CN205755047U - The pcb board that a kind of thermal diffusivity is strong - Google Patents
The pcb board that a kind of thermal diffusivity is strong Download PDFInfo
- Publication number
- CN205755047U CN205755047U CN201620664322.0U CN201620664322U CN205755047U CN 205755047 U CN205755047 U CN 205755047U CN 201620664322 U CN201620664322 U CN 201620664322U CN 205755047 U CN205755047 U CN 205755047U
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- Prior art keywords
- heat dissipating
- dissipating layer
- pcb board
- substrate
- layer
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Abstract
The utility model discloses the pcb board that a kind of thermal diffusivity is strong, including conductive layer, insulating barrier, heat dissipating layer, substrate and installing hole, the bottom of described conductive layer is provided with insulating barrier, the bottom of described insulating barrier is provided with heat dissipating layer, hot melt adhesive layer is accompanied between upper surface and the insulating barrier of described heat dissipating layer, and the lower surface of heat dissipating layer is evenly coated with INFRARED ABSORPTION coating, described heat dissipating layer is evenly distributed with through hole, and the bottom of heat dissipating layer is provided with substrate, the surface of described substrate is coated with heat sink material, described substrate be formed around installing hole.This utility model, by using aluminium material to make substrate, adds the intensity of whole pcb board；Dispel the heat by utilizing INFRARED ABSORPTION coating can quickly collect heat importing in heat dissipating layer, thus can effectively heat laterally be distributed in the case of not affecting pcb board thickness, significantly improve the radiating efficiency of pcb board, also there is reasonable in design, be prone to the advantages such as processing, popularization and application in being suitable on a large scale.
Description
Technical field
This utility model relates to wiring board techniques field, the pcb board that a kind of thermal diffusivity is strong.
Background technology
Pcb board, also known as printed circuit board (PCB), is also printed substrate, is important electronic unit, is propping up of electronic devices and components
Support body, is the supplier of electronic devices and components electrical connection, and it develops into two-sided, multilamellar and flexibility from monolayer.At printed circuit board
Before appearance, the interconnection between electronic component is all dependent on electric wire and is directly connected to and forms complete circuit.At current electronics row
In industry, circuit board is intended only as effective experimental tool and exists, and printed circuit board (PCB) constantly to high accuracy, high density and
High reliability direction is developed, and constantly reduces volume, reduces cost, raising performance, so that pcb board is the most
Occupy very important status, and remain in that powerful vitality.
In prior art, pcb board is widely used, and uses the major advantage of pcb board to greatly reduce wiring and assembling
Mistake, improves Automated water gentle productive labor rate.It is known that electronic component the most often produces in a large number
Heat, so the thermal diffusivity of pcb board is an important indicator.But, in use Chang Yinwei is each for pcb board on the market
Kind of situation and produce overheated problem, and problems of excessive heat is the one of the main reasons causing PCB to damage.Therefore, currently on the market
Stronger and meet the pcb board of International Environmental Protection trend in the urgent need to designing a thermal diffusivity, this becomes those skilled in the art urgently
Technical problem to be solved.
Summary of the invention
The purpose of this utility model is the pcb board providing a kind of thermal diffusivity strong, to solve to propose in above-mentioned background technology
Problem.
For achieving the above object, this utility model following technical scheme of offer: the pcb board that a kind of thermal diffusivity is strong, including leading
Electric layer, insulating barrier, heat dissipating layer, substrate and installing hole, the bottom of described conductive layer is provided with insulating barrier, and the bottom of described insulating barrier sets
There is heat dissipating layer, between upper surface and the insulating barrier of described heat dissipating layer, accompany hot melt adhesive layer, and the lower surface of heat dissipating layer is evenly coated with
INFRARED ABSORPTION coating, the bottom of described heat dissipating layer is provided with substrate, and the surface of described substrate is coated with heat sink material, described substrate
It is formed around installing hole.
Preferably, described heat dissipating layer is set to Graphene heat conducting film.
Preferably, it is provided with insulating lacquer layer bottom described INFRARED ABSORPTION coating.
Preferably, described heat dissipating layer is evenly distributed with through hole.
Preferably, described substrate is made by aluminium material.
Compared with prior art, the beneficial effects of the utility model are: 1, by heat dissipating layer is set to Graphene heat conducting film,
Effectively heat can laterally be distributed, the most not affect the thickness of pcb board, and utilize INFRARED ABSORPTION coating can quickly collect heat
Measure and import Graphene heat conducting film to dispel the heat, thus significantly improve radiating efficiency；2, by using aluminium material to make substrate
Add the intensity of whole pcb board, additionally, also there is reasonable in design, be prone to the advantages such as processing, promote in being suitable on a large scale
Application.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, conductive layer；2, insulating barrier；3, heat dissipating layer；4, substrate；5, installing hole；6, hot melt adhesive layer；7, INFRARED ABSORPTION
Coating；8, insulating lacquer layer；9, through hole.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
As it is shown in figure 1, this utility model provides following technical scheme: the pcb board that a kind of thermal diffusivity is strong, including conduction
Layer 1, insulating barrier 2, heat dissipating layer 3, substrate 4 and installing hole 5, the bottom of described conductive layer 1 is provided with insulating barrier 2, described insulating barrier 2
Bottom is provided with heat dissipating layer 3, accompanies hot melt adhesive layer 6, and the following table of heat dissipating layer 3 between upper surface and the insulating barrier 2 of described heat dissipating layer 3
Face is evenly coated with INFRARED ABSORPTION coating 7, and the bottom of described heat dissipating layer 3 is provided with substrate 4, and the surface of described substrate 4 is coated with heat radiation
Material, described substrate 4 be formed around installing hole 5.
Further, described heat dissipating layer 3 is set to Graphene heat conducting film, effectively can laterally be distributed by heat, and lead
Thermal effect is good；It is provided with insulating lacquer layer 8 bottom described INFRARED ABSORPTION coating 7, there is protective effect；Described heat dissipating layer 3 uniformly divides
It is furnished with through hole 9, the bonding strength of heat dissipating layer 3 and hot melt adhesive layer 6 can be increased, prevent it to be layered；Described substrate 4 is made by aluminium material
Form, the intensity of whole pcb board can be increased.
Be improved by it is to be noted that of the present utility model, the strong pcb board of this thermal diffusivity by conductive layer 1, insulating barrier 2,
Heat dissipating layer 3, substrate 4 and be arranged on the installing hole 5 of substrate 4 surrounding and form, by heat dissipating layer 3 is set to Graphene heat conducting film,
Effectively heat laterally can be distributed, and good heat conduction effect, the most do not affect the thickness of pcb board, utilize infrared suction simultaneously
Receive coating 7 can quickly collect heat and import Graphene heat conducting film and dispel the heat, thus significantly improve radiating efficiency；By adopting
Make substrate 4 with aluminium material and add the intensity of whole pcb board, additionally, also there is reasonable in design, to be prone to processing etc. excellent
Point, popularization and application in being suitable on a large scale.
Last it is noted that the foregoing is only preferred embodiment of the present utility model, it is not limited to this
Utility model, although being described in detail this utility model with reference to previous embodiment, for those skilled in the art
For, the technical scheme described in previous embodiment still can be modified by it, or enters wherein portion of techniques feature
Row equivalent.All within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. made, all should
Within being included in protection domain of the present utility model.
Claims (5)
1. the pcb board that thermal diffusivity is strong, including conductive layer (1), insulating barrier (2), heat dissipating layer (3), substrate (4) and installing hole
(5), it is characterised in that: the bottom of described conductive layer (1) is provided with insulating barrier (2), and the bottom of described insulating barrier (2) is provided with heat dissipating layer
(3), accompany hot melt adhesive layer (6) between upper surface and the insulating barrier (2) of described heat dissipating layer (3), and the lower surface of heat dissipating layer (3) is equal
The even INFRARED ABSORPTION coating (7) that scribbles, the bottom of described heat dissipating layer (3) is provided with substrate (4), and the surface of described substrate (4) is coated with
Heat sink material, described substrate (4) be formed around installing hole (5).
The pcb board that a kind of thermal diffusivity the most according to claim 1 is strong, it is characterised in that: described heat dissipating layer (3) is set to graphite
Alkene heat conducting film.
The pcb board that a kind of thermal diffusivity the most according to claim 1 is strong, it is characterised in that: described INFRARED ABSORPTION coating (7) end
Portion is provided with insulating lacquer layer (8).
The pcb board that a kind of thermal diffusivity the most according to claim 1 is strong, it is characterised in that: described heat dissipating layer uniformly divides in (3)
It is furnished with through hole (9).
The pcb board that a kind of thermal diffusivity the most according to claim 1 is strong, it is characterised in that: described substrate (4) is by aluminium material system
Form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620664322.0U CN205755047U (en) | 2016-06-29 | 2016-06-29 | The pcb board that a kind of thermal diffusivity is strong |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620664322.0U CN205755047U (en) | 2016-06-29 | 2016-06-29 | The pcb board that a kind of thermal diffusivity is strong |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755047U true CN205755047U (en) | 2016-11-30 |
Family
ID=57382693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620664322.0U Expired - Fee Related CN205755047U (en) | 2016-06-29 | 2016-06-29 | The pcb board that a kind of thermal diffusivity is strong |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755047U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107084321A (en) * | 2017-05-08 | 2017-08-22 | 安徽科发信息科技有限公司 | A kind of high heat conduction LED substrate |
-
2016
- 2016-06-29 CN CN201620664322.0U patent/CN205755047U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107084321A (en) * | 2017-05-08 | 2017-08-22 | 安徽科发信息科技有限公司 | A kind of high heat conduction LED substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20170629 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |