CN202941071U - Adhesive tape for cooling component - Google Patents
Adhesive tape for cooling component Download PDFInfo
- Publication number
- CN202941071U CN202941071U CN 201220525133 CN201220525133U CN202941071U CN 202941071 U CN202941071 U CN 202941071U CN 201220525133 CN201220525133 CN 201220525133 CN 201220525133 U CN201220525133 U CN 201220525133U CN 202941071 U CN202941071 U CN 202941071U
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- layer
- adhesive tape
- adhesive
- wire
- components
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Abstract
The utility model discloses an adhesive tape for cooling a component. The adhesive tape comprises a metal woven layer which is formed by weaving first copper wires as warp and second copper wires as weft. An upper surface of the metal woven layer is pasted with an aluminum foil layer, a lower surface of the metal woven layer is coated with an adhesive layer, and another surface of the adhesive layer is coated with a release material layer. A plurality of graphite particles are evenly distributed in the adhesive layer. The diameter of the graphite particles is in a range from 3 microns to 6 microns, the diameters of the first copper wires and second copper wires are in a range from 0.003 millimeter to 0.006 millimeter. The adhesive tape for cooling the component can effectively prevent the surface scratch of a graphite heat exchange material, and a heat conduction interface material with good heat conductivity and stable use is obtained. The adhesive tape is convenient to use, and the tight combination of a heat source surface and the adhesive tape is facilitated.
Description
Technical field
The utility model relates to a kind of thermal paste adhesive tape, relates in particular to a kind of adhesive tape for the components and parts heat radiation.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating adopted in the past, because volume is large, can produce the problems such as noise, by market, eliminated gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all finding new efficient heat sink material.Scientific discovery, the distinctive heat radiator performance of graphite material, can meet the heat radiation of existing electronic devices and components well.
And in the market graphite paper heat radiation be many, but also there are some shortcomings in this, the processing more complicated, pass through special processing, and thickness relatively thick (graphite material thickness is thicker, and radiating effect is poorer).
Summary of the invention
The utility model provides a kind of adhesive tape for the components and parts heat radiation, and this adhesive tape for the components and parts heat radiation can prevent graphite thermal exchange material surface tear effectively, thereby obtains heat-conducting interface material a kind of stable use, that have thermal conductive resin; And easy to use, be convenient to be combined closely with adhesive tape in the thermal source surface.
For achieving the above object, the technical solution adopted in the utility model is: a kind of adhesive tape for the components and parts heat radiation, comprise a wire sheathing, and this wire sheathing is formed through knitting device by the first copper wire as warp and the second copper wire as parallel; This wire sheathing upper surface has covered aluminium foil layer, and the wire sheathing lower surface is coated with adhesive-layer, and another surface label of this adhesive-layer is covered with the separated type material layer, and described adhesive-layer inside is evenly distributed with several graphite granules.
In technique scheme, further improved technical scheme is as follows:
1. in such scheme, the diameter range of described graphite granule is 36 microns.
2. in such scheme, in described wire sheathing, the diameter of the first copper wire, the second copper wire is 0.003 0.006mm.
3. in such scheme, described separated type material layer is release film layer or off-style paper layer.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model is for the adhesive tape of components and parts heat radiation, and its aluminium foil layer can prevent graphite thermal exchange material surface tear effectively, thereby obtains heat-conducting interface material a kind of stable use, that have thermal conductive resin; Secondly, its adhesive-layer inside is evenly distributed with several graphite granules, easy to use, after only needing surperficial release liners is peeled off, covers respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electronic device) surface.
The accompanying drawing explanation
Accompanying drawing 1 is the ultra-thin graphite radiating adhesive tape of the utility model structural representation;
Accompanying drawing 2 is the utility model wire sheathing structural representation.
In above accompanying drawing: 1, wire sheathing; 11, the first copper wire; 12, the second copper wire; 2, adhesive-layer; 3, separated type material layer; 4, graphite granule; 5, aluminium foil layer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of adhesive tape for the components and parts heat radiation, comprise a wire sheathing 1, and this wire sheathing 1 is formed through knitting device with the second copper wire 12 as parallel by the first copper wire 11 as warp; This wire sheathing 1 upper surface has covered aluminium foil layer 5, and wire sheathing 1 lower surface is coated with adhesive-layer 2, and these adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described adhesive-layer 2 inside are evenly distributed with several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 4.8 microns.
In above-mentioned wire sheathing 1, the diameter of the first copper wire 11, the second copper wire 12 is 0.0032mm, and above-mentioned separated type material layer 3 is off-style paper layers.
Embodiment 2: a kind of adhesive tape for the components and parts heat radiation, comprise a wire sheathing 1, and this wire sheathing 1 is formed through knitting device with the second copper wire 12 as parallel by the first copper wire 11 as warp; This wire sheathing 1 upper surface has covered aluminium foil layer 5, and wire sheathing 1 lower surface is coated with adhesive-layer 2, and these adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described adhesive-layer 2 inside are evenly distributed with several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 4.5 microns.
In above-mentioned wire sheathing 1, the diameter of the first copper wire 11, the second copper wire 12 is 0.0055mm, and above-mentioned separated type material layer 3 is release film layers.
While adopting the above-mentioned adhesive tape for the components and parts heat radiation, its aluminium foil layer can prevent graphite thermal exchange material surface tear effectively, thereby obtains heat-conducting interface material a kind of stable use, that have thermal conductive resin; Secondly, its adhesive-layer 2 inside are evenly distributed with several graphite granules 4, easy to use, after only needing surperficial release liners is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electronic device) surface.
Above-described embodiment is only explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (4)
1. the adhesive tape for components and parts heat radiations, it is characterized in that: comprise a wire sheathing (1), this wire sheathing (1) is formed through knitting device by the first copper wire (11) as warp and the second copper wire (12) as parallel; This wire sheathing (1) upper surface has covered aluminium foil layer (5), wire sheathing (1) lower surface is coated with adhesive-layer (2), another surface label of this adhesive-layer (2) is covered with separated type material layer (3), and described adhesive-layer (2) inside is evenly distributed with several graphite granules (4).
2. the adhesive tape for components and parts heat radiations according to claim 1, it is characterized in that: the diameter range of described graphite granule (4) is 36 microns.
3. the adhesive tape for components and parts heat radiations according to claim 1, it is characterized in that: in described wire sheathing (1), the diameter of the first copper wire (11), the second copper wire (12) is 0.003 0.006mm.
4. the adhesive tape for components and parts heat radiations according to claim 1, it is characterized in that: described separated type material layer (3) is release film layer or off-style paper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525133 CN202941071U (en) | 2012-10-15 | 2012-10-15 | Adhesive tape for cooling component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525133 CN202941071U (en) | 2012-10-15 | 2012-10-15 | Adhesive tape for cooling component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202941071U true CN202941071U (en) | 2013-05-15 |
Family
ID=48325289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220525133 Expired - Lifetime CN202941071U (en) | 2012-10-15 | 2012-10-15 | Adhesive tape for cooling component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202941071U (en) |
-
2012
- 2012-10-15 CN CN 201220525133 patent/CN202941071U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130515 |