CN103528010A - LED photovoltaic module - Google Patents
LED photovoltaic module Download PDFInfo
- Publication number
- CN103528010A CN103528010A CN201310433204.XA CN201310433204A CN103528010A CN 103528010 A CN103528010 A CN 103528010A CN 201310433204 A CN201310433204 A CN 201310433204A CN 103528010 A CN103528010 A CN 103528010A
- Authority
- CN
- China
- Prior art keywords
- light source
- cob light
- led
- aluminium base
- ceramic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
- F21S9/037—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light the solar unit and the lighting unit being located within or on the same housing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED photovoltaic module which comprises an aluminum substrate, a first ceramic layer, a second ceramic layer, a COB light source, an insulation plate and a driving power supply. The aluminum substrate is provided with a first surface and a second surface opposite to the first surface, the first ceramic layer and the second ceramic layer are arranged on the first surface and the second surface of the aluminum substrate respectively and used for heat conduction, the COB light source is arranged on the first ceramic layer, and the insulation plate is arranged at the position of the COB light source and is embedded into the space between the first surface and the second surface of the aluminum substrate. Metalized through holes used for guiding the leads of the COB light source out to the second surface of the aluminum substrate are formed in the insulation plate. The driving power supply is arranged on the second surface of the aluminum substrate and is connected with the leads, guided out through the metalized through holes in the second surface of the aluminum substrate, of the COB light source to drive the COB light source. The driving power supply is an alternating-current driving power supply. The heat conduction is carried out through the ceramic layers, and the problem that in the prior art, LED lamps cannot be integrated due to the fact that the calorific value of a light supply and a driving power supply is too large is solved.
Description
Technical field
The present invention relates to LED lighting field, particularly relate to a kind of LED photoelectricity module.
Background technology
Light emitting diode (LED, Light-Emitting Diode) be the luminous semi-conductor electricity sub-element of a kind of energy, the diode of being made by gallium (Ga) and the compound of arsenic (AS), phosphorus (P), nitrogen (N), it is a kind of of semiconductor diode, electric energy conversion can be become to luminous energy.Light emitting diode is the same with general-purpose diode to be comprised of a PN junction, also has unilateral conduction.When adding that to light emitting diode He You N district, hole that forward voltage Hou，Cong P district is injected into N district is injected into the electronics in P district, near PN junction in several microns respectively with the electronics in N district and the hole-recombination in P district, produce the fluorescence of spontaneous radiation.In different semi-conducting materials, electronics is different with the residing energy state in hole.How much different the energy discharging when electronics and hole-recombination is, and the energy discharging is more, and the light wavelength of sending is shorter.Gallium arsenide phosphide diode glows, gallium phosphide diode green light, the blue light of gallium nitride diode.
In recent years, along with the develop rapidly of LED industry, LED lighting relies on himself power savings advantages on market, to occupy very large share.The bulb of LED, generally by three parts: LED light source, driving power and lamp housing form, wherein LED light source and driving power are to determine the performance of LED bulb and the principal element of price.Patent of the present invention is integrated into assembly-LED photoelectricity module by LED light source and driving power exactly, and its performance is improved, and cost declines.Due to designs simplification, be more suitable in production in enormous quantities.
Existing all LED light sources are all separated with driving power, and the reason one of doing is like this that the volume of driving power is larger, can not integrate with LED light source, the 2nd, light source and power supply itself be all the main body of heating.Visible, when high power and small size, heat radiation becomes impassable obstacle, and LED is under hot operation state, and its light decay accelerates and life characteristic will decline greatly.
Summary of the invention
The shortcoming of prior art, the object of the present invention is to provide a kind of LED photoelectricity module in view of the above, for solving in prior art LED lamp due to light source and the excessive and problem that cannot integrate of driving power caloric value.
For achieving the above object and other relevant objects, the invention provides a kind of LED photoelectricity module, comprising: the aluminium base with first surface and the second surface relative with described first surface; Be separately positioned on the first surface of aluminium base and second surface for the first ceramic layer and second ceramic layer of heat conduction; Be arranged on the COB light source on the first ceramic layer; Be arranged on described COB light source place and embed the first surface of described aluminium base and the insulation board between second surface; Described insulation board is provided with for the lead-in wire of COB light source being exported to the metallization via hole of the second surface of aluminium base; The lead-in wire of the COB light source that is arranged on the second surface of aluminium base and draws with the metallization via hole of second surface from aluminium base is connected with the driving power that COB light source is driven.
