WO2017124784A1 - Wide-angle light emitting led filament lamp - Google Patents

Wide-angle light emitting led filament lamp Download PDF

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Publication number
WO2017124784A1
WO2017124784A1 PCT/CN2016/102248 CN2016102248W WO2017124784A1 WO 2017124784 A1 WO2017124784 A1 WO 2017124784A1 CN 2016102248 W CN2016102248 W CN 2016102248W WO 2017124784 A1 WO2017124784 A1 WO 2017124784A1
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Prior art keywords
light source
substrate
heat transfer
transfer plate
filament lamp
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PCT/CN2016/102248
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French (fr)
Chinese (zh)
Inventor
曾茂进
王其远
鲍永均
黄温昌
曹亮亮
陈小波
吴明浩
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漳洲立达信光电子科技有限公司
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Publication of WO2017124784A1 publication Critical patent/WO2017124784A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction

Definitions

  • the invention relates to the technical field of LED illumination, in particular to a large-angle illumination LED filament lamp.
  • LED Luminaires gradually replace traditional lighting fixtures. Because LED lighting has the characteristics of point light source and directionality, it is difficult for LED lamps to completely replace traditional incandescent lamps and achieve full light distribution.
  • a group of LED chips are packaged on a transparent substrate to form an LED filament, which can realize large-angle illumination, and then connect a plurality of filaments to form a luminous effect similar to a tungsten filament lamp.
  • the LED filament has substantially no heat sink, and the LED filament cannot be thermally conducted, so it is difficult to conduct the heat generated by the LED chip. The heat can only be thermally and thermally dissipated by the convection of the radiation and the internal gas, which easily causes the heat to accumulate. The life of the LED filament is shortened.
  • the existing LED filament lamp is usually manufactured by a heat-conducting gas and a glass sealing process.
  • This technology has high technical requirements for sealing, and the equipment is expensive, which easily leads to the problem that the sealing is not sealed, gas leakage, explosion, glass bubble is fragile, etc. .
  • Long-term use is difficult to avoid air leakage problems, and air leakage will result in reduced heat dissipation or even LED filaments being burnt.
  • the heat dissipation performance of the gas is limited, and can only meet the development of the low-power LED filament lamp. Once the power is high, the heat generated by the LED filament cannot be dissipated in time, which easily causes thermal damage and light decay of the LED chip, so that the light of the whole lamp is made. The maintenance rate is low and the life is short.
  • a large-angle LED light filament lamp comprising a lamp body, a heat transfer plate and a plurality of light source plates, each light source plate comprising a substrate and a plurality of LED light sources spaced apart on the substrate, the heat transfer plate being disposed at the lamp head a top portion of the body, the heat transfer plate is provided with a plurality of connecting portions, the connecting portions are respectively disposed on the heat transfer plate and thermally connected to the heat transfer plate, and the bottom of the light source plate is respectively fixed to the connection And electrically connected to the connecting portion, the substrate of each light source plate is made of a heat dissipating material, and the LED light source is disposed on a side of the substrate and is densely distributed near a bottom of the substrate.
  • the present invention places the LED light source on the substrate such that it is densely distributed near the bottom of the substrate, and the bottoms of the light source plates are respectively fixed to the connection thermally connected to the heat transfer plate.
  • the heat generated by the LED light sources can form a gradient distribution on the substrate, and the heat generated at a position closer to the bottom of the substrate is more, and the heat conduction path of the portion of the heat to the heat transfer plate is shorter. Rapidly conducting to the connecting portion and conducting out through the heat transfer plate, increasing the speed of heat conduction and avoiding heat accumulation, so that the large-angle LED filament lamp has good heat dissipation effect, and does not need to separately charge heat-conducting gas and glass sealing.
  • the process avoids the complicated process specially designed for charging heat-conducting gas and glass sealing, and has the advantages of simple assembly process and good heat dissipation.
  • the large-angle LED light filament lamp includes a lamp body 10 , a heat transfer plate 20 , and a plurality of light source plates 30 .
  • Each of the light source plates 30 includes a substrate 31 and is disposed on the substrate 31 .
  • a plurality of LED light sources (not shown) are disposed on the top of the base body 10.
