CN105805579A - Large-angle light-emitting LED filament lamp - Google Patents
Large-angle light-emitting LED filament lamp Download PDFInfo
- Publication number
- CN105805579A CN105805579A CN201610031425.8A CN201610031425A CN105805579A CN 105805579 A CN105805579 A CN 105805579A CN 201610031425 A CN201610031425 A CN 201610031425A CN 105805579 A CN105805579 A CN 105805579A
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- Prior art keywords
- light source
- substrate
- heat transfer
- transfer plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000002241 glass-ceramic Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a large-angle light-emitting LED filament lamp. The LED filament lamp comprises a lamp holder body, a heat transfer plate and a plurality of light source plates, wherein each light source plate comprises a substrate and a plurality of LED light sources arranged on the substrate at intervals; the heat transfer plate is arranged at the top of the lamp holder body; a plurality of connection parts are arranged on the heat transfer plate; the connection parts are arranged on the heat transfer plate at intervals and are in thermal connection with the heat transfer plate; the bottoms of the light source plates are fixed on the connection plates and are in thermal connection with the connection parts respectively; the substrate of each light source plate is made of a heat dissipation material; the LED light sources are arranged on the side surface of the substrate and are densely distributed in the position near the bottom of the substrate. The large-angle light-emitting LED filament lamp has the advantages of simple assembling process and high heat dissipation performance.
Description
Technical field
The present invention relates to technical field of LED illumination, particularly to a kind of Large-angle emission LED lamp silk lamp.
Background technology
In recent years, due to quickly growing of LED industry, LED lamp progressively replaces traditional lighting.Owing to LED luminescence has the characteristic such as point source and directivity, therefore LED lamp is difficult to replace conventional incandescent, accomplishes that full luminous intensity distribution illuminates.Existing a kind of LED filament, is that one group of LED chip encapsulation is formed LED filament on the transparent substrate, it is possible to achieve wide-angle is luminous, and then multiple filaments connect the illumination effect forming similar tengsten lamp.At present, LED filament is substantially free of radiator, and LED filament cannot be carried out heat conducting and radiating, conduct so being difficult to the heat by LED chip produces, heat can only carry out heat conduction and heat radiation by the convection current of radiation and internal gas, it is easy to causes the accumulation of heat so that the lost of life of LED filament.
Existing LED filament lamp generally adopts and fills heat-conducting gas and glass envelope bubble technique manufacture, and the technology of envelope bubble is required height, apparatus expensive by this technique, it is easy to cause that envelope bubble is not tamping, gas leakage, blast, the problem such as glass envelope is frangible.Life-time service is difficult to avoid that and there will be leakage problem, and gas leakage can cause that heat-sinking capability reduces even LED filament and is burned out.And the heat dispersion of gas is limited, the exploitation of low-power LED filament lamp can only be met, and once do high-power, the heat of the generation of LED filament cannot shed in time, it is easy to causing cause thermal damage and the light decay of LED chip so that the lux maintenance of whole lamp is low, the life-span is short.
Summary of the invention
In view of this, it is necessary to a kind of simple for assembly process, Large-angle emission LED lamp silk lamp of dispelling the heat good is provided.
A kind of Large-angle emission LED lamp silk lamp, including body, heat transfer plate and multiple light source board, each light source board all includes substrate and the multiple LED light sources being disposed on this substrate, this heat transfer plate is arranged on the top of this body, this heat transfer plate is provided with multiple connecting portion, described connecting portion be disposed on this heat transfer plate respectively and with this heat transfer plate thermally coupled, the bottom of described light source board be separately fixed on described connecting portion and with described connecting portion thermally coupled, the substrate of each light source board is made by heat sink material, described LED light source is arranged on the side of this substrate and closeer in the position distribution of bottom near this substrate.
nullCompared with prior art，When LED light source is arranged on this substrate by the present invention，Make its position distribution in the bottom near this substrate closeer，And the bottom of these light source boards be separately fixed at on the hot linked connecting portion of heat transfer plate，So，The heat that these LED light sources produce can form Gradient distribution on the substrate，The heat produced closer to the position of the bottom of this substrate is more，And this partial heat is shorter to the heat conduction path of this heat transfer plate，Can be transmitted to rapidly on this connecting portion，And conducted by this heat transfer plate，Put forward highly thermally conductive speed，Avoid heat build-up，This large-angle LED filament light fixture is made to have good radiating effect，And without additionally filling heat-conducting gas and glass envelope bubble technique，Avoid the complicated technology designed exclusively for filling heat-conducting gas and glass envelope bubble，Have simple for assembly process、Dispel the heat good advantage.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of Large-angle emission LED lamp silk lamp first embodiment of the present invention.
