CN202936347U - Heat conducting adhesive tape for electronic device - Google Patents
Heat conducting adhesive tape for electronic device Download PDFInfo
- Publication number
- CN202936347U CN202936347U CN 201220525132 CN201220525132U CN202936347U CN 202936347 U CN202936347 U CN 202936347U CN 201220525132 CN201220525132 CN 201220525132 CN 201220525132 U CN201220525132 U CN 201220525132U CN 202936347 U CN202936347 U CN 202936347U
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- layer
- adhesive tape
- electronic device
- heat conducting
- heat conduction
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat conducting adhesive tape for an electronic device. The adhesive tape comprises a metal braid layer, wherein the metal weaving layer is weaved by a plurality of warps and wefts, and the warps and the wefts are formed by alternatively arranging copper fibers and aluminum fibers; the upper surface of the metal weaving layer is coated with an aluminum foil layer in an adhesive manner, the lower surface of the metal weaving layer is coated with a viscose layer, and the other side of the viscose layer is coated with a mold release material layer in a pasting manner; a plurality of graphite particles are uniformly distributed in the viscose layer, diameters of the graphite particles range from 4 mu m to 7 mu m, the quantity proportion of the copper fibers to the aluminum fibers in the warps is 1:(2-4), and the quantity proportion of the copper fibers to the aluminum fibers in the wefts is 1:(2-4). The heat conducting adhesive tape for the electronic device can effectively prevent the surface of a graphite heat exchange material from being scratched, so that a heat conducting interface material which can be used stably and has a good thermal conductivity is obtained; and the heat conducting adhesive tape is used conveniently, and a heat source surface and the adhesive tape are combined closely and conveniently.
Description
Technical field
The utility model relates to a kind of heat conduction adhesive tape, relates in particular to a kind of used for electronic device heat conduction adhesive tape.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function causes integrated level more and more higher from strength to strength like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating that adopted in the past because volume is large, can produce the problems such as noise, is eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.Scientific discovery, the distinctive heat radiator performance of graphite material can satisfy the heat radiation of existing electronic devices and components well.
And in the market graphite paper heat radiation be many, but also there are some shortcomings in this, the processing more complicated will be passed through special processing, and thickness relatively thick (graphite material thickness is thicker, and radiating effect is poorer).
Summary of the invention
The utility model provides a kind of used for electronic device heat conduction adhesive tape, and this used for electronic device heat conduction adhesive tape can prevent graphite thermal exchange material surface tear effectively, thereby obtains heat-conducting interface material a kind of stable use, that have thermal conductive resin; And easy to use, be convenient to be combined closely in thermal source surface and adhesive tape.
For achieving the above object, the technical solution adopted in the utility model is: a kind of used for electronic device heat conduction adhesive tape, comprise a bonding braid, described bonding braid is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn and aluminum filament; This bonding braid upper surface has covered aluminium foil layer, and the bonding braid lower surface is coated with adhesive-layer, and another surface label of this adhesive-layer is covered with the separated type material layer, and described adhesive-layer inside is evenly distributed with several graphite granules.
In technique scheme, further improved technical scheme is as follows:
1. in such scheme, the diameter range of described graphite granule is 47 microns.
2. in such scheme, in described warp, copper fiber yarn and aluminum filament quantitative proportion are 1:2 4, and in described parallel, copper fiber yarn and aluminum filament quantitative proportion are 1:2 4.
3. in such scheme, described separated type material layer is release film layer or off-style paper layer.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model is used for the adhesive tape of components and parts heat radiation, and its aluminium foil layer can prevent graphite thermal exchange material surface tear effectively, thereby obtains heat-conducting interface material a kind of stable use, that have thermal conductive resin; Secondly, its adhesive-layer inside is evenly distributed with several graphite granules, and is easy to use, after only needing the separate-type paper on surface is peeled off, covers respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Description of drawings
Accompanying drawing 1 is the ultra-thin graphite radiating sealing tape of the utility model structural representation;
Accompanying drawing 2 is the utility model bonding braid structural representation.
