CN204144252U - The sub-LED light emission device of integration excess - Google Patents
The sub-LED light emission device of integration excess Download PDFInfo
- Publication number
- CN204144252U CN204144252U CN201420475092.4U CN201420475092U CN204144252U CN 204144252 U CN204144252 U CN 204144252U CN 201420475092 U CN201420475092 U CN 201420475092U CN 204144252 U CN204144252 U CN 204144252U
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- Prior art keywords
- radiator
- light emission
- led light
- base plate
- emission device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The utility model relates to the encapsulation technology of LED light emission device, discloses the sub-LED light emission device of a kind of integrated excess.In the sub-LED light emission device of integrated excess of the present utility model, radiator base plate is a part for radiator, double as the substrate of supporting chip and the radiator of heat conduction, owing to not needing to provide support in addition the substrate of chip and making it be connected with radiator, make that the heat conduction path of the chip be placed on this radiator base plate is the shortest, thermal resistance is little, material consumption optimization in production process, power consumption are lacked, and during production and assembly, technique is simple, production efficiency is high.
Description
Technical field
The utility model relates to the encapsulation technology of LED light emission device, particularly the sub-LED light emission device of integrated excess.
Background technology
Existing COB (chip on board, Chip On Board) substrate mainly contains two kinds:
1) metal substrate (as shown in Figure 1), with the metal that conductive coefficient is high, as fine copper, fine aluminium etc. do the base material of substrate 8 ', adhered thereto printed substrate (4 '+5 ').Isolated by insulating material 5 ' between the electric wiring 4 ' of printed substrate and metal substrate.LED (light-emitting diode, Light Emitting Diode) bonding of chip 1 ' use glue 3 ' is on metallic substrates, each chip chamber metal wire 2 ' bonding is electrically connected, and after connecting, the both positive and negative polarity of chip is connected with the output of LED drive power respectively by printed substrate (4 '+5 ').LED chip 1 ' is connected do heat conduction with metal substrate, and LED chip 1 ' is electrically connected by the output of printed substrate and LED drive power.As shown in Figure 1, also comprise fluorescent glue 6 ' and box dam 7 ', substrate 8 ' is connected with radiator 9 ' by heat-conducting glue 10 ' concrete structure;
2) ceramic substrate (as shown in Figure 2), with the non-conductive ceramic material that conductive coefficient is high, as aluminium nitride, aluminium oxide etc. do the base material of substrate 8 ', above sintering metal printed wire 4 '.LED chip 1 ' glue 3 ' is bonded on ceramic substrate, and each chip chamber plain conductor 2 ' bonding is electrically connected, and after connecting, the both positive and negative polarity of chip is connected with the output of LED drive power respectively by operplate printing circuit 4 '.LED chip 1 ' is connected do heat conduction with ceramic substrate, and LED chip 1 ' is electrically connected by the output of plain conductor 2 ' bonding printed wire 4 ' with LED drive power.As shown in Figure 2, similarly, also comprise fluorescent glue 6 ' and box dam 7 ', substrate 8 ' is connected with radiator 9 ' by heat-conducting glue 10 ' concrete structure.The effect of COB substrate is to provide LED chip and is fixed on substrate with certain arrangement, formed with substrate be mechanically connected, heating power is connected and is electrically connected.The substrate of the COB light source made, then connect with radiator 9 ' by the mode of screw, gummed or welding.
But inventor of the present utility model finds, said structure also exists following shortcoming:
1) for the LED bulb finally made, LED chip heat conduction path is long, and thermal resistance is large;
2) production process consumption material, power consumption is large;
3) production process has chemical corrosion and cleaning process, not environmentally;
4) LED light source cumbersome when the production and assembly of LED bulb, production efficiency is low.
Summary of the invention
The purpose of this utility model is to provide a kind of integrated excess sub-LED light emission device, has the shortest chip heat conduction path, power consumption less and structure is simple, production efficiency is high.
For solving the problems of the technologies described above, execution mode of the present utility model discloses the sub-LED light emission device of a kind of integrated excess, and this LED light emission device comprises chip 1, conducting wire 4, insulating barrier 5 and radiator base plate 8;
Chip 1 is placed in the surface of radiator base plate 8, and radiator base plate 8 is a part for radiator and is made up of Heat Conduction Material, and radiator base plate 8 doubles as the substrate of supporting chip and the radiator of heat conduction;
Insulating barrier 5 is provided with between conducting wire 4 and radiator base plate 8;
The both positive and negative polarity of chip 1 is connected with the output of driving power respectively by conducting wire 4.
Compared with prior art, the main distinction and effect thereof are the utility model execution mode:
In the sub-LED light emission device of integrated excess of the present utility model, radiator base plate is a part for radiator, double as the substrate of supporting chip and the radiator of heat conduction, owing to not needing to provide support in addition the substrate of chip and making it be connected with radiator, make that the heat conduction path of the chip be placed on this radiator base plate is the shortest, thermal resistance is little, material consumption optimization in production process, power consumption are lacked, and during production and assembly, technique is simple, production efficiency is high.
