CN202989043U - Heat conducting type adhesive tape for electronic products - Google Patents

Heat conducting type adhesive tape for electronic products Download PDF

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Publication number
CN202989043U
CN202989043U CN 201220526507 CN201220526507U CN202989043U CN 202989043 U CN202989043 U CN 202989043U CN 201220526507 CN201220526507 CN 201220526507 CN 201220526507 U CN201220526507 U CN 201220526507U CN 202989043 U CN202989043 U CN 202989043U
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CN
China
Prior art keywords
layer
adhesive tape
electronic products
type adhesive
conducting type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220526507
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Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
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Sidike New Materials Jiangsu Co Ltd
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Priority to CN 201220526507 priority Critical patent/CN202989043U/en
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Publication of CN202989043U publication Critical patent/CN202989043U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a heat conducting type adhesive tape for electronic products. The heat conducting type adhesive tape for the electronic products comprises a metal weaving layer, wherein the metal weaving layer is formed by a plurality of warps and a plurality of wefts in a weaving mode, and the warps and the wefts are evenly made of copper filaments and aluminum filaments in interval arrangement. A first aluminum foil layer is adhered to the upper surface of the metal weaving layer, a second aluminum foil layer is adhered to the lower surface of the metal weaving layer, a mucilage glue layer is coated on the lower surface of the second aluminum foil layer, a release material layer is coated on the other surface of the mucilage glue layer, a plurality of graphite particles are evenly distributed inside the mucilage glue layer, the diameter of each graphite particle is from 3 micrometers to 6 micrometers, the diameter of each copper filament is from 0.003 millimeter to 0.006 millimeter, the diameter of each aluminum filament is from 0.002 millimeter to 0.005 millimeter, and the release material layer is a release film layer or a release paper layer. The heat conducting type adhesive tape for the electronic products has the advantages of being capable of having good thermal conductivity as thermal interface materials, convenient to use, and capable of easily and closely integrating the surface of a heat source with the heat conducting type adhesive tape.

Description

Use for electronic products heat-conducting type adhesive tape
Technical field
The utility model relates to a kind of heat-conducting type adhesive tape, relates in particular to a kind of use for electronic products heat-conducting type adhesive tape.
Background technology
The acceleration of the continuous upgrading of electronic product, high integrated and high-performance electric subset growing, the work package volume size is more and more less, and speed and the efficient of work are more and more higher, and thermal value is increasing.At present, oneself is subjected to the restriction of its material and self heat conduction and heat radiation limit known metal species heat conduction and heat radiation assembly, must adopt advanced heat conduction and heat radiation technique and the heat conduction and heat radiation material of excellent performance to be defined as away heat, guarantee effective work of its electronic product, and the fan type radiating that adopted in the past, because volume is large, can produce the problems such as noise, eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.Scientific discovery, the distinctive heat radiator performance of graphite material can satisfy the heat radiation of existing electronic devices and components well.
And in the market graphite paper heat radiation be many, but also there are some shortcomings in this, the processing more complicated will be passed through special processing, and thickness relatively thick (graphite material thickness is thicker, and radiating effect is poorer).
Summary of the invention
The utility model provides a kind of use for electronic products heat-conducting type adhesive tape, and this use for electronic products heat-conducting type adhesive tape has the heat-conducting interface material of thermal conductive resin; And easy to use, be convenient to be combined closely in thermal source surface and heat-conducting glue adhesive tape.
For achieving the above object, the technical solution adopted in the utility model is: a kind of use for electronic products heat-conducting type adhesive tape, comprise a bonding braid, described bonding braid is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn and aluminum filament; The upper and lower surface of this bonding braid is covered with respectively the first aluminium foil layer, the second aluminium foil layer, and this second aluminium foil layer lower surface is coated with adhesive-layer, and another surface label of this adhesive-layer is covered with the separated type material layer, and described adhesive-layer inside is evenly distributed with several graphite granules.
In technique scheme, further improved technical scheme is as follows:
1. in such scheme, the diameter range of described graphite granule is 36 microns.
2. in such scheme, described copper fiber yarn diameter is 0.003 0.006mm, and described aluminum filament diameter is 0.002 0.005mm.
3. in such scheme, described separated type material layer is release film layer or off-style paper layer.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model use for electronic products heat-conducting type adhesive tape, it has guaranteed that length and thickness direction have all improved thermal conductivity, and has realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, its adhesive-layer inside is evenly distributed with several graphite granules, and is easy to use, after only needing the separate-type paper on surface is peeled off, covers respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Description of drawings
Accompanying drawing 1 is the utility model use for electronic products heat-conducting type adhesive tape structure schematic diagram;
Accompanying drawing 2 is the utility model bonding braid structural representation.
In above accompanying drawing: 1, bonding braid; 11, copper fiber yarn; 12, aluminum filament; 2, adhesive-layer; 3, separated type material layer; 4, graphite granule; 51, the first aluminium foil layer; 52, the second aluminium foil layer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of use for electronic products heat-conducting type adhesive tape, comprise a bonding braid 1, and described bonding braid 1 is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn 11 and aluminum filament 12; The upper and lower surface of this bonding braid 1 is covered with respectively the first aluminium foil layer 51, the second aluminium foil layer 52, these the second aluminium foil layer 52 lower surfaces are coated with adhesive-layer 2, these adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described adhesive-layer 2 inside are evenly distributed with several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 4 microns.
Above-mentioned copper fiber yarn 11 diameters are 0.003mm, and described aluminum filament 12 diameters are 0.003mm, and above-mentioned separated type material layer 3 is release film layers.
Embodiment 2: a kind of use for electronic products heat-conducting type adhesive tape, comprise a bonding braid 1, and described bonding braid 1 is formed by some warps and some parallel braidings, and this warp and parallel form alternately by copper fiber yarn 11 and aluminum filament 12; The upper and lower surface of this bonding braid 1 is covered with respectively the first aluminium foil layer 51, the second aluminium foil layer 52, these the second aluminium foil layer 52 lower surfaces are coated with adhesive-layer 2, these adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described adhesive-layer 2 inside are evenly distributed with several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 5.5 microns.
Above-mentioned copper fiber yarn 11 diameters are 0.0055mm, and described aluminum filament 12 diameters are 0.0045mm.
Above-mentioned separated type material layer 3 is off-style paper layers.
When adopting above-mentioned use for electronic products heat-conducting type adhesive tape, it has guaranteed that length and thickness direction have all improved thermal conductivity, and has realized the homogeneity of adhesive tape heat conductivility, and the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, its adhesive-layer 2 inside are evenly distributed with several graphite granules 4, and are easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences of doing according to the utility model spirit change or modify, within all should being encompassed in protection domain of the present utility model.