  • the base body 10 is provided with a heat dissipating portion 11 that is thermally connected to the heat dissipating portion 11.
  • the light source plates 30 are respectively disposed obliquely with respect to the heat transfer plate 20, and the light source plates 30 are arranged in a ring shape around the central axis of the heat transfer plate 20.
  • the heat transfer plate 20 is provided with four connecting portions 21 which are respectively disposed on the heat transfer plate 20 and are thermally connected to the heat transfer plate 20.
  • Each of the connecting portions 21 is a block structure integrally provided on the light source panel 30.
  • the bottoms of the light source plates 30 are respectively fixed to the connecting portions 21 and thermally connected to the connecting portions 21, so that the heat of the light source plates 30 can be conducted to the heat transfer plates 20.
  • the tops of the light source plates 30 are disposed closer to the central axis of the heat transfer plate 20 than the bottom thereof.
  • the connecting portions 21 are respectively provided with inclined heat transfer surfaces 211 corresponding to the light source plates 30 to increase the light source plates. 30 is the thermal connection area with these connecting portions 21.
  • the number of the connecting portions 21 may be plural, and the connecting portions 21 may be provided integrally.
  • the substrates 31 are made of a transparent or translucent material, and a part of the light emitted by the LED light sources is emitted outward through the substrate 31.
  • the LED light source is disposed on the front surface of the substrate 31.
  • the back surface of the substrate 31 is further provided with a heat conducting layer (not shown). A portion of the heat conducting layer is thermally connected to the connecting portion 21, and the position of the heat conducting layer is deviated from the LED light source. position.
  • the substrates 31 are made of ceramic, high thermal conductivity glass or sapphire material, and the heat conductive layer is a metallic silver layer or a metallic copper layer attached to the back surface of the substrate 31.
  • the LED light sources on each of the light source panels 30 are packaged together by a phosphor layer to form a surface light source.
  • the substrate 31 of each light source panel 30 is made of a heat dissipating material.
  • the LED light sources are disposed on the side of the substrate 31 and are densely distributed near the bottom of the substrate 31.
  • the heat generated by the LED light sources can be A gradient distribution is formed on the substrate 31.
  • the heat generated at a position closer to the bottom of the substrate 31 is more, and the heat conduction path of the portion of the heat to the heat transfer plate 20 is shorter, and can be quickly transmitted to the connecting portion 21,
  • the speed of heat conduction is increased and conducted through the heat transfer plate 20 to the heat dissipating portion 11 thermally connected to the heat transfer plate 20, and is radiated through the heat dissipating portion 11 to prevent heat accumulation, resulting in failure of these LED light sources.
  • FIG. 2, FIG. 4 and FIG. 5, further including a circuit board 50 disposed above the heat transfer plate 20, and the circuit board 50 is provided with a positioning hole 51 corresponding to the connecting portions 21, The circuit board 50 can be sleeved on the connecting portions 21.
  • Each of the light source plates 30 is further provided with an electrode terminal 52.
  • One end of the electrode terminals 52 is electrically connected to the circuit board 50.
  • the other ends of the electrode terminals 52 are provided with elastic contacts 521, and each light source plate
  • the bottoms of the substrates 31 in the 30 are respectively provided with electrodes (not shown), and the elastic contacts 521 of the electrode terminals 52 are elastically abutted with the electrodes on the light source plates 30 to achieve electrical connection, so that no additional bonding wires are needed. Easy to automate production.
  • a light bulb case 40 is further disposed.
  • the bottom of the light bulb case 40 is disposed on the heat transfer plate 20 and the light source plate 30 is received therein.
  • the light bulb case 40 is a hemispherical bulb structure, and the light source plate 30 is adjacent to the light source plate 30.
  • the LED light source at the bottom of the substrate 31 is disposed corresponding to the bottom of the bulb shell 40, and the bottom of the bulb shell 40 is used to direct most of the light emitted from the LED light source on the light source panel 30 near the bottom of the substrate 31 toward the heat transfer plate 20.
  • the bulb shell 40 is of a transparent or translucent structure made of plastic or glass, and a light diffusing material may be disposed on the bulb shell 40.
  • the position of the LED light source is relatively dense and large near the bottom of the substrate 31, and the distribution is relatively sparse and relatively thin at a position away from the bottom of the substrate.
