JP5122062B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device having a light emitting element such as a light emitting diode (LED) or a laser diode, and more particularly to a light emitting device capable of emitting light in an oblique direction with respect to a mounting surface on a substrate or the like.

  Light emitting devices with LED chips mounted on packages, etc., can be roughly classified into two types: top emission type (top view) type and side emission type (side view type), which are parallel to the mounting surface of the substrate. Or the perpendicular | vertical surface is a light emission surface.

  For example, to explain the top view type, a box-shaped mold resin having a recess in the center of the upper surface, a plurality of leads integrally formed with the mold resin so as to extend horizontally on both side surfaces of the mold resin, 2. Description of the Related Art A light emitting device that includes an LED chip mounted on the bottom surface of a recess is known (for example, see Patent Document 1).

The light-emitting device having such a configuration is used by being mounted on a substrate or the like. If it is desired to irradiate light with the light emitting direction directed to an angle other than vertical or horizontal, is the substrate tilted and attached to a device casing or the like? A configuration is adopted in which a reflecting plate or a light guide plate is inclined and disposed on the optical path while the substrate is horizontal or vertical. In addition, a method of mounting a light-emitting device on a flexible substrate and bending the flexible substrate to have a predetermined angle, a method of using a lead-type light-emitting device that cannot be surface-mounted, and bending the lead portion, etc. are also used. It was.
JP 2003-17753 A ([0023], FIG. 2, FIG. 3)

  However, according to the conventional light emitting device, if light is emitted in a direction inclined with respect to the mounting surface of the substrate or the like, it is necessary to incline or bend the mounting surface in accordance with the light emitting direction. In addition, there is a problem that the emitted light is attenuated due to the use of the reflection plate and the light guide plate. In addition, when a flexible substrate is used, the cost increases. If the lead is bent, it takes time and effort to bend, and there is a problem that the bending causes stress to the LED lamp and breakage.

  In recent years, since a high-output blue LED has been realized, white light can be easily obtained, and various uses of a light-emitting device using the LED are considered. For example, as an illumination or light source for game machines such as pachinko machines, home appliances, toys, instrument panels in automobiles, etc., and infrared projectors (LEDs, etc.) and light receivers (photodiodes, phototransistors, etc.) were mounted. For devices such as optical communication devices (IrDA, etc.), remote controllers, optical sensors, etc., light can be emitted in multiple directions even when mounted on a simple flat surface, making it efficient for members with inclined surfaces and curved surfaces. Development of a light-emitting device that can illuminate well is expected.

  Accordingly, an object of the present invention is to provide a light emitting device capable of emitting light in an oblique direction with respect to a mounting surface on a substrate or the like.

Recesses present invention in order to achieve the above object, the an insulating material, the mounting surface to be mounted on a mounting surface of the substrate or the like, before Symbol inclined surface inclined with respect to the mounted surface, which is formed on the inclined surface And a holding member having a light emitting element mounting surface exposed in the recess, a light emitting element mounted on the light emitting element mounting surface of the holding member, and a plurality of light emitting elements connected to the light emitting element and connected to the mounting surface A plurality of conductors, and the holding member is insert-molded in the plurality of conductors to form the inclined surface and the light emitting element mounting surface so as to be inclined with respect to the mounting surface. A light emitting device is provided.

In order to achieve the above object, the present invention is made of an insulating material, and is mounted on a mounting surface such as a substrate, an inclined surface inclined with respect to the mounted surface, a recess formed on the inclined surface, And a holding member that has a conductor arrangement surface that is inclined with respect to the mounted surface and a part of which constitutes the bottom surface of the recess ,
Arranged on the conductor arrangement surface of the holding member, a part is held by the holding member so that the light emitting element mounting surface is exposed in the recess, and the other part protrudes outside the holding member. A plurality of conductors formed ;
A light emitting element mounted on the light emitting element mounting surface of the conductor exposed in the recess of the holding member ,
The plurality of conductors are bent so that the other portion extends from both ends of the conductor arrangement surface to the mounting surface, and is close to the mounting surface among both ends of the conductor arrangement surface. Provided is a light-emitting device that is bent so that an angle formed by a conductor portion located on the conductor placement surface and a conductor portion located on the mounting surface is less than 90 ° at the other end.

