CN208402321U - A kind of compound graphite radiating chip architecture - Google Patents
A kind of compound graphite radiating chip architecture Download PDFInfo
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- CN208402321U CN208402321U CN201820985158.2U CN201820985158U CN208402321U CN 208402321 U CN208402321 U CN 208402321U CN 201820985158 U CN201820985158 U CN 201820985158U CN 208402321 U CN208402321 U CN 208402321U
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- graphite flake
- graphite
- flake
- copper foil
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Abstract
The utility model discloses a kind of compound graphite radiating chip architectures, including upper layer graphite flake and lower layer's graphite flake；Copper foil layer is equipped between the upper layer graphite flake and lower layer's graphite flake；The upper surface of described upper layer graphite flake is equipped with foil layer；Insulating layer is equipped with below lower layer's graphite flake；Releasing layer is equipped with below the insulating layer；It is bonded respectively by thermally conductive adhesive-layer between the foil layer, upper layer graphite flake, copper foil layer, lower layer's graphite flake, insulating layer and releasing layer；The upper surface of the upper layer graphite flake is equipped with the groove of a plurality of indent.Double-layer graphite piece is arranged in the utility model, and centre adds copper foil layer and improves toughness, and groove is equipped on the graphite flake of upper layer, increases heat dissipation area, there are technical problem inconvenient to use for the graphite heat radiation fin of the effective solution prior art.
Description
Technical field
The utility model belongs to heat sink material technical field, is related to a kind of compound graphite radiating chip architecture.
Background technique
With the fast development of electronics industry, electronic product carries increasingly lighting, and volume is smaller and smaller, and function is more next
It is more powerful, cause integrated level higher and higher in this way.Volume is caused to reduce in this way, function becomes powerful, directly results in electronics member device
The cooling requirements of part are higher and higher.The fan type radiating used in the past, since volume is big, the problems such as noise can be generated, gradually by
Market, so more and more being radiated using graphite heat radiation fin.
Graphite material has extensive property, including heigh clarity, high conductivity, high-termal conductivity, high intensity etc.,
But graphite flake also has shortcoming, though being that high thermal conductivity graphite flake has certain folding resistance, the intensity between material is weak, can
To be torn easily, or because institute's adhesive attachment means displacement and disrepair phenomenon occurs, entry material falls off, so as to cause electricity
The short circuit on road.Graphite heat radiation fin structure in the form of sheets, there is also the small technical problems of heat dissipation area, use inconvenient.
Utility model content
The purpose of this utility model is to solve the graphite heat radiation fin of the prior art there are technical problem inconvenient to use, is mentioned
For a kind of compound graphite radiating chip architecture.
To achieve the goals above, the utility model uses following technical scheme:
A kind of compound graphite radiating chip architecture, including upper layer graphite flake and lower layer's graphite flake；The upper layer graphite flake and
Copper foil layer is equipped between lower layer's graphite flake；The upper surface of described upper layer graphite flake is equipped with foil layer；Below lower layer's graphite flake
Equipped with insulating layer；Releasing layer is equipped with below the insulating layer；The foil layer, upper layer graphite flake, copper foil layer, lower layer's graphite
It is bonded respectively by thermally conductive adhesive-layer between piece, insulating layer and releasing layer；The upper surface of the upper layer graphite flake is equipped in a plurality of
Recessed groove.
Further, the groove is the bar shaped groove of a plurality of parallelly distribute on, and foil layer is pasted onto the upper of upper layer graphite flake
In surface and groove.
Further, it glues or will connect by thermally conductive adhesive-layer between the upper layer graphite flake and lower layer's graphite flake and copper foil layer
Junction is set as hair side, by being press-connected.
Further, the foil layer is using insulation PET film layer.
Double-layer graphite piece is arranged in the utility model, and centre adds copper foil layer and improves toughness, and slot is equipped on the graphite flake of upper layer
Ditch increases heat dissipation area, and there are technical problem inconvenient to use for the graphite heat radiation fin of the effective solution prior art.
Detailed description of the invention
Fig. 1 is the utility model structure diagram.
In figure: 1, foil layer 2, upper layer graphite flake 3, copper foil layer 4, lower layer's graphite flake 5, insulating layer 6, releasing layer 7,
Groove.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, however the reality
Applying example is the utility model a part of the embodiment, and instead of all the embodiments, therefore those of ordinary skill in the art are not doing
Other done under the premise of creative work out provide for simple replacement of, and fall within the protection scope of the utility model.
