JPH08162673A - Light emitting diode lamp - Google Patents
Light emitting diode lampInfo
- Publication number
- JPH08162673A JPH08162673A JP29765594A JP29765594A JPH08162673A JP H08162673 A JPH08162673 A JP H08162673A JP 29765594 A JP29765594 A JP 29765594A JP 29765594 A JP29765594 A JP 29765594A JP H08162673 A JPH08162673 A JP H08162673A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- led
- emitting diode
- terminal
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、発光ダイオードランプ
に関し、特にプリント基板と平行方向に光を照射する発
光ダイオードランプに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp that emits light in a direction parallel to a printed circuit board.
【０００２】[0002]
【従来の技術】発光ダイオード（以下ＬＥＤ）は駆動電
圧が低く、応答速度が速く、小型で、かつ動作寿命が長
い等の利点があるので、各種電気機器の表示ランプとし
て使用されている。従来のＬＥＤランプは図５に示すよ
うに、一組のリード端子１，２と、一組のリード端子の
一方のリード端子２の先端部に固着されたＬＥＤ素子３
と、ＬＥＤ素子３と他方のリード端子１とを接続する金
属ワイヤ４と、ＬＥＤ素子３を含むリード端子１，２の
先端を覆う樹脂封止部５とから構成されている。2. Description of the Related Art A light emitting diode (hereinafter referred to as an LED) is used as a display lamp for various electric devices because it has advantages such as low driving voltage, fast response speed, small size, and long operating life. As shown in FIG. 5, a conventional LED lamp has a set of lead terminals 1 and 2 and an LED element 3 fixed to the tip of one lead terminal 2 of the set of lead terminals.
And a metal wire 4 connecting the LED element 3 and the other lead terminal 1, and a resin sealing portion 5 that covers the tips of the lead terminals 1 and 2 including the LED element 3.
【０００３】ＬＥＤランプを電気機器の表示ランプとし
て使用する場合、リード端子１，２をプリント基板６に
対し垂直に挿入し、リード端子１，２に駆動電圧を印加
することでＬＥＤ素子３を発光させて、スイッチのＯＮ
／ＯＦＦや各種インジケータの表示を行っている。When the LED lamp is used as a display lamp of an electric device, the lead terminals 1 and 2 are vertically inserted into the printed circuit board 6 and a drive voltage is applied to the lead terminals 1 and 2, so that the LED element 3 emits light. Let's turn on the switch
/ OFF and various indicators are displayed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、図６に
示すように、上述の構造のＬＥＤランプをプリント基板
６に対し水平方向に光を照射させるには、リード端子
１，２を直角方向にフォーミング加工してプリント基板
６に挿入していたので、組立工程の増加を招いていた。However, as shown in FIG. 6, in order for the LED lamp having the above-mentioned structure to irradiate the printed circuit board 6 with light in the horizontal direction, the lead terminals 1 and 2 are formed at right angles. Since it was processed and inserted into the printed circuit board 6, the number of assembly steps was increased.
【０００５】また、リード端子１，２をフォーミング加
工する場合、樹脂封止部５にできるだけ応力が加わらな
いように、ＬＥＤランプの発光面から一定の距離Ｌを隔
てた位置でフォーミング加工しなければならず、電気機
器が小型化する現在ではそのスペースを確保することが
難しくなってきた。本発明は、上述した問題点に鑑み、
フォーミング加工することなく、プリント基板に対し水
平方向に光を照射できるＬＥＤランプを提供するもので
ある。Further, when the lead terminals 1 and 2 are subjected to the forming process, the forming process should be performed at a position separated from the light emitting surface of the LED lamp by a certain distance L so that the resin sealing portion 5 is not stressed as much as possible. However, it is becoming difficult to secure the space nowadays as electric devices are becoming smaller. The present invention, in view of the above problems,
Provided is an LED lamp capable of irradiating light onto a printed circuit board in a horizontal direction without forming.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記の目的を
達成するために次のような構成をとる。すなわち、請求
項１記載のＬＥＤランプは、一組のリード端子と、前記
一組のリード端子の一方の先端にこのリード端子の長手
方向に沿うように設けられた素子搭載部と、前記素子搭
載部に固着されたＬＥＤ素子と、前記ＬＥＤ素子と他方
のリード端子とを接続する金属ワイヤと、ＬＥＤ素子を
含むリード端子の先端部を覆う樹脂封止部とを具備し、
前記樹脂封止部は半ドーム状の形状を有していることを
特徴とするものである。The present invention has the following constitution in order to achieve the above object. That is, the LED lamp according to claim 1, wherein a pair of lead terminals, an element mounting portion provided at one end of the pair of lead terminals along the longitudinal direction of the lead terminals, and the element mounting. An LED element fixed to the portion, a metal wire that connects the LED element and the other lead terminal, and a resin sealing portion that covers a tip portion of the lead terminal including the LED element,
The resin encapsulation portion has a semi-dome shape.