  • the bottoms of the light source plates 30 are respectively fixed on the connecting portions 21 thermally connected to the heat transfer plates 20, so that the heat generated by the LED light sources can form a gradient distribution on the substrate 31, closer to the bottom of the substrate 31.
  • the position generates more heat, and the heat transfer path of the part of the heat to the heat transfer plate 20 is shorter, can be quickly transmitted to the connecting portion 21, and is conducted through the heat transfer plate 20 to increase the speed of heat conduction.
  • the high-angle LED filament lamp has good heat dissipation effect, and does not need to separately charge heat-conducting gas and glass sealing process, avoiding complicated process specially designed for charging heat-conducting gas and glass sealing, and has simple assembly process The advantages of good heat dissipation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A wide-angle light emitting LED filament lamp comprises a lamp holder (10), a heat transfer plate (20) and a plurality of light source plates (30), each of the light source plates (30) comprising a substrate (31) and a plurality of LED light sources arranged at intervals on the substrate (31), the heat transfer plate (20) being disposed at a top portion of the lamp holder (10) and provided with a plurality of connecting portions (21) thereon, the connecting portions (21) being arranged at intervals on the heat transfer plate (20) respectively and thermally connected thereto, bottom portions of the light source plates (30) being fixed on the connecting portions (21) respectively and thermally connected thereto, each of the substrates (31) of the light source plates (30) being made of heat sink material, the LED light sources being disposed on side surfaces of the substrates (31) and having a denser distribution at positions of the substrates (31) closer to the bottoms. The wide-angle light emitting LED filament lamp is advantageous in easy assembly process and good heat dissipation performance.

Description

大角度发光LED灯丝灯Large angle LED light filament lamp
本发明涉及LED照明技术领域,特别涉及一种大角度发光LED灯丝灯。The invention relates to the technical field of LED illumination, in particular to a large-angle illumination LED filament lamp.
近年来,由于LED 产业的发展迅速,LED 灯具逐步取代传统的照明灯具。由于LED发光具有点光源和方向性等特性,故LED灯具很难完全代替传统白炽灯,做到全配光照明。现有一种LED灯丝,是将一组LED芯片封装在透明基板上形成LED灯丝,可以实现大角度发光,然后将多个灯丝连接形成类似钨丝灯的发光效果。目前,LED灯丝基本没有散热体, LED灯丝无法进行热传导散热,所以很难将LED芯片产生的热量传导出去,热量只能靠辐射和内部气体的对流进行导热和散热,容易造成热量的堆积,使得LED灯丝的寿命缩短。In recent years, due to the rapid development of the LED industry, LED                 Luminaires gradually replace traditional lighting fixtures. Because LED lighting has the characteristics of point light source and directionality, it is difficult for LED lamps to completely replace traditional incandescent lamps and achieve full light distribution. In the existing LED filament, a group of LED chips are packaged on a transparent substrate to form an LED filament, which can realize large-angle illumination, and then connect a plurality of filaments to form a luminous effect similar to a tungsten filament lamp. At present, the LED filament has substantially no heat sink, and the LED filament cannot be thermally conducted, so it is difficult to conduct the heat generated by the LED chip. The heat can only be thermally and thermally dissipated by the convection of the radiation and the internal gas, which easily causes the heat to accumulate. The life of the LED filament is shortened.
现有的LED灯丝灯通常采用充导热气体和玻璃封泡工艺制造,此工艺对封泡的技术要求高,设备昂贵,容易导致封泡没封紧,漏气,爆炸、玻璃泡易碎等问题。长期使用难以避免会出现漏气问题,而漏气会导致散热能力降低甚至LED灯丝被烧毁。且气体的散热性能有限,只能满足小功率LED灯丝灯的开发,而一旦做大功率,LED灯丝的产生的热量无法及时散出,容易引起LED芯片的热损坏和光衰,使得整灯的光通维持率低,寿命短。The existing LED filament lamp is usually manufactured by a heat-conducting gas and a glass sealing process. This technology has high technical requirements for sealing, and the equipment is expensive, which easily leads to the problem that the sealing is not sealed, gas leakage, explosion, glass bubble is fragile, etc. . Long-term use is difficult to avoid air leakage problems, and air leakage will result in reduced heat dissipation or even LED filaments being burnt. Moreover, the heat dissipation performance of the gas is limited, and can only meet the development of the low-power LED filament lamp. Once the power is high, the heat generated by the LED filament cannot be dissipated in time, which easily causes thermal damage and light decay of the LED chip, so that the light of the whole lamp is made. The maintenance rate is low and the life is short.
