CN204462998U - Panel computer and mobile phone thermal diffusion sheet - Google Patents
Panel computer and mobile phone thermal diffusion sheet Download PDFInfo
- Publication number
- CN204462998U CN204462998U CN201420746416.3U CN201420746416U CN204462998U CN 204462998 U CN204462998 U CN 204462998U CN 201420746416 U CN201420746416 U CN 201420746416U CN 204462998 U CN204462998 U CN 204462998U
- Authority
- CN
- China
- Prior art keywords
- thermal diffusion
- plastic film
- black plastic
- diffusion sheet
- copper sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000002985 plastic film Substances 0.000 claims abstract description 31
- 229920006255 plastic film Polymers 0.000 claims abstract description 31
- 229920000297 Rayon Polymers 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims abstract description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 8
- 229920006289 polycarbonate film Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004381 surface treatment Methods 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 18
- 229910002804 graphite Inorganic materials 0.000 description 16
- 239000010439 graphite Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of panel computer and mobile phone thermal diffusion sheet, this thermal diffusion sheet comprises the black plastic film, the copper sheet that set gradually from top to bottom and is attached to the layers of two-sided of copper sheet lower surface, described black plastic film is bonded in the upper surface of copper sheet by viscose glue, the surface of described black plastic film is rough cloudy surface structure.The rough cloudy surface of the black plastic film in the utility model adds the contact area of its surface and air, add surface treatment and become black, these two factors favourable to thermal diffusion are combined and are added the thermal diffusivity of black plastic film to air, recycling copper sheet preferably horizontal pyroconductivity, add whole thermal diffusion sheet to conduct the thermal convection of air, reach the object of heat absorption and heat radiation rapidly.Thermal diffusion sheet of the present utility model not only has good thermal diffusivity, and does not need coating and high-temperature baking when making, and manufacture no dust pollution, production technology is simple, and cost is low.
Description
Technical field
The utility model relates to a kind of thermal diffusion sheet, particularly a kind of panel computer and mobile phone thermal diffusion sheet.
Background technology
Existing flat computer and mobile phone heat radiator are made up of graphite copper sheet or electrographite sheet, although electrographite sheet effect is very good, but price is high, use few, the radiating effect of graphite copper sheet is better than naked copper sheet, but graphite will be coated on copper sheet when making, need complex apparatus and 300-400 degree high-temperature baking, graphite material price is also high, production cost is more high than naked copper sheet, and the manufacture environmental pollution of nano level dag is very serious, and graphite copper sheet radiating effect only exceeds 1/5 than naked copper sheet.Again because the graphite linings on graphite copper sheet surface has good electrical conductivity, if be contained in flat computer and mobile phone, because of flat computer and interior of mobile phone space little, be covered with wiring board, for avoiding short circuit, so when graphite copper sheet is contained in little interior volume, the graphite linings on its surface needs to live with nonconducting plastic film covering.But the porosity characteristic of graphite surface is covered by film like this, little when not covering film with the contact area rate of air, therefore it is not good to be covered with the graphite copper sheet thermal diffusivity after film, little with naked copper difference, and graphite copper sheet will 1/5 than naked copper heat diffusion properties when not covering film.In flat computer and this little space of mobile phone use, graphite copper sheet cannot give play to its advantage.
Summary of the invention
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of low cost and the good panel computer of thermal diffusivity and mobile phone thermal diffusion sheet.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions: a kind of panel computer and mobile phone thermal diffusion sheet, this thermal diffusion sheet comprise from
Upper under the black plastic film, the copper sheet that set gradually and be attached to the layers of two-sided of copper sheet lower surface, described black plastic film is bonded in the upper surface of copper sheet by viscose glue, the surface of described black plastic film is rough cloudy surface structure.
Further, described black plastic film is poly terephthalic acid film or polycarbonate film.
Further, the thickness of described black plastic film is 0.005mm-0.05mm.
Further, the thickness of described copper sheet is 0.025-0.15mm.
