CN204227105U - A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source - Google Patents

A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source Download PDF

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Publication number
CN204227105U
CN204227105U CN201420649225.5U CN201420649225U CN204227105U CN 204227105 U CN204227105 U CN 204227105U CN 201420649225 U CN201420649225 U CN 201420649225U CN 204227105 U CN204227105 U CN 204227105U
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China
Prior art keywords
flat
optical source
led optical
plate led
plate
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Expired - Fee Related
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CN201420649225.5U
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Chinese (zh)
Inventor
柳尧铭
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NINGBO BRIGHT LIGHTING Co Ltd
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NINGBO BRIGHT LIGHTING Co Ltd
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Priority to CN201420649225.5U priority Critical patent/CN204227105U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

Flat-plate LED optical source and use the light fixture of this flat-plate LED optical source to comprise a radiator structure, a flat-plate LED optical source, and for the heat-conducting glue of bonding radiator structure and flat-plate LED optical source.Described flat-plate LED optical source comprises an insulated substrate, at least one LED chip, two inner pins, and covers the phosphor powder layer on described LED chip and inner pin.Because described flat-plate LED optical source comprises the insulated substrate that has circuit, at least one is arranged on the LED chip on described insulated substrate, two are arranged on described insulated substrate and inner pin spaced with LED chip, make in the successive process of this flat-plate LED optical source as comparatively simple in assembling.

