CN103047555B - LED lamp having dissipating base material - Google Patents
LED lamp having dissipating base material Download PDFInfo
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- CN103047555B CN103047555B CN201110431846.7A CN201110431846A CN103047555B CN 103047555 B CN103047555 B CN 103047555B CN 201110431846 A CN201110431846 A CN 201110431846A CN 103047555 B CN103047555 B CN 103047555B
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- Prior art keywords
- metal
- heat radiating
- radiating material
- luminescence unit
- led light
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
A LED lamp is disclosed which is composed of a plurality of light unit, each of the light unit has metal its leads inserted into a heat sink for heat dissipation. A circuit board is optionally to use for electrically coupling the metal leads of each light unit to a control circuit for controlling the on/off of each of the light units.
Description
Technical field
The present invention relates to a kind of LED light lamp.
Background technology
As shown in Figure 1, US Patent No. 7,434,964B1 discloses a kind of LED light lamp on October 14th, 2008, and it is arranged on the periphery of a heat radiating material 30 with light-emitting diode (LED) module (LED module).Light-emitting diode (LED) module system is wherein placed in the front of circuit board 52 by many light emitting diodes 54, many heat pipes (heat pipe) 40 are placed in the inside of heat radiating material 30, a bowl-shape lid 20 is placed in the bottom of heat radiating material 30, and a lamp holder 10 is placed in the below of bowl-shape lid 20.
Above-mentioned common LED lamp body amasss huge and weight is relatively heavier, with high costs and make complicated.One lighter, make easily and radiating effect preferably light fixture product is extremely to be developed.
Summary of the invention
For the above-mentioned deficiency of prior art, technical problem to be solved by this invention is that proposition one is light, making is easy, and radiating effect preferably has the LED light lamp of heat radiating material.
A kind of LED light lamp that the present invention provides for solving its technical problem, comprise luminescence unit, its innovative point is, this luminescence unit comprises the first metal and the second metal, luminescence chip, packing colloid, lens and heat radiating material, and luminescence chip is placed in the upper end of the first metal; Packing colloid parcel luminescence chip and the first metal and bimetallic upper end; Lens are arranged at before luminescence chip; Heat radiating material is attached at the first metal and bimetallic lower end.
The another kind of LED light lamp that the present invention provides for solving its technical problem, comprise luminescence unit, its innovative point is, this luminescence unit comprises the first metal, the second metal, metal base, luminescence chip, the first wire, the second wire, packing colloid, lens and heat radiating material, and the first metal is parallel with the second metal; Metal base is placed in below the first metal and the second metal; Luminescence chip is placed on metal base; First electrode of luminescence chip is electrically coupled to the first metal by the first wire; Second electrode of luminescence chip is electrically coupled to the second metal by the second wire; The upper end of packing colloid parcel luminescence chip, the first metal, bimetallic lower end and metal base; Lens are placed in luminescence chip front; Heat radiating material is attached at metal base.
Another LED light lamp that the present invention provides for solving its technical problem, its innovative point is, comprises heat radiating material, lower floor's centre gangway, slot and luminescence unit, and heat radiating material has internal layer ringwall and outer ringwall; Lower floor's centre gangway is arranged at internal layer ringwall center; Slot is arranged between internal layer ringwall and outer ringwall; Luminescence unit has metal leg, and metal leg is solidly plugged in slot.
Another LED light lamp that the present invention provides for solving its technical problem, its innovative point is, comprises heat radiating material, lower floor's centre gangway, slot and luminescence unit, and heat radiating material has internal layer ringwall and outer ringwall; Lower floor's centre gangway is arranged at internal layer ringwall center; Slot is arranged between internal layer ringwall and outer ringwall; Luminescence unit has metal base, and metal base is solidly plugged in slot.
Another LED light lamp that the present invention provides for solving its technical problem, its innovative point is, comprises heat radiating material, two jacks and luminescence unit, and two jacks are arranged at heat radiating material, and with the central shaft of heat radiating material to parallel; Luminescence unit has the first metal leg and the second metal leg, and the first metal leg and the second metal leg are solidly plugged in jack respectively.
