KR101353579B1 - Light emitting diode lamp and light emitting apparatus - Google Patents

Light emitting diode lamp and light emitting apparatus Download PDF

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Publication number
KR101353579B1
KR101353579B1 KR1020070065232A KR20070065232A KR101353579B1 KR 101353579 B1 KR101353579 B1 KR 101353579B1 KR 1020070065232 A KR1020070065232 A KR 1020070065232A KR 20070065232 A KR20070065232 A KR 20070065232A KR 101353579 B1 KR101353579 B1 KR 101353579B1
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KR
South Korea
Prior art keywords
light emitting
lead
emitting diode
leads
led
Prior art date
Application number
KR1020070065232A
Other languages
Korean (ko)
Other versions
KR20090001106A (en
Inventor
양승만
조재호
Original Assignee
서울반도체 주식회사
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Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020070065232A priority Critical patent/KR101353579B1/en
Publication of KR20090001106A publication Critical patent/KR20090001106A/en
Application granted granted Critical
Publication of KR101353579B1 publication Critical patent/KR101353579B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode lamp, and to provide a light emitting diode lamp applicable to a thin product.

To this end, the LED lamp according to the present invention comprises a chip mounting portion; A first lead extending from the chip mounting portion; A second lead spaced apart from the first lead; A light emitting diode mounted on the chip mounting unit; A wire connecting the light emitting diode and the second lead; And a sealing part sealing a portion of the chip mounting part, the light emitting diode, the first lead, and the second lead, wherein each of the first and second leads is exposed below the sealing part and a part of the sealing part is partially sealed. It is characterized in that it is bent to position. The seal is formed with a recess in an opposite direction, and portions of the first and second leads are inserted into the recess. In addition, the first and second leads have steps in the side of the seal.

LED Lamps, Bending, Stepped, Concave, Thin, Sealed

Description

LIGHT EMITTING DIODE LAMP AND LIGHT EMITTING APPARATUS}

1 is a cross-sectional view for explaining a conventional light emitting diode lamp.

Figure 2 is a perspective view for explaining a light emitting diode lamp according to an embodiment of the present invention.

3 is a sectional view taken along X-X of FIG. 2;

Figure 4 is a perspective view for explaining a light emitting diode lamp according to another embodiment of the present invention.

5 is a view for explaining a light emitting device according to an embodiment of the present invention;

6 is a view showing a state in which a light emitting diode lamp is mounted on the substrate shown in FIG.

DESCRIPTION OF THE REFERENCE SYMBOLS

30: light emitting diode lamp 31a: first lead

31b: 2nd lead 33: Top part

35: LED 37: wire

38: sealing part 38a: recessed part

39: resin 50: substrate

52 groove 53a: first electrode portion

53b: second electrode portion

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to light emitting diode lamps, and more particularly, to light emitting diode lamps that can be applied to thin products by bending the leads protruding downward from the sealing portion to be located on the side of the sealing portion.

In general, LED lamps are widely used for indicators, electronic signs, and displays because they can implement colors, and are also used for general lighting because they can implement white light. Such light emitting diode lamps are highly efficient, have a long lifetime, and are environmentally friendly, so the field of using them continues to increase.

1 is a cross-sectional view illustrating a conventional light emitting diode (LED) lamp.

Referring to FIG. 1, the LED lamp includes a top 23 and a first lead having a pin type leg 21a extending from the top 23. The snap leg 21a includes a bent portion 22a that is bent almost vertically on the wide side and the bottom. In addition, a second lead having a snap leg 21b is disposed to correspond to the first lead spaced apart from the first lead. The snap leg 21b of the second lead also includes a bent portion 22b that is bent almost vertically on the wide side and the bottom. The first lead and the second lead may be formed of a metal or alloy such as copper or iron, and may be molded using a molding technique.

A cavity may be formed in the top portion 23 of the first lead. The side wall of the cavity forms an inclined reflecting surface for reflecting light emitted from the light emitting diode in the required direction.