有鉴于此,有必要提供一种组装工艺简单、散热良好的大角度发光LED灯丝灯。In view of this, it is necessary to provide a large-angle light-emitting LED filament lamp with a simple assembly process and good heat dissipation.
一种大角度发光LED灯丝灯,包括灯头体、传热板及多个光源板,每个光源板均包括基板及间隔设置在该基板上的多个LED光源,该传热板设置在该灯头体的顶部,该传热板上设有多个连接部,所述连接部分别间隔设置在该传热板上且与该传热板热连接,所述光源板的底部分别固定在所述连接部上且与所述连接部热连接,每个光源板的基板均由散热材料制成,所述LED光源设置在该基板的侧面上且在靠近该基板的底部的位置分布较密。A large-angle LED light filament lamp comprising a lamp body, a heat transfer plate and a plurality of light source plates, each light source plate comprising a substrate and a plurality of LED light sources spaced apart on the substrate, the heat transfer plate being disposed at the lamp head a top portion of the body, the heat transfer plate is provided with a plurality of connecting portions, the connecting portions are respectively disposed on the heat transfer plate and thermally connected to the heat transfer plate, and the bottom of the light source plate is respectively fixed to the connection And electrically connected to the connecting portion, the substrate of each light source plate is made of a heat dissipating material, and the LED light source is disposed on a side of the substrate and is densely distributed near a bottom of the substrate.
与现有技术相比,本发明将LED光源设置于该基板上时,使得其在靠近该基板的底部的位置分布较密,而这些光源板的底部分别固定在与传热板热连接的连接部上,这样,这些LED光源产生的热量可在该基板上形成梯度分布,更靠近该基板的底部的位置产生的热量更多,而此部分热量到该传热板的热传导路径较短,可迅速的传导到该连接部上,并通过该传热板传导出去,提高热传导的速度,避免热量堆积,使得该大角度LED灯丝灯具有良好的散热效果,且无需另外充导热气体和玻璃封泡工艺,避免了专门为充导热气体和玻璃封泡而设计的复杂工艺,具有组装工艺简单、散热良好的优点。Compared with the prior art, the present invention places the LED light source on the substrate such that it is densely distributed near the bottom of the substrate, and the bottoms of the light source plates are respectively fixed to the connection thermally connected to the heat transfer plate. In this way, the heat generated by the LED light sources can form a gradient distribution on the substrate, and the heat generated at a position closer to the bottom of the substrate is more, and the heat conduction path of the portion of the heat to the heat transfer plate is shorter. Rapidly conducting to the connecting portion and conducting out through the heat transfer plate, increasing the speed of heat conduction and avoiding heat accumulation, so that the large-angle LED filament lamp has good heat dissipation effect, and does not need to separately charge heat-conducting gas and glass sealing. The process avoids the complicated process specially designed for charging heat-conducting gas and glass sealing, and has the advantages of simple assembly process and good heat dissipation.
图1figure 1
是本发明大角度发光LED灯丝灯第一实施例的立体图。It is a perspective view of the first embodiment of the high angle illumination LED filament lamp of the present invention.
图2figure 2
是图1所示大角度发光LED灯丝灯立体分解图。 It is an exploded view of the large-angle LED light filament lamp shown in Figure 1.
图3image 3
是图1所示大角度发光LED灯丝灯的剖面图Is a sectional view of the large angle LED light filament lamp shown in Figure 1.
图4Figure 4
是图2所示大角度发光LED灯丝灯中电极端子的立体图 Is a perspective view of the electrode terminal in the large angle LED light filament lamp shown in Fig. 2.
图5Figure 5
是图2所示大角度发光LED灯丝灯的部分组装立体图Is a partially assembled perspective view of the large angle LED light filament lamp shown in Figure 2.