Preferably, described driving power is AC driven power.
Preferably, described driving power comprises the driving chip of internal or external MOSFET pipe and the peripheral circuit of this driving chip, and wherein said driving chip drives LED lamp respectively by the connection type of drive that the LED lamp in COB light source is divided into multistage.
Preferably, described driving power comprises a constant current drive source and peripheral circuit, and wherein said constant current drive source drives the LED lamp of series connection with the type of drive that is connected of the LED lamp series connection of some in COB light source.
Preferably, described the first ceramic layer forms be arranged on the first surface sintering of aluminium base by silk-screen or spraying coating process after; Described the second ceramic layer forms be arranged on the second surface sintering of aluminium base by silk-screen or spraying coating process after.
Preferably, on the first ceramic layer and the second ceramic layer, adopt silk screen printing process that silver slurry is pressed to default connection line, after solidifying, make the printed circuit being connected with described driving power for described COB light source.
Preferably, the thickness of described insulation board and the consistency of thickness of described aluminium base.
Preferably, described aluminium base is shaped as circle, ellipse or polygon.
Preferably, described COB light source is annular COB light source, bar shaped COB light source, circular COB light source or polygon COB light source.
Preferably, in described annular COB light source, be provided with equally distributed some LED, the quantity of described LED is 30～48 or 72～96.
Preferably, described aluminium base is provided with the installing hole that at least one joins photoelectricity module and heat abstractor or lamp outer casing.
As mentioned above, LED photoelectricity module of the present invention, has following beneficial effect:
1, LED photoelectricity module of the present invention leads on two surfaces at aluminium base coated ceramic slurry respectively, and used high thermal conductivity coefficient, after the ceramic material high temperature sintering of high withstand voltage (DC 4000V), form ceramic layer, afterwards COB light source and driving power are separately positioned on to two surfaces of aluminium base, the heat that COB light source and driving power produce can pass through respectively ceramic layer heat conduction to aluminium base, so the present invention can be so that COB light source and driving power be integrated, solved in prior art in LED lamp due to light source and the excessive and problem that cannot integrate of driving power caloric value.
2, in addition, in the present invention, use and exchange direct driving power, can solve the problem that power supply component number is few, volume is little of driving.
Accompanying drawing explanation
Fig. 1 is shown as the Facad structure schematic diagram of LED photoelectricity module of the present invention.
Fig. 2 is shown as the reverse side structural representation in LED photoelectricity module of the present invention.
Element numbers explanation
1 LED photoelectricity module
11 aluminium bases
12 COB light sources
13 first ceramic layers
14 insulation boards
141 metallization via holes
15 installing holes
16 driving powers
17 second ceramic layers
The specific embodiment
By particular specific embodiment explanation embodiments of the present invention, person skilled in the art scholar can understand other advantages of the present invention and effect easily by the disclosed content of this description below.
This specific embodiment relates to Fig. 1 to Fig. 2.Notice, appended graphic the illustrated structure of this description, ratio, size etc., equal contents in order to coordinate description to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the present invention, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under the effect that the present invention can produce and the object that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this description, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the present invention.
The object of the present invention is to provide a kind of LED photoelectricity module, for solving in prior art LED lamp due to light source and the excessive and problem that cannot integrate of driving power caloric value.By describing principle and the embodiment of a kind of LED photoelectricity module of the present invention in detail, make those skilled in the art not need creative work can understand a kind of LED photoelectricity module of the present invention below.
Refer to Fig. 1 and Fig. 2, Fig. 1 is shown as the Facad structure schematic diagram of LED photoelectricity module of the present invention, and Fig. 2 is shown as the reverse side structural representation in LED photoelectricity module of the present invention.As depicted in figs. 1 and 2, the invention provides a kind of LED photoelectricity module, particularly, described LED photoelectricity module 1 comprises: aluminium base 11, the first ceramic layer 13, the second ceramic layer 17, COB light source 12, insulation board 14 and driving power 16.
