CN208200824U - A kind of graphene Heat dissipation adhesive tape with buffering effect - Google Patents
A kind of graphene Heat dissipation adhesive tape with buffering effect Download PDFInfo
- Publication number
- CN208200824U CN208200824U CN201820543259.4U CN201820543259U CN208200824U CN 208200824 U CN208200824 U CN 208200824U CN 201820543259 U CN201820543259 U CN 201820543259U CN 208200824 U CN208200824 U CN 208200824U
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive layer
- adhesive
- release film
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003139 buffering effect Effects 0.000 title claims abstract description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 15
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 109
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000002270 dispersing agent Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 241000446313 Lamella Species 0.000 claims abstract description 26
- 229920000742 Cotton Polymers 0.000 claims abstract description 23
- 238000004049 embossing Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of graphene Heat dissipation adhesive tape with buffering effect, it is made of eight layers of structure, it is from top to bottom embossing release film layer respectively, first adhesive layer, buffer foamed cotton layer, second adhesive layer, thermal dispersant coatings, copper foil lamella, third adhesive layer, lower release film layer, third adhesive layer is coated between the lower layer of copper foil lamella and lower release film layer upper layer, thermal dispersant coatings are coated on copper foil lamella upper layer, second adhesive layer is coated on thermal dispersant coatings upper layer, the lower layer of buffering foamed cotton layer is bonded in the second adhesive layer upper layer, first adhesive layer is coated on the upper layer of buffering foamed cotton layer, embossing release film layer lower layer is bonded in the first adhesive layer upper layer, upper release film layer, first adhesive layer, buffer foamed cotton layer, second adhesive layer, thermal dispersant coatings, copper foil lamella, third adhesive layer, lower release film presses hierarchical combination together.The heat that the utility model generates when electronic product can work distributes, moreover it is possible to absorb electronic product vibration to the active force of electronic component through buffering foamed cotton layer, it is therefore prevented that the rupture of component.
Description
Technical field
The utility model relates to electronics applications auxiliary field, especially a kind of graphene heat dissipation with buffering effect
Adhesive tape.
Background technique
Existing various civil electronics, many electronic components need to cover cooling fin and radiate, such as in electronic product
The OLED mould group in portion.Main cooling fin major part structure is that thermal dispersant coatings are coated on copper foil currently on the market, or in stone
Upper double-sided adhesive is bonded on ink sheet.The cooling fin of this structure widely uses on the market, in the especially intelligent hand of mobile terminal
That applies on machine equipment is more.Heat dissipation product is mainly used on electronic product module group assembling, in some electronic product mould groups, adds
It needs to radiate in work and use process and be combined with shockproof, for example (OLED module is OLED display screen+PCB+ to processing OLED mould group
Framework is constituted, and in processing, is needed to paste cooling fin between OLED display screen and PCB, framework and is guaranteed the normal of OLED display screen
Work), not only there is higher requirement to heat dissipation performance, and OLED mould group after processing is needed to have shockproof function, product is avoided to rupture.
Based on above-mentioned, providing a kind of effectively effectively can distribute and play damping, buffering to the heat generated in electronic product work
The Heat dissipation adhesive tape of effect seems particularly necessary.