【０００７】請求項２記載のＬＥＤランプは、請求項１
記載のＬＥＤランプにおいて、前記素子搭載部に凹部が
形成されていることを特徴とするものである。The LED lamp according to claim 2 is the LED lamp according to claim 1.
In the LED lamp described above, a recess is formed in the element mounting portion.
【０００８】[0008]
【作用】本発明によれば、リード端子の先端にこのリー
ド端子の長手方向に沿うように素子搭載部を設けてＬＥ
Ｄ素子を固着し、しかもＬＥＤ素子を覆う樹脂封止部の
形状を半ドーム状としているので、プリント基板に対し
平行方向の光をフォーミング加工をせずにプリント基板
に垂直に挿入するだけ得られ、しかも、樹脂封止部のレ
ンズ効果により効率よく照射させることができる。According to the present invention, the element mounting portion is provided at the tip of the lead terminal so as to extend along the longitudinal direction of the lead terminal.
Since the D element is fixed and the resin encapsulation that covers the LED element has a semi-dome shape, light parallel to the printed circuit board can be obtained by inserting it vertically into the printed circuit board without performing the forming process. In addition, the lens effect of the resin sealing portion enables efficient irradiation.
【０００９】また、素子搭載部に設けた凹部が反射板と
しての役割を果たすので、さらに効率よく光を照射する
ことができる。Further, since the concave portion provided in the element mounting portion functions as a reflection plate, it is possible to irradiate light more efficiently.
【００１０】[0010]
【実施例】以下、本発明の実施例を、図１を参照しつつ
説明する。尚、従来と同一部分や相当部分には同一の符
号を付している。図１に示すように、本発明のＬＥＤラ
ンプは、半田メッキ等された少なくとも一組の金属製の
リード端子１，２と、この一組のリード端子１，２の一
方のリード線２の先端にこのリード端子の長手方向に沿
うように設けられた素子搭載部７と、この素子搭載部７
に固着されたＧａＰ，ＧａＡｓ等のからなるＬＥＤ素子
３と、ＬＥＤ素子３と他方のリード端子２とを電気的に
接続する金やアルミニウム等からなる金属ワイヤ４と、
ＬＥＤ素子３を含むリード端子の先端部を覆う透明また
は半透明の樹脂、例えばエポキシ樹脂からなる樹脂封止
部５とを具備し、樹脂封止部５の形状を半ドーム状とし
ている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG. Incidentally, the same reference numerals are given to the same or corresponding portions as in the conventional case. As shown in FIG. 1, the LED lamp of the present invention has at least one set of metal lead terminals 1 and 2 which are plated with solder, and the tip of one lead wire 2 of the one set of lead terminals 1 and 2. The element mounting portion 7 provided along the longitudinal direction of the lead terminal, and the element mounting portion 7
An LED element 3 made of GaP, GaAs or the like fixed to the LED element, and a metal wire 4 made of gold or aluminum for electrically connecting the LED element 3 and the other lead terminal 2.
It is provided with a transparent or semitransparent resin, for example, a resin sealing portion 5 made of an epoxy resin, which covers a tip portion of the lead terminal including the LED element 3, and the resin sealing portion 5 has a semi-dome shape.