下面结合附图与具体实施方式对本发明作进一步详细描述。The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
请参考图1至图5,该大角度发光LED灯丝灯,包括灯头体10、传热板20及多个光源板30,每个光源板30均包括基板31及间隔设置在该基板31上的多个LED光源(图未示),该传热板20设置在该灯头体10的顶部,该灯头体10上设有散热部11,该传热板20与该散热部11热连接。Referring to FIG. 1 to FIG. 5 , the large-angle LED light filament lamp includes a lamp body 10 , a heat transfer plate 20 , and a plurality of light source plates 30 . Each of the light source plates 30 includes a substrate 31 and is disposed on the substrate 31 . A plurality of LED light sources (not shown) are disposed on the top of the base body 10. The base body 10 is provided with a heat dissipating portion 11 that is thermally connected to the heat dissipating portion 11.
其中,这些光源板30分别相对该传热板20倾斜设置,并且这些光源板30绕该传热板20的中轴线成环形排列。该传热板20上设有四个连接部21,这些连接部21分别间隔设置在该传热板20上且与该传热板20热连接。每个连接部21均为一体设置在该光源板30上的块体结构。这些光源板30的底部分别固定在这些连接部21上且与这些连接部21热连接,使得这些光源板30的热量可以传导到该传热板20上。本实施例中,这些光源板30的顶部相对其底部更靠近该传热板20的中轴线设置,这些连接部21对应这些光源板30分别设有倾斜的传热面211,以便增加这些光源板30与这些连接部21的热连接面积。本实施例中,这些连接部21可为多个,也可将这些连接部21设置为一体。The light source plates 30 are respectively disposed obliquely with respect to the heat transfer plate 20, and the light source plates 30 are arranged in a ring shape around the central axis of the heat transfer plate 20. The heat transfer plate 20 is provided with four connecting portions 21 which are respectively disposed on the heat transfer plate 20 and are thermally connected to the heat transfer plate 20. Each of the connecting portions 21 is a block structure integrally provided on the light source panel 30. The bottoms of the light source plates 30 are respectively fixed to the connecting portions 21 and thermally connected to the connecting portions 21, so that the heat of the light source plates 30 can be conducted to the heat transfer plates 20. In this embodiment, the tops of the light source plates 30 are disposed closer to the central axis of the heat transfer plate 20 than the bottom thereof. The connecting portions 21 are respectively provided with inclined heat transfer surfaces 211 corresponding to the light source plates 30 to increase the light source plates. 30 is the thermal connection area with these connecting portions 21. In this embodiment, the number of the connecting portions 21 may be plural, and the connecting portions 21 may be provided integrally.
本实施例中,这些基板31由透明或半透明材料制成,这些LED光源发出的一部分光穿过该基板31向外射出。这些LED光源设置在该基板31的正面,该基板31的背面还设有导热层(图未示),该导热层的一部分与该连接部21热连接,该导热层的位置偏离这些LED光源的位置。具体的,这些基板31由陶瓷、高导热玻璃或蓝宝石材料制成,该导热层为附着在该基板31背面的金属银层或金属铜层。每个光源板30上的LED光源被一个荧光粉层封装在一起形成面发光光源。每个光源板30的基板31均由散热材料制成,这些LED光源设置在该基板31的侧面上且在靠近该基板31的底部的位置分布较密,这样,这些LED光源产生的热量可在该基板31上形成梯度分布,更靠近该基板31的底部的位置产生的热量更多,而此部分热量到该传热板20的热传导路径较短,可迅速的传导到该连接部21上,提高热传导的速度,并通过该传热板20传导到与该传热板20热连接的该散热部11上,经该散热部11散发出去,避免热量堆积,导致这些LED光源失效。In this embodiment, the substrates 31 are made of a transparent or translucent material, and a part of the light emitted by the LED light sources is emitted outward through the substrate 31. The LED light source is disposed on the front surface of the substrate 31. The back surface of the substrate 31 is further provided with a heat conducting layer (not shown). A portion of the heat conducting layer is thermally connected to the connecting portion 21, and the position of the heat conducting layer is deviated from the LED light source. position. Specifically, the substrates 31 are made of ceramic, high thermal conductivity glass or sapphire material, and the heat conductive layer is a metallic silver layer or a metallic copper layer attached to the back surface of the substrate 31. The LED light sources on each of the light source panels 30 are packaged together by a phosphor layer to form a surface light source. The substrate 31 of each light source panel 30 is made of a heat dissipating material. The LED light sources are disposed on the side of the substrate 31 and are densely distributed near the bottom of the substrate 31. Thus, the heat generated by the LED light sources can be A gradient distribution is formed on the substrate 31. The heat generated at a position closer to the bottom of the substrate 31 is more, and the heat conduction path of the portion of the heat to the heat transfer plate 20 is shorter, and can be quickly transmitted to the connecting portion 21, The speed of heat conduction is increased and conducted through the heat transfer plate 20 to the heat dissipating portion 11 thermally connected to the heat transfer plate 20, and is radiated through the heat dissipating portion 11 to prevent heat accumulation, resulting in failure of these LED light sources.
