CN202738258U - Efficient heat dissipating flexible circuit board - Google Patents
Efficient heat dissipating flexible circuit board Download PDFInfo
- Publication number
- CN202738258U CN202738258U CN 201220458603 CN201220458603U CN202738258U CN 202738258 U CN202738258 U CN 202738258U CN 201220458603 CN201220458603 CN 201220458603 CN 201220458603 U CN201220458603 U CN 201220458603U CN 202738258 U CN202738258 U CN 202738258U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- base plate
- substrate
- copper line
- efficient heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an efficient heat dissipating flexible circuit board, comprising a base plate (1), a copper line layer (4), and a heat conducting insulating adhesive layer (3) coated on an upper surface of the base plate (1). The copper line layer (4) is adhered on the heat conducting insulating adhesive layer (3). The base plate (1) is made of aluminium foil. The circuit board also comprises a cover film (2) on an outer surface. Since the circuit board uses the heat conducting insulating adhesive layer to make the base plate and the copper line layer fit closely, the circuit board has high heat conducting efficiency and good heat dissipating performance. The base plate made of the aluminium foil has good flexibility and is flexible. The circuit board can be applied to three-dimensional space, and is simple in structure, novel in design, and has practicality.
Description
Technical field
The utility model relates to a kind of wiring board, is specifically related to a kind of high-efficient heat-dissipating flex circuit application.
Background technology
Usually wiring board is divided into three kinds:
1, glass-fiber-plate: wiring board in the market employed base material, major part is glass-fiber-plate, thin having accomplishes also have 0.15mm's by 0.2mm.Although this sheet material is very thin, do not possess flexibility, can not be arbitrarily crooked, be restricted in the three-dimensional application of two dimension.
2, aluminium base: have good thermal conductivity and thermal diffusivity, but do not possess good flexibility, can not be arbitrarily crooked.
3, flex plate: possess good flexibility, can be arbitrarily crooked, but heat conductivility and poor radiation.
For making wiring board can be applied to three dimensions, and possess good heat conduction and heat dispersion, should adopt to have pliability and the good sheet material of thermal diffusivity is done board substrate.
The utility model content
The technical problem that (one) will solve
The technical problems to be solved in the utility model provides a kind of high-efficient heat-dissipating flex circuit application.
(2) technical scheme
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of high-efficient heat-dissipating flex circuit application, it comprises substrate (1) and copper line layer (4), described substrate (1) upper surface scribbles heat conductive insulating glue-line (3), described copper line layer (4) is adhered on the described heat conductive insulating glue-line (3), described substrate (1) is made by aluminium foil, and described wiring board also comprises the coverlay (2) that is located at outer surface.
As preferably, described substrate (1) is made by the pressing technology.
(3) beneficial effect
The utility model is compared to prior art, it has following beneficial effect: owing to adopting the heat conductive insulating glue-line that substrate and copper line layer are fitted tightly, heat transfer efficiency is high, perfect heat-dissipating, the substrate of being made by aluminium foil is flexible good, flexible, can be applied to three dimensions, it is simple in structure, and modern design has practicality.
Description of drawings
Fig. 1 is the structural representation of high-efficient heat-dissipating flex circuit application of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
A kind of high-efficient heat-dissipating flex circuit application as shown in Figure 1, it comprises substrate 1 and copper line layer 4, and substrate 1 upper surface scribbles heat conductive insulating glue-line 3, and copper line layer 4 is adhered on the heat conductive insulating glue-line 3, substrate 1 is made by aluminium foil, and wiring board also comprises the coverlay 2 that is located at outer surface.Substrate 1 is by pressing technology system
During manufacturing, use first the pressing technology to make aluminum foil substrate, will become again.Then the circuit production that designs is made into the wiring board of required form on aluminum foil substrate.
The utility model is owing to adopting the heat conductive insulating glue-line that substrate and copper line layer are fitted tightly, and heat transfer efficiency is high, perfect heat-dissipating, the substrate of being made by aluminium foil is flexible good, flexible, can be applied to three dimensions, it is simple in structure, and modern design has practicality.
Certainly, above only is concrete exemplary applications of the present utility model, and protection range of the present utility model is not constituted any limitation.In addition to the implementation, the utility model can also have other execution mode.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop within the utility model scope required for protection.
Claims (2)
1. high-efficient heat-dissipating flex circuit application, it is characterized in that: it comprises substrate (1) and copper line layer (4), described substrate (1) upper surface scribbles heat conductive insulating glue-line (3), described copper line layer (4) is adhered on the described heat conductive insulating glue-line (3), described substrate (1) is made by aluminium foil, and described wiring board also comprises the coverlay (2) that is located at outer surface.
2. according to the described high-efficient heat-dissipating flex circuit application of claim, it is characterized in that: described substrate (1) is made by the pressing technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220458603 CN202738258U (en) | 2012-09-10 | 2012-09-10 | Efficient heat dissipating flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220458603 CN202738258U (en) | 2012-09-10 | 2012-09-10 | Efficient heat dissipating flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202738258U true CN202738258U (en) | 2013-02-13 |
Family
ID=47663904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220458603 Expired - Fee Related CN202738258U (en) | 2012-09-10 | 2012-09-10 | Efficient heat dissipating flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202738258U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891586A (en) * | 2017-04-01 | 2017-06-27 | 松扬电子材料(昆山)有限公司 | Aluminum foil substrate suitable for FPC and preparation method thereof |
| CN112105143A (en) * | 2020-10-15 | 2020-12-18 | 河南博美通电子科技有限公司 | Flexible circuit board structure with aluminum foil replacing high-polymer flexible film and preparation process |
-
2012
- 2012-09-10 CN CN 201220458603 patent/CN202738258U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891586A (en) * | 2017-04-01 | 2017-06-27 | 松扬电子材料(昆山)有限公司 | Aluminum foil substrate suitable for FPC and preparation method thereof |
| CN112105143A (en) * | 2020-10-15 | 2020-12-18 | 河南博美通电子科技有限公司 | Flexible circuit board structure with aluminum foil replacing high-polymer flexible film and preparation process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU QIYOO ENERGY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: BAI HONGWU Effective date: 20130306 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130306 Address after: 511450 Guangdong city of Guangzhou province Panyu District Dalong Street Shek Kong Village Zhongjiazhuang Road No. 9 Patentee after: GUANGZHOU QIYOO ENERGY TECHNOLOGY Co.,Ltd. Address before: 511450, Guangdong Province, Guangzhou City, Panyu District Road, Shek Kong west section, Donghua garden, seventeen, three ladder, room 602 Patentee before: Bai Hongwu |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 511450 Guangdong city of Guangzhou province Panyu District Dalong Street Shek Kong Village Zhongjiazhuang Road No. 9 Patentee after: GUANGZHOU WOHOO TECH Co.,Ltd. Address before: 511450 Guangdong city of Guangzhou province Panyu District Dalong Street Shek Kong Village Zhongjiazhuang Road No. 9 Patentee before: GUANGZHOU QIYOO ENERGY TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130213 Termination date: 20210910 |