Fig. 2 is the lamp three-dimensional exploded view of Large-angle emission LED lamp silk shown in Fig. 1.
Fig. 3 is the profile of the lamp of Large-angle emission LED lamp silk shown in Fig. 1.
Fig. 4 is the axonometric chart of electrode terminal in the lamp of Large-angle emission LED lamp silk shown in Fig. 2.
Fig. 5 is the part assembling stereogram of the lamp of Large-angle emission LED lamp silk shown in Fig. 2.
Description of reference numerals:
10 body 11 radiating parts
20 heat transfer plate 21 connecting portions
211 heat-transfer area 30 light source boards
31 substrate 40 bulb housings
50 circuit board 51 resigning holes
52 electrode terminal 521 elastic contact blades
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail.
Refer to Fig. 1 to Fig. 5, this Large-angle emission LED lamp silk lamp, including body 10, heat transfer plate 20 and multiple light source board 30, each light source board 30 all includes substrate 31 and the multiple LED light source (not shown) being disposed on this substrate 31, this heat transfer plate 20 is arranged on the top of this body 10, this body 10 is provided with radiating part 11, this heat transfer plate 20 and this radiating part 11 thermally coupled.
Wherein, these light source boards 30 this heat transfer plate 20 relative respectively is obliquely installed, and these light source boards 30 circularize arrangement around the axis of this heat transfer plate 20.This heat transfer plate 20 is provided with four connecting portions 21, these connecting portions 21 be respectively separated be arranged on this heat transfer plate 20 and with this heat transfer plate 20 thermally coupled.Each connecting portion 21 is the block structure being integrally disposed upon on this light source board 30.The bottom of these light source boards 30 be separately fixed on these connecting portions 21 and with these connecting portion 21 thermally coupleds so that the heat of these light source boards 30 can be transmitted on this heat transfer plate 20.In the present embodiment, the top of these light source boards 30 relatively bottom it axis closer to this heat transfer plate 20 arrange, these connecting portions 21 these light source boards 30 corresponding are respectively equipped with the heat-transfer area 211 of inclination, in order to increase the thermally coupled area of these light source boards 30 and these connecting portions 21.In the present embodiment, these connecting portions 21 can be multiple, it is possible to these connecting portions 21 are set to one.
In the present embodiment, these substrates 31 are made up of transparent or semitransparent material, and a part of light that these LED light sources send outwards penetrates through this substrate 31.These LED light sources are arranged on the front of this substrate 31, and the back side of this substrate 31 is additionally provided with heat-conducting layer (not shown), a part for this heat-conducting layer and this connecting portion 21 thermally coupled, and the position of these LED light sources is deviateed in the position of this heat-conducting layer.Concrete, these substrates 31 are made up of heat conduction glass ceramic, high or sapphire material, and this heat-conducting layer is the metallic silver layer or the metal copper layer that are attached to this substrate 31 back side.LED light source on each light source board 30 is packaged together formation face illuminating source by a phosphor powder layer.The substrate 31 of each light source board 30 is made by heat sink material, these LED light sources are arranged on the side of this substrate 31 and closeer in the position distribution of bottom near this substrate 31, so, the heat that these LED light sources produce can form Gradient distribution on this substrate 31, the heat produced closer to the position of the bottom of this substrate 31 is more, and this partial heat is shorter to the heat conduction path of this heat transfer plate 20, can be transmitted on this connecting portion 21 rapidly, put forward highly thermally conductive speed, and it is transmitted on this radiating part 11 hot linked with this heat transfer plate 20 by this heat transfer plate 20, distribute through this radiating part 11, avoid heat build-up, cause that these LED light sources lost efficacy.
Additionally, refer to Fig. 2, Fig. 4 and Fig. 5, also including circuit board 50, this circuit board 50 is arranged on the top of this heat transfer plate 20, and this circuit board 50 these connecting portions 21 corresponding are provided with resigning hole 51 so that this circuit board 50 can be set on these connecting portions 21.On this circuit board 50, corresponding each light source board 30 is additionally provided with electrode terminal 52, one end of these electrode terminals 52 electrically connects with this circuit board 50, the other end of these electrode terminals 52 is provided with elastic contact blade 521, the bottom of the substrate 31 in each light source board 30 is respectively equipped with electrode (not shown), the elastic contact blade 521 of these electrode terminals 52 electrically connects with realization with the abutting of the electrode elastic on these light source boards 30 respectively, so without other bonding wire, it is simple to automated production.