【００１１】図２は、本発明の他の実施例を示してお
り、同図（ａ）は平面図を、同図（ｂ）は側面図を示し
ている。本実施例のＬＥＤランプも、一組の金属製のリ
ード端子１，２と、一方のリード線２の先端にこのリー
ド端子の長手方向に沿うように設けられた素子搭載部７
と、この素子搭載部７に固着されたＬＥＤ素子３と、Ｌ
ＥＤ素子３と他方のリード端子２とを電気的に接続する
金属ワイヤ４と、ＬＥＤ素子３を含むリード端子の先端
部を覆う樹脂封止部５とを具備し、樹脂封止部５は半ド
ーム状の形状を有している。同図からも明らかなよう
に、本実施例では素子搭載部７に凹部８を設けてること
で、凹部８が反射板としての役割を果たし、光を効率よ
く照射させることができる。2A and 2B show another embodiment of the present invention. FIG. 2A is a plan view and FIG. 2B is a side view. Also in the LED lamp of this embodiment, a pair of metal lead terminals 1 and 2 and an element mounting portion 7 provided at the tip of one lead wire 2 along the longitudinal direction of the lead terminal.
And the LED element 3 fixed to this element mounting portion 7,
A metal wire 4 that electrically connects the ED element 3 and the other lead terminal 2 and a resin sealing portion 5 that covers the tip of the lead terminal including the LED element 3 are provided. It has a dome shape. As is clear from the figure, in the present embodiment, the recess 8 is provided in the element mounting portion 7, so that the recess 8 serves as a reflection plate, and light can be efficiently emitted.
【００１２】次ぎに、図３に本発明のＬＥＤランプをプ
リント基板６に挿入して、ＬＥＤ素子３を発光させたと
きの光路を示している。同図（ａ）は、プリント基板６
に垂直に挿入したときのＬＥＤランプの側面図を示し、
矢印は光路を示している。同図から明らかなようにＬＥ
Ｄ素子３から発光する光は、半ドーム状の樹脂封止部５
で屈折しプリント基板６と平行方向に照射される。同図
（ｂ）は、ＬＥＤランプの底面図を示している。ここで
も、ＬＥＤ素子３の前面に形成される半ドーム状の樹脂
封止部５により、ＬＥＤ素子３から発光する光はプリン
ト基板６と平行方向に照射される。Next, FIG. 3 shows an optical path when the LED lamp of the present invention is inserted into the printed board 6 to cause the LED element 3 to emit light. FIG. 1A shows a printed circuit board 6
Shows a side view of the LED lamp when inserted vertically into the
The arrow indicates the optical path. As is clear from the figure, LE
The light emitted from the D element 3 is a semi-dome-shaped resin sealing portion 5
The light is refracted by and is irradiated in a direction parallel to the printed circuit board 6. FIG. 3B shows a bottom view of the LED lamp. Also here, the light emitted from the LED element 3 is applied in a direction parallel to the printed circuit board 6 by the semi-dome-shaped resin sealing portion 5 formed on the front surface of the LED element 3.
【００１３】次に、本発明のＬＥＤランプの製造方法を
図４を参照に説明する。まず、同図（ａ）に示すよう
に、鉄または銅等からなる金属板材を打抜いて、ＬＥＤ
ランプを構成する一組のリード端子１，２を適宜間隔
（Ｗ）で互いに平行状にタイバー部９，９’で連結した
状態のリードフレーム１０を形成し、リード端子２の先
端の素子搭載部７に導電ペースト等でＬＥＤ素子３を固
着した後、ＬＥＤ素子３と他のリード端子１を、金やア
ルミニウム等からなる金属ワイヤで電気的に接続する。Next, a method of manufacturing the LED lamp of the present invention will be described with reference to FIG. First, as shown in FIG. 3A, a metal plate material made of iron, copper, or the like is punched out to form an LED.
A lead frame 10 is formed in which a pair of lead terminals 1 and 2 forming a lamp are connected in parallel to each other at appropriate intervals (W) by tie bar portions 9 and 9 ', and an element mounting portion at the tip of the lead terminal 2 is formed. After fixing the LED element 3 to 7 with a conductive paste or the like, the LED element 3 and other lead terminals 1 are electrically connected with a metal wire made of gold, aluminum, or the like.