Relative to prior art, the heat radiating material of LED light lamp of the present invention has slot or shrinkage pool, and provide the metal leg of luminescence unit to insert fixing use, heat radiating material outer wall is exposed in air, is convenient to the heat of luminescence unit to be distributed to light fixture outside.
Accompanying drawing explanation
Fig. 1 is the structural representation of common luminescent diode lights.
Fig. 2 A ~ 2B is the structural representation of luminescence unit embodiment one of the present invention.
Fig. 3 A ~ 3C is the structural representation of the strong heat radiating material of ring of the present invention.
Fig. 4 is the structural representation of LED light lamp embodiment one of the present invention.
Fig. 5 A ~ 5B is the structural representation of LED light lamp embodiment two of the present invention.
Fig. 6 A ~ 6B is the structural representation of LED light lamp embodiment three of the present invention.
Fig. 7 is the structural representation of LED light lamp embodiment four of the present invention.
Fig. 8 A ~ 8B is the structural representation of LED light lamp embodiment five of the present invention.
Fig. 9 A ~ 9D is the structural representation of LED light lamp embodiment six of the present invention part assembly.
Figure 10 A ~ 10B is the structural representation of LED light lamp embodiment six of the present invention.
Figure 11 is LED light lamp embodiment seven explosive view of the present invention.
Figure 12 is the structural representation of LED light lamp embodiment seven of the present invention.
Figure 13 A ~ 13B is the structural representation of LED light lamp embodiment eight of the present invention.
Figure 14 A ~ 14B is the structural representation of LED light lamp embodiment nine of the present invention.
Figure 15 A ~ 15B is the structural representation of luminescence unit embodiment two of the present invention.
Figure 16 A ~ 16B is the structural representation of luminescence unit embodiment three of the present invention.
Figure 17 A ~ 17C is the exploded view of LED light lamp embodiment ten of the present invention.
Figure 18 A ~ 18B is the structural representation of luminescence unit embodiment four of the present invention.
Figure 19 A ~ 19B is the structural representation of luminescence unit embodiment five of the present invention.
Figure 20 A ~ 20C is the exploded view of LED light lamp embodiment 11 of the present invention.
Figure 21 A ~ 21C is the exploded view of LED light lamp embodiment 12 of the present invention.
Figure 22 A ~ 22C is the exploded view of LED light lamp embodiment 13 of the present invention.
Figure 23 A ~ 23C is the structural representation of the part assembly of LED light lamp embodiment 14 of the present invention.
Figure 24 A ~ 24C is the structural representation of the part assembly of LED light lamp embodiment 15 of the present invention.
Wherein: 21 is the first flat metal pin; 23 is the second flat metal pin; 608,609 is luminescence unit; 62 is flexible circuit board; 62B is rigid circuit board; 621 is through hole; 66 is lamp screw base; 663,6631 is luminescence chip; 664 is metal wire; 703 is dress colloid; 72 is lens; 914 is ringwall heat radiating material; 914S is heat radiating material inner surface; 914P is the material that is electrically insulated; 917,917E, 917G, 917K are heat radiating material; 917A is internal layer ringwall; 917B is outer ringwall; 917C is heat radiating material; 917D is the inwall of internal layer ringwall; 918 is slot; 919 is rigid circuit board; 919C is wire; 919R is through hole; 962 is ball-type printing opacity protecting cover; 1009,1009B is luminescence unit; 1019,1019B is luminescence unit; 1021,1023 is metal leg; 1021A, 1023A are arched arm; 1021F, 1023F are planar metal; 1024,1025 is metal leg; 1101,1101B is printing opacity protecting cover; 1102 is pipeline ring wall; 1103 is centre gangway; 1103B is centre gangway; 1103F is central opening; 1104 is through hole; 1105A, 1105B are bending projection; 1106A, 1106B are groove; 1121B, 1123B are curved boom; 1121,1123 is metal leg; 1121F, 1123F are planar metal; 1031 is metal base; 1041,1042 is metal wire.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, set forth the present invention further.These embodiments are interpreted as only being not used in for illustration of the present invention limiting the scope of the invention.After the content of having read the present invention's record, those skilled in the art can make various changes or modifications the present invention, and these equivalence changes and modification fall into the scope of the claims in the present invention equally.