Utility model content
It, can not be while heat dissipation in order to overcome the cooling fin applied in existing field of electronic device since its structure is limited
The drawbacks of providing damping effect for electronic product components, the utility model are provided with eight layers of structure, have buffering foamed cotton layer,
The thermal energy generated during not only electronic product can work in actual use distributes, moreover it is possible to effectively absorb electricity by buffering foamed cotton layer
Sub- product generates vibration to the active force of electronic component, prevents a kind of graphite with buffering effect of electronic product components rupture
Alkene Heat dissipation adhesive tape.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of graphene Heat dissipation adhesive tape with buffering effect, it is characterised in that be made of eight layers of structure, from top to bottom divide
It is not embossing release film layer, the first adhesive layer, buffering foamed cotton layer, the second adhesive layer, thermal dispersant coatings, copper foil lamella, third gluing
Layer, lower release film layer, third adhesive layer are coated between the lower layer of copper foil lamella and lower release film layer upper layer, thermal dispersant coatings coating
On copper foil lamella upper layer, the second adhesive layer is coated on thermal dispersant coatings upper layer, and the lower layer for buffering foamed cotton layer is bonded in the second adhesive layer
Upper layer, the first adhesive layer are coated on the upper layer of buffering foamed cotton layer, and embossing release film layer lower layer is bonded in the first adhesive layer upper layer, on
Release film layer, the first adhesive layer, buffering foamed cotton layer, the second adhesive layer, thermal dispersant coatings, copper foil lamella, third adhesive layer, under it is release
Film presses hierarchical combination together.
First adhesive layer, the second adhesive layer, third adhesive layer use acrylate glue.
The thermal dispersant coatings are the thermally conductive masking liquids of graphene, and when thermal dispersant coatings are coated on copper foil lamella upper layer, graphene is thermally conductive
Masking liquid scraper or plate gravure coating method are coated on copper foil lamella upper layer, form thermal dispersant coatings after constant temperature baking.
The embossing release film layer has three-decker, is from top to bottom pet layer, PE plinthitic horizon, silicone release respectively
Layer, PE plinthitic horizon lamination are sprayed on PE plinthitic horizon in pet layer upper layer, silicone release layer.
The utility model beneficial effect is: when the utility model is used according to the installation site needs of electronic product components,
Adhesive tape is intercepted one section, is bonded on electronic product components after release film is torn, the copper foil lamella upper layer of the utility model has stone
Black alkene thermal dispersant coatings, copper foil lamella and thermal dispersant coatings graphene have good thermal conductivity, when effectively electronic product can work
The heat of generation is distributed through copper foil lamella and thermal dispersant coatings graphene.Due to having buffering foamed cotton layer, in actual use can also
Electronic product generation vibration is effectively absorbed to the active force of electronic component by buffering foamed cotton layer, it is therefore prevented that electronic product components
Rupture.Based on above-mentioned, so the application prospect that the utility model has had.
Detailed description of the invention
The utility model is described further with reference to the accompanying drawings and examples.
Fig. 1 is the utility model structure diagram.
Fig. 2 is the utility model embossing release film layer structure schematic diagram.
Specific embodiment
Fig. 1, shown in 2, a kind of graphene Heat dissipation adhesive tape with buffering effect is made of, from top to bottom eight layers of structure
Be respectively embossing release film layer 1, the first adhesive layer 2, buffering foamed cotton layer 3, the second adhesive layer 4, thermal dispersant coatings 5, copper foil lamella 6,
Third adhesive layer 7, lower release film layer 8, third adhesive layer 7 be coated on copper foil lamella 6 lower layer and lower 8 upper layer of release film layer it
Between, thermal dispersant coatings 5 are coated on 6 upper layer of copper foil lamella, and the second adhesive layer 4 is coated on 5 upper layer of thermal dispersant coatings, buffering foamed cotton layer 3
Lower layer is bonded in 4 upper layer of the second adhesive layer, and the first adhesive layer 2 is coated on the upper layer of buffering foamed cotton layer 3, under embossing release film layer 1
Layer is bonded in the first adhesive layer upper layer, upper release film layer, the first adhesive layer, buffering foamed cotton layer, the second adhesive layer, thermal dispersant coatings,
Copper foil lamella, third adhesive layer, lower release film press hierarchical combination together.