【００１４】次いで、同図（ｂ）に示すように、ＬＥＤ
ランプの樹脂封止部５の形状通りにくぼみが形成された
複数のポット部１１を有する成形型１２の各ポット部１
１に透明または半透明の樹脂、例えばエポキシ樹脂１３
を注入する。そして、リードフレーム１０の各先端部を
下向きにしてエポキシ樹脂１３に浸漬し、この状態で成
形型１２及びリードフレーム１０をオーブンに入れ、所
定の条件でエポキシ樹脂１３を硬化させる。Then, as shown in FIG.
Each pot part 1 of a molding die 12 having a plurality of pot parts 11 in which recesses are formed according to the shape of the resin sealing part 5 of the lamp.
1 is a transparent or translucent resin, for example epoxy resin 13
Inject. Then, the lead frame 10 is dipped in the epoxy resin 13 with each tip facing downward, and in this state, the mold 12 and the lead frame 10 are put in an oven to cure the epoxy resin 13 under predetermined conditions.
【００１５】次いで、リードフレーム１０を成形型１２
から離型すると、同図（ｃ）に示すように、ＬＥＤ素子
３を含むリード端子１，２の先端部を覆う樹脂封止部５
が形成される。さらに、この状態でタイバー部９，９’
の所定箇所を切断し、図１に示す本発明のＬＥＤランプ
を製造する。Next, the lead frame 10 is attached to the molding die 12.
When the mold is released from the mold, as shown in FIG. 3C, the resin sealing portion 5 covering the tip portions of the lead terminals 1 and 2 including the LED element 3.
Is formed. Furthermore, in this state, the tie bar portions 9 and 9 '
1 is cut to manufacture the LED lamp of the present invention shown in FIG.
【００１６】[0016]
【発明の効果】以上、説明したように本発明のＬＥＤラ
ンプによれば、リード端子の先端にこのリード端子の長
手方向に沿うように素子搭載部を設けてＬＥＤ素子を固
着し、しかもＬＥＤ素子を覆う樹脂封止部の形状を半ド
ーム状としているので、プリント基板に対し平行方向の
光をフォーミング加工をせずにプリント基板に垂直に挿
入するだけ得られ、しかも、樹脂封止部のレンズ効果に
より効率よく照射させることができる。As described above, according to the LED lamp of the present invention, the element mounting portion is provided at the tip of the lead terminal along the longitudinal direction of the lead terminal to fix the LED element, and the LED element is fixed. Since the shape of the resin encapsulation part that covers is a semi-dome shape, light in the direction parallel to the printed circuit board can be obtained by inserting it vertically into the printed circuit board without performing the forming process. The effect allows efficient irradiation.
【００１７】また、素子搭載部に設けた凹部が反射板と
しての役割を果たすので、さらに効率よく光を照射する
ことができる。Further, since the concave portion provided in the element mounting portion functions as a reflection plate, it is possible to irradiate light more efficiently.
【図１】本発明のＬＥＤランプを示す説明図。FIG. 1 is an explanatory view showing an LED lamp of the present invention.
【図２】本発明の他の実施例を示す説明図。FIG. 2 is an explanatory view showing another embodiment of the present invention.
【図３】本発明のＬＥＤランプの発光状態を示す図面。FIG. 3 is a view showing a light emitting state of the LED lamp of the present invention.
【図４】本発明のＬＥＤランプの製造方法を示す説明
図。FIG. 4 is an explanatory view showing a method for manufacturing the LED lamp of the present invention.
【図５】従来のＬＥＤランプを示す説明図。FIG. 5 is an explanatory view showing a conventional LED lamp.
【図６】従来のＬＥＤランプを示す説明図。FIG. 6 is an explanatory view showing a conventional LED lamp.