The LED 25 is located on the cavity of the top 23. The LED 25 may be secured to the bottom of the cavity using an electrically conductive adhesive, such as silver epoxy, and thus electrically connected to the first lead. The LED 25 is electrically connected to the second lead through a wire 27. The sealing resin 28 seals the top 23 of the first lead, the LED 25 and a part of the second lead. Therefore, after the bent portions 22a and 22b of the first lead and the second lead are mounted on the printed circuit board, the current may be supplied to the LED lamp through the printed circuit board. At this time, current flows through the LED 25, and as a result, light is emitted.

However, the conventional LED lamp has a high height of the product when mounted on the printed circuit board, that is, the height between the bottom of the first and second leads and the top of the sealing resin 28, so that a thin product cannot be applied in design. There are disadvantages. As a result, LED lamps that can be applied to thin products are required.

An object of the present invention is to provide a light emitting diode lamp that can be applied to a thin product.

Another object of the present invention is to provide a thin product in a simple process by electrically connecting the electrode portion formed in the groove and the first and second leads of the LED lamp when the LED lamp is mounted in the groove of the substrate. It is to provide a light emitting device that can be made.

In order to achieve the above technical problem, a light emitting diode lamp according to an embodiment of the present invention comprises a chip mounting unit; A first lead extending from the chip mounting portion; A second lead spaced apart from the first lead; A light emitting diode mounted on the chip mounting unit; A wire connecting the light emitting diode and the second lead; And a sealing part sealing a portion of the chip mounting part, the light emitting diode, the first lead, and the second lead, wherein each of the first and second leads is exposed below the sealing part and a part of the sealing part is partially sealed. It is characterized in that it is bent to position.

According to this embodiment, the first and second leads have steps in the side of the seal. The seal is formed with a recess in an opposite direction, and portions of the first and second leads are inserted into the recess.
The LED lamp according to the embodiment of the present invention further includes a phosphor dispersed around the light emitting diode.

In addition, the light emitting device according to the present invention comprises a substrate having a groove; And a light emitting diode lamp mounted in a groove of the substrate. This LED lamp includes a chip mounting portion; A first lead extending from the chip mounting; A second lead spaced apart from the first lead; A light emitting diode mounted on the chip mounting unit; A wire connecting the light emitting diode and the second lead; And a sealing part sealing a portion of the chip mounting part, the light emitting diode, the first lead, and the second lead, wherein each of the first and second leads is exposed below the sealing part and a part of the sealing part is partially sealed. It is bent to be located on the side. In addition, the first and second leads of the light emitting diode lamp have stepped sides in the sealing part. The encapsulation part has a concave portion formed in an opposite direction, and portions of the first and second leads are inserted into the concave portion, and further include a phosphor scattered around the light emitting diode.

Such a light emitting diode lamp is mounted in a groove of the substrate. The substrate further includes electrode portions formed on sidewalls of the groove, and first and second leads positioned at sides of the sealing portion of the light emitting diode lamp are electrically connected to the electrode portions.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

2 is a perspective view illustrating a light emitting diode lamp according to an embodiment of the present invention, FIG. 3 is a cross-sectional view taken along line XX of FIG. 2, and FIG. 4 illustrates a light emitting diode lamp according to another embodiment of the present invention. It is a perspective view for doing so.

Referring to FIG. 2, the LED lamp 30 according to the present invention may seal the LED 35 with the first and second leads 31a and 31b for applying current to the LED 35 (see FIG. 3). Seal 38.

Referring to FIG. 3, the LED lamp 30 includes a chip mounting part 33 (hereinafter referred to as a 'top part') on which the LED 35 is mounted, and a first lead 31a extending to the top part 33. And a second lead 31b disposed to correspond to the first lead 31a while being spaced apart from the first lead 31a, an LED 35 positioned on the top portion 33, a wire 37, and a sealing part. It comprises 38.

The top portion 33 includes an upper surface on which the LED 35 is mounted. The upper surface of the top portion 33 is formed with a cavity as shown in FIG. Both side walls of the cavity form an inclined surface for reflecting light emitted from the LED 35. LED 35 is located on the bottom surface of the cavity of the top portion 33.

In this embodiment, the cavity is formed on the top surface of the top portion 33 in which the LED 35 is located, but the top surface of the top portion 33 may be formed as a flat surface and the LED on the top surface. 35 may be located.

