-jet technology, together
When, it is realized electrically by the through hole on the first separation layer 304 between the first conductive circuit layer 202 and the second conductive circuit layer 405
Connection.Similarly, electric conductivity is realized by curing and sintering processes by the second conductive circuit layer 405 that printing is formed.
As shown in fig. 6, after the second conductive circuit layer 405 is formed, by the second adhesive layer 503 by 304 He of the first separation layer
Second separation layer 505 bonds, while also offers through hole in advance on the second separation layer 505.Likewise, the second of through hole is conductive
Line layer 405 cannot have adhesive layer covering, prevent from being electrically insulated.
As shown in fig. 7, after the first separation layer 304 and the bonding of the second separation layer 505, by ink-jet technology in the second separation layer
Continue to prepare the 3rd conductive circuit layer 605 on 505, the 3rd conductive circuit layer is formed after curing sintering.
As shown in figure 8, reusing the 3rd adhesive layer 703 bonds the 3rd separation layer 705 and the second separation layer 505, and will
It needs the place of the 3rd conductive circuit layer 605 and following 4th conductive circuit layer (not shown) unicom to be prepared exposed, prevents
Only the covering of the 3rd adhesive layer 703 causes electrical isolation.And so on, preparation (the wherein N of N sandwich circuits can be realized as needed<
20 layers).
In step 230, the second basal layer, and the are formed back in the one side of separation layer in the last one conductive circuit layer
It is fixed between two basal layers and the last one separation layer by adhesive layer.
In conclusion flexible multi-layer circuit board according to embodiments of the present invention using fexible film as the first basal layer,
Second basal layer and separation layer open up electric connection of the through hole for neighbouring conducting wire interlayer on separation layer in advance.
Conducting wire is prepared using graphical printing technology, is bonded between multilayer isolation board by adhesive layer.The embodiment of the present invention
Flexible multi-layer circuit board have the characteristics that flatness is high, flexible, thickness is thin, it is more preferable around folding endurance, heat expansion stress performance, fit
For in flexible and slimming equipment.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
Also there are other identical elements in process, method, article or equipment including the element.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that：
In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, can carry out herein form and
Various change in details.
Claims (10)
1. a kind of multi-layer flexible circuit board, which is characterized in that including：
Opposite the first basal layer and the second basal layer being arranged in parallel；
At least two conductive circuit layers being formed between first basal layer and second basal layer, described at least two
It is mutually parallel between conductive circuit layer, each conductive circuit layer includes multiple spaced conducting wires；
Separation layer, between being arranged at per two neighboring conductive circuit layer, wherein, the separation layer offers through hole, so that described
The conducting wire of isolation board both sides is electrically connected by the through hole.
2. multi-layer flexible circuit board according to claim 1, which is characterized in that the thickness of the separation layer is 1 μm~50 μ
m。
3. multi-layer flexible circuit board according to claim 1, which is characterized in that the surface of the separation layer is formed with easy to stick
Attached layer, the surface tension of the easy adhesion layer are more than 45dyn, and thickness is less than 1um.
4. multi-layer flexible circuit board according to claim 1, which is characterized in that a diameter of 0.1mm of the through hole~
5mm。
5. multi-layer flexible circuit board according to claim 1, which is characterized in that the line width of the conducting wire for 1um~
2000um。
6. multi-layer flexible circuit board according to claim 1, which is characterized in that the material of the conducting wire is nanometer
Gold, and/or nano silver, and/or Nanometer Copper, and/or nano aluminum and/or metal alloy compositions.
7. multi-layer flexible circuit board according to claim 1, which is characterized in that first basal layer, the second basal layer
Be polyimides, and/or polyethylene terephthalate, and/or polyethylene naphthalate with the material of separation layer,
And/or polypropylene, and/or makrolon and/or composite film material.
8. multi-layer flexible circuit board according to claim 1, which is characterized in that between first substrate and separation layer,
It is fixed between each two separation layer, between second substrate and separation layer by adhesive layer, the adhesive layer is UV glue or heat
Solidification glue.
It is 9. a kind of such as the preparation method of claim 1 to 8 any one of them multi-layer flexible circuit board, which is characterized in that including：
A conductive circuit layer is formed on the first basal layer；
The conductive unit that multiple laminations successively are set is formed in the conductive circuit layer, each conductive unit includes having
It the separation layer of through hole and is formed on the separation layer back in another conductive circuit layer of the first basal layer one side；
In the last one conductive circuit layer the second basal layer is formed back in the one side of the separation layer.
10. multi-layer flexible circuit board according to claim 9, which is characterized in that the conductive circuit layer uses printing side
Formula is directly graphically formed on first basal layer or the separation layer, and the mode of printing is silk-screen printing or intaglio plate
Printing or ink jet printing or flexographic printing or trans-printing or aerosol printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611027500.XA CN108076581A (en) | 2016-11-17 | 2016-11-17 | Multi-layer flexible circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611027500.XA CN108076581A (en) | 2016-11-17 | 2016-11-17 | Multi-layer flexible circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108076581A true CN108076581A (en) | 2018-05-25 |
Family
ID=62161089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611027500.XA Pending CN108076581A (en) | 2016-11-17 | 2016-11-17 | Multi-layer flexible circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108076581A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113036571A (en) * | 2019-12-24 | 2021-06-25 | 广州方邦电子股份有限公司 | Preparation method of connector, connector and integrated device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113036571A (en) * | 2019-12-24 | 2021-06-25 | 广州方邦电子股份有限公司 | Preparation method of connector, connector and integrated device |
| CN113036571B (en) * | 2019-12-24 | 2023-01-03 | 广州方邦电子股份有限公司 | Preparation method of connector, connector and integrated device |
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Application publication date: 20180525 |
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