M266548 八、新型說明： 【新型所屬之技術領域】 本創作係有關-種發光二極體燈具之結構，特別是關於_種高功率發光二 極體燈具之結構。 【先前技術】 發光二極體(light emitting diode; LED)因其光電轉換效率於過 去二十年來快速提昇’且具有體積小、效率高與省電節能等優點，被 視為未來具尚潛力之照明光源。現今’發光二極體照明已被大量應用 於交通信號燈、汽車車燈、大樓外牆燈幕、電子看板及投射燈等工商 產品上。傳統之鎢絲燈泡，由於耗電量大、使用壽命短，並不符合環 保訴求，因此，後來開發出一種如第一圖所示之燈泡式發光二極體燈 具以取代原來傳統的鎢絲燈泡。此燈泡式發光二極體燈具100之結 構包含：一燈座102,燈座102上設置一印刷電路板(printed circuit board ; PCB)104，此印刷電路板1〇4上電性連接複數個發光二極 體106，並焊有電容108、二極體11〇等相關電子元件；一具有一 螺紋部之銅頭112設置於燈座下方，且銅頭112底部具有一導 接點（conductive node) 114，其中，該等發光二極體之正負電 極透過印刷電路板104分別與銅頭112和導接點114電性相連接， 而銅頭112與導接點間114間彼此電性絕緣，即其分屬發光二極體 燈具100兩電性相反之導電電極；一玻璃罩11 6設置於燈座102上， 並包覆住該等發光二極體1 〇6。一般而言，目前此種燈泡式發光二極 M266548 體燈具内部所使用的發光二極體皆以低功率為主，主要規格為Φ 3mm 或Φ 5mm，每顆發光二極體平均功率約為0.04瓦(W)左右，即發光 二極體之平均工作點在0.02安培(A)電流和2伏特（V)電壓附近。因 此，若要達到一定程度的照明亮度，通常需將多顆低功率發光二極體 集結設置於燈泡内。然而，隨著發光二極體數目之增加，其所產生之 總熱量也相對增加，再者，發光二極體被玻璃罩116封閉其中，易 造成散熱不良，導致操作溫度過高，以致使用壽命減短甚至燒毁。故 散熱問題為此種燈泡式發光二極體燈具之技術瓶頸之一。另一方面， 當所設置之發光二極體數目愈多，將使得燈具整體體積變大，造成難 以達成硬體設備體積微化之目標。 繼之，一具有高功率性能之發光二極體燈具則被提出，如第二 圖所示，此種高功率發光二極體燈具，又稱臥式高功率發光二極體燈 具。此高功率發光二極體燈具200包括一底座202 ;底座202中設 置一銅座204及一導線架206，導線架206由兩金屬片所構成，且 部份導線架206外露於該底座202 ; —高功率發光二極體晶片208 黏著於銅座204上；高功率發光二極體晶片208之正負電極透過導 線210與導線架電性206連接；底座202上並形成一封裝樹脂層212 做為一透鏡並包覆住導線架206、高功率發光二極體晶片208與導 線210。複參第二圖，此種臥式高功率發光二極體燈具之導電架通常 焊接於一鋁基板214上之一印刷電路板216，藉此，發光二極體燈 具200與印刷電路板216產生電性連接。此種高功率發光二極體燈 M266548 具内所安裝之高功率發光二極體晶片，每單顆晶片約具有0.6W以上 之功率，可提供相當之照明亮度。因此，在相同之功率要求下，其整 體燈具之體積將較傳統燈泡式發光二極體燈具來得小；同時，高功率 發光二極體晶片208所伴隨而生之熱量可經由銅座204傳導至鋁基 板214，再排出於空氣中，達到散熱目的。之後，有人提出如第三圖 所示之一種改良式高功率發光二極體燈具結構300，其係於前述燈具 之銅座308下方設置一散熱片302,並同樣焊接於一印刷電路板304 上，高功率發光二極體晶片306產生之熱量，透過銅座308傳導至 散熱片302,並經由散熱片302與空氣接觸之面積將熱排出。隨著 散熱片302中葉片數之增加，葉片暴露於空氣中之表面積亦增加， 因而散熱效能隨之提昇。然而如前所述，此種臥式高功率發光二極體 燈具通常需焊接並固定於平面電路板上，造成更換、維修不易，故市 場推廣困難。此外，目前許多硬體設施與安裝規格皆以燈泡式燈具為 設計考量，燈泡式燈具優點之一在於其裝卸容易、應用普及，故臥式 高功率發光二極體燈具之替代性與相容性相對偏低。 鑒於上述，亟待提出一種高功率發光二極體燈具，結合目前廣泛 被應用之燈泡式銅頭結構，達到取代傳統燈泡式產品之便利性，並同 時具有散熱佳、高照明功率及體積小等優點。 【新型内容】 本創作之一主要目的係提供一種高功率發光二極體燈具，其能改 善傳統習知發光二極體燈具所引發的缺點。 M266548 本創作之另一目的係提供一種高 力车發光二極體燈具，其具有高 功率之照明，並具備散熱性能佳及體積小之優點 本創作之另一目的係提供 種 用於-般照明裝置’與傳統燈泡式高二極體燈具，能普遍適 且裝設及拆取容易。 本創作之又一目的係提供 種 N功率發光二極體燈具，不僅具有 散熱效率佳之散熱裝置，且燈具整體構件 使用壽命長，極具經濟價值。 簡單、易於組裝；同時，其 根據上述之目的，本創作提供一 種向功率發光二極體燈具，係 括：-底座，具有-凹檜、-散熱片及—導接點，且此底座具導電 導熱功能；一導線架；一燈座套筒將部一 H刀底座與部份導線架包覆住 並將彼此固定，其中底座與導線架盞 …、生連接，而導線架之一第一 分與一第二部分及此凹槽、此散熱片以 ^ 及此V接點皆未被此燈座套 包覆住，且此燈座套筒與散熱片間存 +二空間與外界空氣連通 -南功率發光二極體晶片黏著於此凹槽 .^ 此向功率發光二極體晶 之一％極與此底座電性連接 道治力L不 私11相反之電極藉由一導線與] 導線以卜狀第-部份之接觸 座之導接點與此導電架外•之“產生電性連接，因此，） ^ 备 一口^刀相當於此燈具與外界設備連、名 之兩電性相反之導ff極；—有逐 架外mm ，、料封讀層，《並覆蓋於此導！ ^、切槽、«線及此高功轉光二鋪晶片上，用以取 和保護上述個元件· 牛，及一透鏡片設置於此封裝膠層上方，並與其緊密接合，其 M266548 中此透鏡片絲光魏，使得發光 加照明效率。此燈財，高功杯^㈣片產生之姐朝敢方向射出，增 至埒埶n、 極體晶片所產生之熱能可經由底座傳導 :亚過散熱片之表面，排熱至此燈座套筒與散熱存在之空間， 取後熱能排送至空氣中，達到散熱效果。 1、本_與先前技術之功效，摘作燈具的優點在於，可藉㈣設散熱 y之茱片數量，增加其與空氣接觸之表面積，提升燈具的散熱效果。同時，亦 可於設計燈具時加大燈座筒與散熱片間之中空空間，增進燈具散熱效率。因此， 本猶克服了 $知技術無法解決之散熱_丨且當此燈具之燈座套筒之外表面 十為/、有螺紋部時，此燈座套筒、導線架和導接點之組合將具有如傳統燈 /包式燈具之鋼頭雜，賴取代傳紐泡產品之便利性。 上述有關本創作之内容及以下的實施方式詳細說明皆為範 限制0复它 "匕不脫離本創作之精神的等效改變或修飾均應包含在本創作 的申請專利範圍内。 【實施方式】 本創作將根據以下所附圖示做詳細之說明。在此特別一提的是， 所有圖示均A/Γ的 -間早的形式且未依照比例描繪，而尺寸均被誇大以利瞭 解本創作。 ' 參考第四A圖，係為本創作高功率發光二極體燈具之一較佳第_ 貝施例結構剖視圖。此高功率發光二極體燈具400主要包括：一具 M266548 有一凹槽（cup)402、—却丸 月文熱片404和一導接點406之底座408、一 高功率發光二極體晶月4^ 斗 1〇、一 導線架（lead frame)412、一導線 414、一燈座套筒416、 ~封裝膠層418、一透鏡片（lens)420和一 套蓋422。一般而言，届 早顆發光二極體晶片之功率在0.6W以上者即 可稱之為而功率’目前金田 条界所泛指之高功率發光二極體其平均功率約 在1.2W〜1.75W此簕圖咖M266548 8. Description of the new type: [Technical field to which the new type belongs] This creation is about the structure of a kind of light-emitting diode lamps, especially about the structure of _ high-power light-emitting diode lamps. [Previous technology] Light emitting diodes (LEDs) have been rapidly improved over the past two decades because of their photoelectric conversion efficiency, and they have the advantages of small size, high efficiency, power saving and energy saving, and are considered to have potential in the future. Lighting source. Today's light-emitting diode lighting has been widely used in industrial and commercial products such as traffic lights, car lights, building exterior curtains, electronic signage, and projection lights. Traditional tungsten filament light bulbs, due to their high power consumption and short service life, do not meet environmental protection requirements. Therefore, a light bulb-type light emitting diode lamp as shown in the first figure was developed