Further, the thickness of described layers of two-sided is 0.01mm-0.07mm.
The beneficial effects of the utility model are: the black plastic film with rough cloudy surface is directly attached to copper sheet surface by the utility model, thus rough cloudy surface adds the contact area of its surface and air, add surface treatment and become black, these two factors favourable to thermal diffusion combine add black plastic film surface to the thermal diffusivity of air, utilize copper sheet preferably horizontal pyroconductivity simultaneously, thus add whole thermal diffusion sheet the thermal convection of air is conducted, reach the object of heat absorption and heat radiation rapidly.Again because the black plastic film in the utility model is non-conductive, one deck insulation film can be pasted again, form a more cheap heat radiator better than graphite copper sheet.In addition, thermal diffusion sheet of the present utility model, when making, only need simple laminating machine, and this thermal diffusion sheet integral thickness is very thin, can tackle the packing problem of small space completely.Thermal diffusion sheet of the present utility model not only has thermal diffusivity more better than traditional graphite copper sheet, and does not need coating and high-temperature baking when making, and manufacture no dust pollution, production technology is simple, and cost is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model panel computer and mobile phone thermal diffusion sheet.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection domain of the present utility model.
As shown in Figure 1, a kind of panel computer and mobile phone thermal diffusion sheet, this thermal diffusion sheet comprises the black plastic film 1, the copper sheet 2 that set gradually from top to bottom and is attached to the layers of two-sided 3 of copper sheet 2 lower surface, described black plastic film 1 is bonded in the upper surface of copper sheet 2 by viscose glue, the surface of described black plastic film 1 is rough cloudy surface structure.
Furtherly, black plastic film 1 wherein can be poly terephthalic acid film (PET film) or polycarbonate film (PC film).
Furtherly, the thickness of black plastic film 1 is wherein 0.005mm-0.05mm.
Furtherly, the thickness of copper sheet 2 is wherein 0.025-0.15mm.
Furtherly, the thickness of layers of two-sided 3 is wherein 0.01mm-0.07mm.
When making this thermal diffusion sheet, with 0.025mm-0.15mm copper sheet 2 for base material, upper surface sticks the black plastic film 1(poly terephthalic acid film or polycarbonate film that thickness is 0.05mm-0.05mm), and the surface treatment of this black plastic film 1 becomes rough cloudy surface structure, lower surface sticks the layers of two-sided 3 that thickness is 0.01mm-0.07mm, three's compound forms thermal diffusion sheet, applies on flat computer and handheld communication machine.
Because copper sheet 2 has the pyroconductivity in good X-Y surface level direction, the pyroconductivity in this surface level direction is 400W/mk, but very poor perpendicular to the thermal radiation rate in the Z-direction of surface level.So as radiating element, existing is technically do a lot of fin on copper sheet,
To increase the surface area that contacts with air, but on this structure panel computer that is used in small space or mobile phone, insert being difficult in casing.And the black plastic film 1 that surface is cloudy surface by thermal diffusion sheet of the present utility model is directly attached to copper sheet 2 surface.Thus, the rough cloudy surface of black plastic film adds the contact area of its surface and air, add surface treatment and become black, and then these two factors favourable to thermal diffusion combine add black plastic film surface to the thermal diffusivity of air, make whole thermal diffusion sheet have thermal radiation rate in preferably Z-direction.Thus the summation characteristic of the thermal radiation rate in the preferably Z-direction utilizing the black plastic film 1 of copper sheet 2 preferably horizontal pyroconductivity and cloudy surface to bring, adds whole thermal diffusion sheet and conducts the thermal convection of air, reaches the object of heat absorption and heat radiation rapidly.