Description

A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source
Technical field
The utility model relates to a kind of fixture, particularly relates to a kind of flat-plate LED optical source and uses the light fixture of this flat-plate LED optical source.
Background technology
Usual light emitting diode (LED:light emitting diode, hereinafter referred to as LED) as one circulating current in semiconductor pn ties, thus send the diode of light, GaAs (GaAs) is used as ultrared light emitting diode, arsenic gallium aluminium (GaAIAs) is the light emitting diode being used as infrared ray or ruddiness, gallium arsenide phosphide (GaAsP) is used as redness, orange, or the light emitting diode of yellow, gallium phosphide (GaP) is used as redness, green or yellow light emitting diode, gallium nitride (GaN) is white light-emitting diode, it is by terres rares chromium substance, thulium, the fluorophor that terbium is used as active ions mixes, thus send white light.
Luminescence chip is normally arranged on aluminium base by traditional LED flat plate light source, then by fixing on circuit boards by modes such as Reflow Solderings for the aluminium base being provided with chip, this circuit board is provided with the circuit be electrically connected with luminescence chip.Above-mentioned LED flat plate light source is due to techniques such as needs Reflow Solderings, and complicated process of preparation, cost is higher.And along with LED flat plate light source use more and more, LED flat plate light source prepare the focus that convenience becomes people.
Utility model content
In view of this, the utility model provides a kind of flat-plate LED optical source and uses the light fixture of this flat-plate LED optical source, to meet the demand.
A kind of flat-plate LED optical source comprises the insulated substrate that has circuit, at least one is arranged on the LED chip on described insulated substrate, two are arranged on described insulated substrate and inner pin spaced with LED chip, and cover the phosphor powder layer on described LED chip and inner pin.Described two inner pins and described LED chip are electrically connected.
Use the light fixture of described flat-plate LED optical source to comprise a radiator structure, one is arranged on the above-mentioned flat-plate LED optical source on described radiator structure, and for the heat-conducting glue of bonding described radiator structure and flat-plate LED optical source.
Compared with prior art, because described flat-plate LED optical source comprises the insulated substrate that has circuit, at least one is arranged on the LED chip on described insulated substrate, two are arranged on described insulated substrate and inner pin spaced with LED chip, make in the successive process of this flat-plate LED optical source as comparatively simple in assembling.And compared to traditional flat-plate light source, the circuit of flat-plate LED optical source of the present utility model and LED chip can be set directly in dielectric base, realize the object dispelling the heat and arrange circuit by dielectric base simultaneously, without the need to arranging Heat Conduction Material and wiring board separately again, structure is more simple, and technique is also more easy.
Be described further below with reference to the technique effect of accompanying drawing to design of the present utility model, concrete structure and generation, to understand the purpose of this utility model, characteristic sum effect fully.
Accompanying drawing explanation
Fig. 1 is the plane domain planning chart of a kind of flat-plate LED optical source that the utility model provides
Fig. 2 is the structural representation of the light fixture of the flat-plate LED optical source using Fig. 1.
Detailed description of the invention
As shown in Figures 1 and 2, be a kind of structural representation using the light fixture 100 of flat-plate LED optical source that the utility model provides.The light fixture 100 of described use flat-plate LED optical source comprises a radiator structure 10, and at least one is arranged on the flat-plate LED optical source 11 on described radiator structure 10, and for bonding the heat-conducting glue 12 of described radiator structure 10 and flat-plate LED optical source 11.Be understandable that, described light fixture 100 also comprises other some functional modules, and as lampshade, resistance, end cap etc., its technology known by art technology, does not repeat them here.It should be noted that, profile in fig. 2, it is formed along the AA broken line of Fig. 1.
Described radiator structure 10 is for arranging described flat-plate LED optical source 11, and the technology of described radiator structure 10 known by those skilled in the art, is not described in detail in this.
Described flat-plate LED optical source 11 comprises the insulated substrate 111 that has circuit, at least one is arranged on the LED chip 112 on described insulated substrate 111, two are arranged on described insulated substrate 111 and inner pin 113 spaced with LED chip 112, one deck covers described LED chip 112 and the phosphor powder layer 114 on inner pin 113, two to be arranged on described insulated substrate 111 and the external pin 115 be positioned at outside phosphor powder layer 114, one exposes to and connects pin 116 outside described phosphor powder layer 114, and one be electrically connected at described in connect the protective resistance 117 of drawing between outer pin 116 and external pin 115.
See also Fig. 1, unfilled region is insulated substrate 111.This insulated substrate 111 can be non-conductive ceramic substrate.Ceramic substrate refers to that Copper Foil is at high temperature bonded directly to the special process plate in aluminium oxide (Al2O3) or aluminium nitride (AlN) ceramic substrate surface (single or double).Made ultra-thin composite base plate has good electrical insulation performance, high thermal conduction characteristic, excellent solderability and high adhesive strength, and can produce various figure circuit as pcb board, has very large current capacity.
In FIG, the region being filled with black is completely described LED chip 112.Described LED chip 112 is made up of multi-lager semiconductor material, and it is also the core component of LED, i.e. PN junction, and its major function is luminous energy by electric energy conversion, and the main material of chip is monocrystalline silicon.Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and the other end is N-type semiconductor.When electric current acts on this PN junction by wire, the electronics of N-type semiconductor will push P-type semiconductor to, and electronics and hole-recombination in P district, then will send luminous energy with form of photons.In the present embodiment, the semi-conducting material that described PN junction is used is gallium nitride (GaN).Described LED chip 112 can be one, also can be multiple.In the present embodiment, described LED chip 112 is four.
In FIG, be filled with horizon angle be the hatched region of 135 degree is inner pin 113.This inner pin 113 is electrically connected with LED chip 112, inputs electric energy to give described LED chip 112.This inner pin 113 can be made up of metals such as silver.It can be arranged on two angles, to save space.Described inner pin 113 is respectively arranged with a weld zone, being namely filled with horizon angle is the hatched area of 10 degree.This weld zone is for being welded to connect the wire of this inner pin 113 and LED chip 112.
In FIG, be filled with horizon angle be the hatched region of 45 degree is phosphor powder layer 114.Fluorescent material is that object is stimulated and absorbs energy and transit to excitation state (non-steady state) and turn back in the process of ground state a kind of material of releasing energy in the form of light again.The kind of fluorescent material is different, then can the light of luminous different colours.In the present embodiment, on blue LED die 112, coating can by blue-light excited yellow fluorescent powder, and the blue light that LED chip 112 sends and the gold-tinted that phosphor powder layer 114 sends complementation form white light.Therefore described flat-plate LED optical source 11 is white LED light source.Described phosphor powder layer 114 is square, thus whole flat-plate LED optical source 11 is square.
In FIG, be filled with horizon angle be the hatched region of 90 degree is external pin 115.This external pin 115 is electrically connected with inner pin 113, and is electrically connected respectively one to one with two inner pins 113.This external pin 115 is arranged on insulated substrate 111, and its material also can be the materials such as silver.Its end is rounded, is beneficial to welding lead.
In FIG, be filled with horizon angle is that the hatched area of 165 degree is for connecing pin 116.This connects pin 116 is arrange to arrange described protective resistance 117.This connects pin 116 can be the part that inner pin 113 extends phosphor powder layer 114.
Described protective resistance 117 can be positive temperature coefficient thermistor, and namely it is to responsive to temperature, shows different resistance values at different temperature.This protective resistance 117 resistance value when temperature is higher is larger, thus the electric current of supply LED chip 112 is less, and then makes LED chip 112 send less heat, reaches the object of protection LED chip 112.
Described flat-plate LED optical source 11 also comprises one deck and is coated in packaging plastic 118 on described phosphor powder layer 114.Be made up from packaging plastic 118 of transparent material, it can make various shape, as taper shape, thus reaches the object of light being carried out to luminous intensity distribution.
Described heat-conducting glue 12 is for bonding described flat-plate LED optical source 11 and radiator structure 10.Heat-conducting glue, also known as heat conductive silica gel.Be based on organic silica gel, add the macromolecular material such as inserts, Heat Conduction Material, mixing silica gel, has good heat conduction, electrical insulation capability.
Compared with prior art, because described flat-plate LED optical source 11 comprises an insulated substrate 111, at least one is arranged on the LED chip 112 on described insulated substrate 111, two are arranged on described insulated substrate 111 and inner pin 113 spaced with LED chip 112, make in the successive process of this flat-plate LED optical source 11 as comparatively simple in assembling.And compared to traditional flat-plate light source, the circuit of flat-plate LED optical source of the present utility model and LED chip can be set directly in dielectric base, realize the object dispelling the heat and arrange circuit by dielectric base simultaneously, without the need to arranging Heat Conduction Material separately again and circuit board structure is more simple, technique is also more easy.
More than describe preferred embodiment of the present utility model in detail.Should be appreciated that the ordinary skill of this area just can make many modifications and variations according to design of the present utility model without the need to creative work.Therefore, in all technical fields, technical staff complies with by the available technical scheme of logical analysis, reasoning, or a limited experiment on design of the present utility model, prior art basis, all should in claims of the present utility model.