  According to this configuration, the conductor for supplying power to the light emitting element is provided, and the emitted light can be emitted in an oblique direction with respect to the mounting surface on the substrate or the like.

  The holding member preferably includes a reflecting surface that rises obliquely from the light emitting element mounting surface. According to this configuration, since the emitted light emitted from the side surface of the light emitting element is reflected by the reflecting surface, the emission direction is changed, and the emitted light is emitted in the optical axis direction of the light emitting device, so the amount of light in the optical axis direction is increased. It is done.

  The light emitting element is electrically connected to a conductor exposed on the light emitting element mounting surface, and is disposed so that a portion extending from the light emitting element mounting surface extends along a standing surface standing with respect to the substrate mounting surface 11c. It is preferable that the end is exposed to the mounting surface of the holding member. According to this configuration, since the conductor is bent along the standing surface of the holding member, the conductor is guided so as not to bend in an unnecessary direction.

  It is preferable that the optical axis of the emitted light emitted from the light emitting element is inclined with respect to a mounting surface such as a substrate. According to this configuration, light having an optical axis inclined at a predetermined angle can be emitted from the substrate simply by mounting the light emitting device on the substrate.

  In the minimum configuration, the light emitting element is preferably composed of a single LED chip that emits a single color, such as a red LED chip, a green LED chip, a blue LED chip, and a white LED chip. Thereby, size reduction can be achieved. Moreover, you may combine the LED chip of 2 or more colors for a light emitting element. Further, a plurality of LED chips of the same color or different colors may be included in one light emitting device. According to this configuration, various emission colors can be obtained by changing the emission color, and the emission intensity can be increased by using the same emission color. At this time, by providing individual terminals for power supply of each LED chip, each LED chip can be supplied with power individually. For example, light emission by LED chips of different emission colors can be individually controlled.

  The holding member preferably has a suction surface which is a suction surface parallel to the substrate mounting surface at the upper end of the holding member. According to this configuration, when sucking by the mounting machine, the suction is performed by using the suction surface parallel to the substrate mounting surface, so that the mounting work performed horizontally on the substrate is facilitated, and the tilt at the time of mounting, etc. Is less likely to occur. Also, the suction tool for mounting is not a special type, and a generally used tool having a flat tip and no directivity can be used.

  Further, it is preferable that the holding member has a conductor exposed or protruded between the substrate and the holding member when the board is mounted. According to this configuration, the LED lamp can be mounted on the substrate by hand using a soldering iron as well as automatic mounting.

  Preferably, the holding member forms a protruding piece that protrudes in a direction opposite to the light emitting direction by the LED chip to increase the board mounting surface. According to this configuration, since the contact area between the substrate and the substrate mounting surface increases, it is possible to prevent overturning when mounted on the substrate, so that the stability of the light emitting device when mounted on the substrate can be improved. Further, even in a packaging state by emboss taping, the embossed tape member is formed in a recessed shape, and the contact area between the bottom surface of the pocket portion into which the light emitting device is inserted with the substrate mounting surface down and the substrate mounting surface increases. This makes it difficult for tilting and falling in the pocket to occur, so it is possible to avoid suction mistakes and suction deviations caused by the mounting machine when mounting the board. Can do.

  Also, a first step of producing a lead frame in which a conductor having a predetermined shape is formed on a thin metal plate, and a light emitting element that holds the conductor with a plastic material and has a predetermined angle with respect to a substrate mounting surface A second step of forming a plurality of holding members having a mounting surface, and holding the holding member by a lead frame; and a predetermined conductor portion is cut from the lead frame, and a tip of the conductor portion is mounted on the substrate of the holding member And a third step of bending the conductor portion so as to reach the surface.