Black plastic film 1 in the utility model is non-conductive, can paste one deck insulation film again, forms a more cheap heat radiator better than graphite copper sheet.On processing procedure, thermal diffusion sheet of the present utility model only needs simple laminating machine, and this thermal diffusion sheet integral thickness is very thin, can tackle the packing problem of small space completely.Thermal diffusion sheet of the present utility model not only has thermal diffusivity more better than traditional graphite copper sheet, and does not need coating and high-temperature baking when making, and manufacture no dust pollution, production technology is simple, and cost is low.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model instructions and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. a panel computer and mobile phone thermal diffusion sheet, it is characterized in that: this thermal diffusion sheet comprises the black plastic film, the copper sheet that set gradually from top to bottom and is attached to the layers of two-sided of copper sheet lower surface, described black plastic film is bonded in the upper surface of copper sheet by viscose glue, the surface of described black plastic film is rough cloudy surface structure.
2. panel computer according to claim 1 and mobile phone thermal diffusion sheet, is characterized in that: described black plastic film is poly terephthalic acid film or polycarbonate film.
3. panel computer according to claim 1 and mobile phone thermal diffusion sheet, is characterized in that: the thickness of described black plastic film is 0.005mm-0.05mm.
4. panel computer according to claim 1 and mobile phone thermal diffusion sheet, is characterized in that: the thickness of described copper sheet is 0.025mm-0.15mm.
5. panel computer according to claim 1 and mobile phone thermal diffusion sheet, is characterized in that: the thickness of described layers of two-sided is 0.01mm-0.07mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420746416.3U CN204462998U (en) | 2014-12-03 | 2014-12-03 | Panel computer and mobile phone thermal diffusion sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420746416.3U CN204462998U (en) | 2014-12-03 | 2014-12-03 | Panel computer and mobile phone thermal diffusion sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204462998U true CN204462998U (en) | 2015-07-08 |
Family
ID=53669858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420746416.3U Expired - Fee Related CN204462998U (en) | 2014-12-03 | 2014-12-03 | Panel computer and mobile phone thermal diffusion sheet |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204462998U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105584121A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电(昆山)股份有限公司 | Graphite heat diffusion sheet for tablet personal computer and mobile phone |
-
2014
- 2014-12-03 CN CN201420746416.3U patent/CN204462998U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105584121A (en) * | 2016-03-11 | 2016-05-18 | 奇华光电(昆山)股份有限公司 | Graphite heat diffusion sheet for tablet personal computer and mobile phone |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104426244B (en) | Wireless charging device | |
CN204265679U (en) | A kind of Kapton adhesive tape | |
CN202931733U (en) | Portable electronic device | |
CN202656536U (en) | Structure for adding metal layers in composite case | |
CN203446104U (en) | Insulating thermal conductive substrate | |
CN204634154U (en) | Two-sided heat-conducting substrate | |
CN104994682B (en) | A kind of PCB with heat dissipation performance and apply its mobile terminal | |
CN204462998U (en) | Panel computer and mobile phone thermal diffusion sheet | |
CN204801156U (en) | Thermal film of low heat conduction of high even heat | |
CN105472947A (en) | Electronic device | |
CN206030662U (en) | No substrate graphite alkene heat conduction membrane | |
CN203884121U (en) | Radiating fin | |
CN203968561U (en) | A kind of heat abstractor and electronic equipment | |
CN205179499U (en) | Polyimide is high, and heat dissipation covers membrane | |
CN101934611A (en) | Plane resistor copper foil laminated sheet covered with polytetrafluoroethylene glass cloth | |
CN204697470U (en) | A kind of novel graphite heat conducting film | |
CN205755051U (en) | A kind of novel high heat-conduction circuit board | |
CN205364691U (en) | Good copper -clad plate of heat dissipation function | |
CN202738258U (en) | Efficient heat dissipating flexible circuit board | |
CN105584121A (en) | Graphite heat diffusion sheet for tablet personal computer and mobile phone | |
CN204585969U (en) | A kind of good copper-clad plate of dispelling the heat | |
CN203968554U (en) | Biadhesive heat-conducting silica gel sheet | |
CN102649329A (en) | Uniform temperature and thermal insulation thin film material | |
CN205202355U (en) | Copper base copper -clad plate of ceramic film structure | |
CN205755047U (en) | The pcb board that a kind of thermal diffusivity is strong |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 |