The present invention is by two surface difference coated ceramic slurries at aluminium base 11, after sintering, form ceramic layer, afterwards on the first ceramic layer and the second ceramic layer, adopt silk screen printing process that silver slurry is pressed to default connection line, after solidifying, make the printed circuit being connected with described driving power for described COB light source.Again COB light source 12 and driving power 16 are separately positioned on to two ceramic layer surfaces of aluminium base 11, the heat that COB light source 12 and driving power 16 produce can pass through respectively ceramic layer heat conduction, so the present invention can be so that COB light source 12 and driving power 16 be integrated.
Described aluminium base 11 is matrixes of whole LED photoelectricity module 1, the heat that COB light source 12 and driving power 16 send is conducted to aluminium base 11, then by aluminium base 11, is conducted to the heat-dissipating casing of bulb by the first ceramic layer 13, second ceramic layer 17 of high thermal conductivity coefficient.
In the present invention, described aluminium base 11 has first surface and the second surface relative with described first surface, particularly, the shape of described aluminium base 11 can be circle, ellipse or polygon, but be not limited to above-mentioned shape, those skilled in the art can according to the actual requirements, set the shape of described aluminium base 11.
In addition, in the present embodiment, described aluminium base 11 is provided with at least one installing hole 15.By installing hole 15, can described LED photoelectricity module 1 be joined with heat abstractor or lamp outer casing with screw or bolt.Particularly, in the present embodiment, described installing hole 15 is arranged on the edge of aluminium base 11, quantity be three or other arbitrarily.
The first ceramic layer 13 and the second ceramic layer 17 are separately positioned on the first surface of aluminium base 11 and second surface for heat conduction, and described the first ceramic layer 13 is arranged on the first surface of aluminium base 11 by techniques such as silk-screen or sprayings, then form through high temperature sintering; Described the second ceramic layer 17 is arranged on the second surface of aluminium base 11 by silk-screen or spraying, then forms through high temperature sintering.
That is to say, two surperficial coated ceramic layers at aluminium base 11, specifically can adopt and by technologies such as silk-screen, sprayings, paste ceramic size is coated in to first surface and the second surface of aluminium base 11, form the first ceramic layer 13 and the second ceramic layer 17 after sintering.On the first ceramic layer 13 and the second ceramic layer 17, adopt silk screen printing process that silver slurry is pressed to default connection line, after solidifying, make the printed circuit being connected with described driving power 16 for described COB light source 12.According to the electronic circuit of driving power 16 and COB light source 12 by conductive silver paste silk-screen on the first ceramic layer 13 and the second ceramic layer 17 surfaces, after solidifying, can carry out LED chip binding or element is processed with surface mounting technology.
In addition, in the present invention, the pottery that the first ceramic layer 13 and the second ceramic layer 17 adopt all should have high thermal conductivity coefficient, and thermal conductivity factor is greater than 30W/m/K and is advisable.
COB light source 12 is exactly that LED chip is directly attached to the integrated area source of high light efficiency on the mirror metal substrate of high reflecting rate, COB light source 12 has been rejected support concept, this technology electroless plating, without Reflow Soldering, without paster operation, so operation reduces closely 1/3rd, cost has also saved 1/3rd.
COB chip on board (Chip On Board, COB) first technical process is that insulation for the substrate surface, high pressure resistant and heat-conduction epoxy resin (the general epoxy resin with mixing silver-colored particle) cover silicon chip and lay a little, then silicon chip is directly placed in to substrate surface, till heat cure to silicon chip is securely fixed in substrate, by the method for spot welding, between Chip and substrate, Chip and Chip, directly set up electrical connection more subsequently.Bare chip technology mainly contains two kinds of forms: a kind of COB technology, another kind is flip chip technology (FlipChip).Chip on board encapsulation (COB), semiconductor chip handing-over is mounted on printed substrate, and the electrical connection of chip and substrate realizes with lead-in wire sewing method, and the electrical connection of chip and substrate realizes with lead-in wire sewing method, and covers to guarantee reliability with resin.