  According to this configuration, it is possible to manufacture a light emitting device whose light emitting direction is oblique with respect to the substrate mounting surface while only bending the conductor and following the same technique as the conventional member and processing method. . Further, by forming a lead frame in which a plurality of holding members are assembled and then dividing and individualizing the lead frame, the steps of mounting the light emitting element and resin sealing are simplified, and productivity can be improved.

  In the second step, it is preferable that the optical axis of the emitted light emitted from the light emitting element is inclined with respect to a mounting surface such as a substrate. According to this configuration, it is possible to manufacture a light emitting device that can emit light having an optical axis inclined at a predetermined angle from the substrate simply by being mounted on the substrate.

  The light emitting device according to the present invention can emit light in an oblique direction with respect to a mounting surface on a substrate or the like.

[First Embodiment]
(Configuration of light emitting device)
1 and 2 show a configuration of a light emitting device according to a first embodiment of the present invention. 1A is a front view of a light emitting device, FIG. 1B is a bottom view, and FIG. 1C is a plan view. 2A is a left side view of the light emitting device of FIG. 1, FIG. 2B is a right side view, and FIG. 2C is a circuit diagram.

  As shown in FIG. 1 and FIG. 2, the light emitting device 1 has a concave portion 11 a formed in an inclined surface 19 on the upper surface, and a chip mounting surface 11 b as a light emitting element mounting surface on which an LED chip 12 as a light emitting element is mounted. And a package 11 as a holding member provided with a reflecting surface 11e that reflects the emitted light of the LED chip 12 and emits the light to the outside, the LED chip 12 mounted on the chip mounting surface 11b, and the LED chip 12 Leads 13A and 13B arranged along respective opposing side surfaces of the package 11 and colorless, transparent, translucent or colored transparent epoxy resin, etc. are injected into the recess 11a to seal the LED chip 12. Sealing member 16 to be provided.

  The package 11 is made by insert-molding leads 13A and 13B, which are conductors, using a plastic material. The package 11 has a substantially heptagonal shape when viewed from the front side, and has projecting pieces 11A and 11B that project in the right side of the front side, that is, in the direction opposite to the light emitting direction by the LED chip.

  The protruding pieces 11A and 11B have an inclined portion 24 perpendicular to the chip mounting surface 11b and a vertical portion 23 perpendicular to the substrate mounting surface 11c. The package 11 has, on the left side of the front surface thereof, a front vertical surface 25 that is continuous with the inclined surface 19 and perpendicular to the substrate mounting surface 11c, and a notch 18 that is formed by cutting out the lower portion of the front vertical surface. The notch 18 exposes the lead 13A from the front side to the bottom surface, and by inserting the tip of the soldering iron into this portion, it has a shape that can be easily soldered manually. The inclined portion 24 may not be perpendicular to the chip mounting surface 11b, and the vertical portion 23 and the front vertical surface 25 may not be perpendicular to the substrate mounting surface 11c. These are parts that are changed in design. The protruding pieces 11A and 11B are formed so as to protrude in the direction opposite to the light emitting direction by the LED chip 11b. However, even if formed so as to protrude in a direction perpendicular to the light emitting direction by the LED chip 11b, stability at the time of mounting. Similar effects can be obtained for purposes such as sex.

  The angle between the bottom surface of the package 11 that is the substrate mounting surface 11c and the chip mounting surface 11b that is the bottom surface of the recess 11a is set to 45 °. Here, the angle is 45 °, but any angle can be used.

  The LED chip 12 is generally cubic and emits the emitted light to the upper surface and the side surface excluding the mounting surface. The LED chip 12 is configured as an electric circuit shown in FIG. A terminal 12a and a cathode terminal 12b connected to the ground or a negative power source are provided. The LED chip 12 may be, for example, blue or green based on a GaN compound semiconductor, or red based on an AlInGaP compound semiconductor.