Fig. 1, shown in 2, the first adhesive layer 2, the second adhesive layer 4, third adhesive layer 7 use acrylate glue.Thermal dispersant coatings 5
It is the thermally conductive masking liquid of graphene, when thermal dispersant coatings 5 are coated on copper foil 6 upper layer of lamella, the thermally conductive masking liquid scraper of graphene or intaglio plate are applied
Mode for cloth is coated on 6 upper layer of copper foil lamella, forms thermal dispersant coatings after constant temperature baking.Embossing release film layer 1 has three-decker, point
It is not pet layer 1-1, PE plinthitic horizon 1-2, silicone release layer 1-3, PE plinthitic horizon 1-2 lamination in the upper layer pet layer 1-1, organosilicon
Release layer 1-3 is sprayed on PE plinthitic horizon 1-2.
Fig. 1, shown in 2, when the utility model is used the installation site needs according to electronic product components, adhesive tape is cut
One section is taken, is bonded on electronic product components after release film 1 is torn, 6 upper layer of copper foil lamella of the utility model is dissipated with graphene
Hot coating 5, copper foil lamella 6 and 5 graphene of thermal dispersant coatings have good thermal conductivity, generation when effectively electronic product can work
Heat distributed through copper foil lamella 6 and 5 graphene of thermal dispersant coatings.Due to having buffering foamed cotton layer 3, can also lead in actual use
The too slow foamed cotton layer 3 that rushes effectively absorbs electronic product generation vibration to the active force of electronic component, prevents the broken of electronic product components
It splits.Based on above-mentioned, so the application prospect that the utility model has had.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (4)
1. a kind of graphene Heat dissipation adhesive tape with buffering effect, it is characterised in that be made of eight layers of structure, from top to bottom distinguish
Be embossing release film layer, the first adhesive layer, buffering foamed cotton layer, the second adhesive layer, thermal dispersant coatings, copper foil lamella, third adhesive layer,
Lower release film layer, third adhesive layer are coated between the lower layer of copper foil lamella and lower release film layer upper layer, and thermal dispersant coatings are coated on
Copper foil lamella upper layer, the second adhesive layer are coated on thermal dispersant coatings upper layer, and the lower layer for buffering foamed cotton layer is bonded in the second adhesive layer
Layer, the first adhesive layer are coated on the upper layer of buffering foamed cotton layer, and embossing release film layer lower layer is bonded in the first adhesive layer upper layer, on from
Type film layer, the first adhesive layer, buffering foamed cotton layer, the second adhesive layer, thermal dispersant coatings, copper foil lamella, third adhesive layer, lower release film
Together by hierarchical combination.
2. a kind of graphene Heat dissipation adhesive tape with buffering effect according to claim 1, it is characterised in that the first gluing
Layer, the second adhesive layer, third adhesive layer use acrylate glue.
3. a kind of graphene Heat dissipation adhesive tape with buffering effect according to claim 1, it is characterised in that thermal dispersant coatings
It is the thermally conductive masking liquid of graphene.
4. a kind of graphene Heat dissipation adhesive tape with buffering effect according to claim 1, it is characterised in that embossing release
Film layer has three-decker, is from top to bottom pet layer, PE plinthitic horizon, silicone release layer respectively, PE plinthitic horizon lamination is in PET
Layer upper layer, silicone release layer are sprayed on PE plinthitic horizon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820543259.4U CN208200824U (en) | 2018-04-17 | 2018-04-17 | A kind of graphene Heat dissipation adhesive tape with buffering effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820543259.4U CN208200824U (en) | 2018-04-17 | 2018-04-17 | A kind of graphene Heat dissipation adhesive tape with buffering effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208200824U true CN208200824U (en) | 2018-12-07 |
