CN203032018U - Adhesive film-free metal foil-graphite heat-conducting composite - Google Patents
Adhesive film-free metal foil-graphite heat-conducting composite Download PDFInfo
- Publication number
- CN203032018U CN203032018U CN 201220434648 CN201220434648U CN203032018U CN 203032018 U CN203032018 U CN 203032018U CN 201220434648 CN201220434648 CN 201220434648 CN 201220434648 U CN201220434648 U CN 201220434648U CN 203032018 U CN203032018 U CN 203032018U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- base material
- conducting composite
- graphite
- foil substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an adhesive film-free metal foil-graphite heat-conducting composite. An aluminum foil substrate or a copper foil substrate and a graphite coating formed by coating graphite powder paint on the bottom surface or the surface layer of the aluminum foil substrate or the copper foil substrate constitute an aluminum foil-graphite heat-conducting composite or a copper foil-graphite heat-conducting composite. The graphite coating is formed by coating the graphite powder paint on the bottom surface or the surface layer of the aluminum foil substrate or the copper foil substrate. The graphite coating is 3-30 micrometers in thickness. The aluminum foil substrate and the copper foil substrate are 7-100 micrometers and 15-100 micrometers in thickness. The heat conductivity of the aluminum foil substrate is 230W/M*K. The heat conductivity of the copper foil substrate is 380W/M*K. The composite is easy to manufacture, can be cut and stamped into any shape, and can be smoothly attached to any plane and bent surface. The aluminum foil substrate or the copper foil substrate is composited with the graphite coating, so that the heat-conducting property is improved.
Description
Technical field
The utility model belongs to interface Heat Conduction Material technical field, relates to a kind of metal forming graphite heat conducting composite of adhesive-free film.
Background technology
Growing along with the acceleration of the upgrading of electronic product and mini, high integrated and high-performance electric subset, electronic product heat conduction or heat dissipation technology are maked rapid progress.The radiating effect of Heat Conduction Material becomes the key of complete machine Miniaturization Design.In order to guarantee electronic device or equipment quiet rum, the heat of generation need be shed in time, remove hot spot region.Thereby, to the quality of Heat Conduction Material, heat conductivility has proposed requirements at the higher level.
In prior art, Chinese invention patent application publication No. CN102039716A, on 05 04th, 2011 Shen Qing Publication day " conductive and heat-conductive graphite tape manufacture method " has disclosed the conductive and heat-conductive graphite tape and has been sprayed on the film glue with basement membrane by duster by graphite powder, and graphite powder and glued membrane are flattened to the product of making by rolling.Described basement membrane is Kapton or polyester film; Described glued membrane is the ACM pressure sensitive adhesive.
Its weak point: the thermal conductivity of Kapton or polyester film basement membrane is lower, and the thermal conductivity of bi-material is all below 0.4 W/MK.Owing to having used ACM pressure sensitive adhesive glued membrane as adhesive, increased thermal resistance.The use of basement membrane and glued membrane has reduced the heat-conducting effect of this product.
Commercially available metal forming-aluminium foil, Copper Foil, light, thin, good heat conductivility with it and being widely used.But in actual applications, be exposed to aluminium foil and the Copper Foil of air, easily oxidation, thus reduce its heat conductivility.The good heat conductivility that how to keep aluminium foil and Copper Foil, make heat-conductive composite material have high heat conductivility, is interface Heat Conduction Material field of engineering technology problem demanding prompt solution.
The utility model content
The utility model purpose is for the technological deficiency existed in prior art, and a kind of metal forming graphite heat conducting composite of adhesive-free film is provided, and this Heat Conduction Material heat transfer efficiency is high, be difficult for oxidized, lightweight, there is the warping resistance performance, can smoothly be attached to any plane and curved surface.
For realizing the purpose of this utility model, the technical scheme adopted is:
A kind of metal forming graphite heat conducting composite of adhesive-free film, it is characterized in that: described metal forming is aluminum foil material and copper foil material, described aluminum foil material and copper foil material, respectively as aluminium foil base material and copper foil base material, the metal forming graphite heat conducting composite of described adhesive-free film, respectively by aluminium foil base material or copper foil base material and respectively on the bottom surface or surface layer of aluminium foil base material, or the equadag coating of the blacking moulding applied on the bottom surface of copper foil base material or surface layer forms
.
Described equadag coating, its Thickness Design is 3 μ m~30 μ m.
Described aluminium foil base material, its Thickness Design is 7 μ m~100 μ m.
Described copper foil base material, its Thickness Design is 15 μ m~100 μ m.
Described aluminium foil base material, its thermal conductivity is 230 W/MK.
Described copper foil base material, its thermal conductivity is 380 W/MK.
Advantage and beneficial effect
Compared with prior art, the utlity model has following advantage and beneficial effect:
Advantage
Be easy to make, lightweight, can cut and strike out arbitrary shape, can repeatedly bend, there is good warping resistance performance, can smoothly be attached to any plane and curved surface, appearance looks elegant.