  The leads 13A and 13B are formed by subjecting a thin metal plate made of copper, copper alloy or the like to press working or the like, and are obtained separately from the lead frame, as will be described in a second embodiment described later. As shown in FIG. 1A, the leads 13A and 13B are distributed to a left side surface and a right side surface, which are standing surfaces standing with respect to the substrate mounting surface 11c, and one end of the lead 13B is disposed on the chip mounting surface 11b. The LED chip 12 is mounted so as to be exposed above, and the other lead 13A is exposed on the chip mounting surface 11b and connected to the LED chip 12 via a bonding wire 17. The other end of each of the leads 13A and 13B is bent so as to reach the board mounting surface 11c in a state of being in close contact with the standing surface provided upright with respect to the board mounting surface 11c of the package 11.

(Mounting and operation of light emitting device)
The package 11 is mounted at a predetermined position on the mounting surface of a substrate such as a device so that the chip mounting surface 11b faces a desired irradiation direction. At this time, the ends of the leads 13A and 13B of the board mounting surface 11c are matched with the LED driving wiring pattern such as the board of the device. Next, by performing soldering by reflow or the like, the ends of the leads 13A and 13B and the wiring pattern of the board of the device or the like are connected by solder.

  When power is supplied from a power circuit (not shown) to an LED driving wiring pattern on a substrate such as a device, a voltage is applied to the anode and cathode of the LED chip 12 through the leads 13A and 13B, and the LED chip 12 is turned on. . The emitted light emitted in the vertical direction by the LED chip 12 passes through the sealing member 16 and is emitted toward the optical axis direction of the light emitting device 1 having an angle of 45 ° C. with respect to the bottom surface of the package 11. . Also, the emitted light emitted in the lateral direction from the side surface of the LED chip 12 is reflected toward the opening of the recess 11a by the reflecting surface 11e in the recess 11a, passes through the sealing member 16, and again, The light is emitted in the direction of the optical axis of the light emitting device 1 having an angle of 45 ° with respect to the bottom surface of the package 11.

(Effects of the first embodiment)
According to the first embodiment, the following effects are obtained.
(A) Only the chip mounting surface 11b is formed so as to be inclined with respect to the substrate mounting surface 11c, and the members such as the leads 13A and 13B, the bending method of the leads 13A and 13B, and the like use conventional techniques. Thus, it is possible to obtain the light emitting device 1 in which the optical axis of the emitted light is oblique with respect to the substrate mounting surface 11c.
(B) The direction of the optical axis of the emitted light emitted from the LED chip 12 can be changed only by changing the angle between the chip mounting surface 11b and the substrate mounting surface 11c, and the substrate on the device side needs to be inclined or bent. Therefore, the degree of freedom in the arrangement design on the device side can be improved.
(C) Since the projecting pieces 11A and 11B projecting in the direction opposite to the light emitting direction by the LED chip are formed on the package 11 and the board mounting surface 11c is increased, the area of the grounding portion of the LED lamp is increased and the weight balance is achieved. Therefore, the LED lamp is less likely to fall on the protruding pieces 11A and 11B, so that the stability during mounting on the board or in the packaging member can be improved.
(D) The inclined surfaces rising from the LED chip mounting surface 11b of the leads 13A and 13B can be used as the light reflecting surface 11e that reflects the emitted light of the LED chip 12, thereby increasing the light emission efficiency.
(E) Since the suction surface 11d on the upper surface of the package 11 is parallel to the substrate mounting surface 11c, mounting on the substrate by the automatic mounting machine and suction at that time can be easily performed.
(F) Since the lead 13A is exposed between the substrate and the package 11, the LED lamp can be mounted on the substrate even by manual work using a soldering iron.

[Second Embodiment]
3 and 4 show a light emitting device according to the second embodiment of the present invention. 3A is a front view of the light emitting device, FIG. 3B is a bottom view, and FIG. 3C is a plan view. 4A is a left side view of the light emitting device of FIG. 3, FIG. 4B is a right side view, and FIG. 4C is a circuit diagram.

  The light emitting device 1 is characterized in that the number of LED chips 12 mounted in the first embodiment is three, and the number of leads is increased to four in accordance with this, and the other configuration is the first embodiment. It is the same as the form.

  There are three LED chips used in the present embodiment, for example, a red LED chip 12A, a green LED chip 12B, and a blue LED chip 12C, which are shown in FIG. 3 (c) and FIG. 4 (a). As shown, the chips are mounted in a row in the vertical direction on the chip mounting surface 11b. Here, the LED chips are mounted in a line in the vertical direction, but the LED chips can be arbitrarily arranged, for example, in a triangular shape.

  As shown in FIG. 3B, there are four leads 14A, 14B, 14C, and 14D connected to the LED chips 12A to 12C, and one end of each of the leads 14A to 14C is connected to the LED chips 12A to 12C. The one end of the LED chip 12D is commonly connected to the cathodes of the LED chips 12A to 12C. The other ends of the leads 14A to 14D are dispersedly arranged at the four corners of the substrate mounting surface 11c of the package 11, as shown in FIG. The intermediate portions of the leads 14A and 14B are bent along the right side surface of the package 11 as shown in FIG. 3A, and the intermediate portions of the leads 14C and 14D are shown in FIG. Thus, it is bent so as to follow the left side surface of the package 11.

  The LED chips 12A to 12C are configured in the electric circuit shown in FIG. 4C, and are connected to the anode terminals 15a, 15b, and 15c connected to the positive power source and the ground or the negative power source, and the LED chip 12A. And a cathode terminal 15d commonly connected to the cathodes of ˜12C. Here, the cathodes are connected in common, but the anodes may be shared. Of the three LED chips, two cathodes may be shared, and the other one may be powered independently or may be arbitrarily combined.

(Method for manufacturing light emitting device)
5 to 7 show a method for manufacturing a light-emitting device according to the second embodiment of the present invention. FIG. 5 is a plan view of the lead frame, and FIG. 6 is a plan view after insert molding. FIG. 7 shows a process following FIG. 6, in which (a) is a plan view of the individualized light emitting device, and (b) is a cross-sectional view taken along line AA of (a).

  First, a thin metal plate of a predetermined size made of copper, copper alloy or the like is prepared. As shown in FIG. 5, a lead frame 20 is prepared in which an opening 22 is formed by subjecting the thin metal plate to pressing or etching. Note that sprocket holes 20 </ b> A are provided at regular intervals on both sides of the lead frame 20. Next, a plastic material is insert-molded into the lead frame 20 to form a plurality of packages 11 simultaneously as shown in FIG. At this time, the side surface of the package 11 is sandwiched between the gripping portions 20 a and 20 b of the lead frame 20.

  Next, each of the lead portions to be the leads 14A to 14D is cut at the lead frame cutting position 21 shown in FIG. 7A while the side surface of the package 11 is held between the gripping portions 20a and 20b, and the package 11 is individualized. To do. At this time, the leads 14A to 14D are flush with each other as shown by the solid line in FIG.

  Next, the package 11 is fixed to a dedicated jig (not shown), and as shown in FIG. 7B, the leads 14A to 14D are bent from the solid line position to the dotted line position. That is, the leads 14A ′ (14B ′) and 14C ′ (14D ′) at the solid line positions are bent to form the leads 14A (14B) and 14C (14D) at the dotted line positions.

  Next, the LED chips 12A to 12C are mounted on the chip mounting surface 11b of the package 11 where the leads 14A to 14D have been bent. The LED chips 12A to 12C have their cathodes connected to the leads 14D exposed on the chip mounting surface 11b, and are fixed to the mounting surface and electrically connected, for example, by using a conductive adhesive. Connect. The anodes of the LED chips 12A to 12C are connected to the leads 14A to 14C through bonding wires 17A to 17C. Next, a sealing member 16 made of, for example, an epoxy resin is injected into the recess 11a. Thus, the light emitting device 1 is completed. The completed light emitting device 1 is removed from the lead frame 20 by being pushed out by a jig (not shown) from the state of being sandwiched between the gripping portions 20a and 20b of the lead frame 20.

