CN207869491U - Insulate tension aluminum substrate radiator structure - Google Patents
Insulate tension aluminum substrate radiator structure Download PDFInfo
- Publication number
- CN207869491U CN207869491U CN201721897781.4U CN201721897781U CN207869491U CN 207869491 U CN207869491 U CN 207869491U CN 201721897781 U CN201721897781 U CN 201721897781U CN 207869491 U CN207869491 U CN 207869491U
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- China
- Prior art keywords
- aluminum substrate
- glue
- layer
- lines
- cloth
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of insulation tension aluminum substrate radiator structures comprising copper foil layer, the first AD glue-lines, glass layer of cloth, the 2nd AD glue-lines, aluminum substrate layer and the graphene thermal dispersant coatings being bonded successively according to sequence from top to bottom；The utility model smart structural design, rationally there is glass layer of cloth by the way that the first AD glue-lines and the 2nd AD glue-lines are laminating, it is tightly combined, utilize the compact structure and flexibility of glass layer of cloth, anti- electrical breakdown capability effectively is greatly improved relative to traditional screen cloth structure, and there is excellent anti-folding and stretching resistance performance；It is laminating on aluminum substrate layer simultaneously to have graphene thermal dispersant coatings, with high thermal conductivity energy and good mechanical performance, the thermal energy generated when the electronic component on copper foil layer can work rapidly transfers out rapidly to come and distribute, and good heat dissipation effect is conducive to wide popularization and application.
Description
Technical field
The utility model is related to heat-radiating substrate technical field, more particularly to a kind of insulation tension aluminum substrate radiator structure.
Background technology
Heat conductive circuit base board is widely used in the fields such as computer, LED illumination, communication, medical treatment, industrial equipment and space flight,
Three layers of heat conductive circuit base board point, bottom is heat dissipating layer, and centre is dielectric insulation layer, and upper layer is conductive layer.Intermediate dielectric insulation
Layer is typically to be constituted using hardboard PP.Contain screen cloth in hardboard PP, there is more and larger mesh, lead to its compactness
Difference, anti-electrical breakdown capability is undesirable, and insulation and pull resistance still have room for promotion.In addition whole heat dissipation effect is nor very
It is ideal.Present electronic product and component have developed rapidly, heat conduction governing and heat conductive design especially in miniature electronic component
Increasingly strict, the requirement to heat conductive circuit base board is higher and higher, or even has arrived harsh degree, therefore, in order to improve electronics member
The performance and stability of device and its system, prolong the service life, and a kind of anti-electrical breakdown capability of exploitation is strong, tension effect is good, scattered
The fast insulation tension aluminum substrate radiator structure of thermal velocity is extremely urgent.
Utility model content
Against the above deficiency, the utility model aim is to provide a kind of smart structural design, rationally, anti-electrical breakdown capability
By force, the insulation tension aluminum substrate radiator structure that tension effect is good, radiating rate is fast.
To achieve the above object, the technical solution provided is the utility model：
A kind of insulation tension aluminum substrate radiator structure comprising copper foil layer, the first AD glue-lines, glass layer of cloth, the 2nd AD glue
Layer, aluminum substrate layer and graphene thermal dispersant coatings, the copper foil layer, the first AD glue-lines, glass layer of cloth, the 2nd AD glue-lines, aluminum substrate
Layer and graphene thermal dispersant coatings are bonded successively according to sequence from top to bottom.
As a kind of improvement of the utility model, the thickness of the copper foil layer is 12~36 microns.
As a kind of improvement of the utility model, the thickness of the first AD glue-lines is 10~25 microns.
As a kind of improvement of the utility model, the thickness of the glass layer of cloth is 12.5~25 microns.
As a kind of improvement of the utility model, the thickness of the 2nd AD glue-lines is 10~25 microns.
As a kind of improvement of the utility model, the thickness of the aluminum substrate layer is 45~300 microns.
As a kind of improvement of the utility model, the thickness of the graphene thermal dispersant coatings is 5~25 microns.
The beneficial effects of the utility model are：The utility model smart structural design rationally passes through the first AD glue-lines and
Two AD glue-lines are laminating glass layer of cloth, is tightly combined, using the compact structure and flexibility of glass layer of cloth, effectively relative to biography
System screen cloth structure greatly improves anti-electrical breakdown capability, and has excellent anti-folding and stretching resistance performance；Simultaneously in aluminum substrate
It is laminating on layer to have graphene thermal dispersant coatings, there is high thermal conductivity energy and good mechanical performance, it can rapidly will be on copper foil layer
Electronic component work when the thermal energy that generates transfer out rapidly to come and distribute, good heat dissipation effect is answered conducive to being widely popularized
With.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
Embodiment：Referring to Fig. 1, a kind of insulation tension aluminum substrate radiator structure that the utility model embodiment provides, packet
Include copper foil layer 1, the first AD glue-lines 2, glass layer of cloth 3, the 2nd AD glue-lines 4, aluminum substrate layer 5 and graphene thermal dispersant coatings 6, the copper
Layers of foil 1, the first AD glue-lines 2, glass layer of cloth 3, the 2nd AD glue-lines 4, aluminum substrate layer 5 and graphene thermal dispersant coatings 6 according to from up to
Under sequence be bonded successively.Preferably, being coated with black ink layer on the copper foil layer 1, copper foil layer 1 is set to have preferably resistance to
High temperature, radiation hardness, resistant to chemical etching and electrical insulation capability, good combination property is easy to process, highly practical.In black ink layer
It is equipped with hollow out solder joint vacancy, the welding sequence of electron component is brought convenience.