此外,请参考图2、图4及图5,还包括电路板50,该电路板50设置在该传热板20的上方,且该电路板50对应这些连接部21设有让位孔51,使得该电路板50可以套设在这些连接部21上。该电路板50上对应每个光源板30还设有电极端子52,这些电极端子52的一端与该电路板50电连接,这些电极端子52的另一端设有弹性触片521,每个光源板30中的基板31的底部分别设有电极(图未示),这些电极端子52的弹性触片521分别与这些光源板30上的电极弹性的抵接以实现电连接,这样无需另外焊线,便于自动化生产。In addition, please refer to FIG. 2, FIG. 4 and FIG. 5, further including a circuit board 50 disposed above the heat transfer plate 20, and the circuit board 50 is provided with a positioning hole 51 corresponding to the connecting portions 21, The circuit board 50 can be sleeved on the connecting portions 21. Each of the light source plates 30 is further provided with an electrode terminal 52. One end of the electrode terminals 52 is electrically connected to the circuit board 50. The other ends of the electrode terminals 52 are provided with elastic contacts 521, and each light source plate The bottoms of the substrates 31 in the 30 are respectively provided with electrodes (not shown), and the elastic contacts 521 of the electrode terminals 52 are elastically abutted with the electrodes on the light source plates 30 to achieve electrical connection, so that no additional bonding wires are needed. Easy to automate production.
此外,还包括灯泡壳40,该灯泡壳40的底部罩设在该传热板20并将这些光源板30收容于内,该灯泡壳40为过半球泡壳结构,这些光源板30上靠近该基板31底部的LED光源对应该灯泡壳40的底部设置,该灯泡壳40的底部用于将这些光源板30上靠近该基板31底部的LED光源发出的大部分光线朝向靠近该传热板20的方向折射。该灯泡壳40为透明或半透明结构,其由塑料或玻璃制成,该灯泡壳40上可以设置光线扩散材料。In addition, a light bulb case 40 is further disposed. The bottom of the light bulb case 40 is disposed on the heat transfer plate 20 and the light source plate 30 is received therein. The light bulb case 40 is a hemispherical bulb structure, and the light source plate 30 is adjacent to the light source plate 30. The LED light source at the bottom of the substrate 31 is disposed corresponding to the bottom of the bulb shell 40, and the bottom of the bulb shell 40 is used to direct most of the light emitted from the LED light source on the light source panel 30 near the bottom of the substrate 31 toward the heat transfer plate 20. Directional refraction. The bulb shell 40 is of a transparent or translucent structure made of plastic or glass, and a light diffusing material may be disposed on the bulb shell 40.