  On the contrary, the mounting of the LED chips 12A to 12C and the connection with the leads 14A to 14C by the bonding wires 17A to 17C, or the filling of the sealing member 16 into the recess 11a is performed by cutting the leads 14A to 14D. Or may be mounted before bending.

  The above is the manufacturing method for the light emitting device 1 of the second embodiment, but the light emitting device 1 according to the first embodiment can also be manufactured by the same process.

(Effect of the second embodiment)
According to the second embodiment, in addition to the effects of the first embodiment, the following effects can be obtained.
(A) According to the method for manufacturing the light emitting device 1, as shown in FIG. 5, a lead frame 20 in which a plurality of packages 11 are assembled is used and separated into individual packages 11 at the final step (at the time of completion). By doing so, it is possible to process a large number of LED chip mounting and resin sealing processes all at once, and it is possible to improve productivity.
(B) Since a driving current can be applied independently to each of the LED chips 12A to 12C, an illumination effect by changing the light emission color or light emission pattern, gradation display by other step control of each light emission color, etc. It can be applied to necessary applications.
(C) Since the lead on the cathode side of the LED chips 12A to 12C is used in common, the number of components used can be reduced, so that the size can be reduced and the mounting area can be reduced.

[Third Embodiment]
8 and 9 show a light emitting device according to a third embodiment of the present invention. 8A is a front view of the light emitting device, FIG. 8B is a bottom view, and FIG. 8C is a plan view. 9A is a left side view of the light emitting device of FIG. 8, FIG. 9B is a right side view, and FIG. 9C is a circuit diagram.

  The light-emitting device 1 is characterized in that, in the LED lamp according to the second embodiment, the LED chips 12 mounted are connected by independent leads 14A to 14F, and the other configuration is the first. This is the same as the embodiment. Further, the manufacturing method of the light emitting device 1 is the same as that of the second embodiment, and thus the description thereof is omitted.

  The LED chips used in the present embodiment are, for example, three of red LED chip 12A, green LED chip 12B, and blue LED chip 12C, and leads 14A and 14D are LED chips with respect to LED chip 12A. Leads 14B and 14E are connected to 12B, and leads 14C and 14F are connected to LED chip 12C, respectively.

  According to the third embodiment, in addition to the effects of the first and second embodiments, since leads are not used in common, some of the same color among a number of LED chips are connected. There are advantages such as collective control and the choice of polarity of the driver IC on the control circuit side.

[Fourth Embodiment]
10 and 11 show a light emitting device according to a fourth embodiment of the present invention. 10A is a front view of the light emitting device, FIG. 10B is a bottom view, and FIG. 10C is a plan view. 11, (a) is a left side view of the light emitting device of FIG. 10, (b) is a right side view, and (c) is a circuit diagram.

  In the LED lamp according to the third embodiment, the light emitting device 1 includes the lead 14 without bending the end of the lead 14 on the side of the substrate mounting surface 11c along the substrate mounting surface 11c of the package 11. The lead 14 is directly extended from the package 11 in a direction perpendicular to the mounting surface so that the tip portion protrudes from the substrate when the substrate is mounted, and the other configuration is the same as that of the third embodiment. Since the manufacturing method of the light emitting device 1 is the same as that of the second embodiment, the description thereof is omitted.

