CN206619611U - A kind of bare crystalline encapsulates light engine - Google Patents
A kind of bare crystalline encapsulates light engine Download PDFInfo
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- CN206619611U CN206619611U CN201720421643.2U CN201720421643U CN206619611U CN 206619611 U CN206619611 U CN 206619611U CN 201720421643 U CN201720421643 U CN 201720421643U CN 206619611 U CN206619611 U CN 206619611U
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- bare crystalline
- substrate
- light engine
- constant current
- rectifier bridge
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Abstract
Light engine is encapsulated the utility model discloses a kind of bare crystalline, including substrate (1), drive circuit and multiple bare crystalline LED chips (3), drive circuit includes rectifier bridge (21) and constant current chip (22), rectifier bridge (21) and constant current chip (22) are fixed on substrate (1) in bare crystalline form by crystal-bonding adhesive, and multiple LED chips (3) are arranged on substrate (1) around drive circuit.The utility model uses the rectifier bridge and constant current chip of bare crystalline form, small with substrate space is occupied, and is difficult extinction, the advantages of improving production efficiency and increase the service life.
Description
Technical field
The utility model belongs to technical field of LED illumination, more particularly to a kind of bare crystalline encapsulation light engine.
Background technology
LED light engine i.e. comprising LED potted elements or LED array (module), LED driver and other luminosity, calorifics,
The both mechanically and electrically integrated-type light source of component.Branch can be directly connected to by the ordinary connector matched with LED lamp
On circuit.The stability of LED indoor light fixture can be effectively improved, each performance parameter is improved, thus obtained extensively in field of LED illumination
General application and attention.The research and development time of light fixture can be simplified using light engine, the installation time for reducing light fixture can there is provided system
By property.
But traditional light engine arrangement is all to use plastic packaging patch form, internal electronic element volume is big, occupies
Substrate space is big；And the rectifier bridge of traditional plastic packaging patch form and constant current chip surface are the easy extinction of black, influence light extraction
Efficiency and radiating.In addition, in manufacture craft, the light engine (DOB) of conventionally employed SMD electronic component, COB encapsulation systems
Make and electronic component (SMT) needs substep to carry out, influence production efficiency.Therefore, it is necessary to provide, one kind is easy to assembly, be difficult to inhale
Light, space availability ratio is high, the light engine arrangement of good heat dissipation.
Utility model content
The technological deficiency existed for prior art, the purpose of this utility model is to provide a kind of bare crystalline encapsulation light engine,
Including substrate 1, drive circuit and multiple bare crystalline LED chips 3, the drive circuit includes rectifier bridge 21 and constant current chip 22,
The rectifier bridge 21 and the constant current chip 22 are fixed on the substrate 1 in bare crystalline form by crystal-bonding adhesive, multiple described
Bare crystalline LED chip 3 is arranged on the substrate 1 around the drive circuit.
Preferably, the rectifier bridge 21, the constant current chip 22 and multiple LED chips 3 are connected in series.
Preferably, multiple surfaces of bare crystalline LED chip 3 are coated with fluorescent adhesive layer.
Preferably, the crystal-bonding adhesive includes any one in following material：
Silicones；
Epoxy resin；Or
Polyimide resin.
Preferably, the substrate 1 is aluminium base or ceramic substrate.
Preferably, the substrate 1 is shaped as circle, the multiple circular arrays of bare crystalline LED chip 3 arrangements.
The utility model uses the rectifier bridge and constant current chip of bare crystalline form, small with substrate space is occupied, and is difficult extinction,
The advantages of improving production efficiency and increase the service life.
Brief description of the drawings
By reading the detailed description made with reference to the following drawings to non-limiting example, other spies of the present utility model
Levy, objects and advantages will become more apparent upon：
Fig. 1 shows embodiment of the present utility model, and a kind of bare crystalline encapsulates the structural representation of light engine.
Embodiment
To become apparent from the purpose of this utility model, technical scheme and advantage, below in conjunction with the accompanying drawings and embodiment pair
The technical solution of the utility model is described.
Technical scheme provided by the utility model is there is provided a kind of LED photovoltaic integration engine of integration packaging, using naked
Brilliant encapsulation technology, the rational deployment in structure design, to improve luminous and radiating efficiency, and it is easy for installation.