１，２ リード端子 ３ ＬＥＤ素子 ４ 金属ワイヤ ５ 樹脂封止部 ６ プリント基板 ７ 素子搭載部 ８ 凹部 ９，９’ タイバー １０ レードフレーム １１ ポット部 １２ 成形型 １３ エポキシ樹脂 1, 2 lead terminal 3 LED element 4 metal wire 5 resin sealing part 6 printed circuit board 7 element mounting part 8 recess 9 and 9'tie bar 10 raid frame 11 pot part 12 molding die 13 epoxy resin
Claims (2)
端子の一方の先端にこのリード端子の長手方向に沿うよ
うに設けられた素子搭載部と、前記素子搭載部に固着さ
れた発光ダイオード素子と、前記発光ダイオード素子と
他方のリード端子とを接続する金属ワイヤと、発光ダイ
オード素子を含むリード端子の先端部を覆う樹脂封止部
とを具備し、前記樹脂封止部は半ドーム状の形状を有し
ていることを特徴とする発光ダイオードランプ。1. A set of lead terminals, an element mounting portion provided at one end of the pair of lead terminals along the longitudinal direction of the lead terminal, and light emission fixed to the element mounting portion. The semiconductor device includes a diode element, a metal wire connecting the light emitting diode element and the other lead terminal, and a resin sealing portion covering a tip portion of the lead terminal including the light emitting diode element, wherein the resin sealing portion is a half dome. A light-emitting diode lamp having a shape of a circle.
ことを特徴とする請求項１記載の発光ダイオードラン
プ。2. The light emitting diode lamp according to claim 1, wherein a recess is formed in the element mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29765594A JPH08162673A (en) | 1994-11-30 | 1994-11-30 | Light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29765594A JPH08162673A (en) | 1994-11-30 | 1994-11-30 | Light emitting diode lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08162673A true JPH08162673A (en) | 1996-06-21 |
Family
ID=17849410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29765594A Pending JPH08162673A (en) | 1994-11-30 | 1994-11-30 | Light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08162673A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006109886A1 (en) * | 2005-04-12 | 2006-10-19 | Japan Cash Machine Co., Ltd. | Led device and optical detector therewith for bill validator |
| US7350930B2 (en) | 2004-11-17 | 2008-04-01 | Samsung Electronics Co., Ltd. | Illuminating unit with reflective collimator and image projection system including the same |
| US7473014B2 (en) * | 2002-07-17 | 2009-01-06 | Sharp Kabushiki Kaisha | Light emitting diode lamp and light emitting diode display unit |
| CN102997081A (en) * | 2011-09-13 | 2013-03-27 | 优利德电球股份有限公司 | LED Lamp |
| CN103047555A (en) * | 2011-10-11 | 2013-04-17 | 优利德电球股份有限公司 | Heat sink for LED lamp |
| CN103062673A (en) * | 2011-10-18 | 2013-04-24 | 优利德电球股份有限公司 | Light-emitting diode lamps and a projection lamp |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144861B2 (en) * | 1979-02-02 | 1986-10-04 | Asahi Chemical Ind | |
| JPH05226699A (en) * | 1992-02-17 | 1993-09-03 | Toshiba Corp | Light emitting element |
-
1994
- 1994-11-30 JP JP29765594A patent/JPH08162673A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144861B2 (en) * | 1979-02-02 | 1986-10-04 | Asahi Chemical Ind | |
| JPH05226699A (en) * | 1992-02-17 | 1993-09-03 | Toshiba Corp | Light emitting element |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7473014B2 (en) * | 2002-07-17 | 2009-01-06 | Sharp Kabushiki Kaisha | Light emitting diode lamp and light emitting diode display unit |
| US7350930B2 (en) | 2004-11-17 | 2008-04-01 | Samsung Electronics Co., Ltd. | Illuminating unit with reflective collimator and image projection system including the same |
| WO2006109886A1 (en) * | 2005-04-12 | 2006-10-19 | Japan Cash Machine Co., Ltd. | Led device and optical detector therewith for bill validator |
| US7501659B2 (en) | 2005-04-12 | 2009-03-10 | Japan Cash Machine Co., Ltd. | LED device and optical detector therewith for bill validator |
| CN102997081A (en) * | 2011-09-13 | 2013-03-27 | 优利德电球股份有限公司 | LED Lamp |
| CN103956425A (en) * | 2011-09-13 | 2014-07-30 | 优利德电球股份有限公司 | LED lamp |
| CN104132263A (en) * | 2011-09-13 | 2014-11-05 | 优利德电球股份有限公司 | LED lamp |
| CN103047555A (en) * | 2011-10-11 | 2013-04-17 | 优利德电球股份有限公司 | Heat sink for LED lamp |
| CN103062673A (en) * | 2011-10-18 | 2013-04-24 | 优利德电球股份有限公司 | Light-emitting diode lamps and a projection lamp |
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