(Effect of the fourth embodiment)
According to this 4th Embodiment, in addition to the effect of 1st-3rd Embodiment, there exist the following effects.
(A) Since the lead 14 is protruded from the package 11 toward the substrate side, the lead 14 can be mounted on the through-hole substrate, and the mounting strength of the light emitting device 1 on the mounting substrate and the securing of conduction can be improved.
(B) Since the lead is passed through the hole in the board, manual positioning at the time of mounting, or the soldering iron is applied from the back side of the mounting board, so that the package 11 does not interfere with the soldering. Become.
(C) Since the lead is passed through the back side of the mounting substrate and soldered to the wiring pattern, the heat generated in the light emitting device 1 can be dissipated also to the back side of the mounting substrate. Suppressing and reducing deterioration of light emitting elements and light output due to heat

[Fifth Embodiment]
12 and 13 show a light emitting device according to a fifth embodiment of the present invention. 12A is a front view of the light emitting device, FIG. 12B is a bottom view, and FIG. 12C is a plan view. 13, (a) is a left side view of the light emitting device of FIG. 12, (b) is a right side view, and (c) is a circuit diagram.

  In the LED lamp according to the third embodiment, the light emitting device 1 is configured such that each end of the leads 14A to 14F is bent at the end on the side of the substrate mounting surface 11c inside the substrate mounting surface 11c of the package 11. However, it protrudes from the package 11 in parallel with the substrate, and the other configuration is the same as that of the third embodiment. Since the manufacturing method of the light emitting device 1 is the same as that of the second embodiment, the description thereof is omitted.

(Effect of 5th Embodiment)
According to the fifth embodiment, in addition to the effects of the first to third embodiments, the following effects can be obtained.
(A) Since the leads protrude outside the package 11, the stability on the mounting substrate and the visual positioning during mounting are improved, and the package 11 does not interfere when soldering with a soldering iron. Work becomes easy.
(B) Since the lead portion is outside the package 11, the surface area for radiating the heat generated in the light emitting device 1 is increased and the heat dissipation is improved, so that the temperature rise of the light emitting device 1 is suppressed and light emission by heat is performed. Deterioration of the element, decrease in light emission output, and the like can be reduced.

(Sixth embodiment)
FIG. 14 shows a light emitting device according to the sixth embodiment. The light emitting device 1 has a suction surface 11d parallel to the substrate mounting surface 11c.

  When the light emitting device 1 is sucked by the mounting machine, the suction surface 11d parallel to the substrate mounting surface 11c is sucked and mounted on the substrate by the suction tool 30 as in the first embodiment.

According to the light emitting device 1, a general suction tool can be used without using a special suction tool for sucking the suction surface 11 d parallel to the substrate mounting surface 11 c, thereby reducing manufacturing costs. Can do. Further, since the suction uses the parallel suction surface 11d, the inclination of the light emitting element during mounting is less likely to occur.
[Other embodiments]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the first to fifth embodiments, the reflection efficiency of the reflection surface 11e is increased by changing the angle of the reflection surface 11e in the recess 11a or by depositing metal so as not to cause a short circuit between the leads. May be. Further, the sealing resin may have a lens shape, or a powder such as silica having a light diffusion effect may be mixed in the sealing resin. Thereby, condensing and light diffusion according to the required purpose of the LED lamp can be performed.

  In addition, in each of the above embodiments, the leads are distributed so as to be in the same direction as the emission direction of the emitted light of the substrate mounting surface 11c and in the opposite direction. May be. Thereby, the light emitting device can be mounted even in a place where the formation of the wiring pattern is limited.

  Further, an assembly of molded products corresponding to the holding portion is manufactured without using a lead frame. Next, a metal film is formed on the entire surface by surface treatment such as plating, and a part of the metal film is removed by etching or the like. Next, a package is formed by patterning the LED chip mounting surface and the leads so as to be a wiring portion connecting them. Next, the light-emitting device 1 can be manufactured in the same manner as described in the second embodiment also by dividing the package structure by a method such as dicing.