to replace the traditional tungsten filament bulbs. . The structure of the bulb-type light emitting diode lamp 100 includes: a lamp holder 102, and a printed circuit board (PCB) 104 is arranged on the lamp holder 102. A plurality of light emitting diodes are electrically connected to the printed circuit board 104. The diode 106 is connected with related electronic components such as the capacitor 108 and the diode 110; a copper head 112 having a threaded portion is arranged below the lamp holder, and a conductive node is provided at the bottom of the copper head 112 114, wherein the positive and negative electrodes of the light-emitting diodes are electrically connected to the copper head 112 and the conductive contact 114 through the printed circuit board 104, and the copper head 112 and the conductive contact 114 are electrically insulated from each other, that is, The light-emitting diode lamp 100 belongs to two electrically conductive electrodes with opposite electrical properties; a glass cover 116 is disposed on the lamp holder 102 and covers the light-emitting diodes 106. Generally speaking, the light-emitting diodes used in this type of bulb-type light-emitting diode M266548 are mainly low-power. The main specifications are Φ 3mm or Φ 5mm, and the average power of each light-emitting diode is about 0.04. About watts (W), that is, the average operating point of the light-emitting diode is around 0.02 amps (A) and 2 volts (V). Therefore, to achieve a certain level of lighting brightness, multiple low-power light-emitting diodes are usually assembled in the bulb. However, with the increase in the number of light-emitting diodes, the total heat generated by them also increases. Furthermore, the light-emitting diodes are enclosed by the glass cover 116, which easily results in poor heat dissipation and high operating temperatures, which leads to a long service life. Shortened or even burned. Therefore, the heat dissipation problem is one of the technical bottlenecks of this type of light bulb type light emitting diode lamp. On the other hand, when the number of light-emitting diodes provided is larger, the overall volume of the lamp becomes larger, which makes it difficult to achieve the goal of miniaturizing the volume of the hardware equipment. Then, a high-power light-emitting diode lamp was proposed. As shown in the second figure, this high-power light-emitting diode lamp is also called a horizontal high-power light-emitting diode lamp. This high-power light emitting diode lamp 200 includes a base 202; a copper base 204 and a lead frame 206 are arranged in the base 202, the lead frame 206 is composed of two metal sheets, and a part of the lead frame 206 is exposed on the base 202; The high-power light-emitting diode chip 208 is adhered to the copper base 204; the positive and negative electrodes of the high-power light-emitting diode chip 208 are electrically connected to the lead frame 206 through a wire 210; a sealing resin layer 212 is formed on the base 202 as a lens The lead frame 206, the high-power light-emitting diode chip 208, and the lead 210 are covered. Revisiting the second figure, the conductive frame of such a horizontal high-power light-emitting diode lamp is usually welded to a printed circuit board 216 on an aluminum substrate 214, whereby the light-emitting diode lamp 200 and the printed circuit board 216 are produced. Electrical connection. This high-power light-emitting diode lamp M266548 is equipped with a high-power light-emitting diode chip. Each single chip has a power of about 0.6W or more, which can provide a considerable brightness. Therefore, under the same power requirements, the overall size of the light fixture will be smaller than that of the traditional light bulb type light emitting diode light fixture; at the same time, the heat generated by the high power light emitting diode chip 208 can be conducted to the aluminum through the copper base 204 The substrate 214 is discharged into the air to achieve heat dissipation. Later, someone proposed an improved high-power light-emitting diode lamp structure 300 as shown in the third figure, which is provided with a heat sink 302 under the copper base 308 of the aforementioned lamp, and is also soldered to a printed circuit board 304. The heat generated by the high-power light-emitting diode chip 306 is conducted to the heat sink 302 through the copper seat 308, and the heat is discharged through the area where the heat sink 302 is in contact with the air. As the number of blades in the heat sink 302 increases, the surface area of the blades exposed to the air also increases, so the heat dissipation efficiency increases. However, as mentioned above, such horizontal high-power light-emitting diode lamps usually need to be soldered and fixed on a flat circuit board, which makes replacement and maintenance difficult, so it is difficult to market. In addition, many current hardware facilities and installation specifications are designed with light bulbs as one of the advantages. One of the advantages of light bulbs is that they are easy to disassemble and popularize. Therefore, the replacement and compatibility of horizontal high-power light-emitting diode lamps. Relatively low. In view of the above, it is urgent to propose a high-power light-emitting diode lamp, combined with the bulb-type copper head structure currently widely used, to achieve the convenience of replacing traditional bulb-type products, and also has the advantages of good heat dissipation, high lighting power and small size . [New content] One of the main purposes of this creation is to provide a high-power light-emitting diode lamp, which can improve the disadvantages caused by traditional conventional light-emitting diode lamps. M266548 Another purpose of this creation is to provide a high-power car light-emitting diode lamp, which has high-power lighting, and has the advantages of good heat dissipation performance and small size. Another purpose of this creation is to provide a general-purpose lighting The device 'and the traditional bulb-type high-diode lamps can be generally adapted and easily installed and removed. Another purpose of this creation is to provide an N-power light-emitting diode lamp, which not only has a heat-dissipating device with good heat dissipation efficiency, but also has a long service life as a whole and has great economic value. Simple and easy to assemble; at the same time, according to the above purpose, this creation provides a light emitting diode lamp for power, which includes:-a base with-recessed,-heat sink and-conductive contacts, and the base is conductive A heat-conducting function; a lead frame; a lamp holder sleeve covers an H knife base and a part of the lead frame and fixes each other, wherein the base and the lead frame are connected, and one of the lead frames is the first And a second part, the groove, the heat sink and the V contact are not covered by the lamp holder cover, and the lamp holder sleeve and the heat sink have a space + two spaces in communication with the outside air- South power light emitting diode chip is adhered to this groove. ^ One of the directional power light emitting diode crystals is electrically connected to this base, and the power is not self-contained. 11 The opposite electrode is connected by a wire and a wire. The contact point of the contact part of the bubbly part-outside of this conductive frame is “electrically connected, so) ^ Prepare a mouthpiece ^ The knife is equivalent to the connection of this lamp with external equipment, and the two electrical properties are opposite. Guide ff pole;-There are frame-by-frame outer mm, and material seal reading layers, "and cover this guide! ^ , Grooving, «line and this high-power light-transmitting second-layer wafer to take and protect the above-mentioned components · cattle, and a lens sheet is placed above the packaging adhesive layer and tightly bonded to it, and this lens sheet in its M266548 The mercerizing light makes the luminescence increase the lighting efficiency. This lamp is created by the sister of the high power cup ^ cymbal, and it is increased to 埒 埶 n. The thermal energy generated by the polar chip can be conducted through the base: On the surface, the heat is exhausted to the space where the sleeve of the lamp holder and the heat exists, and the heat energy is discharged to the air after taking out to achieve the heat dissipation effect. 1. The effect of this and the previous technology is that it can be used for heat dissipation. The number of y-sheets increases the surface area in contact with the air and improves the heat dissipation effect of the lamp. At the same time, when designing the lamp, the hollow space between the lamp holder tube and the heat sink can be increased to improve the heat dissipation efficiency of the lamp. Overcome the heat dissipation that cannot be solved by the known technology. 丨 And when the outer surface of the lamp holder sleeve of this lamp is /, there is a threaded part, the combination of the lamp holder sleeve, the lead frame and the lead point will have the traditional Light / Package The complexity of steel heads depends on the convenience of replacing Chuanbuo products. The above-mentioned content of this creation and the detailed description of the following embodiments are limited in scope. It is equivalent to changing or modifying without departing from the spirit of this creation. All should be included in the scope of the patent application for this creation. [Embodiment] This creation will be described in detail according to the attached drawings below. It is particularly mentioned here that all the drawings are A / Γ's-between early The form is not drawn to scale, and the dimensions are exaggerated to facilitate understanding of this creation. 'Refer to Figure 4A, which is a cross-sectional view of the structure of one of the best examples of this creative high-power light-emitting diode lamp. This high The power light-emitting diode lamp 400 mainly includes: a M266548 with a cup 402,-but Maru Moonlight 404 and a base 408 of a lead point 406, a high-power light-emitting diode crystal 4 ^ The bucket 10, a lead frame 412, a lead 414, a lamp holder sleeve 416, ~ encapsulant 418, a lens 420, and a set of covers 422. Generally speaking, the power of the early light-emitting diode chip above 0.6W can be referred to as the power. At present, the average power of high-power light-emitting diodes commonly referred to by Jintian Sector is about 1.2W ~ 1.75. W This picture coffee
軍已国内’亦gP其工作點通常在〇·35Α與3.5V〜5V 附近本創作同功率發光二極體燈具之設計所使用之高功率發光二極 體晶片即以此為考量基礎1而，其設計㈣亦可推廣至未來具更高 功率之發光二極體或其它發光源。 本實施例中’整體之底座408如第四A圖所示包含凹槽402、 散熱片404和導接點4〇6，底座4〇8其整體形體大致上係一柱狀體， 且具有導電及導熱性，可由銅或鋁等材質製成。凹槽402係供高功 率發光二極體晶片41〇容置於上；且凹槽402表面並鍍有一反射層， 例如一鋁層’用以反射由高功率發光二極體晶片410產生之側面光， 提间光利用率。接著，利用燈座套筒416將部份導電架412及部分 底座408包覆住，亦即將其埋入其中；而凹槽402、散熱片404、 導接點4G6及部分之導電架412則未被燈座套筒416包覆住，且散 熱片404表面與燈座套筒416間存在-中空空間428與外界空氣連 通。燈座套筒416 ’係—絕緣體，其形體大致為—圓筒狀結構，具有 一筒内空間且外表面具有一圓柱面；燈座套筒416之功能係固定底 座408和導線架412，及防止底座408與導線架412電性接觸。在 M266548 此特別-提的是，燈座套筒416可設計為由兩個形狀對稱之半圓筒 絕緣體所組合，並將導線架和底座彼此固定，亦或視需求燈座套筒川 可設計為由複數個可組合於一起之絕緣體組合而成。如第四A圖， 散熱片404係容置於燈座套筒416之筒内空間内，而導接點獅則 突出於該筒内空間外。導線架412為兩形狀相同、擺放位置互為對 稱之導電金屬片所構成，每—導電金屬片之_端，在此稱為導線架 之-第-部份，外露於燈座套筒416開口對端之上端面，用以跟導 線414連接；而導電金屬片之另一端，在此稱為導線架化之一第 二部份，則突出於燈座套筒416之圓柱面外，形成兩個大小、形狀 相同且位置對稱於燈座套筒416圓周之導接片，俗稱為導電牛角。 參考第四B圖’係為將第四A圖之高功率發光二極體燈具彻旋轉 卯度之側視圖’其令可看出外露之導線架412之第二部分（即導接 片’亦稱導電牛角）的形狀與位置關係。燈座套筒416可由射出成形 與模組製程之方式製成，再行組合，其形成材質可為—聚碳酸樹脂 ί (pc)。 高功率發光二極體晶片410藉由—黏膠，例如銀膠，黏著於凹 槽402底部並與之緊密接合，其一電極透過一導線（圖未顯示）與底座 顿電性連接；而另一電性相反之電極則如第四A圖所示透過導線 4M與導線架412電性連接，其中，導線414之材質—般係選擇全 線’並利用封裝技術中之打線技術完成焊接。由上述知， 導接點406與外露之導電架412所形成之兩導接片即分別為此高功 M266548 率發光-極體燈具400兩電性相反之導電電極。繼之，於燈座套筒 416 口對端上形成一具有透光性之封裝膠層418，將凹槽4〇2、 高功率發光二極體晶片410、導線414及外露導線架之第一部分包 覆住’藉以將上述元件固定，予以保護。形成封裝膠層418之封裝 膠體材質可為-環氧樹脂（Ep〇xy resin，Ep)或石夕膠等材質。因應封 表膠層418之.X置，燈座套筒416於形成之初，可於其上端面設計 -階梯式同心圓雙凹槽，如第四A圖所示，第—凹部之半徑係小於第二 凹部之半徑；此第-凹部係供封裝膠體材質洗灌置入其中，形成封裝膠_ 層418，當第-凹部填滿後，所餘留之第二凹部空間則供之後部分透鏡片42〇 與套蓋422容设於其中並與燈座套筒416卡合。透鏡片42〇設置於封 裝膠層418上方並與其緊密接合，此透鏡片42〇具有折射聚光之性· 能，能使高功率二極體晶片410產生之光線集中並朝預定方向射出。* 複參第四A圖，透鏡片420可為一圓形雙凸或一單凸鏡片，其中央 部份較厚，而周圍部份較薄且平整，此平整部分係用以供之後之套蓋 422置放之用。透鏡片420可以碳酸聚脂材料射出形成或利用石英、籲 玻璃等材質製成。接著，一具有一貫穿部分之套蓋42〇設置於透鏡 片420和燈座套筒416上，套蓋422包覆住透鏡片420，並與透鏡 片420和燈座套筒416緊密接觸與卡合，其中，高功率發光二極體晶片414產 生之光線，係經由該貫穿部分射出。套蓋422為一環狀套筒結構，且其 貫穿部分為一漏斗錐面，該漏斗錐面表面並鍍有一層反光層424，例 如-銘層或翻層，用以反射由透鏡片42〇散射出之光線，增加照明 強度’ k冋光源利用效率。敢後，於套蓋422上端設置一透光片426， 12 M266548 做為一頂面，封閉貫穿部分之射出口。由上述知，此實施例之高功率 發光二極體燈具400其整體構件簡單、易於製造及組裝，故具備經 濟價值。 本實施例中，底座408因具有導電性，其整體可視為一柱狀導線， 當導電時，因電阻與導線截面積成反比，故底座408具有低電阻值； 且當底座408截面積愈大，其電阻值將愈小。高功率發光二極體晶 片410發光時產生之熱量，將透過底座408傳導至散熱片404，再籲 由散熱片404之表面散熱至燈座套筒416與散熱片404間所存在之 空間428，最後排熱至外界空氣中，達成散熱效果。參考第四A圖， 散熱片404可為複數個串接之散熱葉片所構成，當散熱葉月之數量 -愈多，其整體與空氣接觸的表面積也愈大，因而散熱效果愈佳。另外， · 於設計燈具時，可將燈座套筒416與散熱片404間所存在之空間428 適度地加大，藉以增加與外界空氣之流通，提升排熱效果。底座408、 凹槽402及散熱板404以及導接點406可以以一體成形之方式同時 _ 形成，例如可採衝壓或擠塑等方法，而其材質則可選擇具有導熱及導 電性之材質，例如銅或铭等。如前述，複參第四A圖，就燈具裝置 之整體外觀與操作方式而言，本實施例之高功率發光二極體燈具400 可視為一燈泡式發光二極體燈具，其係利用導接點406和兩導接片 (導電牛角）與外界做電性接觸，第五A圖與第五B圖為其與外界 硬體設備之組合操作示意圖。第五A圖為此高功率發光二極體燈具 400與外界裝置502組合前之俯視圖，第五B圖則為組合後之側視 13 M266548 剖面圖。由此可知，高功率發光二極 4具400可輕易藉由旋轉卡 合之方式，固定於應用硬體上，具有梦 、一 卸谷易之優點，其可應用範圍 涵蓋父通信號燈、電子看板等照明設備上。 在此特別—提較，第—實施财在軸封«層418後’再於 其上設置透鏡片420,其目的為可藉由改變或更換不同的透鏡片形式 以達到不同的聚光功能效果或要求，而封裝縣418的功用在於固 定及保護《元件，同時具有透紐能。然而，在此提出本創作之第 二實施例’如第四c圖所示，其係在第—實施例形成封裝勝層418 於燈座套筒416上方時，直接將其形塑成—具有聚光功能之形狀， 如第四c圖所示之封裝膠層418，亦即封裝膠層418本身即為一透 鏡片。 本創作之第三實施例，如第六A圖所示，其整體裝置之結構、組 裝方式與第-實施例相似，相異點在於此高功率發光二極體燈具_ 之導電架612係由兩金屬薄片所構成，且燈座套筒6 16之筒外表面 设計為具有一螺紋部，而突出於燈座套筒616筒外表面之兩導接片（在 前述實施例稱之導電牛角），則緊貼附於燈座套筒616外表面之螺紋 部上。欲形成具有一螺紋部表面之燈座套筒，僅需於燈座套筒616 射出成形時改變其射出模組即可，因此製作容易。在此實施例中，由 燈座套筒616、導接點606和外露之導接片所組成之機構部份，具 有如一般傳統燈泡螺紋狀鋼頭之功能，可直接旋入燈泡螺紋接座内。 14 M266548 因此，同功率發光二極體燈具6。。，除裝設容易與更換方便外，其與 傳、、先^包式產之替代性與相容性高，具有寬廣的照明應用。除上述 特點之外’此實施例之高功率發光二極體燈具6 〇 〇同樣具備如前述 第-實域燈具4 Q 〇之優點：在相同的照明功率要求下，其體 較傳統的燈泡式發光二極體燈具來得小，且具有良.好的散熱效果= 時:整體燈具之構件簡單、組裝容易，具有經濟價值。在此特別 的疋’本創作之燈具並非僅限用於高功率發光二極體 光二極體，甚至任何料b ，、匕功率之發 任㈣式之發光源，皆可應用於本創作中 具裝置内。 促®之燈 、請不之坪述以幫助本創作之闡明。當然，本文 例並非㈣嘛紙辦_。樓㈣ ^ 明盥描丁 ”罕乂佳實施例做特別說 作二::热知本技術之專門人士應可明瞭及實施，其他未脫離本創 中細下所完成的等效改變或修飾，均應包含在下述之中請專利範圍 【圖式簡單說明】 第一圖係1知燈泡式發光二極體燈具示意圖； 第二圖係—利用鋁基板散熱之習知 --^ ^ 式间功辜發光二極體燈具示意圖； -極體燈具示意圖； 一圖係-利用散熱片散熱之習知队式高功率發光_ 15 M266548 第四A _為本_巾第—實施例之高辨發光二極贿具之剖視圖； 第四B圖係將第四A圖之高功率發光二極體燈具旋轉9 q度之侧視圖； 第®C_為本創作巾第二實關之高功率料二極體燈具之剖視圖； 第五A _為本創射第—實關之高辨發光二極贿具與外界裂置么 合前之俯視圖； Ί 第五B _林_巾第—實關之高辦發光二極舰具與外界装置纪 合後之剖視圖； ° 第六A圖係為本創作中第三實施例之高功率發光二極體燈具之剖視圖；及 第六B圖係為本創作中第三實施例之高功率發光二極體燈具之侧視圖。 【主要元件符號說明】 10 0 發光二極體燈具 10 2 燈座 10 4 印刷電路板 10 6 發光二極體 10 8 電容 110 二極體 1 1 2 銅頭 114 導接點 116 玻璃罩 2 0 0 臥式高功率發光二極體燈具 2 0 2 底座 2 0 4 銅座 2 0 6 導線架 2 0 8 發光二極體晶片 2 10 導線 2 12 封裝膠層 2 1 4 銘基板 2 16 印刷電路板 3 0 0 臥式高功率發光 二極體燈具 3 0 2 散熱片 3 0 4 印刷電路板 M266548 3 0 6 發光二極體晶片 3 0 8 銅座 4 0 0 燈泡式高功率發光二極體燈具 4 0 2 凹槽 4 0 4 散熱片 4 0 6 導接點 4 0 8 底座 4 10 發光二極體晶片 4 1 2 導線架 4 14 導線 4 1 6 燈座套筒 4 18 封裝膠層 4 2 0 透鏡片 4 2 2 套蓋 4 2 4 反光層 4 2 6 透光片 4 2 8 散熱空間 5 0 2 外界裝置 6 0 0 燈泡式高功率發光二極體燈具 6 12 導線架 6 1 6 燈座套筒 17The military has domestically, and its operating point is usually around 0.35A and 3.5V ~ 5V. The high-power light-emitting diode chip used in the design of the same-power light-emitting diode lamp is based on this consideration1. Its design can also be extended to light emitting diodes or other light sources with higher power in the future. In the present embodiment, as shown in FIG. 4A, the overall base 408 includes a groove 402, a heat sink 404, and a contact point 406. The overall shape of the base 408 is substantially a columnar body and has conductivity. And thermal conductivity, can be made of copper or aluminum. The groove 402 is for the high-power light-emitting diode wafer 41 to be placed thereon; and the surface of the groove 402 is plated with a reflective layer, such as an aluminum layer, to reflect the side generated by the high-power light-emitting diode wafer 410. Light, improved light utilization. Then, a part of the conductive frame 412 and a part of the base 408 are covered with the lamp socket sleeve 416, that is, to be buried therein; the groove 402, the heat sink 404, the lead 4G6, and a part of the conductive frame 412 are not It is covered by the lamp holder sleeve 416, and there is a space between the surface of the heat sink 404 and the lamp holder sleeve 416-the hollow space 428 is in communication with the outside air. Lampholder sleeve 416 'series-insulator, its shape is roughly-cylindrical structure, has a cylinder inner space and an outer surface with a cylindrical surface; the function of the lampholder sleeve 416 is to fix the base 408 and the lead frame 412, and Prevent the base 408 from making electrical contact with the lead frame 412. In M266548, it is particularly mentioned that the lamp holder sleeve 416 can be designed by combining two symmetrical semi-cylindrical insulators, and the lead frame and the base are fixed to each other, or the lamp holder sleeve can be designed as required It is composed of a plurality of insulators which can be combined together. As shown in FIG. 4A, the heat sink 404 is accommodated in the inner space of the tube of the lamp socket sleeve 416, and the contact point lion protrudes from the inner space of the tube. The lead frame 412 is composed of two conductive metal pieces of the same shape and symmetrical placement positions. Each of the _ ends of the conductive metal pieces is referred to herein as the -part-of the lead frame, and is exposed on the lamp holder sleeve 416. The upper end of the opposite end of the opening is used to connect with the lead 414; the other end of the conductive metal sheet, referred to herein as a second part of the lead frame, protrudes beyond the cylindrical surface of the lamp socket sleeve 416 to form Two guide pieces of the same size, shape and position symmetrical to the circumference of the lamp holder sleeve 416 are commonly referred to as conductive horns. Refer to the fourth diagram B 'is a side view of the high-power light-emitting diode lamp of the fourth diagram A. The side view of the whole lead frame 412 can be seen. Called conductive horns) shape and position relationship. The lamp holder sleeve 416 can be made by injection molding and module manufacturing methods, and then combined, and the forming material thereof can be polycarbonate resin (pc). The high-power light-emitting diode chip 410 is adhered to the bottom of the groove 402 and tightly bonded with an adhesive, such as silver glue. One electrode is electrically connected to the base through a wire (not shown); An electrically opposite electrode is electrically connected to the lead frame 412 through the lead 4M as shown in FIG. 4A. Among them, the material of the lead 414 is generally selected from the “full line” and the bonding technology is used to complete the welding. It is known from the above that the two conductive pieces formed by the conductive contact 406 and the exposed conductive frame 412 are respectively two conductive electrodes with opposite electrical properties for the high-power M266548 rate luminous-polar body lamp 400. Next, a light-transmitting packaging adhesive layer 418 is formed on the mouth-to-end of the socket 416 of the lamp holder, and the groove 402, the high-power light-emitting diode chip 410, the lead 414, and the first part of the exposed lead frame are formed. 'Covering' is used to fix and protect the above components. The material of the encapsulant that forms the encapsulant layer 418 can be epoxy resin (Ep.xy resin, Ep) or Shi Xijiao. In accordance with the .X setting of the surface sealant layer 418, the lamp holder sleeve 416 can be designed on the upper end surface of the cover at the beginning of the formation-a stepped concentric double groove, as shown in Figure A, the radius of the first-recess The radius of the second recess is smaller than the radius of the second recess. The first recess is for washing and filling of the encapsulating colloid material to form an encapsulation layer 418. After the first recess is filled, the remaining space of the second recess is used for the rear lens. The sheet 42 and the cover 422 are accommodated therein and are engaged with the socket sleeve 416. The lens sheet 42 is disposed above the sealing adhesive layer 418 and is tightly bonded to the lens sheet 420. This lens sheet 42 has the property of refracting and condensing light, and can concentrate the light generated by the high-power diode wafer 410 and emit it in a predetermined direction. * Revisiting the fourth A picture, the lens sheet 420 may be a circular biconvex or a single convex lens, the central part of which is thicker, and the surrounding part is thinner and flat. This flat part is used for the subsequent set The cover 422 is used for placement. The lens sheet 420 may be formed by emitting a carbonated polyester material or made of a material such as quartz or glass. Next, a cover 42 with a penetrating portion is disposed on the lens sheet 420 and the lamp holder sleeve 416. The cover 422 covers the lens sheet 420, and is in close contact with the lens sheet 420 and the lamp holder sleeve 416 and engages with the card. The light generated by the high-power light-emitting diode wafer 414 is emitted through the through portion. The cover 422 is a ring-shaped sleeve structure, and the penetrating part is a funnel cone surface. The funnel cone surface is plated with a reflective layer 424, such as a layer or a flip layer, for reflecting the lens sheet 42. The scattered light increases the intensity of the light source. After daring, a light-transmitting sheet 426 is set on the upper end of the cover 422, 12 M266548 is used as a top surface, and the exit of the penetration part is closed. From the above, the high-power light-emitting diode lamp 400 of this embodiment has simple economic components and is easy to manufacture and assemble, so it has economic value. In this embodiment, because the base 408 has conductivity, the whole can be regarded as a columnar wire. When conducting, the resistance is inversely proportional to the cross-sectional area of the wire, so the base 408 has a low resistance value. , The smaller the resistance value will be. The heat generated when the high-power light-emitting diode chip 410 emits light will be conducted to the heat sink 404 through the base 408, and then the heat from the surface of the heat sink 404 to the space 428 between the lamp socket sleeve 416 and the heat sink 404. Finally, it exhausts heat to the outside air to achieve heat dissipation. Referring to FIG. 4A, the heat sink 404 may be composed of a plurality of heat sink blades connected in series. As the number of heat sink leaves-the more, the larger the surface area in contact with the air as a whole, so the better the heat dissipation effect. In addition, when designing the lamp, the space 428 existing between the lamp holder sleeve 416 and the heat sink 404 can be appropriately enlarged, so as to increase the circulation with the outside air and improve the heat removal effect. The base 408, the groove 402, the heat sink 404, and the contact point 406 can be formed simultaneously in an integrated manner. For example, it can be stamped or extruded, and the material can be selected from materials with thermal and electrical conductivity, such as Copper or Ming. As mentioned above, referring to Figure 4A again, in terms of the overall appearance and operation mode of the lamp device, the high-power light-emitting diode lamp 400 of this embodiment can be regarded as a light-bulb light-emitting diode lamp. The point 406 and the two lead tabs (conductive horns) make electrical contact with the outside world. Figures 5A and 5B are schematic diagrams of the combined operation with external hardware equipment. The fifth figure A is a top view of the high-power light-emitting diode lamp 400 before the combination with the external device 502, and the fifth figure B is a side view 13 M266548 after the combination. It can be seen that the high-power light-emitting diodes 4 and 400 can be easily fixed to the application hardware by rotating and engaging. It has the advantages of dreaming and unloading, and its application scope covers the parent signal light and electronic signboard. And other lighting equipment. Here, in particular-comparison, the first-the implementation of the lens «Layer 418 after the shaft seal« and then set a lens sheet 420 on it, the purpose is to change or replace different lens sheet forms to achieve different light-concentrating function effects Or require, and the function of the package county 418 is to fix and protect the element, and at the same time have the ability of transparent button. However, it is proposed here that the second embodiment of this creation, as shown in Figure 4c, is formed in the first embodiment when the package winning layer 418 is formed above the lamp socket sleeve 416, and it is directly formed into- The shape of the light condensing function is as shown in the encapsulating adhesive layer 418 shown in FIG. 4c, that is, the encapsulating adhesive layer 418 itself is a lens sheet. The third embodiment of this creation, as shown in FIG. 6A, the overall device structure and assembly method are similar to the first embodiment. The difference is that the conductive frame 612 of this high-power light-emitting diode lamp is composed of It is composed of two metal sheets, and the outer surface of the tube of the lamp holder sleeve 6 16 is designed to have a threaded portion, and two guide pieces (conducting horns in the foregoing embodiment are called