Specifically, the thickness of the copper foil layer 1 is 12~36 microns.Preferably 12 microns, 20 microns, 30 microns or 36 are micro-
Rice.The thickness of the first AD glue-lines 2 and the 2nd AD glue-lines 4 is 10~25 microns.Preferably 10 microns, 15 microns, it is 18 micro-
Rice or 25 microns.The thickness of the glass layer of cloth 3 is 12.5~25 microns.Preferably 12.5 microns, 14 microns, 16 microns or 25
Micron.The thickness of the aluminum substrate layer 5 is 45~300 microns.Preferably 45 microns, 60 microns, 100 microns or 300 microns.Institute
The thickness for stating graphene thermal dispersant coatings 6 is 5~25 microns.Preferably 5 microns, 10 microns, 15 microns or 25 microns.
In use, due to by the first AD glue-lines 2 and the 2nd AD glue-lines 4 are laminating glass layer of cloth 3, being tightly combined, utilizing
The compact structure and flexibility of glass layer of cloth 3 effectively greatly improve anti-electrical breakdown capability relative to traditional screen cloth structure, and
And there is excellent anti-folding and stretching resistance performance；It is laminating on aluminum substrate layer 5 simultaneously to have graphene thermal dispersant coatings 6, have higher
Heat conductivility and good mechanical performance, the thermal energy generated when the electronic component on copper foil layer 1 can work rapidly are rapid
It transfers out and comes and distribute, good heat dissipation effect.
According to the disclosure and teachings of the above specification, the utility model those skilled in the art can also be to above-mentioned reality
The mode of applying is changed and is changed.Therefore, the utility model is not limited to specific implementation mode disclosed and described above, right
Some modifications and changes of the utility model should also be as falling into the protection scope of the claims of the present utility model.In addition, to the greatest extent
Some specific terms are used in pipe this specification, these terms are merely for convenience of description, not to the utility model
Any restrictions are constituted, using same or similar other board structures, in scope of protection of the utility model.
Claims (7)
1. a kind of insulation tension aluminum substrate radiator structure, which is characterized in that it include copper foil layer, the first AD glue-lines, glass layer of cloth,
2nd AD glue-lines, aluminum substrate layer and graphene thermal dispersant coatings, the copper foil layer, the first AD glue-lines, glass layer of cloth, the 2nd AD glue
Layer, aluminum substrate layer and graphene thermal dispersant coatings are bonded successively according to sequence from top to bottom.
2. insulation tension aluminum substrate radiator structure according to claim 1, which is characterized in that the thickness of the copper foil layer is
12~36 microns.
3. insulation tension aluminum substrate radiator structure according to claim 1, which is characterized in that the thickness of the first AD glue-lines
Degree is 10~25 microns.
4. insulation tension aluminum substrate radiator structure according to claim 1, which is characterized in that the thickness of the glass layer of cloth
It is 12.5~25 microns.
5. insulation tension aluminum substrate radiator structure according to claim 1 or 3, which is characterized in that the 2nd AD glue-lines
Thickness be 10~25 microns.
6. insulation tension aluminum substrate radiator structure according to claim 1, which is characterized in that the thickness of the aluminum substrate layer
It is 45~300 microns.
7. insulation tension aluminum substrate radiator structure according to claim 1, which is characterized in that the graphene thermal dispersant coatings
Thickness be 5~25 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897781.4U CN207869491U (en) | 2017-12-29 | 2017-12-29 | Insulate tension aluminum substrate radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897781.4U CN207869491U (en) | 2017-12-29 | 2017-12-29 | Insulate tension aluminum substrate radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869491U true CN207869491U (en) | 2018-09-14 |
Family
ID=63463959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721897781.4U Expired - Fee Related CN207869491U (en) | 2017-12-29 | 2017-12-29 | Insulate tension aluminum substrate radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788637A (en) * | 2018-10-23 | 2019-05-21 | 江西增孚新材料科技有限公司 | Ceramic circuit-board |
-
2017
- 2017-12-29 CN CN201721897781.4U patent/CN207869491U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788637A (en) * | 2018-10-23 | 2019-05-21 | 江西增孚新材料科技有限公司 | Ceramic circuit-board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180914 Termination date: 20201229 |