The structure of the light-emitting device concerning the 1st Embodiment of this invention is shown, (a) is a front view of a light-emitting device, (b) is a bottom view, (c) is a top view. The other part of the light-emitting device of FIG. 1 is shown, (a) is a left side view, (b) is a right side view, and (c) is a circuit diagram. The light-emitting device which concerns on the 2nd Embodiment of this invention is shown, (a) is a front view, (b) is a bottom view, (c) is a top view. The other part of the light-emitting device of FIG. 3 is shown, (a) is a left side view, (b) is a right side view, and (c) is a circuit diagram. It is a top view which shows the manufacturing method of the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a top view of the lead frame used for the light-emitting device which concerns on the 2nd Embodiment of this invention. 5A and 5B show a process following FIG. 5, in which FIG. 5A is a plan view of an individual light emitting device, and FIG. 5B is a cross-sectional view taken along line AA in FIG. The manufacturing method of the light-emitting device concerning the 3rd Embodiment of this invention is shown, (a) is a front view of a light-emitting device, (b) is a bottom view, (c) is a top view. The light-emitting device which concerns on the 3rd Embodiment of this invention is shown, (a) is a left view of the light-emitting device of FIG. 8, (b) is a right view, (c) is a circuit diagram. The light-emitting device which concerns on the 4th Embodiment of this invention is shown, (a) is a front view of a light-emitting device, (b) is a bottom view, (c) is a top view. The light-emitting device which concerns on the 4th Embodiment of this invention is shown, (a) is a left view of the light-emitting device of FIG. 10, (b) is a right view, (c) is a circuit diagram. The light-emitting device which concerns on the 5th Embodiment of this invention is shown, (a) is a front view of a light-emitting device, (b) is a bottom view, (c) is a top view. The light-emitting device which concerns on the 5th Embodiment of this invention is shown, (a) is a left view of the light-emitting device of FIG. 12, (b) is a right view, (c) is a circuit diagram. It is a front view which shows the light-emitting device which concerns on 6th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 11 Package 11A, 11B Projection piece 11a Recess 11b Chip mounting surface 11c Substrate mounting surface 11d Adsorption surface 11e Reflective surface 12, 12A-12C LED chip 12a Anode terminal 12b Cathode terminals 13A, 13B, 14A-14F, 14A ' 14D 'Leads 15a to 15c Anode terminal 15d Cathode terminal 16 Sealing members 17, 17A, 17B, 17C Bonding wire 18 Notch 19 Inclined surface 20 Lead frame 20A Sprocket holes 20a, 20b Holding part 21 Lead frame cutting position 22 Opening 23 Vertical part 24 Inclined part 25 Front vertical surface 30 Suction tool

Claims (4)

It is made of an insulating material and mounted on a mounting surface such as a substrate, an inclined surface inclined with respect to the mounted surface, a recess formed on the inclined surface, and inclined with respect to the mounted surface A holding member having a conductor arrangement surface, part of which constitutes the bottom surface of the recess ,
Arranged on the conductor arrangement surface of the holding member, a part is held by the holding member so that the light emitting element mounting surface is exposed in the recess, and the other part protrudes outside the holding member. A plurality of conductors formed ;
A light emitting element mounted on the light emitting element mounting surface of the conductor exposed in the recess of the holding member ,
The plurality of conductors are bent so that the other portion extends from both ends of the conductor arrangement surface to the mounting surface, and is close to the mounting surface among both ends of the conductor arrangement surface. And a light emitting device bent at an end portion so that an angle formed between a conductor portion located on the conductor placement surface and a conductor portion located on the mounting surface is less than 90 ° .   The light-emitting device according to claim 1, wherein the holding member has a suction surface parallel to the mounting surface.   The light-emitting device according to claim 1, wherein the holding member includes a reflection surface that is provided around the light-emitting element and reflects light emitted from the light-emitting element in a direction substantially perpendicular to the light-emitting element mounting surface. .   The light emitting device according to claim 1, wherein the holding member has a protruding portion that protrudes in a direction opposite to a side of the mounted surface on which the light emitting element mounting surface faces.