Family
ID=64524455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820543259.4U Active CN208200824U (en) | 2018-04-17 | 2018-04-17 | A kind of graphene Heat dissipation adhesive tape with buffering effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208200824U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110345547A (en) * | 2019-07-31 | 2019-10-18 | 天津北方烯旺材料科技有限公司 | Graphene radiating subassembly and graphene electric heater |
| CN111849376A (en) * | 2020-08-03 | 2020-10-30 | 湖南弘擎电子材料科技有限公司 | A kind of heat dissipation foam tape and preparation method thereof |
| CN111976249A (en) * | 2020-08-20 | 2020-11-24 | 合肥维信诺科技有限公司 | Composite foam layer and display module |
| CN113879912A (en) * | 2021-09-13 | 2022-01-04 | 山东嘉元新能源材料有限公司 | Novel protection of cladding electrolytic copper foil book device |
| CN113999623A (en) * | 2021-11-18 | 2022-02-01 | 太仓展新胶粘材料股份有限公司 | Integrated composite heat dissipation buffer part and preparation method thereof |
| CN114106726A (en) * | 2021-11-29 | 2022-03-01 | 京东方科技集团股份有限公司 | Heat dissipation film and electronic device with same |
-
2018
- 2018-04-17 CN CN201820543259.4U patent/CN208200824U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110345547A (en) * | 2019-07-31 | 2019-10-18 | 天津北方烯旺材料科技有限公司 | Graphene radiating subassembly and graphene electric heater |
| CN111849376A (en) * | 2020-08-03 | 2020-10-30 | 湖南弘擎电子材料科技有限公司 | A kind of heat dissipation foam tape and preparation method thereof |
| CN111976249A (en) * | 2020-08-20 | 2020-11-24 | 合肥维信诺科技有限公司 | Composite foam layer and display module |
| CN113879912A (en) * | 2021-09-13 | 2022-01-04 | 山东嘉元新能源材料有限公司 | Novel protection of cladding electrolytic copper foil book device |
| CN113879912B (en) * | 2021-09-13 | 2023-12-26 | 山东嘉元新能源材料有限公司 | Protective device for coating electrolytic copper foil coil |
| CN113999623A (en) * | 2021-11-18 | 2022-02-01 | 太仓展新胶粘材料股份有限公司 | Integrated composite heat dissipation buffer part and preparation method thereof |
| CN113999623B (en) * | 2021-11-18 | 2023-08-08 | 太仓展新胶粘材料股份有限公司 | An integrated composite heat dissipation buffer and its preparation method |
| CN114106726A (en) * | 2021-11-29 | 2022-03-01 | 京东方科技集团股份有限公司 | Heat dissipation film and electronic device with same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208200824U (en) | A kind of graphene Heat dissipation adhesive tape with buffering effect | |
| EP2685797B1 (en) | Composite material and electron device | |
| US10945331B2 (en) | Mobile display device | |
| CN204047017U (en) | A kind of heat conductive pad | |
| CN109996423B (en) | Composite multilayer graphite sheet structure, manufacturing method, heat dissipation structure and electronic device | |
| CN207612462U (en) | A high thermal conductivity printed circuit board | |
| CN205902314U (en) | Compound graphite radiating sheet | |
| KR101796206B1 (en) | thermal dissipation pad | |
| CN210607231U (en) | Novel composite heat dissipation material | |
| JP2022077489A (en) | Heat-dissipating conductive flexible substrate | |
| KR20170080096A (en) | Radiating sheet | |
| CN206686441U (en) | Flexible circuit board heat radiation structure and wearing equipment | |
| CN206402529U (en) | A kind of high-cooling property printed circuit board (PCB) | |
| CN212684919U (en) | High heat conduction graphite heat dissipation film | |
| CN211670998U (en) | Electrothermal film | |
| CN208402321U (en) | A kind of compound graphite radiating chip architecture | |
| CN205364688U (en) | Heat conduction graphite piece | |
| CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
| CN210610139U (en) | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material | |
| CN210628295U (en) | Graphite heat dissipation film | |
| CN210840545U (en) | Wave-absorbing shielding film with heat dissipation and conduction functions | |
| CN205467591U (en) | Thermal insulation piece | |
| CN107105604A (en) | A kind of shockproof foam bar of quick conductive | |
| CN207733169U (en) | A thermally conductive sheet with improved structure | |
| CN206650917U (en) | A kind of radiating printed circuit board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |