CN202941077U - Graphite heat radiation structure for electronic product - Google Patents
Graphite heat radiation structure for electronic product Download PDFInfo
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- CN202941077U CN202941077U CN 201220574318 CN201220574318U CN202941077U CN 202941077 U CN202941077 U CN 202941077U CN 201220574318 CN201220574318 CN 201220574318 CN 201220574318 U CN201220574318 U CN 201220574318U CN 202941077 U CN202941077 U CN 202941077U
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- graphite
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- heat radiation
- heat
- electronic product
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Abstract
The utility model discloses a graphite heat radiation structure for an electronic product. The graphite heat radiation structure for the electronic product comprises a graphite sheet; the surface of the graphite sheet is coated with a composite metal layer; the lower surface of the graphite sheet is coated with a thermal conductive adhesive layer; an aluminium layer and a copper layer are stacked to form the composite metal layer; the other surface of the thermal conductive adhesive layer is coated with a releasing film; the composite metal layer is located on the surface of the graphite sheet opposite to the thermal conductive adhesive layer; the copper layer is located between the aluminium layer and the graphite sheet; the releasing film has a thickness of 12 to 25mum, and the releasing film is a PET film coated with a silicone oil layer; and the silicone oil layer on the surface of the PET film is bonded with the thermal conductive adhesive layer. When the graphite heat radiation structure coats a component ready for heat radiation, seamless connection with the component ready for heat radiation is facilitated, heat diffusion is made use of to prevent the adhesive tape from being partially overheated, graphite powder can be prevented from dropping, the circuit can then be prevented from being short-circuited, and reliability of products is improved.
Description
Technical field
The utility model relates to a kind of graphite radiating structure for electronic product, belongs to the adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function causes integrated level more and more higher from strength to strength like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.On the one hand, the fan type radiating that adopted in the past because volume is large, can produce the problems such as noise, is eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.On the other hand, graphite material has property widely, comprise heigh clarity, high conductivity, high-termal conductivity, high strength etc., utilize graphite material, can develop various product application types, such as graphite circuit structure, graphite core chip architecture, graphite touch screen structure, etc.Although various application possibilities are arranged, be directed to graphite material, how it is effectively processed, such as precise cutting, be still the problem that needs solution.
But graphite flake also has weak point, though be that high conductive graphite sheet has certain folding resistance, but the weak strength between material, can be torn easily, perhaps because of the displacement of institute's adhesive attachment means, disrepair phenomenon occur, entry material comes off etc., thereby cause the short circuit of circuit, again, in cutting graphite flake process, the technical problems such as graphite flake breaks can appear.
Summary of the invention
The utility model purpose is to provide a kind of graphite radiating structure for electronic product, this graphite radiating structure is covered on when thermal component, both be conducive to and the seamless link for the treatment of thermal component, utilize heat diffusion, avoid the adhesive tape local overheating, can prevent that again graphite powder from coming off, thereby avoid short circuit, improve the reliability of product.
For achieving the above object, the kind technical scheme that the utility model adopts is: a kind of graphite radiating structure for electronic product, comprise a graphite flake, and this graphite flake surface is covered with a complex metal layer; This graphite flake lower surface is coated with the heat-conducting glue adhesion coating, described complex metal layer by aluminium lamination and copper layer by layer stacked group become, a release film is covered on heat-conducting glue adhesion coating another surface.
In technique scheme, further improved plan is as follows:
1. in such scheme, described complex metal layer is positioned at graphite flake and heat-conducting glue adhesion coating opposing surface.
2. in such scheme, described copper layer is between aluminium lamination and graphite flake.
3. in such scheme, the thickness of described release film is 12 μ m ~ 25 μ m.
4. in such scheme, described release film is the PET film that scribbles silicon layer, and silicon layer and the described heat-conducting glue adhesion coating on this PET film surface are bonding.
Because technique scheme is used, the utility model compared with prior art has following advantages and effect:
1. the utility model is used for the graphite radiating structure of electronic product, its graphite flake surface is covered with a complex metal layer, employing is with the anisotropic metal level of wire coefficient and the combination of isotropism metal level, both improved the thermal conductivity along length, also improved the thickness direction thermal conductivity, realize the uniformity of adhesive tape heat conductivility, exempted from the adhesive tape local overheating, improved performance and the life-span of product; Secondly, adopt by aluminium lamination and copper layer by layer stacked group become complex metal layer, be conducive to form the temperature gradient of ladder, thereby keep heat conducting motive force, be conducive to that heat is stable to be transmitted fast.
2. the utility model is used for the graphite radiating structure of electronic product, it is positioned on the metal level of graphite flake lower surface and is coated with the heat-conducting glue adhesion coating, be covered on when thermal component, both be conducive to and the seamless link for the treatment of thermal component, be beneficial to again heat diffusion, avoid the graphite heat radiation fin local overheating, thereby improved performance and the life-span of product; Secondly, can prevent that also graphite powder from coming off, thereby avoid short circuit, improve the reliability of product.
Description of drawings
Accompanying drawing 1 is used for the graphite radiating structural representation of electronic product for the utility model.
In above accompanying drawing: 1, graphite flake; 2, heat-conducting glue adhesion coating; 3, release film; 31, silicon layer; 32, PET film; 4, complex metal layer; 41, aluminium lamination; 42, copper layer.
Embodiment
Below in conjunction with embodiment, the utility model is further described:
Embodiment 1: a kind of graphite radiating structure for electronic product, comprise a graphite flake 1, and this graphite flake 1 surface is covered with a complex metal layer 4; This graphite flake 1 lower surface is coated with heat-conducting glue adhesion coating 2, and described complex metal layer 4 is by aluminium lamination 41 and copper layer 42 is stacked forms, and a release film 3 is covered on heat-conducting glue adhesion coating 2 another surfaces.