In the present invention, described COB light source 12 is arranged on the first ceramic layer 13.In the present embodiment, particularly, described COB light source 12 can be annular COB light source, bar shaped COB light source, circular COB light source or polygon COB light source, but is not limited to above-mentioned shape, those skilled in the art can according to the actual requirements, set the shape of described COB light source 12.
If adopt annular COB light source, in described annular COB light source, some LED are uniformly distributed, and closer, according to the Vf magnitude of voltage of operating voltage and LED, the quantity of described LED is 30～48 or 72～96.The diameter visual lamp power encircling in annular COB light source and LED quantity and determine.
Described insulation board 14 is arranged on described COB light source 12 places and embeds between the first surface and second surface of described aluminium base 11, and the consistency of thickness of the thickness of described insulation board 14 and described aluminium base 11, to arrange ceramic layer.Described insulation board 14 is provided with for the lead-in wire of COB light source 12 being exported to the metallization via hole 141 of the second surface of aluminium base 11.The function of described insulation board 14 is by the LED lead-out wire in the COB light source 12 of aluminium base 11 first surfaces (front), by " via hole " (being described metallization via hole 141), be directed at second surface (reverse side), receive the output that drives chip in driving power 16.Described insulation board 14 is pressed into aluminium base 11 with special technique, and this technology is necessary, and is well-known to those skilled in the art, to guarantee to meet the requirement of safety such as insulating, withstand voltage.
The lead-in wire of the COB light source 12 that described driving power 16 is arranged on the second surface of aluminium base 11 and draws with the metallization via hole 141 of second surface from aluminium base 11 is connected that COB light source 12 is driven.
In the present invention, described driving power 16 is AC driven power.In the present invention, use and exchange direct driving power, can solve the problem that power supply component number is few, volume is little of driving.Simultaneously just because of the number of elements of the circuit of interchange direct drive mode is few, reliability is high, performance good, just makes AC driven power can realize integral installation at the reverse side of LED photoelectricity module 1.During use, only need weld two lines, as power supply input, whole LED photoelectricity module 1 just can work.
Described AC power can adopt following several concrete form.
1, described driving power 16 can adopt the driving chip of built-in MOSFET pipe and the peripheral circuit of this driving chip, and wherein said driving chip drives LED lamp respectively by the connection type of drive that the LED lamp in COB light source 12 is divided into multistage.
The mode that adopts multistage to drive, driving built-in chip type MOSFET pipe, is divided into multistage by LED lamp string and drives, and the advantage of this multistage actuation techniques is that power factor is high, harmonic wave is little, peripheral circuit is simple, is easy to realize the functions such as light modulation.Due to internal high-voltage power-type MOSFET pipe, cost is higher.
2, described driving power 16 can also adopt the driving chip of external MOSFET pipe and the peripheral circuit of this driving chip, and wherein said driving chip drives LED lamp respectively by the connection type of drive that the LED lamp in COB light source 12 is divided into multistage.
The mode that adopts multistage to drive, driving the external MOSFET pipe of chip, drive circuit (digital circuit or digital-analog hybrid circuit) is separated with high-voltage MOSFET pipe, and because drive circuit is separated with high-voltage MOSFET pipe, the cost of chip declines greatly, but peripheral circuit part more (MOSFET pipe is external), its advantage is applying flexible, can be extended to high-power output (10W-50W), and when high-power applications, cost is low, has outstanding advantage.
3, described driving power 16 can adopt again a constant current drive source and peripheral circuit, and wherein said constant current drive source drives the LED lamp of series connection with the type of drive that is connected of the LED lamp series connection of some in COB light source 12.
The mode that adopts LED single hop, constant-current source to drive, depending on operating voltage, LED is connected with different quantity, access constant current chip, its advantage is that the part of peripheral circuit is minimum, cost is minimum, shortcoming is can not light modulation, and power factor is lower, harmonic wave is higher, and is only suitable for the occasion in little electric current, low-power applications.
In actual use, described driving power 16 includes but not limited to the driving power 16 of above-mentioned three kinds of forms, and those skilled in the art can, according to the pluses and minuses of each driving power 16 of actual conditions structure, determine specifically to select which kind of driving power 16.