Further, select type and the material of radiator base plate as required, while realizing optimum radiating effect, go in various forms of radiator, flexibly and easily.
Further, the position needing to arrange conducting wire by the method for printing or spray at radiator base plate forms insulating barrier, does not need in process of production to carry out chemical corrosion and cleaning, clean environment firendly.
Further, the position needing to arrange conducting wire at radiator base plate forms conducting wire by the metal forming after shaping is engaged in insulating barrier, does not need in process of production to carry out chemical corrosion and cleaning, clean environment firendly.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED light emission device of existing employing metal substrate.
Fig. 2 is the structural representation of the LED light emission device of existing employing ceramic substrate.
Fig. 3 is the structural representation of the sub-LED light emission device of a kind of integrated excess in the utility model first execution mode, and wherein the remainder of radiator base plate and radiator is integrated.
Fig. 4 is the structural representation of the sub-LED light emission device of a kind of integrated excess in the utility model first execution mode.Wherein the remainder of radiator base plate and radiator is assembled and is formed this radiator.
Embodiment
In the following description, many ins and outs are proposed in order to make reader understand the application better.But, persons of ordinary skill in the art may appreciate that even without these ins and outs with based on the many variations of following execution mode and amendment, also can realize each claim of the application technical scheme required for protection.
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, execution mode of the present utility model is described in further detail.
The utility model first execution mode relates to the sub-LED light emission device of a kind of integrated excess.Fig. 3 is the structural representation of the sub-LED light emission device of this integrated excess.The sub-LED light emission device of this integrated excess comprises chip 1, conducting wire 4, insulating barrier 5 and radiator base plate 8.
As shown in Figure 3, chip 1 is placed in the surface of radiator base plate 8, and radiator base plate 8 is a part for radiator and is made up of Heat Conduction Material, and radiator base plate 8 doubles as the substrate (i.e. LEDCOB substrate) of supporting chip and the radiator of heat conduction.
Be appreciated that in each execution mode of the present utility model, radiator base plate 8 can be integrated with the remainder 9 of radiator, as shown in Figure 3; Radiator base plate 8 also can be assembled with the remainder 9 of radiator and form this radiator, as shown in Figure 4.
In addition, be appreciated that the material of radiator base plate 8 can be identical with the material of the remainder 9 of radiator, also can not be identical.Preferably, in the present embodiment, the base material of radiator base plate 8 by the high metal of conductive coefficient, as the formation such as fine copper, fine aluminium.
Select type and the material of radiator base plate as required, while realizing optimum radiating effect, go in various forms of radiator, flexibly and easily.
This radiator base plate 8 makes conducting wire 4, between conducting wire 4 and radiator base plate 8, is provided with the insulating barrier 5 that insulating material is formed.
Preferably, in the present embodiment, insulating barrier 5 is formed by printing or being sprayed on radiator base plate 8.Be appreciated that insulating barrier 5 also can be formed by other modes such as photoetching in other execution modes of the present utility model.
The position needing to arrange conducting wire by the method for printing or spray at radiator base plate forms insulating barrier, does not need in process of production to carry out chemical corrosion and cleaning, clean environment firendly.
Alternatively, conducting wire 4 can be formed by the metal forming after shaping being engaged on insulating barrier 5, or conducting wire 4 and insulating barrier 5 can be bonded on radiator base plate 8 with printed substrate form.
The position needing to arrange conducting wire at radiator base plate forms conducting wire by the metal forming after shaping is engaged in insulating barrier, does not need in process of production to carry out chemical corrosion and cleaning, clean environment firendly.
The both positive and negative polarity of chip 1 is connected respectively by the output of conducting wire 4 with driving power (not shown).
Preferably, in the present embodiment, LED light emission device comprises multiple chip 1, and multiple chip 1 is electrically connected to each other by metal wire 2 bonding, and the both positive and negative polarity of the multiple chips 1 after connection is electrically connected to be connected with the output of driving power with conducting wire 4 respectively by metal wire 2 bonding.Be appreciated that in the various embodiments of the utility model, by after multiple chip-in series, a pair both positive and negative polarity can be drawn, also by after multiple chip parallel connection, multipair both positive and negative polarity can be drawn.Be not limited to the structure shown in Fig. 3 or Fig. 4.
In addition, be appreciated that in other execution modes of the present utility model, multiple chip also can be electrically connected by other modes such as flip chip bonding, ball bonding, is not limited to above-mentioned wire bond and connects.
Preferably, in the present embodiment, chip 1 is bonded on radiator base plate 8 by adhesive 3.
In addition, be appreciated that in other execution modes of the present utility model, also can chip be placed on radiator base plate by other modes such as welding material welding, sintering, be not limited to above-mentioned adhesive bonding.
In the sub-LED light emission device of integrated excess of present embodiment, radiator base plate is a part for radiator, double as the substrate of supporting chip and the radiator of heat conduction, owing to not needing to provide support in addition the substrate of chip and making it be connected with radiator, make that the heat conduction path of chip placed on it is the shortest, thermal resistance is little, material consumption optimization in production process, power consumption are lacked, and during production and assembly, technique is simple, production efficiency is high.