Above-mentioned complex metal layer 4 is positioned at graphite flake 1 and heat-conducting glue adhesion coating 2 opposing surface, and above-mentioned copper layer 42 is between aluminium lamination 41 and graphite flake 1.
The thickness of above-mentioned release film 3 is 16 μ m, and above-mentioned release film 3 is for scribbling the PET film 32 of silicon layer 31, and the silicon layer 31 on this PET film 32 surfaces is bonding with described heat-conducting glue adhesion coating 2.
Embodiment 2: a kind of graphite radiating structure for electronic product, comprise a graphite flake 1, and this graphite flake 1 surface is covered with a complex metal layer 4; This graphite flake 1 lower surface is coated with heat-conducting glue adhesion coating 2, and described complex metal layer 4 is by aluminium lamination 41 and copper layer 42 is stacked forms, and a release film 3 is covered on heat-conducting glue adhesion coating 2 another surfaces.
Above-mentioned copper layer 42 is between aluminium lamination 41 and graphite flake 1.
The thickness of above-mentioned release film 3 is 24 μ m.
Above-mentioned release film 3 is for scribbling the PET film 32 of silicon layer 31, and the silicon layer 31 on this PET film 32 surfaces is bonding with described heat-conducting glue adhesion coating 2.
When adopting above-mentioned graphite radiating structure for electronic product, its graphite flake surface is covered with a complex metal layer, employing is with the anisotropic metal level of wire coefficient and the combination of isotropism metal level, both improved the thermal conductivity along length, also improved the thickness direction thermal conductivity, realize the uniformity of adhesive tape heat conductivility, exempted from the adhesive tape local overheating, improved performance and the life-span of product; Secondly, adopt by aluminium lamination and copper layer by layer stacked group become complex metal layer, be conducive to form the temperature gradient of ladder, thereby keep heat conducting motive force, be conducive to that heat is stable to be transmitted fast; Again, it is positioned on the metal level of graphite flake lower surface and is coated with the heat-conducting glue adhesion coating, is covered on when thermal component, both be conducive to and the seamless link for the treatment of thermal component, be beneficial to again heat diffusion, avoid the graphite heat radiation fin local overheating, thereby improved performance and the life-span of product; Secondly, can prevent that also graphite powder from coming off, thereby avoid short circuit, improve the reliability of product.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (5)
1. graphite radiating structure that is used for electronic product is characterized in that: comprise a graphite flake (1), this graphite flake (1) surface is covered with a complex metal layer (4); This graphite flake (1) lower surface is coated with heat-conducting glue adhesion coating (2), and described complex metal layer (4) is by aluminium lamination (41) and copper layer (42) stacked composition, and a release film (3) is covered on heat-conducting glue adhesion coating (2) another surface.
2. graphite radiating structure according to claim 1 is characterized in that: described complex metal layer (4) is positioned at graphite flake (1) and heat-conducting glue adhesion coating (2) opposing surface.
3. graphite radiating structure according to claim 1, it is characterized in that: described copper layer (42) is positioned between aluminium lamination (41) and graphite flake (1).
4. graphite radiating structure according to claim 1, it is characterized in that: the thickness of described release film (3) is 12 μ m ~ 25 μ m.
5. graphite radiating structure according to claim 1 and 2 is characterized in that: described release film (3) is for scribbling the PET film (32) of silicon layer (31), and the silicon layer (31) on this PET film (32) surface is bonding with described heat-conducting glue adhesion coating (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220574318 CN202941077U (en) | 2012-11-01 | 2012-11-01 | Graphite heat radiation structure for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220574318 CN202941077U (en) | 2012-11-01 | 2012-11-01 | Graphite heat radiation structure for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202941077U true CN202941077U (en) | 2013-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220574318 Expired - Lifetime CN202941077U (en) | 2012-11-01 | 2012-11-01 | Graphite heat radiation structure for electronic product |
Country Status (1)
| Country | Link |
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| CN (1) | CN202941077U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105584121A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电（昆山）股份有限公司 | Graphite heat diffusion sheet for tablet personal computer and mobile phone |
| CN108937958A (en) * | 2018-07-19 | 2018-12-07 | 刘肖俊 | A kind of high stable degree finger cot type blood oxygen probe suitable for using for a long time |
| CN108937959A (en) * | 2018-07-19 | 2018-12-07 | 刘肖俊 | A kind of high degree of comfort high-reliability blood oxygen probe |
| CN110278694A (en) * | 2019-07-10 | 2019-09-24 | 东莞市源冠塑胶模具有限公司 | A kind of ultrathin type electronic equipment dissipating heat patch |
-
2012
- 2012-11-01 CN CN 201220574318 patent/CN202941077U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105584121A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电（昆山）股份有限公司 | Graphite heat diffusion sheet for tablet personal computer and mobile phone |
| CN108937958A (en) * | 2018-07-19 | 2018-12-07 | 刘肖俊 | A kind of high stable degree finger cot type blood oxygen probe suitable for using for a long time |
| CN108937959A (en) * | 2018-07-19 | 2018-12-07 | 刘肖俊 | A kind of high degree of comfort high-reliability blood oxygen probe |
| CN110278694A (en) * | 2019-07-10 | 2019-09-24 | 东莞市源冠塑胶模具有限公司 | A kind of ultrathin type electronic equipment dissipating heat patch |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130515 |
|
| CX01 | Expiry of patent term |