CN204721709U - A kind of double-sided ceramic circuit board - Google Patents
A kind of double-sided ceramic circuit board Download PDFInfo
- Publication number
- CN204721709U CN204721709U CN201520301811.5U CN201520301811U CN204721709U CN 204721709 U CN204721709 U CN 204721709U CN 201520301811 U CN201520301811 U CN 201520301811U CN 204721709 U CN204721709 U CN 204721709U
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Abstract
The utility model discloses a kind of double-sided ceramic circuit board, it comprises ceramic substrate, and good heat dissipation is high pressure resistant, and the conducting structure of upper and lower circuit unit is very reliable, makes easily.The utility model comprises the ceramic substrate be made up of ceramic material, and ceramic substrate upper and lower surface is coating one deck conductive unit respectively, and this conductive unit comprises conductive layer, protective layer and help layer; Described conductive layer has respectively treats welding zone and conduction region; Described conductive unit also comprises several and is coated on and helps layer and relative to the insulating barrier above the conduction region of conductive layer; Described ceramic substrate comprises withstand voltage ceramic layer, and withstand voltage ceramic layer upper and lower surface is disposed with porous ceramic layer and luminescent ceramic layer; Described conductive unit is arranged in described luminescent ceramic layer; Described ceramic substrate and conductive unit offer conductive through hole by laser drilling device; Electroconductive cured piece of the basic upper conductive unit of conducting pottery and underlying conductive unit is provided with in conductive through hole; Dope layer is provided with outside described conductive through hole.
Description
Technical field
The utility model relates to a kind of ceramic circuit-board, is specifically related to a kind of wiring board comprising ceramic substrate.
Background technology
Pottery possesses reliable insulating properties and heat-sinking capability, and it possesses very large advantage for board substrate; In order to high-performance and the high integration of realizing circuit plate, we are all provided with the unit of circuit in ceramic substrate upper and lower surface, conducting thus for upper and lower circuit unit encounters some problems, the perforate of ceramic substrate is cumbersome, the conducting adopting the copper-plated technique of traditional electrical to realize upper and lower circuit unit after perforate bothers more, its structures shape complexity of technical process; The conducting structure of therefore common ceramic substrate upper and lower circuit unit is all realized by external connection line; This structure makes circuit board integral wire harness increase, and easily damages; Meanwhile, the composition form of circuit unit is varied, and the form that traditional one deck impressing pattern layer back upper place covers layer protective layer not only wastes material, and it is all inconvenient when welding electronic elements or plug-in unit conducting; We are by such wiring board with ceramic material through being usually used in LED illumination field, and for the application of LED illumination field, still not, resistance to pressure is poor, does not have booster action to LED illumination effect for the thermal diffusivity of such wiring board of tradition.
Utility model content
Technical problem to be solved in the utility model is for above-mentioned deficiency of the prior art; a kind of double-sided ceramic circuit board is provided; it comprises ceramic substrate; good heat dissipation, high pressure resistant, the conducting structure of upper and lower circuit unit is very reliable; make easily; the layout of circuit unit itself is convenient to the weldment of electronic component, and possess reliable protective capability, conducting wire is not fragile.
The utility model solves the technical scheme that its technical problem adopts: a kind of double-sided ceramic circuit board, comprise the ceramic substrate be made up of ceramic material, ceramic substrate upper and lower surface is coating one deck conductive unit respectively, and this conductive unit comprises several and is indirectly coated on this ceramic base plate surface and forms a predetermining circuit distribution patterns and the conductive layer of electronic component electrical connection;
Described conductive unit also comprises several and is coated on protective layer on conductive layer; On protective layer, coating one deck helps layer; Described conductive layer has respectively at least onely treats welding zone in order to what be electrically connected with electronic component, and at least onely treats with this conduction region that welding zone is electrically connected, protective layer and help layer sequentially stacking being coated on treat on welding zone and conduction region; Described conductive unit also comprises several and is coated on and helps layer and relative to the insulating barrier above the conduction region of conductive layer;
Described ceramic substrate comprises withstand voltage ceramic layer, and withstand voltage ceramic layer upper and lower surface is disposed with porous ceramic layer and luminescent ceramic layer; Described conductive unit is arranged in described luminescent ceramic layer;
Described ceramic substrate and conductive unit offer pass through aperture by laser drilling device, and this through hole is conductive through hole; Electroconductive cured piece of the basic upper conductive unit of conducting pottery and underlying conductive unit is provided with in conductive through hole; Described electroconductive cured piece is silver slurry cured block or copper slurry cured block; Dope layer is provided with outside described conductive through hole.