In addition, preferably, the sub-LED light emission device of this integrated excess can also comprise box dam 7 and fluorescent glue 6.
As shown in Figure 3 or Figure 4, be provided with box dam 7 in chip 1 surrounding, fluorescent glue 6 to be filled in box dam 7 and to cover chip 1.
Conducting wire 4 outer to be connected with the output of driving power at box dam 7 at least partially.
Be appreciated that in other execution modes of the present utility model, also can not establish box dam.
In addition, be appreciated that in other execution modes of the present utility model, the other materials such as silica gel also can be used to cover chip, be not limited to above-mentioned fluorescent glue.
To sum up, the sub-LED light emission device of integrated excess of the present utility model has following advantage:
1) for the LED bulb finally made, form the shortest LED chip heat conduction path, thermal resistance is little;
2) production process material consumption optimization, power consumption is few;
3) be clean environment firendly production process, there is no chemical corrosion and cleaning process;
4) LED light source technique when the production and assembly of LED bulb is simple, and production efficiency is high.
Although by referring to some preferred implementation of the present utility model, the utility model illustrated and describe, but those of ordinary skill in the art should be understood that and can do various change to it in the form and details, and does not depart from spirit and scope of the present utility model.
Claims (9)
1. the sub-LED light emission device of integrated excess, is characterized in that, this LED light emission device comprises chip (1), conducting wire (4), insulating barrier (5) and radiator base plate (8);
Described chip (1) is placed in the surface of described radiator base plate (8), the part that described radiator base plate (8) is radiator and being made up of Heat Conduction Material, described radiator base plate (8) doubles as the substrate of supporting chip and the radiator of heat conduction;
Described insulating barrier (5) is provided with between described conducting wire (4) and described radiator base plate (8);
The both positive and negative polarity of described chip (1) is connected with the output of driving power respectively by described conducting wire (4).
2. the sub-LED light emission device of integrated excess according to claim 1, is characterized in that, described radiator base plate (8) is integrated with the remainder (9) of radiator; Or
Described radiator base plate (8) is assembled with the remainder (9) of radiator and is formed this radiator.
3. the sub-LED light emission device of integrated excess according to claim 1, is characterized in that, the material of described radiator base plate (8) is identical with the material of the remainder (9) of radiator; Or
The material of described radiator base plate (8) is different from the material of the remainder (9) of this radiator.
4. the sub-LED light emission device of integrated excess according to claim 3, is characterized in that, described Heat Conduction Material is copper or aluminium.
5. the sub-LED light emission device of integrated excess according to claim 1, is characterized in that, described LED light emission device comprises multiple described chip (1);
Multiple described chip (1) is electrically connected to each other by metal wire (2) bonding;
The both positive and negative polarity of the multiple described chip (1) after connection is electrically connected to be connected with the output of driving power with described conducting wire (4) respectively by metal wire (2) bonding.
6. the sub-LED light emission device of integrated excess according to claim 1, it is characterized in that, described chip (1) is by adhesive (3) bonding or be welded on described radiator base plate (8) by welding material (3).
7. the sub-LED light emission device of integrated excess according to claim 1, is characterized in that, described insulating barrier (5) is by printing or being sprayed on the upper formation of described radiator base plate (8).
8. the sub-LED light emission device of integrated excess according to claim 1, is characterized in that, described conducting wire (4) described insulating barrier (5) is upper to be formed by the metal forming after shaping being engaged in; Or
Described conducting wire (4) and described insulating barrier (5) are bonded on described radiator base plate (8) with printed substrate form.
9. the sub-LED light emission device of integrated excess according to any one of claim 1 to 8, is characterized in that, described LED light emission device also comprises box dam (7) and fluorescent glue (6);
Be provided with described box dam (7) in described chip (1) surrounding, described fluorescent glue (6) to be filled in described box dam (7) and to cover described chip (1);
Described conducting wire (4) at least partially at described box dam (7) outward to be connected with the output of described driving power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420475092.4U CN204144252U (en) | 2014-08-21 | 2014-08-21 | The sub-LED light emission device of integration excess |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420475092.4U CN204144252U (en) | 2014-08-21 | 2014-08-21 | The sub-LED light emission device of integration excess |
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| Publication Number | Publication Date |
|---|---|
| CN204144252U true CN204144252U (en) | 2015-02-04 |
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| CN201420475092.4U Expired - Fee Related CN204144252U (en) | 2014-08-21 | 2014-08-21 | The sub-LED light emission device of integration excess |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355622A (en) * | 2014-08-21 | 2016-02-24 | 上海威廉照明电气有限公司 | Integrated super-quantum LED light-emitting device |
| CN106898680A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
| CN106898688A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
-
2014
- 2014-08-21 CN CN201420475092.4U patent/CN204144252U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355622A (en) * | 2014-08-21 | 2016-02-24 | 上海威廉照明电气有限公司 | Integrated super-quantum LED light-emitting device |
| CN106898680A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
| CN106898688A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20210821 |
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| CF01 | Termination of patent right due to non-payment of annual fee |