Fig. 2 A ~ 2B is luminescence unit embodiment one of the present invention.
Fig. 2 A shows the structure of the lead frame of a pair luminescence unit 608, and each unit wherein has the first flat metal pin 21 and the second flat metal pin 23 parallel to each other.Luminescence chip 663 has bottom-side electrodes and pastes and the upper end being electrically coupled to the first flat metal pin 21.The surface electrode of luminescence chip 663 is electrically coupled to the second flat metal pin 23 by metal wire 664.When the first flat metal pin 21 and the second flat metal pin 23 are energized, luminescence chip 663 can be lit.
Fig. 2 B shows luminescence chip 663, metal wire 664, the first flat metal pin 21 that packing colloid 703 has wrapped up Fig. 2 A, and the upper end of the second flat metal pin 23, forms luminescence unit 608.Lens 72 are arranged at before luminescence chip 663, in order to modify the emergent ray of luminescence chip 663.Ringwall heat radiating material 914 prepares the lower end being attached at the first flat metal pin 21 and the second flat metal pin 23, provides radiating effect.The preparation of the first flat metal pin 21 and the second flat metal pin 23, traditional lead frame (lead frame) processing procedure can be adopted to make it, under this processing procedure, the front-surface that the first flat metal pin 21 has a front-surface and the second flat metal pin 23 is copline.
Fig. 3 A ~ 3C is ringwall heat radiating material when implementing of the present invention.
Fig. 3 A shows luminescence unit 608 and has metal leg 21 and 23, is attached at the schematic perspective view of ringwall heat radiating material 914 inner surface 914S.
Fig. 3 B shows the AA ' profile of Fig. 3 A, and the ringwall heat radiating material 914 that Fig. 3 B shows is made by ceramic material, and the first flat metal pin 21 of luminescence unit 608 and the second flat metal pin 23 are attached at ringwall heat radiating material 914 inner surface 914S.The heat that luminescence unit 608 produces when lighting conducts to ringwall heat radiating material 914 via metal leg 21 and 23 and is dissipated into light fixture outside.
Fig. 3 C shows another embodiment of AA ' profile of Fig. 3 A, the ringwall heat radiating material 914M that Fig. 3 C shows can be made of metal, the material 914P that is electrically insulated is arranged on ringwall heat radiating material inner surface 914S, first flat metal pin 21 of luminescence unit 608 and the second flat metal pin 23 are attached at the material 914P that is electrically insulated, and the first flat metal pin 21 and the second flat metal pin 23 are electrically insulated with metal ringwall heat radiating material.
Fig. 4 is LED light lamp embodiment one of the present invention.
Fig. 4 shows ball-type printing opacity protecting cover 962 and is arranged on above heat radiating material 914, and luminescence unit 608 is attached at ringwall heat radiating material 914 inner surface 914S.Ball-type printing opacity protecting cover 962 wraps up luminescence unit 608 and makes not by the pollution of external dust.Lamp screw base 66 is arranged on below heat radiating material 914, and bulb can be spun solid in traditional Edison base (not indicating in figure).
Fig. 5 A ~ 5B is LED light lamp embodiment two of the present invention.
Fig. 5 A shows the making example of a pair luminescence unit 609, the first metal leg 1024 and the second metal leg 1025 arranged parallel, and metal base 1031 is placed in below the first metal leg 1024 and the second metal leg 1025; Luminescence chip 6631 is placed in metal base 1031 upper end.Luminescence chip 6631 first surface electrode is electrically coupled to the first metal leg 1024 lower end by the first metal wire 1041, and luminescence chip 6631 second surface electrode is electrically coupled to the second metal leg 1025 lower end by the second metal wire 1042.