综上所述,本发明将LED光源设置于该基板31上时,使得其在靠近该基板31的底部的位置分布较密、较多,在远离该基板的底部的位置分布相对较稀疏、较少,而这些光源板30的底部分别固定在与传热板20热连接的连接部21上,这样,这些LED光源产生的热量可在该基板31上形成梯度分布,更靠近该基板31的底部的位置产生的热量更多,而此部分热量到该传热板20的热传导路径较短,可迅速的传导到该连接部21上,并通过该传热板20传导出去,提高热传导的速度,避免热量堆积,使得该大角度LED灯丝灯具有良好的散热效果,且无需另外充导热气体和玻璃封泡工艺,避免了专门为充导热气体和玻璃封泡而设计的复杂工艺,具有组装工艺简单、散热良好的优点。In summary, when the LED light source is disposed on the substrate 31, the position of the LED light source is relatively dense and large near the bottom of the substrate 31, and the distribution is relatively sparse and relatively thin at a position away from the bottom of the substrate. The bottoms of the light source plates 30 are respectively fixed on the connecting portions 21 thermally connected to the heat transfer plates 20, so that the heat generated by the LED light sources can form a gradient distribution on the substrate 31, closer to the bottom of the substrate 31. The position generates more heat, and the heat transfer path of the part of the heat to the heat transfer plate 20 is shorter, can be quickly transmitted to the connecting portion 21, and is conducted through the heat transfer plate 20 to increase the speed of heat conduction. Avoiding heat accumulation, the high-angle LED filament lamp has good heat dissipation effect, and does not need to separately charge heat-conducting gas and glass sealing process, avoiding complicated process specially designed for charging heat-conducting gas and glass sealing, and has simple assembly process The advantages of good heat dissipation.
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,任何本领域人员在不脱离本方案技术范围内,利用上述揭露的技术内容作些许改动的为同等变化的等效实施例。但凡脱离本发明技术方案内容,依据本发明技术实质对以上实施例所做的任何修改、等同替换、改进等,均应包含在本发明保护的范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any person skilled in the art can make some modifications to the equivalent of the above-mentioned technical contents without departing from the technical scope of the present invention. Example. Any modifications, equivalent substitutions, improvements, etc. to the above embodiments in accordance with the technical scope of the present invention are intended to be included within the scope of the present invention.
10 灯头体 11 散热部10 lamp body 11 heat sink
20 传热板 21 连接部20 heat transfer plate 21 connection
211 传热面 30 光源板211 heat transfer surface 30 light source board
31 基板 40 灯泡壳31 substrate 40 bulb housing
50 电路板 51 让位孔50 circuit board 51 position hole
52 电极端子 521 弹性触片52 electrode terminal 521 elastic contact

Claims (12)

  1. 一种大角度发光LED灯丝灯,包括灯头体、传热板及多个光源板,每个光源板均包括基板及间隔设置在该基板上的多个LED光源,该传热板设置在该灯头体的顶部,其特征在于:该传热板上设有多个连接部,所述连接部分别间隔设置在该传热板上且与该传热板热连接,所述光源板的底部分别固定在所述连接部上且与所述连接部热连接,每个光源板的基板均由散热材料制成,所述LED光源设置在该基板的侧面上且在靠近该基板的底部的位置分布较密。A large-angle LED light filament lamp comprising a lamp body, a heat transfer plate and a plurality of light source plates, each light source plate comprising a substrate and a plurality of LED light sources spaced apart on the substrate, the heat transfer plate being disposed at the lamp head The top of the body is characterized in that: the heat transfer plate is provided with a plurality of connecting portions, the connecting portions are respectively disposed on the heat transfer plate and thermally connected to the heat transfer plate, and the bottom of the light source plate is respectively fixed On the connecting portion and thermally connected to the connecting portion, the substrate of each light source plate is made of a heat dissipating material, and the LED light source is disposed on a side of the substrate and distributed near a bottom of the substrate. dense.
  2. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:所述光源板分别相对该传热板倾斜设置,并且所述光源板绕该传热板的中轴线成环形排列。The large-angle light-emitting LED filament lamp according to claim 1, wherein the light source plates are respectively disposed obliquely with respect to the heat transfer plate, and the light source plates are arranged in a ring shape around a central axis of the heat transfer plate.
  3. 根据权利要求2所述的大角度发光LED灯丝灯,其特征在于:所述光源板的顶部相对其底部更靠近该传热板的中轴线设置,所述连接部对应所述光源板分别设有倾斜的传热面。The large-angle light-emitting LED filament lamp according to claim 2, wherein the top of the light source panel is disposed closer to a central axis of the heat transfer plate than the bottom thereof, and the connecting portion is respectively provided corresponding to the light source panel. Inclined heat transfer surface.