In above accompanying drawing: 1, bonding braid; 11, copper fiber yarn; 12, aluminum filament; 2, adhesive-layer; 3, separated type material layer; 4, graphite granule; 5, aluminium foil layer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of used for electronic device heat conduction adhesive tape, comprise a bonding braid 1, and described bonding braid 1 is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn 11 and aluminum filament 12; This bonding braid 1 upper surface has covered aluminium foil layer 5, and bonding braid 1 lower surface is coated with adhesive-layer 2, and these adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described adhesive-layer 2 inside are evenly distributed with several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 4.8 microns.
In above-mentioned warp, copper fiber yarn 11 and aluminum filament 12 quantitative proportions are 1:2, and in described parallel, copper fiber yarn 11 and aluminum filament 12 quantitative proportions are 1:4.
Above-mentioned separated type material layer 3 is off-style paper layers.
Embodiment 2: a kind of used for electronic device heat conduction adhesive tape, comprise a bonding braid 1, and described bonding braid 1 is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn 11 and aluminum filament 12; This bonding braid 1 upper surface has covered aluminium foil layer 5, and bonding braid 1 lower surface is coated with adhesive-layer 2, and these adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described adhesive-layer 2 inside are evenly distributed with several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 5.8 microns.
In above-mentioned warp, copper fiber yarn 11 and aluminum filament 12 quantitative proportions are 1:3, and in described parallel, copper fiber yarn 11 and aluminum filament 12 quantitative proportions are 1:3, and above-mentioned separated type material layer 3 is release film layers.
When adopting above-mentioned used for electronic device heat conduction adhesive tape, its aluminium foil layer can prevent graphite thermal exchange material surface tear effectively, thereby obtains heat-conducting interface material a kind of stable use, that have thermal conductive resin; Secondly, its adhesive-layer 2 inside are evenly distributed with several graphite granules 4, and are easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences of doing according to the utility model spirit change or modify, within all should being encompassed in protection domain of the present utility model.
Claims (4)
1. used for electronic device heat conduction adhesive tape, it is characterized in that: comprise a bonding braid (1), described bonding braid (1) is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn (11) and aluminum filament (12); This bonding braid (1) upper surface has covered aluminium foil layer (5), bonding braid (1) lower surface is coated with adhesive-layer (2), another surface label of this adhesive-layer (2) is covered with separated type material layer (3), and described adhesive-layer (2) inside is evenly distributed with several graphite granules (4).
2. used for electronic device heat conduction adhesive tape according to claim 1, it is characterized in that: the diameter range of described graphite granule (4) is 47 microns.
3. used for electronic device heat conduction adhesive tape according to claim 1, it is characterized in that: in described warp, copper fiber yarn (11) and aluminum filament (12) quantitative proportion are 1:2 4, and in described parallel, copper fiber yarn (11) and aluminum filament (12) quantitative proportion are 1:2 4.
4. used for electronic device heat conduction adhesive tape according to claim 1, it is characterized in that: described separated type material layer (3) is release film layer or off-style paper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525132 CN202936347U (en) | 2012-10-15 | 2012-10-15 | Heat conducting adhesive tape for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525132 CN202936347U (en) | 2012-10-15 | 2012-10-15 | Heat conducting adhesive tape for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202936347U true CN202936347U (en) | 2013-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220525132 Expired - Lifetime CN202936347U (en) | 2012-10-15 | 2012-10-15 | Heat conducting adhesive tape for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202936347U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105819882A (en) * | 2016-03-11 | 2016-08-03 | 汕头大学 | Ceramic metal composite substrate and production method thereof |
| CN107270240A (en) * | 2017-07-05 | 2017-10-20 | 佛山杰致信息科技有限公司 | A kind of LED heat radiation lampshades |
-
2012
- 2012-10-15 CN CN 201220525132 patent/CN202936347U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105819882A (en) * | 2016-03-11 | 2016-08-03 | 汕头大学 | Ceramic metal composite substrate and production method thereof |
| CN105819882B (en) * | 2016-03-11 | 2019-01-01 | 汕头大学 | A kind of ceramet composite substrate and its preparation process |
| CN107270240A (en) * | 2017-07-05 | 2017-10-20 | 佛山杰致信息科技有限公司 | A kind of LED heat radiation lampshades |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130515 |