Claims (1)

1. use for electronic products heat-conducting type adhesive tape, it is characterized in that: comprise a bonding braid (1), described bonding braid (1) is formed with some copper fiber yarn (11) and aluminum filament (12) braidings as parallel by some copper fiber yarn (11) and aluminum filaments (12) as warp; The upper and lower surface of this bonding braid (1) is covered with respectively the first aluminium foil layer (51), the second aluminium foil layer (52), this the second aluminium foil layer (52) lower surface is coated with adhesive-layer (2), another surface label of this adhesive-layer (2) is covered with separated type material layer (3), and described adhesive-layer (2) inside is evenly distributed with several graphite granules (4).
2. use for electronic products heat-conducting type adhesive tape according to claim 1, it is characterized in that: the diameter range of described graphite granule (4) is 36 microns.
3. use for electronic products heat-conducting type adhesive tape according to claim 1, it is characterized in that: described copper fiber yarn (11) diameter is 0.003 0.006mm, described aluminum filament (12) diameter is 0.002 0.005mm.
4. use for electronic products heat-conducting type adhesive tape according to claim 1, it is characterized in that: described separated type material layer (3) is release film layer or off-style paper layer.
CN 201220526507 2012-10-15 2012-10-15 Heat conducting type adhesive tape for electronic products Expired - Lifetime CN202989043U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220526507 CN202989043U (en) 2012-10-15 2012-10-15 Heat conducting type adhesive tape for electronic products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220526507 CN202989043U (en) 2012-10-15 2012-10-15 Heat conducting type adhesive tape for electronic products

Publications (1)

Publication Number Publication Date
CN202989043U true CN202989043U (en) 2013-06-12

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Application Number Title Priority Date Filing Date
CN 201220526507 Expired - Lifetime CN202989043U (en) 2012-10-15 2012-10-15 Heat conducting type adhesive tape for electronic products

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CN (1) CN202989043U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111961447A (en) * 2020-06-18 2020-11-20 上海大陆天瑞激光表面工程有限公司 Method for manufacturing compressible metal thermal interface material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111961447A (en) * 2020-06-18 2020-11-20 上海大陆天瑞激光表面工程有限公司 Method for manufacturing compressible metal thermal interface material
CN111961447B (en) * 2020-06-18 2021-11-05 上海大陆天瑞激光表面工程有限公司 Method for manufacturing compressible metal thermal interface material

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Granted publication date: 20130612