The LED 35 may be fixed on the top surface by using an electrically conductive adhesive such as silver epoxy and electrically connected to the first lead 31a. In addition, the LED 35 is electrically connected to the second lead 31b through a wire 37.

The seal 38 seals the top 33, the LED 35, and the wire 37. In addition, the seal 38 seals a part of the first lead 31a and the second lead 31b. The seal 38 is generally formed using a transparent resin such as epoxy or silicon, but may be molded using a translucent resin according to the purpose. The sealing portion 38 may further include a lens portion 38b that protects the LED 35 and simultaneously refracts the light emitted from the LED 35 into a predetermined direction angle (see FIG. 4). Thus, the appearance of the seal 38 may have a variety of shapes depending on the orientation angle required. For example, the top of the seal 38 can be convex to have a small curvature in order to obtain a narrow angle of orientation. In contrast, the upper portion of the seal 38 can be flat to have a large curvature in order to obtain a wider angle of orientation.

In addition, the resin part 39 may be further formed to cover the LED 35 positioned in the cavity. This resin portion 39 may contain a phosphor. The phosphor converts the wavelength of light emitted from the LED 35 to emit light of the required wavelength. For example, when the LED 35 emits blue light, the phosphor may absorb a portion of the blue light emitted from the LED 35 to emit yellow light. As a result, white light may be realized by blue light emitted from the LED 35 and yellow light emitted from the phosphor. On the other hand, the resin portion 39 may contain two or more kinds of phosphors.

The first lead 31a and the second lead 31b may be formed of a metal or an alloy such as copper or iron.

Each of the first lead 31a and the second lead 31b is bent to protrude downward from the seal 38 so that a part thereof is positioned at the side of the seal 38. Accordingly, the light emitting diode lamp 30 may be applied to a thin product because the height between the bottom surfaces of the first and second leads 31a and 31b and the upper end of the seal 38 is lower than in the related art.

In more detail, the first lead 31a and the second lead 31b protrude downward from the sealing portion 38 to be bent at substantially right angles to the outside in the horizontal direction, and the first bend portion a; A second bent portion (b) bent substantially perpendicularly upward from the bent portion (a) and a step (c) extending from the second bent portion (b) toward the sealing portion 38, respectively. Can be done. Here, the step c may be formed for vertical bending of the second bent portion b.

The sealing portion 38 is formed with a recess 38a into which the step c is inserted. The thickness of the recess 38a is preferably such that the thickness of the recess 38a accommodates the thickness of the first and second leads 31a and 31b, and the width of the step c is fixed while being inserted into the recess 38a. It is more preferable that the width is enough.

A light emitting device equipped with the LED lamp 30 having such a configuration will be described with reference to FIGS. 5 and 6 as follows.

Referring to FIG. 5, the light emitting device according to the present invention includes a substrate 50 and a light emitting diode lamp 30 mounted on the substrate 50. Since the light emitting diode lamp 30 has been described in the above embodiment, description thereof will be omitted.

The substrate 50 is formed with a groove 52 for accommodating the LED lamp 30. The groove 52 is preferably formed in the center of the substrate 50. In this case, the substrate may be a printed circuit board.

The first electrode part 53a and the second electrode part 53b are formed on both side walls of the groove 52 formed in the substrate 50. The first and second electrode portions 53a and 53b may be formed to face each other in the groove 52, but the present invention is not limited thereto, and the first and second electrode parts 53a and 53b may be disposed on sidewalls adjacent to each other in the groove 52. Electrode portions may be formed. As such, when the electrode portions are formed in the groove 52 of the substrate 50 on the sidewalls adjacent to each other, the leads of the LED lamp 30 may be formed to be electrically connected to the electrode portions formed on the groove 52. .

The first and second electrode parts 53a and 53b may be disposed at side surfaces of the sealing part 38 of the LED lamp 30 when the LED lamp 30 is mounted. Is electrically connected to the The wide second bent portions b of the first and second leads 31a and 31b come into contact with the substrate to improve reliability of the operation.