Fig. 1 shows embodiment of the present utility model, and a kind of bare crystalline encapsulates the structural representation of light engine.
In such embodiment, affiliated bare crystalline encapsulation light engine includes substrate 1, drive circuit and multiple bare crystalline LED chips 3. wherein,
Insulating barrier is formed with the substrate 1, the insulating barrier is formed with the circuit of metal pattern, and the substrate 1 is metal substrate, its
Material is preferably aluminium base or copper, nickel, silver or their alloy material composition, with good rigidity and heat conduction
Property.To the substrate 1 by process of surface treatment, performed etching using chemical substances such as acid, alkali.Further, in the base
The LED chip of bare crystalline form is provided with plate 1, in the utility model, using bare crystalline encapsulation technology, directly by LED chip with
And each electronic component in drive circuit is carried out after load, then it is packaged.Specifically, the drive circuit is handed over using outside
Stream power supply is changed by AC/DC, or is changed by DC/DC, is that the bare crystalline LED chip 3 provides electric energy, the bare crystalline LED
Chip, under the driving of drive circuit, converts electrical energy into luminous energy and is illuminated.Further, the number of the bare crystalline LED chip
Mesh is multiple, by realizing electrical connection on the substrate 1 with the drive circuit.Multiple bare crystalline LED chips 3 are in institute
Stating the arrangement mode on substrate 1 can have a variety of, in the specific embodiment shown in Fig. 1, multiple shapes of bare crystalline LED chip 3
Into annular, each electronic component in the drive circuit is integrated in the center of the substrate 1, multiple rings of LED chip 3
It is arranged in around the drive circuit on the substrate 1.
Further, rectifier bridge 21 and constant current chip 22 are at least included in the drive circuit, the rectifier bridge 21 is preferred
For full bridge structure, specifically, full-bridge is by the form connection of full-wave bridge rectifier circuit and by insulation by 4 commutation diodes
Plastic material is packaged as a whole composition, and the alternating voltage of input is converted into galvanic current pressure so as to realize；The perseverance
Stream chip 22 connects the rectifier bridge 21, and it is used to maintain the electric current of the bare crystalline LED chip 3 stable.Specifically, the constant current
Chip 22 is preferably pulsed drive control chip, can reduce the junction temperature of the bare crystalline LED chip 3, it is to avoid overheated during work, is protected
Card working stability simultaneously reduces light decay.
It will be appreciated by those skilled in the art that the rectifier bridge 21, the constant current chip 22 and the bare crystalline LED chip 3 are equal
It is fixed in bare crystalline form by crystal-bonding adhesive on the substrate 1.Specifically, as shown in figure 1, utilizing thermal conductivity material, i.e. institute
State crystal-bonding adhesive and the rectifier bridge 21, the constant current chip 22 and the bare crystalline LED chip 3 be fixed on ad-hoc location respectively,
And carry out baking-curing.Further, the rectifier bridge 21 of ad-hoc location on the substrate 1, the constant current core are being fixed on
Piece 22 and the welding metal wire of the substrate of the bare crystalline LED chip 31, are connected with the printed circuit on the substrate 1,
So as to realize the circuit communication of each electronic component.
Further, in circuit structure of the present utility model, the rectifier bridge 21, the constant current chip 22 and multiple
It is connected in series between the LED chip 3.Further, it is connected in series, can effectively reduces between multiple LED chips
Caloric value.
Further, in the still another embodiment of the present invention, multiple bare crystalline LED chip (3) surfaces are coated with
Fluorescent adhesive layer, the fluorescent adhesive layer mixes fluorescent particle in transparent epoxy resin or silicone-resin matrix and formed, during coating, choosing
Select the whole area of substrate 1 to be coated, the light that can send the LED chip is more uniform, improves display effect.And
Each electronic component is protected in the other positions of the substrate 1 can also be coated with substratum transparent to the substrate 1.
Further, the crystal-bonding adhesive includes any one in silicones, epoxy resin or polyimide resin.