Fig. 5 B shows metal base 1031 upper end, luminescence chip 6631, first metal wire 1041, second metal wire 1042 that packing colloid 703 has wrapped up Fig. 5 A, and the lower end of the first metal leg 1024 and the second metal leg 1025, forms luminescence unit 609.Lens 72 are arranged at before luminescence chip 6631, in order to modify the direction of emergent ray.Heat radiating material 914 prepares to be attached at exposed metal base 1031, provides radiating effect.When first metal wire 1041 and the second metal wire 1042 are energized, luminescence chip 6631 can be lit.The heat that luminescence chip 6631 produces when lighting, conducts to heat radiating material 914 via metal base 1031 and dispels the heat.
Fig. 6 A ~ 6B is LED light lamp embodiment three of the present invention
Fig. 6 A shows ringwall heat radiating material 914 and has inner surface 914S and outer surface, and the metal base 1031 of luminescence unit 609 is attached at the inner surface 914S of ringwall heat radiating material.
Fig. 6 B shows the BB ' profile of Fig. 6 A, and the ringwall heat radiating material 914 that Fig. 6 B shows is made by ceramic material, and the metal base 1031 of luminescence unit 609 is attached at ringwall heat radiating material 914 inner surface 914S.
Fig. 7 is LED light lamp embodiment four of the present invention
Fig. 7 shows ball-type printing opacity protecting cover 962 and is arranged on above ringwall heat radiating material 914, and the metal base 1031 of luminescence unit 609 is attached at ringwall heat radiating material 914 inner surface 914S.Ball-type printing opacity protecting cover 962 wraps up luminescence unit 609 and makes not by the pollution of external dust.Lamp screw base 66 is arranged on below ringwall heat radiating material 914, and bulb can be spun solid in traditional Edison base.A slice flexible circuit board 62 is attached at metal leg 1024 and 1025, circuit first end above circuit board 62 is electrically coupled to metal leg 1024 and 1025 respectively, second end is electrically coupled to control unit (not indicating in figure), so that control unit can control lighting and extinguishing of each luminescence unit 609 respectively.
Fig. 8 A ~ 8B is LED light lamp embodiment five of the present invention
Fig. 8 A shows the use of the rigid circuit board 62B of a slice, rigid circuit board 62B has through hole 621 provides metal leg 1024 and 1025 to insert and electrical couplings use, and circuit 622 electrical couplings inserts the metal leg 1024 and 1025 of through hole 621 to control unit (not indicating in figure).
Fig. 8 B display circuit board 62B has multiple through hole 621 and corresponds respectively to metal leg 1024 and 1025 position, provides metal leg 1024 and 1025 to insert electrical couplings and uses.Wire 622 first end is electrically coupled to through hole 621, and the second end is electrically coupled to control unit (not indicating in figure).
Fig. 9 A ~ 9D is LED light lamp embodiment six of the present invention part assembly
Fig. 9 A shows an ellipse printing opacity protecting cover 1101, and central authorities have pipeline ring wall 1102, forms centre gangway 1103, and there is an opening conducting centre gangway 1103 upper end to outside.
Fig. 9 B is the CC ' profile of Fig. 9 A, has a space S P between the outer shroud of display protecting cover 1101 and center tube ring wall 1102.
Fig. 9 C shows ringwall heat radiating material 917 and has internal layer ringwall 917B and outer ringwall 917A, and a slot 918 is formed between internal layer ringwall 917B and outer ringwall 917A; A centre gangway 1103B is formed at the center of internal layer ringwall 917B, by the inwall 917D of internal layer ringwall 917B around being formed.The below that through hole 1104 is placed in heat radiating material 917 is communicated in centre gangway 1103B, is conducted in centre gangway 1103B lower end and outside.A lamp screw base 66 is placed in below heat radiating material 917.Cold air can enter from through hole 1104, and centre gangway 1103 upper opening through ringwall heat radiating material centre gangway 1103B, protecting cover 1101 is gone out, and the carry heat of heat radiating material 917 can be gone out.
Fig. 9 D is the DD ' profile of Fig. 9 C, and display ringwall heat radiating material 917 has internal layer ringwall 917B and outer ringwall 917A, and a slot 918 is formed between internal layer ringwall 917B and outer ringwall 917A; A centre gangway 1103B is formed at the center of internal layer ringwall 917B, by the inwall 917D of internal layer ringwall 917B around being formed.