As a kind of preferred implementation of the present utility model, described luminescent ceramic layer comprises annular current limliting block and is filled in the fluorescent adhesive layer in annular current limliting block; Described annular current limliting block is the annular current limliting block made with blue glue.
As a kind of preferred implementation of the present utility model, described insulating barrier is the nanometer glaze layer of electrical insulating property.
The utility model compared with prior art has the following advantages:
1, ceramic substrate of the present utility model comprises trilaminate material, and LED blue light can be converted into visible ray by its luminescent ceramic layer, thus can significantly improve light efficiency; Described porous ceramic layer can realize laterally and radial heat transfer by increasing ceramic heat-dissipating area, solves the heat dissipation problem of optics and/or electronic unit; Described withstand voltage ceramic layer has high electric-breakdown resistance energy.Ceramic substrate can be formed by multiple known painting method, such as, can pass through sputtering, evaporation, arc deposited, chemical vapour deposition (CVD), plasma reinforced chemical vapour deposition or sol-gal process and be formed;
2, in a kind of preferred implementation of the present utility model, insulating barrier is set to nanometer glaze layer; Nanometer glaze layer is that nanoparticles sinter forms, and its insulation property are better, and more dust-proof;
3, conductive unit of the present utility model comprises conductive layer, and conductive layer comprises conduction region and treats welding zone, and conductive unit is directly located on ceramic substrate, is convenient to heat radiation; Conduction region and treat welding zone coating layer protective layer simultaneously, conductive layer can be avoided to expose and be oxidized in atmosphere, protective layer adopts nickel metal material to make; Help layer to be coated on protective layer, insulating barrier is coated on and helps relative to the position above conduction region on layer, and electronic component so can be avoided to be soldered to incorrect place, or careless each conductive layer that should not be electrically connected of connection, possesses anti-welding function.
4, the utility model adopts laser drilling device to offer conductive through hole in predetermined place, and conductive through hole runs through ceramic substrate and upper and lower conductive unit; The electric conducting material such as perfusion silver slurry or copper slurry in hole, and make it dry as solid-state, material is thus formed via; The existing electroplating technology of complete difference, production process is simple, avoids the pollution of electroplating and bringing; It also avoid the construction complexity that connecting line brings, hold flimsy defect.
Accompanying drawing explanation
Fig. 1 is the structural representation overlooking direction of a kind of embodiment of the present utility model;
Fig. 2 is the broken section structural representation of the sandwich construction of a kind of embodiment of the present utility model;
Fig. 3 is the structural representation of a kind of embodiment of ceramic substrate of the present utility model.
Description of reference numerals:
3-ceramic substrate, 31-is withstand voltage ceramic layer, 32-porous ceramic layer, 33-luminescent ceramic layer; 4-lead unit, 41-conductive layer, 411-treats welding zone, 412-conduction region, 42-protective layer, and 43-helps layer, 44-insulating barrier; 5-conductive through hole, electroconductive cured piece of 6-.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
As shown in Figures 1 to 3, it illustrates embodiment of the present utility model, as shown in the figure, a kind of double-sided ceramic circuit board of the utility model, comprise the ceramic substrate 3 be made up of ceramic material, ceramic substrate upper and lower surface is coating one deck conductive unit 4 respectively, and this conductive unit comprises several and is indirectly coated on this ceramic base plate surface and forms a predetermining circuit distribution patterns and the conductive layer 41 of electronic component electrical connection;
As shown in the figure, described conductive unit also comprises several and is coated on protective layer 42 on conductive layer; On protective layer, coating one deck helps layer 43; Described conductive layer has respectively at least onely treats welding zone 411 in order to what be electrically connected with electronic component, and at least onely treats with this conduction region 412 that welding zone is electrically connected, protective layer and help layer sequentially stacking being coated on treat on welding zone and conduction region; Described conductive unit also comprises several and is coated on and helps layer and relative to the insulating barrier 44 above the conduction region of conductive layer;
As shown in the figure, described ceramic substrate comprises withstand voltage ceramic layer 31, and withstand voltage ceramic layer upper and lower surface is disposed with porous ceramic layer 32 and luminescent ceramic layer 33; Described conductive unit is arranged in described luminescent ceramic layer;
As shown in the figure, described ceramic substrate and conductive unit offer pass through aperture by laser drilling device, and this through hole is conductive through hole 5; Electroconductive cured piece 6 of the basic upper conductive unit of conducting pottery and underlying conductive unit is provided with in conductive through hole; Described electroconductive cured piece is silver slurry cured block or copper slurry cured block; Dope layer is provided with outside described conductive through hole.