Beneficial effect
1, aluminium foil or copper foil base material and equadag coating are compound, have strengthened heat conductivility.
2, reduced dust pollution.
The accompanying drawing explanation
Fig. 1 is the aluminium foil graphite heat conducting composite structure schematic diagram of the utility model adhesive-free film;
Fig. 2 is the Copper Foil graphite heat conducting composite structure schematic diagram of the utility model adhesive-free film.
In Fig. 1: the 1-equadag coating; 2-aluminium foil base material.
In Fig. 2: the 1-equadag coating; The 3-copper foil base material.
The specific embodiment
Below in conjunction with embodiment, the utility model is further described.
A kind of metal forming graphite heat conducting composite of adhesive-free film, described metal forming is that aluminum foil material is as aluminium foil base material 2, the equadag coating 1 of the blacking moulding applied on described aluminium foil base material 2 and bottom surface at aluminium foil base material 2 or surface layer forms aluminium foil graphite heat conducting composite, as shown in Figure 1, described equadag coating 1 is to be coated on the equadag coating 1 of moulding on the bottom surface of aluminium foil base material 2 or surface layer by blacking.
Described equadag coating 1, its Thickness Design is 3 μ m~30 μ m, the utility model is designed to 5 μ m.
Described aluminium foil base material 2, its Thickness Design is 7 μ m~100 μ m, the utility model is designed to 12 μ m.
Described aluminium foil base material 2, its thermal conductivity is 230 W/MK.
A kind of metal forming graphite heat conducting composite of adhesive-free film, described metal forming is that copper foil material is as copper foil base material 3, the equadag coating 1 of the blacking moulding applied on described copper foil base material 3 and bottom surface at copper foil base material 3 or surface layer forms Copper Foil graphite heat conducting composite, as shown in Figure 2, described equadag coating 1 is to be coated on the equadag coating 1 of moulding on the bottom surface of copper foil base material 3 or surface layer by blacking.
Described equadag coating 1, its Thickness Design is 3 μ m~30 μ m, the utility model is designed to 5 μ m.
Described copper foil base material 3, its Thickness Design is 15 μ m~100 μ m, the utility model is designed to 20 μ m.
Described copper foil base material 3, its thermal conductivity is 380 W/MK.
Aluminium foil in the utility model, Copper Foil, graphite powder is commercially available prod.
In the utility model, owing to usining the aluminium foil of fine aluminium calendering as the base material of Heat Conduction Material, its thermal conductivity is 230 W/MK, and the heat conductivility of aluminium foil is only second to silver, Jin Hetong, approximately is equivalent to 60% of copper.The equadag coating 1 that applies the blacking moulding on aluminium foil base material 2 bottom surfaces or surface layer forms Heat Conduction Material, or the equadag coating 1 that applies the blacking moulding on copper foil base material 3 bottom surfaces that are 380 W/MK in thermal conductivity or surface layer forms Heat Conduction Material, thereby optimized the heat conductivility of aluminium foil-graphite heat conducting material or Copper Foil-graphite heat conducting material, for the slimming of electronic product development provides may.
The metal forming graphite heat conducting composite of adhesive-free film of the present utility model, be applied to notebook computer, high-power LED illuminating lamp, flat-panel monitor, the electronic products such as mobile phone.
The above, be only preferred embodiment of the present utility model, not structure of the present utility model done to any pro forma restriction.Any simple modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong to the scope in the technical solution of the utility model.
Claims (6)
1. the metal forming graphite heat conducting composite of an adhesive-free film, it is characterized in that: described metal forming is aluminum foil material and copper foil material, described aluminum foil material and copper foil material, respectively as aluminium foil base material (1) and copper foil base material (3), the metal forming graphite heat conducting composite of described adhesive-free film, respectively by aluminium foil base material (1) or copper foil base material (3) with respectively on the bottom surface or surface layer of aluminium foil base material (1), or the equadag coating (2) of the blacking moulding applied on the bottom surface of copper foil base material (3) or surface layer forms.
2. the metal forming graphite heat conducting composite of adhesive-free film according to claim 1, it is characterized in that: described equadag coating (2), its Thickness Design is 3 μ m~30 μ m.
3. the metal forming graphite heat conducting composite of adhesive-free film according to claim 1, it is characterized in that: described aluminium foil base material (1), its Thickness Design is 7 μ m~100 μ m.
4. the metal forming graphite heat conducting composite of adhesive-free film according to claim 1, it is characterized in that: described copper foil base material (3), its Thickness Design is 15 μ m~100 μ m.
5. the metal forming graphite heat conducting composite of adhesive-free film according to claim 1, it is characterized in that: described aluminium foil base material (1), its thermal conductivity is 230 W/MK.
6. the metal forming graphite heat conducting composite of adhesive-free film according to claim 1, it is characterized in that: described copper foil base material (3), its thermal conductivity is 380 W/MK.