In sum, LED photoelectricity module of the present invention, has reached following beneficial effect:
1, LED photoelectricity module of the present invention leads on two surfaces at aluminium base coated ceramic slurry respectively, and used high thermal conductivity coefficient, after the ceramic material high temperature sintering of high withstand voltage (DC 4000V), form ceramic coating, afterwards COB light source and driving power are separately positioned on to two surfaces of aluminium base, the heat that COB light source and driving power produce can pass through respectively ceramic layer heat conduction to aluminium base, so the present invention can be so that COB light source and driving power be integrated, solved in prior art in LED lamp due to light source and the excessive and problem that cannot integrate of driving power caloric value.
2, in addition, in the present invention, use and exchange direct driving power, can solve the problem that power supply component number is few, volume is little of driving.
So the present invention has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all can, under spirit of the present invention and category, modify or change above-described embodiment.Therefore, such as in affiliated technical field, have and conventionally know that the knowledgeable, not departing from all equivalence modifications that complete under disclosed spirit and technological thought or changing, must be contained by claim of the present invention.
Claims (11)
1. a LED photoelectricity module, is characterized in that, comprising:
The aluminium base with first surface and the second surface relative with described first surface;
Be separately positioned on the first surface of aluminium base and second surface for the first ceramic layer and second ceramic layer of heat conduction;
Be arranged on the COB light source on the first ceramic layer;
Be arranged on described COB light source place and embed the first surface of described aluminium base and the insulation board between second surface; Described insulation board is provided with for the lead-in wire of COB light source being exported to the metallization via hole of the second surface of aluminium base;
The lead-in wire of the COB light source that is arranged on the second surface of aluminium base and draws with the metallization via hole of second surface from aluminium base is connected with the driving power that COB light source is driven.
2. LED photoelectricity module according to claim 1, is characterized in that, described driving power is AC driven power.
3. LED photoelectricity module according to claim 1 and 2, it is characterized in that, described driving power comprises the driving chip of internal or external MOSFET pipe and the peripheral circuit of this driving chip, and wherein said driving chip drives LED lamp respectively by the connection type of drive that the LED lamp in COB light source is divided into multistage.
4. LED photoelectricity module according to claim 1 and 2, it is characterized in that, described driving power comprises a constant current drive source and peripheral circuit, and wherein said constant current drive source drives the LED lamp of series connection with the type of drive that is connected of the LED lamp series connection of some in COB light source.
5. LED photoelectricity module according to claim 1, is characterized in that, described the first ceramic layer forms be arranged on the first surface sintering of aluminium base by silk-screen or spraying coating process after; Described the second ceramic layer forms be arranged on the second surface sintering of aluminium base by silk-screen or spraying coating process after.
6. LED photoelectricity module according to claim 5, it is characterized in that, on the first ceramic layer and the second ceramic layer, adopt silk screen printing process that silver slurry is pressed to default connection line, after solidifying, make the printed circuit being connected with described driving power for described COB light source.
7. LED photoelectricity module according to claim 1, is characterized in that, the thickness of described insulation board and the consistency of thickness of described aluminium base.
8. LED photoelectricity module according to claim 1, is characterized in that, described aluminium base be shaped as circle, ellipse or polygon.
9. LED photoelectricity module according to claim 1, is characterized in that, described COB light source is annular COB light source, bar shaped COB light source, circular COB light source or polygon COB light source.
10. LED photoelectricity module according to claim 9, is characterized in that, in described annular COB light source, is provided with equally distributed some LED, and the quantity of described LED is 30～48 or 72～96.
11. LED photoelectricity modules according to claim 1, is characterized in that, described aluminium base is provided with at least one installing hole that photoelectricity module and heat abstractor or lamp outer casing are joined.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310433204.XA CN103528010A (en) | 2013-09-22 | 2013-09-22 | LED photovoltaic module |
| PCT/CN2013/090384 WO2015039399A1 (en) | 2013-09-22 | 2013-12-25 | Led photovoltaic module |
| DE212013000310.2U DE212013000310U1 (en) | 2013-09-22 | 2013-12-25 | LED photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310433204.XA CN103528010A (en) | 2013-09-22 | 2013-09-22 | LED photovoltaic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103528010A true CN103528010A (en) | 2014-01-22 |
Family
ID=49930236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310433204.XA Pending CN103528010A (en) | 2013-09-22 | 2013-09-22 | LED photovoltaic module |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103528010A (en) |
| DE (1) | DE212013000310U1 (en) |
| WO (1) | WO2015039399A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287258A (en) * | 2016-09-26 | 2017-01-04 | 苏州圣咏电子科技有限公司 | A kind of light emitting module and there is the light fixture of this light emitting module |
| WO2016184372A3 (en) * | 2015-05-19 | 2017-02-02 | 赵依军 | Led light source assembly, led photoelectric integration module, and led spotlight |
| CN112325212A (en) * | 2019-07-31 | 2021-02-05 | 嘉兴山蒲照明电器有限公司 | LED lamp |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110397854A (en) * | 2019-08-30 | 2019-11-01 | 周永旺 | A kind of LED light source mould group |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101387379A (en) * | 2007-09-14 | 2009-03-18 | 南京汉德森科技股份有限公司 | Plant growth lamp of high-efficiency high-power LED light source |
| CN201636587U (en) * | 2010-01-29 | 2010-11-17 | 上海亮硕光电子科技有限公司 | LED (Light Emitting Diode) embedded cylindrical lamp |
| US20110012161A1 (en) * | 2009-07-14 | 2011-01-20 | Hung Mien-Hsia | Manufacturing methods and installation procedures which conforming to the international safety codes and regulations for ac led lamp |
| CN202024208U (en) * | 2011-04-22 | 2011-11-02 | 常州华天福杰光电科技有限公司 | Light emitting diode (LED) street lamp |
| CN102395236A (en) * | 2011-11-30 | 2012-03-28 | 陈卫平 | LED (light-emitting diode) lamp panel adopting COB (Chip On Board) technology |
| CN202382046U (en) * | 2011-12-05 | 2012-08-15 | 陈卫平 | Lamp panel with special LED bare die arrangement structure |
| CN102795875A (en) * | 2012-07-11 | 2012-11-28 | 铜陵颐和泰新材料股份有限公司 | Preparation method of ceramic-aluminum-base copper clad plate |
| CN202930430U (en) * | 2012-09-07 | 2013-05-08 | 茂邦电子有限公司 | Heat radiation substrate having insulation heat radiation layer |
| CN202931664U (en) * | 2012-07-09 | 2013-05-08 | 苏州热驰光电科技有限公司 | Double-faced aluminium circuit board with ultrahigh heat conductivity |
| CN203104940U (en) * | 2012-12-30 | 2013-07-31 | 东莞市合通电子有限公司 | Inclined hole structure of aluminum substrate |
| CN203478079U (en) * | 2013-09-22 | 2014-03-12 | 上海俪德照明科技股份有限公司 | LED photoelectric module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201462526U (en) * | 2009-06-16 | 2010-05-12 | 刘兴贵 | Improved LED lamp |
| WO2012005771A2 (en) * | 2010-07-06 | 2012-01-12 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
| CN102287651A (en) * | 2011-08-11 | 2011-12-21 | 陞佳集团有限公司 | Light-emitting diode (LED) fluorescent lamp tube with ceramic carrier plate |
| CN202308039U (en) * | 2011-10-14 | 2012-07-04 | 格瑞电子（厦门）有限公司 | Novel aluminum base plate |
| CN103104828A (en) * | 2011-11-11 | 2013-05-15 | 赵依军 | Light emitting diode (LED) lamp wick and lighting device with LED as light source |
-
2013
- 2013-09-22 CN CN201310433204.XA patent/CN103528010A/en active Pending
- 2013-12-25 DE DE212013000310.2U patent/DE212013000310U1/en not_active Expired - Lifetime
- 2013-12-25 WO PCT/CN2013/090384 patent/WO2015039399A1/en active Application Filing
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101387379A (en) * | 2007-09-14 | 2009-03-18 | 南京汉德森科技股份有限公司 | Plant growth lamp of high-efficiency high-power LED light source |