Preferably, as shown in the figure, luminescent ceramic layer comprises annular current limliting block and is filled in the fluorescent adhesive layer in annular current limliting block; Described annular current limliting block is the annular current limliting block made with blue glue; So come, the fluorescing fractions of luminescent ceramic layer is arranged can be spacing reliably, accurately puts glue, prevent fluorescent glue from flowing to beyond the position of setting.
Preferably, as shown in the figure, described insulating barrier is the nanometer glaze layer of electrical insulating property.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from the utility model aim.
Do not depart from design of the present utility model and scope can make many other and change and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.
Claims (3)
1. a double-sided ceramic circuit board, it is characterized in that: comprise the ceramic substrate be made up of ceramic material, ceramic substrate upper and lower surface is coating one deck conductive unit respectively, and this conductive unit comprises several and is indirectly coated on this ceramic base plate surface and forms a predetermining circuit distribution patterns and the conductive layer of electronic component electrical connection;
Described conductive unit also comprises several and is coated on protective layer on conductive layer; On protective layer, coating one deck helps layer; Described conductive layer has respectively at least onely treats welding zone in order to what be electrically connected with electronic component, and at least onely treats with this conduction region that welding zone is electrically connected, protective layer and help layer sequentially stacking being coated on treat on welding zone and conduction region; Described conductive unit also comprises several and is coated on and helps layer and relative to the insulating barrier above the conduction region of conductive layer;
Described ceramic substrate comprises withstand voltage ceramic layer, and withstand voltage ceramic layer upper and lower surface is disposed with porous ceramic layer and luminescent ceramic layer; Described conductive unit is arranged in described luminescent ceramic layer;
Described ceramic substrate and conductive unit offer pass through aperture by laser drilling device, and this through hole is conductive through hole; Electroconductive cured piece of the basic upper conductive unit of conducting pottery and underlying conductive unit is provided with in conductive through hole; Described electroconductive cured piece is silver slurry cured block or copper slurry cured block; Dope layer is provided with outside described conductive through hole.
2. a kind of double-sided ceramic circuit board as claimed in claim 1, is characterized in that: luminescent ceramic layer comprises annular current limliting block and is filled in the fluorescent adhesive layer in annular current limliting block; Described annular current limliting block is the annular current limliting block made with blue glue.
3. a kind of double-sided ceramic circuit board as claimed in claim 1, is characterized in that: described insulating barrier is the nanometer glaze layer of electrical insulating property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520301811.5U CN204721709U (en) | 2015-05-07 | 2015-05-07 | A kind of double-sided ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520301811.5U CN204721709U (en) | 2015-05-07 | 2015-05-07 | A kind of double-sided ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204721709U true CN204721709U (en) | 2015-10-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520301811.5U Expired - Fee Related CN204721709U (en) | 2015-05-07 | 2015-05-07 | A kind of double-sided ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204721709U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108546160A (en) * | 2018-06-15 | 2018-09-18 | 北京梦之墨科技有限公司 | A kind of ceramic base circuit and preparation method thereof |
-
2015
- 2015-05-07 CN CN201520301811.5U patent/CN204721709U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108546160A (en) * | 2018-06-15 | 2018-09-18 | 北京梦之墨科技有限公司 | A kind of ceramic base circuit and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20180507 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |