WO2020244490A1

WO2020244490A1 - Light source circuit board and led bulb with low heat generation

Info

Publication number: WO2020244490A1
Application number: PCT/CN2020/093836
Authority: WO
Inventors: 史杰
Original assignee: 史杰
Priority date: 2019-06-03
Filing date: 2020-06-02
Publication date: 2020-12-10
Also published as: CN110173631A

Abstract

The present invention relates to a light source circuit board and an LED bulb with low heat generation. The light source circuit board comprises a circuit substrate and an LED group light source integrally packaged by a plurality of LED chips. The LED group light source is provided on the circuit substrate, and the plurality of LED chips in the LED group light source form the LED group light source by means of sealing and mounting using silica gel with fluorescent powder. In the present technical solution, an LED group light source particle uses two or more LED chips to integrate and package the light source, so that the operating current of an LED chip in the LED group light source is less than 20 mA by means of a shunt circuit, having low heat generation and low operating temperature. As the heat generated by the light source is greatly reduced, it is possible to make a small heat dissipation substrate, facilitating reduction of cost.

Description

Light source circuit board and low-heat LED bulb

Technical field

The invention belongs to the field of energy-saving technology, specifically the field of LED lighting technology, and particularly refers to a light source circuit board and a low-heat LED bulb.

Background technique

At present, LED circuit board bulbs on the market mostly use plate-shaped aluminum substrates attached to the lamp body (as shown in Figure 1). The current on a single light source chip is relatively large, usually greater than> 30mA, so the heat generation and light decay are large, which affects the life of the bulb. In order to dissipate heat, the size of the lamp body is usually made larger, resulting in high cost, and the luminous body is basically unshaped and unsightly.

On the other hand, the filament lamp (as shown in Figure 2) uses glue to encapsulate the chip and leads, and the light source heats more concentratedly. The encapsulated straight filament has no exposed heat sink, which makes it difficult to dissipate heat, which affects the bulb life.

Summary of the invention

The purpose of the present invention is to provide a light source circuit board and a low-heat LED bulb to solve the problem that the existing bulbs use LED light sources to generate large heat and affect the service life of the bulbs.

The present invention is realized through the following technical solutions:

A light source circuit board includes a circuit substrate and an LED group light source integrated and packaged by a plurality of LED chips;

The LED group light source is arranged on the circuit substrate;

A plurality of LED chips in the LED group light source are sealed and mounted with phosphor-containing silica gel as the LED group light source.

The circuit substrate adopts a copper substrate or an aluminum substrate, and a reflective material layer or a graphene material layer is coated on the surface of the circuit substrate.

On the circuit substrate, a graphene material layer is coated on the non-light source covering heat dissipation surface, so that the temperature of the LED chip can be increased by heat transfer and then radiation.

The circuit substrate includes a circuit substrate body and a plurality of LED chip mounting boards extending outward along one side of the circuit substrate body.

The circuit substrate body can be bent.

In each group of LED light sources, there are two or more LED chips connected in parallel and mounted on the LED group light source with phosphor-filled silica gel; a plurality of LED group light sources are arranged in series on the circuit substrate .

The working current of each LED chip is less than 20mA.

The LED chip is a flip-chip LED chip or a front-mounted LED chip. After mounting, a drop of phosphorous silica gel is added for color matching and curing, or a CSP chip is directly mounted, and there is no need to add a drop of phosphorous silica gel after mounting.

A low-heat LED bulb, using any one of the above light source circuit boards, and further comprising a glass bulb, a lamp holder and a driving module;

The light source circuit board is installed on the bracket in the glass bulb or on the lamp body;

The glass bulb is fixedly connected to the lamp holder, and the lamp holder is provided with a lamp holder; the driving module is disposed in the lamp holder; the lamp holder is electrically connected with the driving module, and the driving module is The light source circuit board is electrically connected.

The glass bulb is filled with protective and hot gas.

The beneficial effects of the present invention are:

1. This technical solution uses two or more LED chips to integrate the packaged light source through the LED group light source particles, and the shunt circuit makes the single LED chip in the LED group light source work current <20mA, less heat generation, and low working temperature.

The calorific value calculation formula is Q=I2Rt, Q is the heat generated equal to the square of the current multiplied by the resistance and then multiplied by the time, that is, Q is equal to the voltage V across the resistance multiplied by the current A passing through it and multiplied by the time t. W=UIt, electric heating Q=I2Rt. It can be seen from the formula that after multiple low-power chips are integrated into a LED group light source, the input current value is reduced by N times because the input working voltage of the light source rises to N*Vf and the light source power is the same as the original high power. The magnitude of the I2 current is 0.0 after the square is smaller, so the heat generation drops a lot.

2. In this technical solution, the heat generated by the light source is greatly reduced, so that the heat dissipation substrate can be made smaller, which is beneficial to reduce the cost.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention. Therefore, It should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can be obtained from these drawings without creative work.

Figure 1 is a schematic diagram of a traditional LED circuit board bulb;

Figure 2 is a schematic diagram of an LED straight wire bulb;

Figure 3a is a schematic diagram of the structure of the light source circuit board of the present invention;

Figure 3b is a front view of the circuit substrate in Figure 3a;

Figure 3c is a top view of the circuit substrate in Figure 3a;

Figure 4a is a schematic diagram of another light source circuit board structure of the present invention;

Figure 4b is a cross-sectional view of Figure 4a;

Figure 4c is a top view of Figure 4a;

Fig. 5 is an expanded schematic diagram of the light source circuit board of the present invention;

Fig. 6 is an enlarged circuit diagram at I of Fig. 5;

Fig. 7 is another exploded schematic diagram of the light source circuit board of the present invention;

FIG. 8 is an enlarged circuit diagram at II of FIG. 7;

Fig. 9 is another expanded schematic diagram of the light source circuit board of the present invention;

Figure 10 is a schematic diagram of a low-heat LED bulb of the present invention;

Figure 11 is a schematic diagram of another low-heat LED bulb of the present invention.

Description of reference signs

001 glass bulb, 002 light source circuit board, 003 real lamp body, 004 lamp holder, 005 lamp holder, 01 glass bulb, 02 light source circuit board, 03 lamp holder, 04 driver module, 05 bracket, 010 circuit board body, 011 LED chip mounting board, 012 reflective material layer, 013 circuit, 020 LED group light source, 021 LED chip, 1 circuit substrate, 2 LED group light source, 101 circuit substrate body, 102 LED chip mounting board, 21 LED chip, 110 circuit substrate body, 120 LED chip mounting board, 200 LED component Group light source, 201LED chip.

Detailed ways

The technical solutions of the present invention will be described in detail below through implementations. The following embodiments are only exemplary, and can only be used to explain and illustrate the technical solutions of the present invention, but should not be interpreted as limiting the technical solutions of the present invention.

Example 1

The application provides a light source circuit board, as shown in FIG. 3a, which includes a circuit substrate 1 and a group of light sources 2 of LEDs integrated and packaged by a plurality of LED chips.

The LED group light source 2 is arranged on a circuit substrate; in this embodiment, the circuit substrate may be a copper substrate, an aluminum substrate or an FPC soft substrate, and a graphene material layer is coated on the circuit substrate.

The circuit substrate 1 includes a circuit substrate body 101 and a plurality of LED chip mounting boards 102 extending outward along one side of the circuit substrate body. A gap is provided between two adjacent LED chip mounting boards, as shown in FIG. 5. The circuit substrate body can be bent, as shown in FIGS. 3a to 4c.

The 4 LED chips 21 in the LED group light source 2 are mounted on the LED group light source with phosphor-containing silica gel, and then through the circuit design on the circuit board, 20 LED group light sources are connected in series to form the light source circuit board, such as As shown in Figure 5 and Figure 6, the voltage of the whole circuit: 20 strings×3V=60V, the current of the sub-chip: 4W÷60V÷4=0.0167A, through the shunt circuit, the operation of a single LED chip in the LED group light source integrated package particles The current is 16.7mA<20mA, the heat generation is low, and the working temperature is low. In the conversion current calculation of this embodiment, the efficiency of the drive module is ignored, and the single chip working current will only be lower if this factor is added.

Example 2

The present application provides a light source circuit board, which is a light source circuit board with a power of 5W, as shown in FIG. 7 and FIG. 8, including a circuit substrate and an LED group light source 200 integrated and packaged by a plurality of LED chips.

The LED group light source 200 is arranged on a circuit substrate; in this embodiment, the circuit substrate may be a copper substrate, an aluminum substrate or an FPC soft substrate, and a graphene material layer is coated on the circuit substrate.

The circuit substrate includes a circuit substrate body 110 and a plurality of LED chip mounting boards 120 extending outward along one side of the circuit substrate body. A gap is provided between two adjacent LED chip mounting boards, as shown in FIG. 7.

In the LED group light source 200, three LED chips 201 are connected in parallel and mounted with phosphor-containing silica gel as the LED group light source. Then, through the circuit design of the circuit board, the light source circuit board composed of 40 LED group light sources is connected in series. , Full circuit voltage: 40 strings×3V=120V, sub-chip current: 5W÷120V÷3=0.0139A, through the shunt circuit, the working current of a single LED chip in each LED group light source is 13.9mA<20mA, The heat generation is low and the operating temperature is low. In the conversion current calculation of this embodiment, the efficiency of the drive module is ignored. Adding this factor to the single-chip operating current will only be lower.

Example 3

The present application provides a light source circuit board, as shown in FIG. 9, including a circuit substrate and an LED group light source 020 integrated and packaged by a plurality of LED chips 021.

The LED group light source is arranged on the circuit substrate; in this embodiment, the circuit substrate can be a copper substrate or an aluminum substrate or an FPC soft substrate, and a reflective material layer 012 is provided on the circuit substrate. The reflective material can be a metal material or a non-metal material , Wherein the metal material includes at least one or more alloy materials composed of copper, silver, zinc, aluminum, nickel, etc.

The circuit substrate includes a circuit substrate body 010 and a plurality of LED chip mounting boards 011 extending outward along one side of the circuit substrate body, and a gap is provided between two adjacent LED chip mounting boards.

In the LED group light source, three LED chips are connected in parallel and mounted with phosphor-containing silica gel as the LED group light source, and then through the circuit 013 design of the circuit substrate, the light source circuit board composed of 30 LED group light sources in series, Through the diversion. The circuit makes the operating current of a single LED chip in each LED group light source <20mA, less heat generation, and low operating temperature.

In other embodiments of the present application, the light source circuit board is coated with a graphene material layer on the circuit substrate on the non-light source covering heat dissipation surface to increase the heat dissipation path of the LED chip temperature by first transferring heat and then radiating.

In each group of LED light sources, two or more LED chips are connected in parallel and mounted with phosphor-containing silica gel to form the LED group light source; multiple LED group light sources are arranged in series on the circuit substrate. Although the introduction of three LED chips in parallel and four LED chips in parallel is used in Examples 1 to 3, it does not mean that the association of two LED chips or more than four LED chips is not introduced, such as five LED chips, six LED chips. The technical solution of parallel connection of LED chips, etc. is just because it is impossible to exhaustively list the number of LED chips, and give examples.

In the technical solution of the present application, no matter how many LED chips are composed of a single LED group light source, the working current of each LED chip is less than 20 mA.

In the technical scheme of this application, the LED chip is a flip-chip LED chip or a front-mounted LED chip. After the mounting, a drop of phosphor-containing silica gel is added for color matching and curing, or a CSP chip is directly mounted, and there is no need to add a drop tape after mounting Phosphor silicone.