It will be appreciated by those skilled in the art that the crystal-bonding adhesive be it is a kind of can effectively be glued various materials again it is conductive can it is gluing
Agent, in matrix resin filled with conductive particle such as, the metallic such as gold, silver, copper, aluminium.It should be noted that passing through silicones
The adhesive of base, epoxy resin-matrix or polyimide resin base forms the molecular structure of conductive silver glue after hardening,
There is provided mechanical property and adhesive property guarantee, and make conductive filler particles formation passage, radiating, formula design, it is anti-aging
Aspect has excellent performance.
Further, the substrate (1) for preferably metal material aluminium base, with good thermal conductivity, electrically absolutely
Edge performance and machining property.And in another specific embodiment, the substrate 1 is ceramic substrate, specifically, ceramic base
Plate has higher reflectivity relative to metal substrate, is favorably improved light efficiency, anti-oxidant, the spy such as acid and alkali-resistance, wear-resisting, ageing-resistant
Property, simultaneously as ceramic substrate thermal conductivity factor is higher, Same Efficieney design can save space.
Further, in the utility model, the substrate 1 is shaped as circle, and multiple bare crystalline LED chips 3 are in
Annular array, can ensure that each LED chip is respectively provided with respectively using the bare crystalline LED chip 3 of annular array
From heatsink transverse passage, improve radiating effect.In another specific change case, it will be appreciated by those skilled in the art that with institute
Double annular array can also be used on the basis of annular array by stating the increase of the number of bare crystalline LED chip 3, it is ensured that each
The individual bare crystalline LED chip 3 goes out the usual of optical channel and keeps radiating effect.
Specific embodiment of the utility model is described above.It is to be appreciated that the utility model not office
It is limited to above-mentioned particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims,
This has no effect on substantive content of the present utility model.
Claims (6)
1. a kind of bare crystalline encapsulates light engine, including substrate (1), drive circuit and multiple bare crystalline LED chips (3), its feature exists
In the drive circuit includes rectifier bridge (21) and constant current chip (22), the rectifier bridge (21) and the constant current chip
(22) it is fixed in bare crystalline form by crystal-bonding adhesive on the substrate (1), multiple bare crystalline LED chips (3) are driven around described
Dynamic circuit configuration is on the substrate (1).
2. bare crystalline encapsulates light engine according to claim 1, it is characterised in that the rectifier bridge (21), the constant current chip
And multiple LED chips (3) are connected in series (22).
3. bare crystalline according to claim 2 encapsulates light engine, it is characterised in that multiple bare crystalline LED chip (3) surfaces
It is coated with fluorescent adhesive layer.
4. bare crystalline as claimed in any of claims 1 to 3 encapsulates light engine, it is characterised in that the crystal-bonding adhesive bag
Include any one in following material：
Silicones；
Epoxy resin；Or
Polyimide resin.
5. bare crystalline according to claim 4 encapsulates light engine, it is characterised in that the substrate (1) is aluminium base or ceramics
Substrate.
6. bare crystalline according to claim 5 encapsulates light engine, it is characterised in that the substrate (1) is shaped as circle, many
Individual bare crystalline LED chip (3) the circular array arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720421643.2U CN206619611U (en) | 2017-04-21 | 2017-04-21 | A kind of bare crystalline encapsulates light engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720421643.2U CN206619611U (en) | 2017-04-21 | 2017-04-21 | A kind of bare crystalline encapsulates light engine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206619611U true CN206619611U (en) | 2017-11-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720421643.2U Active CN206619611U (en) | 2017-04-21 | 2017-04-21 | A kind of bare crystalline encapsulates light engine |
Country Status (1)
| Country | Link |
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| CN (1) | CN206619611U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519898A (en) * | 2018-12-29 | 2019-03-26 | 深圳市乔盛科技发展有限公司 | The configuration structure of light engine driving device |
-
2017
- 2017-04-21 CN CN201720421643.2U patent/CN206619611U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109519898A (en) * | 2018-12-29 | 2019-03-26 | 深圳市乔盛科技发展有限公司 | The configuration structure of light engine driving device |
| CN109519898B (en) * | 2018-12-29 | 2024-04-19 | 深圳市乔盛科技发展有限公司 | Circuit layout structure of light engine driving device |
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