JP2012190970A - Package for light emitting element and light emitting device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for a light emitting element which prevents the occurence of resin burrs due to a support bar holding a reflector and also prevents the damage to a light emitting device, and to provide a light emitting device using the package.SOLUTION: A package for a light emitting element includes: a pair of leads 11, 12 formed in a lead frame 5; a reflector 2 which is provided at least one surface of the pair of leads 11, 12 including a hole and includes a resin; and support bars 31, 32 formed in the lead frame 5 and holding the reflector 2 in a direction perpendicular to a direction in which the pair of leads 11, 12 face each other. The widths of the support bars 31, 32 are wider than the width of the reflector 2 in the direction in which the pair of leads 11, 12 face each other.

Description

  The present invention relates to a light emitting device package using a lead frame for mounting a light emitting device and a light emitting device using the same.

  In recent years, a light-emitting device using a light-emitting element can emit light vividly in addition to being small and power efficient. A light emitting device has been manufactured in which a light emitting element (for example, LED, LD) is mounted on a lead frame, and a reflector is molded that includes not only a thermoplastic resin but also a thermosetting resin.

  The lead frame is formed by punching a plurality of terminals, pedestals and the like for a plurality of light emitting devices side by side with respect to one metal plate. In other words, the light emitting devices are very small, and a large number of light emitting devices are formed side by side on a single metal plate, rather than being formed individually. A large number of light emitting devices are completed in a state where they are connected to each other by a lead frame.

  At this time, the light emitting device and the lead frame are configured as follows so that the light emitting device is not easily detached from the lead frame (metal plate) even after the light emitting devices are insulated from each other. That is, a first lead for mounting the light emitting element, a second lead electrically connected to the light emitting element, a reflector surrounding the light emitting element, a first lead that is part of the lead frame, A support bar that is separated from the second lead and the reflector but whose tip is in contact with the reflector is provided (for example, Patent Document 1). With such a configuration, even if the support bar holds the light emitting device from both sides and the first lead and the second lead are separated from the lead frame, the light emitting device is supported by the lead frame.

JP 2008-300827 A

  However, in the lead frame as in (Patent Document 1) and the light emitting device using the lead frame, resin burrs are formed around the support bar. That is, the light emitting device is completed by storing the punched lead frame in a mold and molding the resin. At this time, even if the positional relationship between the mold and the lead frame is slightly shifted, a margin is provided in the mold so that the support bar is properly stored in the mold. Resin enters the surplus portion to form burrs.

  Such a burr problem occurred even with thermoplastic resins, but became more serious with the use of thermosetting resins. That is, a thermoplastic resin generally has a short molding time and few burrs, whereas a thermosetting resin generally has a long molding time and thus tends to generate burrs.

  Further, since the burr is formed to have a thickness similar to that of the lead frame, the burr becomes thicker than the entire light emitting device. As a result, the light emitting device may be damaged when removing the burrs.

  Accordingly, in view of the above problems, the present invention has an object to provide a light emitting element package capable of preventing the occurrence of burrs by a support bar and preventing the light emitting device from being damaged, and a light emitting device using the same. To do.

  In order to solve the above problems, the present invention provides a pair of leads formed in a lead frame, a hole provided in at least one surface of the pair of leads, a reflector containing a resin, and a lead frame, And a support bar that sandwiches the reflector in a direction perpendicular to the direction in which the pair of leads face each other, and the width of the support bar in the direction in which the pair of leads face each other is wider than the width of the reflector. Package.

  It is possible to provide a light emitting element package capable of preventing the burr from being generated by the support bar and preventing the light emitting device from being damaged, and a light emitting device using the same.

The top view of the light-emitting device in embodiment of this invention The top view of the light-emitting device when the support bar is provided with the through hole in the embodiment of the present invention The top view of the lead frame in an embodiment of the invention Conceptual diagram explaining the formation of burrs Top view of a light emitting device in a conventional example Conceptual diagram in which burrs are formed in the light emitting device in the conventional example.

  The invention according to claim 1 is formed in a pair of leads formed in a lead frame, a hole provided in at least one surface of the pair of leads, a resin-containing reflector, and the lead frame, A support bar that sandwiches the reflector in a direction perpendicular to the direction in which the pair of leads opposes, and the width of the support bar in the direction in which the pair of leads opposes is wider than the width of the reflector The package for a light-emitting element is characterized in that it is possible to prevent burrs from being generated by the support bar and to prevent damage to the light-emitting device.

  The invention according to claim 2 is the light emitting device package according to claim 1, wherein the support bar is provided with a through hole, and the support bar adjusts the force with which the reflector is sandwiched, Generation | occurrence | production of the burr | flash by a support bar can be prevented and damage to a light-emitting device can be prevented.

  The invention according to claim 3 includes the light emitting device package according to any one of claims 1 and 2 and a light emitting device, wherein the light emitting device is disposed in the hole of the reflector and the pair of light emitting devices. The light-emitting device is mounted on one of the leads of the light-emitting device, and it is possible to prevent the burr from being generated by the support bar and prevent the light-emitting device from being damaged.

(Embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments described below.

  FIG. 1 is a top view of a light emitting device according to an embodiment of the present invention, FIG. 2 is a top view of the light emitting device when a support bar is provided with a through hole in the embodiment of the present invention, and FIG. It is a top view of the lead frame in the embodiment.

  The light emitting element package in the present embodiment includes a light emitting element 1, a first lead 11 on which the light emitting element 1 is placed, a second lead 12 connected from the light emitting element 1 by a wire 4, and a reflector 2. Support bars 31 and 32 are provided. The reflector 2 includes a through hole, and the light emitting element 1 is disposed in the through hole. The light emitting element 1 and the second lead 12 are electrically connected by a wire 4. The first lead 11 and the second lead 12 and the support bars 31 and 32 are formed as a lead frame 5 by punching one metal plate, and on the lead frame 5, the first lead 11 and the first lead 11 are formed. Two leads 12 and a plurality of support bars 31 and 32 are arranged. As shown in FIG. 3, the tips of the support bars 31 and 32 are separated from the first lead 11 and the second lead 12 and are in contact with the reflector 2. That is, the tips of the support bars 31 and 32 are not directly connected to the first lead 11, the second lead 12, and the reflector 2. Here, the tips of the support bars 31 and 32 are tips facing the first lead 11 and the second lead 12, and are connected as a single lead frame 5 on the side opposite to the tips. In addition, the light emitting device in the present embodiment refers to a device in which the light emitting element 1 is mounted on a light emitting element package. The second lead 12 connected by 4 and the reflector 2 may be separated before or after.

  The light emitting element 1 is, for example, an LED or an LD, and only one light emitting device may be provided or a plurality of light emitting elements may be provided. The light emitting element 1 is placed on the first lead 11 and is electrically connected. The second lead 12 is electrically conducted via the wire 4. The reflector 2 reflects the light of the light emitting element 1 so that the light of the light emitting element 1 is efficiently irradiated. Moreover, since the light emitting element 1 is generally sealed with an adhesive sealing member (resin), the reflector 2 plays a role of blocking the adhesive sealing member (resin). Further, the light emitting element 1 is disposed in the through hole formed in the reflector 2, and further, a part of the first lead 11 and a part of the second lead 12 are disposed in the through hole. The light emitting element package is a package for mounting the light emitting element 1 and is electrically and mechanically connected to a mounting substrate (not shown). That is, the light emitting element 1 is supplied with power from the mounting substrate via the light emitting element package and is operable. In addition, a resin can be used as a die bonding material for adhering and fixing the light emitting element 1 to the first lead 11, but it is desirable to use a metal adhesive having excellent thermal conductivity. For example, when die bonding is performed using a Sn / Ge alloy (98 wt% / 2 wt%, melting point 360 ° C.), the bonding temperature is maintained at 380 ° C. for several minutes. Furthermore, as the sealing resin in the reflector 2, an epoxy resin, a silicone resin, or the like is used.

  Hereinafter, in order to describe the light emitting element package in detail, the configuration of the light emitting element package will be described with reference to FIG. The first lead 11 and the second lead 12 are metal electrodes, and are electrically and mechanically connected to the light emitting element 1 and electrically and mechanically connected to a mounting substrate on which the light emitting device is mounted. . As a result, the light emitting element 1 is supplied with power from the mounting substrate through the first lead 11 and the second lead 12. The first lead 11 and the second lead 12 are connected and sealed with a sealing member that is a thermosetting insulating material. The reflector 2 that is an insulating member has a through hole and is bonded to the first lead 11 and the second lead 12 by an adhesive sealing member. As described above, the light emitting device package is configured, and a light emitting device capable of emitting light by being supplied with power is installed on the first lead 11 and in the through hole of the reflector 2, and light is emitted by injecting resin into the through hole. The element is encapsulated.

  As the material of the first lead 11 and the second lead 12, a metal material such as oxygen-free copper, oxygen-free copper, a copper alloy, or an Fe-based material (for example, Fe-42% Ni) can be used. In particular, it is desirable to use a material with excellent electrical conductivity in order to suppress the generation of heat due to wiring resistance, and excellent thermal conductivity in order to improve heat diffusion. A copper alloy as the main material is suitable, and in this example, a copper alloy having oxygen-free copper as the main material was used.

  Further, the surfaces of the first lead 11 and the second lead 12 have a high light reflectivity, excellent wire bonding properties, and a die bonding material for fixing the light emitting element 1 or a mounting substrate. It is desirable to use silver or gold which has good wettability with solder and is difficult to oxidize, and can be formed by plating or the like.

  In this example, silver plating was performed using electrolytic plating, which is superior in chemical stability and cost performance of the plating solution compared to electroless plating. In addition, in this embodiment, the silver plating thickness is set to 2 μm or more in order to prevent the underlying metal from diffusing to the plating surface and reducing functions such as solder wettability. Further, light emission is improved by forming an oxide film with a chemical on the surface of a part of the first lead 11 and the second lead 12 or by forming a ceramic layer by thermal spraying or the like. The heat dissipation as the whole element package can be improved.

  The sealing member that connects and seals between the first lead 11 and the second lead 12 is a white thermosetting insulating material with good reflectivity. The light emitting element package may be used in a high temperature situation such as when the light emitting element 1 is mounted or heat generated by light emission of the light emitting element 1. When the sealing member is discolored under this high temperature, the reflectance of the sealing member is lowered, and thus the light extraction efficiency can be deteriorated. For this reason, the sealing member is preferably a resin with high durability to high temperatures.

  The reflector 2 mainly serves to control the directivity of light and efficiently heat the heat generated from the light emitting element 1 upward. The shape of the through hole of the reflector 2 may be a perfect circle, an ellipse, or a polygon as long as the strength of the reflector 2 is ensured. It can also be changed.

  A resin is used for the reflector 2, and a thermosetting resin and a thermoplastic resin are used. Even a thermoplastic resin generates burrs, but a thermosetting resin is more likely to generate. The through hole of the reflector 2 is preferably provided with an inclination so as to have a wide opening in the opening direction. Thereby, the extraction of light in the forward direction can be improved. However, it can also be set as a cylindrical recessed part, without providing an inclination. The inclination angle of the through hole is preferably 95 ° or more and 150 ° or less, particularly preferably 100 ° or more and 120 ° or less, as measured from the bottom surface. The lead frame 5 is formed by punching a single metal plate into a predetermined shape as shown in FIG. The lead frame 5 is set in a mold for forming the reflector 2, and a resin is inserted into the mold. The resin is molded into a predetermined shape in the mold to form a light emitting element package.

  The outer shape of the reflector 2 is a rectangle, but it can also be an ellipse, a circle, a pentagon, a hexagon, or the like. The shape of the through hole is substantially a circle, but may be a substantially elliptical shape, a rectangular shape, a pentagonal shape, a hexagonal shape, or the like. The material of the reflector 2 is a thermosetting resin. Among thermosetting resins, it is preferably formed of at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins, particularly epoxy resins and modified epoxy resins. Silicone resins and modified silicone resins are preferred.

  Next, the support bars 31 and 32 will be described in detail.

  The first lead 11 and the second lead 12 are finally cut from the entire lead frame 5 near the straight lines X and Y. As a result, the light emitting device is insulated from the single lead frame 5. For example, when inspecting whether or not the light emitting element 1 is accurately connected to the first lead 11 and the second lead 12, the light emitting device must be insulated from the lead frame 5 as described above. Otherwise, the first lead 11 and the second lead 12 are electrically connected via the lead frame 5.

  However, as described above, a large number of light emitting element packages are formed on one lead frame 5 and are arranged side by side as light emitting devices. Therefore, it is very efficient to conduct a continuity test or the like while a large number are aligned. Therefore, even after the light emitting device is separated from the entire lead frame 5 in the vicinity of the straight line X and the straight line Y, the light emitting element needs to be supported from the lead frame 5. Therefore, the light emitting device is supported by the support bars 31 and 32 that are not electrically connected to the light emitting device so that the light emitting device is not separated from the lead frame 5.

  The purpose of forming the support bars 31 and 32 is to insulate the first lead 11, the second lead 12 and the reflector 2 from the lead frame 5 before the light emitting element 1 is placed on the first lead 11. In the vicinity of the straight line X and the straight line Y, the lead frame 5 can be separated from the whole. That is, even after being separated from the entire lead frame 5 in the vicinity of X and the straight line Y, the first lead 11 and the second lead 12 and the reflector 2 are supported by the lead frame 5 by the support bars 31 and 32. Therefore, the light emitting elements 1 can be sequentially placed while being aligned. Therefore, the freedom degree in the manufacturing process of a light-emitting device increases.

  As shown in FIG. 3, the lead frame 5 is formed. When the first lead 11 and the second lead 12 are separated from the lead frame 5 near the straight line X and the straight line Y, the support bars 31 and 32 can be insulated from the first lead 11 and the second lead 12. I understand. Further, as shown in FIG. 2, the side surface of the reflector 2 is formed as the gap distance between the first lead 11 and the second lead 12 and the support bars 31 and 32. Therefore, by molding the reflector 2, the support bars 31, 32 are in contact with the reflector 2 and support the light emitting device.

  Next, for the sake of explanation, the shape of the conventional support bar and the shape of the support bar of the present invention will be described in comparison.

  4 is a conceptual diagram for explaining the formation of burrs, FIG. 5 is a top view of a light emitting device in a conventional example, and FIG. 6 is a conceptual diagram in which burrs are formed in the light emitting device in the conventional example.

  When forming the reflector 2 by molding the resin, the shape of the reflector 2 is formed by the upper mold and the lower mold, and the reflector 2 is formed by pouring the resin into the shape. At this time, the shapes of the upper mold and the lower mold are determined with a margin more than the actual size of the lead frame 5 so as not to crush the lead frame 5 between the upper mold and the lower mold. At this time, for example, when the support bars 131 and 132 as shown in FIG. 5 are formed, a margin for the α region is provided in the mold as shown in FIG. 4, so that the resin forming the reflector 2 flows into the α region. This flowing resin becomes burrs. That is, there is a possibility that burrs may be formed in the margin α region of the mold that is connected to the space for forming the reflector 2 formed by the upper mold and the lower mold. Therefore, there is a possibility that burrs are formed in all the shaded portions in FIG. Similarly, the same burr | flash is formed also about the support bar of the patent document 1 mentioned above.

  Further, as shown in FIG. 4, the thickness of the burr is equal to the thickness of the support bar 131, that is, the thickness of the lead frame 5. Accordingly, the thickness of the burr becomes very large with respect to the light emitting element package (for example, the thickness of the lead frame 5 is about 1/5 to 2/3 with respect to the thickness of the light emitting element package). It becomes very difficult to remove from the light emitting device.

  Moreover, since the support bars 131 and 132 are not actually connected to the light emitting device, only burrs remain connected to the light emitting device. Since the burr protrudes from the light emitting device, it is easily broken, and as a result, the light emitting element package may be damaged. In addition, when removing the burrs, the light emitting device may be damaged.

  However, in the present invention, since the support bars 31 and 32 are formed as shown in FIGS. As shown in FIG. 1, the width A of the support bar is formed to be equal to or larger than the width a of the reflector. Accordingly, the margin α region of the mold that is connected to the space for forming the reflector 2 formed by the upper die and the lower die is within the four corner regions γ, and the first lead 11 and It exists only at both end portions of the second lead 12. However, even if burrs are formed at the four corners of the light emitting device of FIG. 1, the burrs can be cut simultaneously when the straight lines X and Y are cut. In that case, it is possible to remove the burrs much more easily than the burrs on the support bars 31 and 32 side. The burr formed on the support bars 31 and 32 side requires a burr removing operation. However, since the burr can be cut at the same time when the straight line X and the straight line Y are cut, the process of the package for the light emitting element can be performed. It can be shortened. Further, if burrs are formed on the side surface of the reflector 2 on the side where the support bars 31 and 32 are present, even if the burrs are removed, the removed marks always remain, but no trace remains in the light emitting device of the present invention.

  As shown in FIGS. 2 and 3, the support bars 31 and 32 may be provided with through holes 31a and 32a. By providing the through holes 31 a and 32 a, the force with which the support bars 31 and 32 sandwich the first lead 11 and the second lead 12 and the reflector 2 can be adjusted. That is, it is necessary to support the light emitting device by the support bars 31 and 32. However, if the sandwiching force is too large, a large force is required when the light emitting device is pulled out from the lead frame 5. Further, since the through holes 31a and 32a are completely separated from the space for forming the reflector 2 formed by the upper mold and the lower mold, the resin flows in no matter how much space is provided in the mold. No burr is formed.

  INDUSTRIAL APPLICABILITY According to the present invention, the present invention can be applied to a package for a semiconductor element that can extend the life and has excellent heat release properties, and a light emitting device using the same.

DESCRIPTION OF SYMBOLS 1 Light emitting element 11 1st lead 12 2nd lead 2 Reflectors 31, 32 Support bar 4 Wire 5 Lead frame A Width of support bar a Width of reflector

Claims (3)

A pair of leads formed on the lead frame;
A reflector provided with a hole on at least one surface of the pair of leads, and a resin-containing reflector;
A support bar formed on the lead frame and sandwiching the reflector in a direction perpendicular to a direction in which the pair of leads are opposed to each other.
A package for a light emitting element, wherein a width of the support bar is wider than a width of the reflector in a direction in which the pair of leads are opposed to each other. The light emitting element package according to claim 1, wherein the support bar is provided with a through hole. A light emitting device package according to any one of claims 1 and 2, and a light emitting device,
The light-emitting device, wherein the light-emitting element is placed in one of the pair of leads in the hole of the reflector.