  4. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:还包括灯泡壳,该灯泡壳的底部罩设在该传热板上并将所述光源板收容于内,该灯泡壳为过半球泡壳结构,所述光源板上靠近该基板底部的LED光源对应该灯泡壳的底部设置,该灯泡壳的底部用于将所述光源板上靠近该基板底部的LED光源发出的大部分光线朝向靠近该传热板的方向折射。The LED lamp lamp of claim 1 , further comprising a bulb shell, wherein a bottom cover of the bulb shell is disposed on the heat transfer plate and the light source panel is received therein, the bulb shell is a hemispherical bulb structure, the LED light source on the light source plate near the bottom of the substrate is disposed corresponding to the bottom of the bulb shell, and the bottom of the bulb shell is used to place most of the LED light source on the light source panel near the bottom of the substrate The light is refracted toward the direction of the heat transfer plate.
  5. 根据权利要求4所述的大角度发光LED灯丝灯,其特征在于:该灯泡壳为透明或半透明结构,其由塑料或玻璃制成,该灯泡壳上可以设置光线扩散材料。The large-angle light-emitting LED filament lamp according to claim 4, wherein the bulb shell is a transparent or translucent structure made of plastic or glass, and the bulb shell may be provided with a light diffusing material.
  6. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:每个光源板上的LED光源被一个荧光粉层封装在一起形成面发光光源。The large angle illuminating LED filament lamp of claim 1 wherein the LED light source on each of the light source panels is packaged together by a phosphor layer to form a surface illuminating source.
  7. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:所述基板由透明或半透明材料制成,所述LED光源发出的一部分光穿过该基板向外射出。The high-angle light-emitting LED filament lamp according to claim 1, wherein the substrate is made of a transparent or translucent material, and a part of the light emitted by the LED light source is emitted outward through the substrate.
  8. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:该灯头体上设有散热部,该传热板与该散热部热连接。The large-angle light-emitting LED filament lamp according to claim 1, wherein the base body is provided with a heat dissipating portion, and the heat transfer plate is thermally connected to the heat dissipating portion.
  9. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:所述LED光源设置在该基板的正面,该基板的背面还设有导热层,该导热层的一部分与该连接部热连接。The large-angle light-emitting LED filament lamp of claim 1 , wherein the LED light source is disposed on a front surface of the substrate, and a heat conductive layer is further disposed on a back surface of the substrate, and a portion of the heat conductive layer is thermally connected to the connecting portion. .
  10. 根据权利要求9所述的大角度发光LED灯丝灯,其特征在于:所述基板由透明或半透明材料制成,所述LED光源发出的一部分光穿过该基板向外射出,该导热层的位置偏离所述LED光源的位置。The large-angle light-emitting LED filament lamp according to claim 9, wherein the substrate is made of a transparent or translucent material, and a part of the light emitted by the LED light source is emitted outward through the substrate, and the heat conducting layer is The position is offset from the position of the LED light source.
  11. 根据权利要求10所述的大角度发光LED灯丝灯,其特征在于:所述基板由陶瓷、高导热玻璃或蓝宝石材料制成,该导热层为附着在该基板背面的金属银层或金属铜层。The large-angle light-emitting LED filament lamp according to claim 10, wherein the substrate is made of ceramic, high thermal conductivity glass or sapphire material, and the heat conductive layer is a metal silver layer or a metal copper layer attached to the back surface of the substrate. .
  12. 根据权利要求1所述的大角度发光LED灯丝灯,其特征在于:还包括电路板,该电路板设置在该传热板的上方,且该电路板对应所述连接部设有让位孔,该电路板上对应每个光源板还设有电极端子,所述电极端子的一端与该电路板电连接,所述电极端子的另一端设有弹性触片,每个光源板中的基板的底部分别设有电极,所述电极端子的弹性触片分别与所述光源板上的电极弹性的抵接以实现电连接。。The large-angle light-emitting LED filament lamp of claim 1 further comprising a circuit board disposed above the heat transfer plate, wherein the circuit board is provided with a yielding hole corresponding to the connecting portion. Each of the light source boards is further provided with an electrode terminal, and one end of the electrode terminal is electrically connected to the circuit board, and the other end of the electrode terminal is provided with an elastic contact piece, and the bottom of the substrate in each light source board Electrodes are respectively disposed, and the elastic contacts of the electrode terminals are respectively elastically abutted with the electrodes on the light source plate to achieve electrical connection. .
PCT/CN2016/102248 2016-01-18 2016-10-17 Wide-angle light emitting led filament lamp WO2017124784A1 (en)

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