| US20110012161A1 (en) * | 2009-07-14 | 2011-01-20 | Hung Mien-Hsia | Manufacturing methods and installation procedures which conforming to the international safety codes and regulations for ac led lamp |
| CN201636587U (en) * | 2010-01-29 | 2010-11-17 | 上海亮硕光电子科技有限公司 | LED (Light Emitting Diode) embedded cylindrical lamp |
| CN202024208U (en) * | 2011-04-22 | 2011-11-02 | 常州华天福杰光电科技有限公司 | Light emitting diode (LED) street lamp |
| CN102395236A (en) * | 2011-11-30 | 2012-03-28 | 陈卫平 | LED (light-emitting diode) lamp panel adopting COB (Chip On Board) technology |
| CN202382046U (en) * | 2011-12-05 | 2012-08-15 | 陈卫平 | Lamp panel with special LED bare die arrangement structure |
| CN202931664U (en) * | 2012-07-09 | 2013-05-08 | 苏州热驰光电科技有限公司 | Double-faced aluminium circuit board with ultrahigh heat conductivity |
| CN102795875A (en) * | 2012-07-11 | 2012-11-28 | 铜陵颐和泰新材料股份有限公司 | Preparation method of ceramic-aluminum-base copper clad plate |
| CN202930430U (en) * | 2012-09-07 | 2013-05-08 | 茂邦电子有限公司 | Heat radiation substrate having insulation heat radiation layer |
| CN203104940U (en) * | 2012-12-30 | 2013-07-31 | 东莞市合通电子有限公司 | Inclined hole structure of aluminum substrate |
| CN203478079U (en) * | 2013-09-22 | 2014-03-12 | 上海俪德照明科技股份有限公司 | LED photoelectric module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016184372A3 (en) * | 2015-05-19 | 2017-02-02 | 赵依军 | Led light source assembly, led photoelectric integration module, and led spotlight |
| CN106287258A (en) * | 2016-09-26 | 2017-01-04 | 苏州圣咏电子科技有限公司 | A kind of light emitting module and there is the light fixture of this light emitting module |
| CN112325212A (en) * | 2019-07-31 | 2021-02-05 | 嘉兴山蒲照明电器有限公司 | LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| DE212013000310U1 (en) | 2016-04-25 |
| WO2015039399A1 (en) | 2015-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102606904B (en) | Comprise the lighting apparatus of light-emitting device | |
| CN100468795C (en) | Semiconductor illuminator integrated heat conducting/radiating moudule | |
| CN102437148A (en) | LED (light emitting diode) two-dimensional array light source with flexible circuit substrate | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| JP2014078686A (en) | Light emitting device and manufacturing method of the same | |
| CN103104828A (en) | Light emitting diode (LED) lamp wick and lighting device with LED as light source | |
| CN103528010A (en) | LED photovoltaic module | |
| CN202469553U (en) | LED two-dimensional array light source having flexible circuit board | |
| CN203478079U (en) | LED photoelectric module | |
| CN103367346A (en) | Novel high-power LED light source and implementation method thereof | |
| CN202712175U (en) | Fluorescent film planar sheet type LED array light source | |
| CN103470968A (en) | Light emitting diode lamp core with large light emitting angle and illumination device with lamp core | |
| CN204227105U (en) | A kind of flat-plate LED optical source and use the light fixture of this flat-plate LED optical source | |
| CN107068845A (en) | Modular, semiconductor structure and light fixture | |
| CN202473912U (en) | LED array light source without circuit substrate | |
| CN201853745U (en) | High-power light emitting diode (LED) ceramic heat sink | |
| CN105299500A (en) | Light emitting diode (LED) lighting device used for providing directional light beam | |
| CN2901016Y (en) | Light emitting unit of LED | |
| CN204240090U (en) | For providing the LED light device of directional beam | |
| CN203413588U (en) | LED (Light Emitting Diode) light source board assembly, LED lamp wick and LED lighting device | |
| CN206619611U (en) | A kind of bare crystalline encapsulates light engine | |
| CN208422957U (en) | A kind of integrated LED multi-chip three-dimension packaging light source | |
| KR20130114870A (en) | Led lighting module | |
| TW201244056A (en) | Light emitting diode module package structure | |
| CN206864499U (en) | Modular, semiconductor structure and light fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140122 |
|
| WD01 | Invention patent application deemed withdrawn after publication |