Embodiment 1: according to Fig. 1, a kind of compound graphite radiating chip architecture, including upper layer graphite flake 2 and lower layer's graphite flake
4；Copper foil layer 3 is equipped between the upper layer graphite flake and lower layer's graphite flake；The upper surface of described upper layer graphite flake is equipped with foil layer 1；
Insulating layer 5 is equipped with below lower layer's graphite flake；Releasing layer 6 is equipped with below the insulating layer；The foil layer, upper layer stone
It is bonded respectively by thermally conductive adhesive-layer between ink sheet, copper foil layer, lower layer's graphite flake, insulating layer and releasing layer；The upper layer graphite
The upper surface of piece 2 is equipped with the groove 7 of a plurality of indent.
Copper foil layer is added between upper layer graphite flake and lower layer's graphite flake, improves the toughness of entire cooling fin, is reduced disconnected
Phenomenon is split, and thermal diffusivity will not weaken.Insulating layer and releasing layer are contacted with electronic component, can be very good transmission of heat by contact, and
And prevent electric power and electrostatic from passing through.
The groove 7 is the bar shaped groove of a plurality of parallelly distribute on, and foil layer 1 is pasted onto upper surface and the slot of upper layer graphite flake
In ditch.
After being absorbed into the heat transfer to upper layer graphite flake of electronic component, heat dissipation area increases, and can accelerate to radiate,
In the case where same radiating efficiency, the area of graphite flake is reduced.
Embodiment 2: being glued between the upper layer graphite flake and lower layer's graphite flake and copper foil layer by thermally conductive adhesive-layer or will be even
Junction is set as hair side, by being press-connected.
The copper foil layer with a thickness of 0.1-0.15mm, can be quick between copper foil layer and upper layer graphite flake and lower layer's graphite
Hot transmitting is carried out, the intensity of graphite flake is improved.
The foil layer 1 is using insulation PET film layer.
Double-layer graphite piece is arranged in the utility model, and centre adds copper foil layer and improves toughness, and slot is equipped on the graphite flake of upper layer
Ditch increases heat dissipation area, and there are technical problem inconvenient to use for the graphite heat radiation fin of the effective solution prior art.
Claims (4)
1. a kind of compound graphite radiating chip architecture, including upper layer graphite flake and lower layer's graphite flake；It is characterized in that, the upper layer
Copper foil layer is equipped between graphite flake and lower layer's graphite flake；The upper surface of described upper layer graphite flake is equipped with foil layer；Lower layer's graphite
Insulating layer is equipped with below piece；Releasing layer is equipped with below the insulating layer；The foil layer, upper layer graphite flake, copper foil layer, under
It is bonded respectively by thermally conductive adhesive-layer between layer graphite flake, insulating layer and releasing layer；The upper surface of the upper layer graphite flake is equipped with
The groove of a plurality of indent.
2. a kind of compound graphite radiating chip architecture according to claim 1, it is characterised in that: the groove is a plurality of flat
The bar shaped groove of row distribution, foil layer are pasted onto upper surface and the groove of upper layer graphite flake.
3. a kind of compound graphite radiating chip architecture according to claim 1, it is characterised in that: the upper layer graphite flake and
It is glued between lower layer's graphite flake and copper foil layer by thermally conductive adhesive-layer or joint face is set as hair side, by being press-connected.
4. a kind of compound graphite radiating chip architecture according to claim 1, it is characterised in that: the foil layer is using exhausted
Edge PET film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985158.2U CN208402321U (en) | 2018-06-26 | 2018-06-26 | A kind of compound graphite radiating chip architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985158.2U CN208402321U (en) | 2018-06-26 | 2018-06-26 | A kind of compound graphite radiating chip architecture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208402321U true CN208402321U (en) | 2019-01-18 |
Family
ID=65132232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820985158.2U Active CN208402321U (en) | 2018-06-26 | 2018-06-26 | A kind of compound graphite radiating chip architecture |
Country Status (1)
| Country | Link |
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| CN (1) | CN208402321U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113103698A (en) * | 2021-04-26 | 2021-07-13 | 湖南沛德新材料有限公司 | Graphite flake beneficial to accelerating heat dissipation and preparation process thereof |
| CN113115510A (en) * | 2021-03-10 | 2021-07-13 | 深圳市宏杰兴业科技有限公司 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
-
2018
- 2018-06-26 CN CN201820985158.2U patent/CN208402321U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115510A (en) * | 2021-03-10 | 2021-07-13 | 深圳市宏杰兴业科技有限公司 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
| CN113103698A (en) * | 2021-04-26 | 2021-07-13 | 湖南沛德新材料有限公司 | Graphite flake beneficial to accelerating heat dissipation and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Leishi Thermal Management Technology Co.,Ltd. Address before: 518000 room 1204, 12 / F, block C, building 2, Shenzhen software industry base, Keyuan Road, Nanshan street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES Ltd. |
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| CP03 | Change of name, title or address |