Example 4

This application provides a low-heat LED bulb, as shown in FIG. 10, using the light source circuit board 02 in any one of the foregoing embodiments 1 to 3, and further including a glass bulb 01, a lamp holder, and a driving module.

The light source circuit board is installed on the bracket 05 in the glass bulb 01; in the embodiments of the present application, the glass bulb is a hollow glass bulb, and there is no specific requirement on the shape of the glass bulb, as long as its function is the same as that of the glass bulb. The technical solution of the present application is realized. Therefore, the shape of the glass bulb of the present application is not limited to a spherical shape, a candle shape, a tube shape, a pear shape, and a mushroom shape.

The glass bulb is fixedly connected with the lamp holder, and the lamp holder is provided with a lamp holder 03; the driving module 04 is arranged in the lamp holder; the lamp holder is electrically connected with the driving module, and the driving module is electrically connected with the light source circuit board.

After combining the above components, the glass bulb is filled with protective and hot gas to better extend the life of the bulb.

Example 5

The present application provides a low-heat LED bulb, as shown in FIG. 11, using the light source circuit board 002 in any one of the foregoing embodiments 1 to 3, and further including a glass bulb 001, a lamp holder 004 and a driving module. The light source circuit board is pasted on the real lamp body 003 with thermally conductive glue, and the driver module is welded to the light source circuit board with a wire passing through the real lamp body. The lamp holder 004 and the lamp holder 005 are equipped to form a low-heat LED bulb.

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principle and spirit of the present invention. And variations, the scope of the present invention is defined by the appended claims and their equivalents.

Claims

A light source circuit board, which is characterized by comprising a circuit substrate and an LED group light source integrated and packaged by a plurality of LED chips;

The LED group light source is arranged on the circuit substrate;

A plurality of LED chips in the LED group light source are sealed and mounted with phosphor-containing silica gel as the LED group light source.
The light source circuit board of claim 1, wherein the circuit substrate is a copper substrate or an aluminum substrate FPC soft substrate, and a reflective material layer or a graphene material layer is provided on the surface of the circuit substrate.
The light source circuit board according to claim 2, characterized in that, on the circuit substrate, a layer of graphene material is coated on the non-light source covering heat dissipation surface, so as to realize the method of transferring the temperature of the LED chip through first heat transfer and then radiation Increase heat dissipation.
The light source circuit board according to claim 1 or 2 or 3, wherein the circuit substrate comprises a circuit substrate body and a plurality of LED chip mounting boards extending outward along one side of the circuit substrate body.
4. The light source circuit board according to claim 4, wherein the circuit substrate body can be bent.
The light source circuit board according to claim 1, wherein two or more LED chips are connected in parallel in each group of LED light sources, and are mounted on the LED group light source with phosphor-containing silica gel. ; A plurality of LED groups of light sources are arranged in series on the circuit substrate.
The light source circuit board according to claim 1 or 6, characterized in that the working current of each LED chip is less than 20 mA.
The light source circuit board according to claim 6, wherein the LED chip is a flip-chip LED chip or a front-mounted LED chip, and after mounting, a drop of phosphor-containing silica gel is added for color matching and curing, or directly mounted with a CSP chip , And there is no need to add a drop of silica gel with phosphor after mounting.
A low-heat LED bulb, characterized by using the light source circuit board of any one of the above claims 1 to 8, and further comprising a glass bulb, a lamp holder and a driving module;

The light source circuit board is installed on the bracket in the glass bulb or on the lamp body;

The glass bulb is fixedly connected to the lamp holder, and the lamp holder is provided with a lamp holder; the driving module is disposed in the lamp holder; the lamp holder is electrically connected with the driving module, and the driving module is The light source circuit board is electrically connected.
9. The low-heat LED bulb according to claim 9, wherein the glass bulb is filled with protective and hot gas.