Figure 10 A ~ 10B is LED light lamp embodiment six of the present invention.
Figure 10 A is the assembly exploded view of LED light lamp embodiment six of the present invention, shows luminescence unit 608 and have metal leg in figure, prepares to be solidly plugged in slot 918 downwards, and top protecting cover 1101 prepares to fix with the heat radiating material 917 of below to combine.
Figure 10 B is that the assembling components of Figure 10 A completes figure, shows protecting cover 1101 and make not pollute by external dust with space S P parcel luminescence unit 608 in figure.The heat that luminescence unit 608 produces, conducts to ringwall heat radiating material 917 via metal leg; Cold air enters from through hole 1104, through centre gangway 1103B and 1103, then is gone out by centre gangway 1103 upper opening, the carry heat of heat radiating material 917 can be gone out.
Figure 11 is LED light lamp embodiment seven explosive view of the present invention.
Figure 11 is LED light lamp embodiment seven assembly exploded view of the present invention, and structure and Fig. 7 of Figure 11 are similar, and only have the heat radiating material 917 of printing opacity protecting cover shape and below different, all the other structures are identical.Figure 11 shows luminescence unit 609 and has metal base 1031, and metal base 1031 is solidly plugged in the slot 918 of ringwall heat radiating material 917, and top printing opacity protecting cover 1101 is combined with the heat radiating material 917 of below.
Figure 12 is LED light lamp embodiment seven of the present invention.
Figure 12 is that the assembling components of Figure 11 completes figure, and luminescence unit 609 is solidly plugged in the slot 918 of heat radiating material 917 with lower end metal base 1031.Printing opacity protecting cover 1101 fixes with the heat radiating material 917 of below and combines.Printing opacity protecting cover 1101 surrounds luminescence unit 609 and makes not by the pollution of external dust.
Figure 13 A ~ 13B is LED light lamp embodiment eight of the present invention.
Figure 13 A is the top view of Figure 13 B, and seemingly, only have printing opacity protecting cover different, all the other principles are identical with Figure 10 B for Figure 13 B and Figure 10 category-B.The printing opacity protecting cover 1101B of Figure 13 A is baked donut shape, and central authorities are provided with opening 1103F.
The arc two ends of Figure 13 B display transparent protecting cover 1101B have bending projection, and upper end bending projection 1105A is snapped in internal layer ringwall 917B upper recess 1106A, and lower end bending projection 1105B is snapped in outer ringwall 917A upper recess 1106B.The height of outer ringwall 917A is lower than internal layer ringwall 917B, and this difference in height provides the arrangement of printing opacity protecting cover 1101B.The central opening 1103F of printing opacity protecting cover 1101B and the centre gangway 1103B of heat radiating material 917E is conducted.A through hole 1104 is placed in the below of heat radiating material 917E, and cold air can enter from through hole 1104, through centre gangway 1103B, then goes out via the central opening 1103F of top printing opacity protecting cover, the carry heat of heat radiating material 917E can be gone out.
Figure 14 A ~ 14B is LED light lamp embodiment nine of the present invention.
Figure 14 A is the profile of Figure 14 B along FF ', and Figure 14 A shows centre gangway 1103B and is manufactured with multi-disc radiating fin 1108 in centre gangway 1103B, increases radiating effect.
Figure 14 B shows radiating fin 1108 and extends to centre gangway 1103B from internal layer ringwall 917B.When cold air upwards flows through centre gangway 1103B by below, can more effectively the heat of heat radiating material 917E be taken away.
Figure 15 A ~ 15B is luminescence unit embodiment two of the present invention.
Figure 15 B is the top view of Figure 15 A, Figure 15 B show luminescence chip 663 ride on the first planar metal 1021F and the second planar metal 1023F, arched arm 1021A and 1023A bending forward with light source in the same way.
Figure 15 A display luminescence unit 1009 has the first metal leg 1021 and there is the first planar metal 1021F on the second metal leg 1023, first metal leg top, and there is the second planar metal 1023F on the second metal leg top; The forward plane of the first planar metal 1021F and the forward plane of the second planar metal 1023F are copline, and luminescence chip 663 rides on the first planar metal 1021F and the second planar metal 1023F.First metal leg 1021 the right and left respectively have one arched arm 1021A bend forward with light source in the same way, second metal leg 1023 the right and left respectively have one arched arm 1023A bend forward with light source in the same way.When the first metal leg 1021 and the second metal leg 1023 are energized, luminescence chip 663 can be lit.
Figure 16 A ~ 16B is luminescence unit embodiment three of the present invention.
From Figure 15 A difference, Figure 16 A is only that the overbending direction of arched arm is different, all the other structures are identical.Figure 16 B is the top view of Figure 16 A, and Figure 16 B shows luminescence chip 663 and rides in the first planar metal 1021F and the second planar metal 1023F back side, and arched arm 1021A, 1023A bending is backward away from light source.Figure 16 A display luminescence unit 1009B has the first metal leg 1021 and there is the first planar metal 1021F on the second metal leg 1023, first metal leg top, and there is the second planar metal 1023F on the second metal leg top; First planar metal 1021F and the second planar metal 1023F is copline, and luminescence chip 663 rides on the first planar metal 1021F and the second planar metal 1023F.First metal leg 1021 the right and left respectively has an arched arm 1021A to bend backward away from light source, and second metal leg 1023 the right and left respectively has an arched arm 1023A to bend backward away from light source.When the first metal leg 1021 and the second metal leg 1023 are energized, luminescence chip 663 can be lit.
Figure 17 A ~ 17C is the exploded view of LED light lamp embodiment ten of the present invention.
Figure 17 A display has the luminescence unit 1009 of arched arm metal leg and 1009B is employed.
Figure 17 B is that ringwall heat radiating material 917G is placed on lamp screw base 66.
Figure 17 C shows the heat radiating material 917G of Figure 17 B along GG ' profile, Figure 17 C shows multiple circular shrinkage hole 918B and is arranged at a circle in the middle of heat radiating material 917G, correspond respectively to the arched arm metal leg 1021 and 1023 of luminescence unit 1009 and 1009B, so that the metal leg of luminescence unit 1021 and 1023 can correspondingly be inserted solid, form LED light lamp.Heat radiating material 917G can be made up of ceramic material.Heat radiating material 917G also can be made up of metal material, and now, the through hole hole wall of heat radiating material 917G, coating insulating materials (not indicating in figure), makes to be able to maintenance between metal base and slotting solid metal leg and be electrically insulated.
Figure 18 A ~ 18B is luminescence unit embodiment four of the present invention.
Figure 18 B is the top view of Figure 18 A.It is rectangle that Figure 18 B shows the bent over arms 1121B of luminescence unit 1019 and the shape of 1123B, rectangular bent arm 1121B and 1123B bend forward with light source in the same way.
Figure 18 A and Figure 15 A difference are only curved boom shape, and all the other structures are identical.Figure 18 A shows the Facad structure of luminescence unit 1019, and luminescence chip 663 rides in planar metal 1121F and 1123F.Figure 18 A display luminescence unit 1019B has the first metal leg 1121 and there is the first planar metal 1121F on the second metal leg 1123, first metal leg top, and there is the second planar metal 1123F on the second metal leg top; Luminescence chip 663 rides on the first planar metal 1121F and the second planar metal 1123F.
Figure 19 A ~ 19B is luminescence unit embodiment five of the present invention.
Figure 19 B is the top view of Figure 19 A, and Figure 19 B shows luminescence chip 663 and rides on the first planar metal 1021F and the second planar metal 1023F, and rectangular bent arm 1021B and 1023B bends backward away from light source.
From Figure 18 A difference, Figure 19 A is only that the overbending direction of arched arm is different, all the other structures are identical.Figure 19 A display luminescence unit 1019B has the first metal leg 1121 and there is the first planar metal 1121F on the second metal leg 1123, first metal leg top, and there is the second planar metal 1123F on the second metal leg top; Luminescence chip 663 rides on the first planar metal 1121F and the second planar metal 1123F.
Figure 20 A ~ 20C is the exploded view of LED light lamp embodiment 11 of the present invention.
The difference of Figure 20 A ~ 20C and Figure 17 A ~ 17C is only that the concave hole type shape of ringwall heat radiating material is different, and all the other structures are identical.Figure 20 A display has the luminescence unit 1019 of rectangular bent arm and 1019B is employed.
Figure 20 B is that ringwall heat radiating material 917C is placed on lamp screw base 66.
Figure 20 C shows Figure 20 B along HH ' profile, Figure 20 C shows multiple rectangular 917R and is arranged at a circle in the middle of ringwall heat radiating material 917C, correspond respectively to the rectangular bent arm metal leg 1121 and 1123 of luminescence unit 1019 and 1019B, so that the rectangular bent arm metal leg 1121 and 1123 of luminescence unit can correspondingly be inserted solid, form LED light lamp.Heat radiating material 917C can be made up of ceramic material; Heat radiating material 917C also can be made up of metal material, and now, the through hole hole wall of heat radiating material 917C, coating insulating materials (not indicating in figure), makes metal base be able to holding with slotting solid metal leg and be electrically insulated.
Figure 21 A ~ 21C is the exploded view of LED light lamp embodiment 12 of the present invention.
Figure 21 A shows a slice flexible circuit board 62 and can be used, and is electrically coupled to the metal leg of luminescence unit 1019 and 1019B, and can controls lighting and extinguishing of each luminescence unit respectively.Figure 21 B is identical with Figure 20 B, and Figure 21 C is identical with Figure 20 C.
Figure 22 A ~ 22C is the exploded view of LED light lamp embodiment 13 of the present invention.
Figure 22 A shows the rigid circuit board 919 of a slice and can be used, and rigid circuit board 919 has rectangular through-hole 919R and corresponds respectively to rectangular bent arm metal leg 1121 and 1123 position, provides metal leg to insert electrical couplings and uses.Rigid circuit board 919 has wire 919C first end and is electrically coupled to through hole 919R, and the second end is electrically coupled to control unit (not indicating in figure).Figure 22 B is identical with Figure 21 B, and Figure 22 C is identical with Figure 21 C.
Figure 23 A ~ 23C is the part assembly of LED light lamp embodiment 14 of the present invention.
Figure 23 A shows the rigid circuit board 919 of a slice and can be used, and rigid circuit board 919 has rectangular through-hole 919R and corresponds respectively to metal leg 1121 and 1123 position, provides metal leg to insert electrical couplings and uses.Rigid circuit board 919 has circuit 919C first end and is electrically coupled to the metal leg inserting through hole, and the second end is electrically coupled to control unit (not indicating in figure).
Figure 23 B shows rigid circuit board 919 and is placed in above heat radiating material 917K, and lamp screw base 66 is placed in below heat radiating material 917K.Heat radiating material 917K is provided with through hole 917R, provides metal leg to insert and uses.
Figure 23 C is the KK ' profile of Figure 23 B, and display heat radiating material 917K is provided with through hole 917R, and through hole 917R corresponds respectively to the rectangular through-hole 919R of circuit board.
Figure 24 A ~ 24C is the part assembly of LED light lamp embodiment 15 of the present invention.
Figure 24 A shows the rigid circuit board 919 of a slice and can be used, and Figure 24 A is the top view of rigid circuit board 919, and rigid circuit board 919 has rectangular through-hole 919R and corresponds respectively to metal leg 1121 and 1123 position, provides metal leg to insert electrical couplings and uses.Rigid circuit board 919 has circuit 919C first end and is electrically coupled to the metal leg inserting through hole, and the second end is electrically coupled to control unit (not indicating in figure).Figure 24 B shows rigid circuit board 919 and is placed in below heat radiating material 917K, and lamp screw base 66 is placed in below heat radiating material 917K.Heat radiating material 917K is provided with through hole 917R, provides metal leg to insert and uses.Figure 24 C is the top view of Figure 24 B, and display heat radiating material 917K is provided with through hole 917R, and through hole 917R corresponds respectively to the rectangular through-hole 919R of circuit board, provides metal leg 1121 and 1123 to insert and uses.Heat radiating material 917K can be that ceramic material is made; Heat radiating material 917K also can be that metal material is made, and now, the through hole hole wall of heat radiating material 917K, coating insulating materials, makes metal base be able to holding with slotting solid metal leg and be electrically insulated.
Claims (4)
1. a LED light lamp, comprise luminescence unit, it is characterized in that, comprise ringwall shape heat radiating material further, this luminescence unit comprises the first flat metal pin and the second flat metal pin, luminescence chip, packing colloid and lens, and the first flat metal pin has a front-surface; Second flat metal pin has a front-surface, and with the front-surface copline of the first flat metal pin; Luminescence chip is placed in the upper end of the front-surface of the first flat metal pin; The upper end of packing colloid parcel luminescence chip and the first flat metal pin and the second flat metal pin; Lens are arranged at before luminescence chip; Multiple luminescence unit arranges in the form of a ring, and the lower end of the first flat metal pin of each luminescence unit and the front-surface of the second flat metal pin is attached at the inwall of described ringwall shape heat radiating material.
2. LED light lamp as claimed in claim 1, it is characterized in that, heat radiating material is made up of ceramic material.
3. LED light lamp as claimed in claim 1, it is characterized in that, heat radiating material is made up of metal material, and its surface has insulating materials, makes heat radiating material and the first flat metal pin, the metal leg of the second flat metal pin is electrically insulated.
4. LED light lamp as claimed in claim 1, it is characterized in that, comprise printing opacity protecting cover and lamp holder further, this printing opacity protecting cover is placed in the top of heat radiating material, and surrounds luminescence unit; This lamp holder is placed in the below of heat radiating material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/270,582 US8931924B2 (en) | 2011-10-11 | 2011-10-11 | Heat sink for LED lamp |
| US13/270,582 | 2011-10-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103047555A CN103047555A (en) | 2013-04-17 |
| CN103047555B true CN103047555B (en) | 2014-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110431846.7A Expired - Fee Related CN103047555B (en) | 2011-10-11 | 2011-12-21 | LED lamp having dissipating base material |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8931924B2 (en) |
| CN (1) | CN103047555B (en) |
| TW (1) | TWI464345B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3047200B1 (en) * | 2013-09-16 | 2018-02-07 | Express Imaging Systems, LLC | Solid-state lighting devices and systems |
| US20150117039A1 (en) * | 2013-10-25 | 2015-04-30 | Kevin Yang | Substrate Gap Mounted LED |
| PL3099974T3 (en) * | 2014-01-29 | 2018-06-29 | Philips Lighting Holding B.V. | Led bulb |
| TW201721053A (en) * | 2015-12-02 | 2017-06-16 | 羅冠傑 | Shell integrated light-emitting diode, assembly and manufacturing method thereof |
| CN111156432A (en) * | 2020-02-11 | 2020-05-15 | 葛铁汉 | All-round light-emitting lampshade and have bulb of this lamp shade |
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- 2011-12-19 TW TW100147031A patent/TWI464345B/en active
- 2011-12-21 CN CN201110431846.7A patent/CN103047555B/en not_active Expired - Fee Related
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| TWM266548U (en) * | 2004-08-12 | 2005-06-01 | Chang I Ming | Light emitting diode lamp |
| CN101144592A (en) * | 2006-09-13 | 2008-03-19 | 海立尔股份有限公司 | Inserter type thermoelectric separation type LED lamp bulb structure possessing heat radiator |
| TW200907241A (en) * | 2007-08-09 | 2009-02-16 | Tai You Entpr Co Ltd | Light emitting diode lamp having heat dissipation module and its lamp holder structure |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103047555A (en) | 2013-04-17 |
| US8931924B2 (en) | 2015-01-13 |
| US20130088875A1 (en) | 2013-04-11 |
| TW201315936A (en) | 2013-04-16 |
| TWI464345B (en) | 2014-12-11 |
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