protruding horns) protruding from the outer surface of the lamp holder sleeve 616 tube. ), It is closely attached to the threaded portion of the outer surface of the socket 616. To form a lamp socket sleeve with a threaded surface, it is only necessary to change its injection module during the injection molding of the lamp socket sleeve 616, so the production is easy. In this embodiment, the mechanism part composed of the lamp socket sleeve 616, the guide contact point 606 and the exposed guide piece has the function of a conventional screw-shaped steel head of a conventional light bulb, and can be directly screwed into the light bulb screw socket. Inside. 14 M266548 Therefore, the same-power light-emitting diode lamps 6. . In addition to being easy to install and replace, it has a high degree of substitution and compatibility with conventional, pre-packaged products, and has a wide range of lighting applications. In addition to the above characteristics, the high-power light-emitting diode lamp 600 of this embodiment also has the advantages of the aforementioned fourth-real-field lamp 4 Q 〇: under the same lighting power requirements, its body is more traditional than the bulb type Light-emitting diode lamps are small and have good. Good heat dissipation effect = Hours: The components of the overall lamp are simple, easy to assemble, and have economic value. The special lamps in this creation are not limited to high-power light-emitting diodes, and even any materials, such as power sources, can be used in this creation. Device. Promote the lamp, please describe it to help explain this creation. Of course, the example in this article is not a matter of paperwork. Lou ^ ^ Ming Xie Ding "Han Yujia's embodiment is specifically described as two :: those who know this technology should be able to understand and implement, other equivalent changes or modifications without departing from the details of this invention, All should be included in the following patent scope [Simplified description of the drawings] The first picture is a schematic diagram of a bulb-type light-emitting diode lamp; the second picture is the practice of using an aluminum substrate to dissipate heat-^ ^ Schematic diagram of LED light fixtures; -Schematic diagram of polar light fixtures; one picture series-the conventional team-type high-power light emission using heat sink _ 15 M266548 Fourth A _ this _ first-embodiment of the high-resolution light-emitting second A cross-sectional view of a bribery tool; Figure 4B is a side view that rotates the high-power light-emitting diode lamp of Figure 4A by 9 q degrees; Section ®C_ is a high-power material diode that is the second practical point of this creative towel. Sectional view of the body lamp; Fifth A _ is the top view of the creative shot No. 1-Shiguan ’s high-resolution light-emitting diode bridging device and the outside before the split; A cross-sectional view of the light-emitting diode ship after being combined with the external device; ° The sixth illustration is the third embodiment in this creation A cross-sectional view of a high-power light-emitting diode lamp; and FIG. 6B is a side view of the high-power light-emitting diode lamp of the third embodiment in the creation. [Description of Symbols of Main Components] 10 0 Light-emitting diode lamp 10 2 Lamp holder 10 4 Printed circuit board 10 6 Light emitting diode 10 8 Capacitor 110 Diode 1 1 2 Copper head 114 Leading point 116 Glass cover 2 0 0 Horizontal high power light emitting diode lamp 2 0 2 Base 2 0 4 Copper base 2 0 6 Lead frame 2 0 8 Light-emitting diode chip 2 10 Wire 2 12 Encapsulant 2 1 4 Nameplate 2 16 Printed circuit board 3 0 0 Horizontal high-power light-emitting diode lamp 3 0 2 Heat sink 3 0 4 Printed circuit board M266548 3 0 6 Light emitting diode chip 3 0 8 Copper base 4 0 0 Bulb type high power light emitting diode lamp 4 0 2 Groove 4 0 4 Heat sink 4 0 6 Leading contact 4 0 8 Base 4 10 Light-emitting diode wafer 4 1 2 Lead frame 4 14 Lead 4 1 6 Lamp holder sleeve 4 18 Sealant 4 2 0 Lens 4 2 2 Cover 4 2 4 Reflective layer 4 2 6 Light transmission Sheet 4 2 8 Cooling space 5 0 2 External device 6 0 0 Bulb type high power light emitting diode Lamps 612 lead frame 616 base sleeve 17