Claims (10)

1. a flat-plate LED optical source, it is characterized in that: described flat-plate LED optical source comprises the insulated substrate that has circuit, at least one is arranged on the LED chip on described insulated substrate, two are arranged on described insulated substrate and inner pin spaced with LED chip, and the phosphor powder layer covered on described LED chip and inner pin, described two inner pins and described LED chip are electrically connected.
2. flat-plate LED optical source as claimed in claim 1, is characterized in that: described insulated substrate is the non-conductive ceramic substrate with circuit.
3. flat-plate LED optical source as claimed in claim 1, it is characterized in that: described flat-plate light source also comprises two external pins be arranged on described insulated substrate sidewall, described two external pins and two inner pins are electrically connected one to one respectively.
4. flat-plate LED optical source as claimed in claim 1, is characterized in that: described flat-plate LED optical source also comprises one deck and is coated in packaging plastic on described phosphor powder layer.
5. flat-plate LED optical source as claimed in claim 1, is characterized in that: described phosphor powder layer is square, circular or other shapes.
6. flat-plate LED optical source as claimed in claim 1, is characterized in that: described flat-plate LED optical source also comprises one and connects pin, and this connects pin and directly extracts from two inner pins.
7. flat-plate LED optical source as claimed in claim 6, is characterized in that: described flat-plate LED optical source also comprises two external pins be arranged on described insulated substrate sidewall, described in connect pin and an external pin is electrically connected.
8. flat-plate LED optical source as claimed in claim 7, is characterized in that: described flat-plate LED optical source also comprises a protective resistance, connects between pin and external pin described in this protective resistance is electrically connected at.
9. flat-plate LED optical source as claimed in claim 8, is characterized in that: described protective resistance is a thermistor.
10. one kind uses the light fixture of described flat-plate LED optical source, it is characterized in that: described light fixture comprises a radiator structure, one is arranged on flat-plate LED optical source as claimed in any one of claims 1-9 wherein on described radiator structure, and for the heat-conducting glue of bonding described radiator structure and flat-plate LED optical source.
CN201420649225.5U 2014-11-03 2014-11-03 A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source Expired - Fee Related CN204227105U (en)

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CN201420649225.5U CN204227105U (en) 2014-11-03 2014-11-03 A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source

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Application Number Priority Date Filing Date Title
CN201420649225.5U CN204227105U (en) 2014-11-03 2014-11-03 A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107975733A (en) * 2017-11-30 2018-05-01 东莞市闻誉实业有限公司 Air-cooled radiating device
CN107990212A (en) * 2017-11-30 2018-05-04 东莞市闻誉实业有限公司 Hang top pendent lamp
CN108019663A (en) * 2017-11-30 2018-05-11 东莞市闻誉实业有限公司 Plate type LED luminaire

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107975733A (en) * 2017-11-30 2018-05-01 东莞市闻誉实业有限公司 Air-cooled radiating device
CN107990212A (en) * 2017-11-30 2018-05-04 东莞市闻誉实业有限公司 Hang top pendent lamp
CN108019663A (en) * 2017-11-30 2018-05-11 东莞市闻誉实业有限公司 Plate type LED luminaire
CN107990212B (en) * 2017-11-30 2020-11-24 东莞市闻誉实业有限公司 Ceiling lamp
CN108019663B (en) * 2017-11-30 2020-11-24 东莞市闻誉实业有限公司 Plate type LED lamp
CN107975733B (en) * 2017-11-30 2020-11-24 东莞市闻誉实业有限公司 Air-cooled heat dissipation device

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150325

Termination date: 20171103