Here, the LED lamp 30 may be surface mounted on the substrate 50 by surface mount technology (SMT), such as a reflow shouldering process. In particular, the first and second leads 31a and 31b of the LED lamp 30 are soldered onto the first and second electrode portions 53a and 53b formed in the grooves 52 of the substrate 50. Soldering causes the first and second electrode portions 53a and 53b located in the grooves 52 of the substrate 50 to face each other on the sides of the sealing portion 38 of the light emitting diode lamp 30, respectively. It is electrically connected to the first and second leads 31a, 31b located. In more detail, the second bent portions b formed in the first leads 31 a and the second leads 31 b are formed in the grooves 52 of the substrate 50. By soldering to each of 53a and 53b, a current may be supplied to the LED lamp 30 through the substrate 50. At this time, the current flows through the LED 35, and as a result, light is emitted.

The state in which the LED lamp 30 is mounted on the substrate 50 is illustrated in FIG. 6, and the first and second leads 31a and 31b are bent so as to be located at the side of the seal 38, respectively. Accordingly, the light emitting diode lamp 30 may be applied to the thin product. In particular, it is possible to simplify the manufacturing process by applying a light emitting diode lamp (30) to small electric, electronic products such as mobile phones or notebook computers from various transportation means, such as automobiles.

According to an embodiment of the present invention, by bending the leads protruding downward from the seal to be located on the side of the seal, the LED lamp may be applied to the thin product.

In addition, according to an embodiment of the present invention there is an effect that can simplify the manufacturing process by soldering the leads of the LED lamp to the electrode portions formed in the groove of the substrate.

Claims (6)

Chip mounting unit; A first lead extending from the chip mounting portion; A second lead spaced apart from the first lead; A light emitting diode mounted on the chip mounting unit; A wire connecting the light emitting diode and the second lead; And A sealing part sealing part of the chip mounting part, the light emitting diode, the first lead, and the second lead, Each of the first and second leads is bent to expose the lower portion of the seal so that a portion thereof is located at the side of the seal, And the first and second leads have stepped sides of the sealing part. delete The method according to claim 1, The side of the sealing portion is a light emitting diode lamp, characterized in that the recessed portion is inserted into the part of the first and second leads. The method according to claim 1, The light emitting diode lamp further comprises a phosphor dispersed around the light emitting diode. A grooved substrate; And A light emitting device comprising the light emitting diode lamp of claim 1 mounted on a groove of the substrate. The method of claim 5, The substrate further includes electrode portions formed on the sidewall of the groove, And first and second leads positioned at sides of a sealing part of the LED lamp are electrically connected to the electrode parts.
KR1020070065232A 2007-06-29 2007-06-29 Light emitting diode lamp and light emitting apparatus KR101353579B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070065232A KR101353579B1 (en) 2007-06-29 2007-06-29 Light emitting diode lamp and light emitting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070065232A KR101353579B1 (en) 2007-06-29 2007-06-29 Light emitting diode lamp and light emitting apparatus

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KR20090001106A KR20090001106A (en) 2009-01-08
KR101353579B1 true KR101353579B1 (en) 2014-01-22

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103594602A (en) * 2013-10-30 2014-02-19 王定锋 SMD-LED support with insulating material pasted, SMD-LED with insulating material pasted, and manufacturing methods of SMD-LED support with insulating material and SMD-LED with insulating material pasted

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980078139A (en) * 1997-04-25 1998-11-16 서두칠 Ultra-thin chip mounting method of board for double-sided printer wiring circuit
JP2004311857A (en) 2003-04-10 2004-11-04 Sharp Corp Semiconductor light emitting device and manufacturing method thereof
JP2006080251A (en) * 2004-09-09 2006-03-23 Nichia Chem Ind Ltd Light-emitting device and manufacturing method therefor
JP2012054533A (en) 2010-08-06 2012-03-15 Nichia Chem Ind Ltd Light emitting device and image display unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980078139A (en) * 1997-04-25 1998-11-16 서두칠 Ultra-thin chip mounting method of board for double-sided printer wiring circuit
JP2004311857A (en) 2003-04-10 2004-11-04 Sharp Corp Semiconductor light emitting device and manufacturing method thereof
JP2006080251A (en) * 2004-09-09 2006-03-23 Nichia Chem Ind Ltd Light-emitting device and manufacturing method therefor
JP2012054533A (en) 2010-08-06 2012-03-15 Nichia Chem Ind Ltd Light emitting device and image display unit

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