?
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220434648 CN203032018U (en) | 2012-08-29 | 2012-08-29 | Adhesive film-free metal foil-graphite heat-conducting composite |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220434648 CN203032018U (en) | 2012-08-29 | 2012-08-29 | Adhesive film-free metal foil-graphite heat-conducting composite |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203032018U true CN203032018U (en) | 2013-07-03 |
Family
ID=48684158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220434648 Expired - Fee Related CN203032018U (en) | 2012-08-29 | 2012-08-29 | Adhesive film-free metal foil-graphite heat-conducting composite |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203032018U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105062432A (en) * | 2015-08-06 | 2015-11-18 | 天津唯能环境科技有限公司 | Penetrating heat conduction material, preparation method and special equipment thereof |
WO2017045232A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电(昆山)股份有限公司 | Natural graphite/aluminum composite heat sink |
US9709348B2 (en) | 2015-10-27 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Heat-dissipating copper foil and graphene composite |
CN107660100A (en) * | 2016-07-26 | 2018-02-02 | 现代自动车株式会社 | Graphite member and its manufacture method |
WO2018215664A1 (en) * | 2017-05-26 | 2018-11-29 | Graphitene Ltd. | Heat spreader and method of manufacture thereof |
CN110167324A (en) * | 2019-06-21 | 2019-08-23 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof and electronic equipment |
-
2012
- 2012-08-29 CN CN 201220434648 patent/CN203032018U/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105062432A (en) * | 2015-08-06 | 2015-11-18 | 天津唯能环境科技有限公司 | Penetrating heat conduction material, preparation method and special equipment thereof |
CN105062432B (en) * | 2015-08-06 | 2018-10-26 | 泉州方寸新材料科技有限公司 | A kind of penetrability Heat Conduction Material and preparation method thereof and special equipment |
WO2017045232A1 (en) * | 2015-09-14 | 2017-03-23 | 奇华光电(昆山)股份有限公司 | Natural graphite/aluminum composite heat sink |
US9709348B2 (en) | 2015-10-27 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Heat-dissipating copper foil and graphene composite |
CN107660100A (en) * | 2016-07-26 | 2018-02-02 | 现代自动车株式会社 | Graphite member and its manufacture method |
CN107660100B (en) * | 2016-07-26 | 2020-03-13 | 现代自动车株式会社 | Graphite member and method for producing same |
US10598445B2 (en) | 2016-07-26 | 2020-03-24 | Hyundai Motor Company | Graphite component and manufacturing method thereof |
WO2018215664A1 (en) * | 2017-05-26 | 2018-11-29 | Graphitene Ltd. | Heat spreader and method of manufacture thereof |
US11421139B2 (en) | 2017-05-26 | 2022-08-23 | Graphitene Ltd. | Heat spreader and method of manufacture thereof |
CN110167324A (en) * | 2019-06-21 | 2019-08-23 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof and electronic equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203032018U (en) | Adhesive film-free metal foil-graphite heat-conducting composite | |
CN203353019U (en) | Graphene metal cooling fin and electronic product cooling structure | |
CN202941075U (en) | Combined-type graphite heat radiation sheet | |
CN106847767A (en) | A kind of graphite Copper Foil heat sink compound | |
CN203590668U (en) | Composite cooling film | |
CN202941076U (en) | Graphite heat radiation sheet for electronic product | |
CN212864650U (en) | Combined type graphite alkene heat dissipation membrane | |
TWM525437U (en) | Natural graphite-aluminum composite heat sink fin | |
CN205510635U (en) | High heat conduction graphite alkene heat dissipation metal forming | |
CN202941077U (en) | Graphite heat radiation structure for electronic product | |
CN204801156U (en) | Thermal film of low heat conduction of high even heat | |
CN102555311B (en) | Interactive fin structure type high heat dissipation membrane and manufacturing method thereof | |
CN202213250U (en) | Graphite-based heatconducting flexible copper-clad plate | |
CN105153960A (en) | Ultrathin heat dissipation adhesive tape | |
CN109429444A (en) | The shell of portable electronic devices transfers thermal dispersant coatings structure | |
CN205467591U (en) | Thermal insulation piece | |
CN210134050U (en) | Electric and heat conductive adhesive tape | |
CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
CN107306489A (en) | The manufacture method of fin and fin | |
CN207252049U (en) | The housing transfer thermal dispersant coatings structure of portable electronic devices | |
CN202463051U (en) | Heat dissipation type composite aluminum sheet | |
CN202941072U (en) | Graphite heat conducting adhesive tape | |
CN204652847U (en) | A kind of use for electronic products heat abstractor | |
CN202945195U (en) | Heat radiating adhesive tape for electronic product | |
CN204494339U (en) | A kind of backlight module conducting strip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20180829 |
|
CF01 | Termination of patent right due to non-payment of annual fee |