In addition, also include bulb housing 40, in the bottom cover of this bulb housing 40 is located at this heat transfer plate 20 and is contained in by these light source boards 30, this bulb housing 40 was hemisphere bubble shell structure, on these light source boards 30, LED light source bottom this substrate 31 is to should the bottom of bulb housing 40 arrange, and the bottom of this bulb housing 40 is for reflecting most of light that LED light source bottom this substrate 31 on these light source boards 30 sends towards near the direction of this heat transfer plate 20.This bulb housing 40 is transparent or semitransparent structure, and it is made up of plastics or glass, and this bulb housing 40 can arrange light diffusion material.
nullIn sum，When LED light source is arranged on this substrate 31 by the present invention，Make its position distribution in the bottom near this substrate 31 closeer、More，Position distribution in the bottom away from this substrate is relatively sparse、Less，And the bottom of these light source boards 30 be separately fixed at on the hot linked connecting portion 21 of heat transfer plate 20，So，The heat that these LED light sources produce can form Gradient distribution on this substrate 31，The heat produced closer to the position of the bottom of this substrate 31 is more，And this partial heat is shorter to the heat conduction path of this heat transfer plate 20，Can be transmitted to rapidly on this connecting portion 21，And conducted by this heat transfer plate 20，Put forward highly thermally conductive speed，Avoid heat build-up，This large-angle LED filament light fixture is made to have good radiating effect，And without additionally filling heat-conducting gas and glass envelope bubble technique，Avoid the complicated technology designed exclusively for filling heat-conducting gas and glass envelope bubble，Have simple for assembly process、Dispel the heat good advantage.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, any those skilled in the art are without departing from, in this programme technical scope, utilizing the technology contents of above-mentioned exposure to make the Equivalent embodiments for equal change of few modifications.In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any amendment made for any of the above embodiments, equivalent replacement, improvement etc., should be included within the scope of protection of the invention.
Claims (12)
1. a Large-angle emission LED lamp silk lamp, including body, heat transfer plate and multiple light source board, each light source board all includes substrate and the multiple LED light sources being disposed on this substrate, this heat transfer plate is arranged on the top of this body, it is characterized in that: this heat transfer plate is provided with multiple connecting portion, described connecting portion be disposed on this heat transfer plate respectively and with this heat transfer plate thermally coupled, the bottom of described light source board be separately fixed on described connecting portion and with described connecting portion thermally coupled, the substrate of each light source board is made by heat sink material, described LED light source is arranged on the side of this substrate and closeer in the position distribution of bottom near this substrate.
2. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: described light source board this heat transfer plate relative respectively is obliquely installed, and described light source board circularizes arrangement around the axis of this heat transfer plate.
3. Large-angle emission LED lamp silk lamp according to claim 2, it is characterised in that: the top of described light source board relatively bottom it axis closer to this heat transfer plate arranges, the described connecting portion described light source board of correspondence is respectively equipped with the heat-transfer area of inclination.
4. Large-angle emission LED lamp silk lamp according to claim 1, it is characterized in that: also include bulb housing, in the bottom cover of this bulb housing is located on this heat transfer plate and is contained in by described light source board, this bulb housing was hemisphere bubble shell structure, near the LED light source of this base plate bottom to should the bottom of bulb housing arrange on described light source board, the bottom of this bulb housing is for reflecting most of light that the LED light source of this base plate bottom close on described light source board sends towards near the direction of this heat transfer plate.
5. Large-angle emission LED lamp silk lamp according to claim 4, it is characterised in that: this bulb housing is transparent or semitransparent structure, and it is made up of plastics or glass, and this bulb housing can arrange light diffusion material.
6. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: the LED light source on each light source board is packaged together formation face illuminating source by a phosphor powder layer.
7. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: described substrate is made up of transparent or semitransparent material, and a part of light that described LED light source sends outwards penetrates through this substrate.
8. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: this body is provided with radiating part, this heat transfer plate and this radiating part thermally coupled.
9. Large-angle emission LED lamp silk lamp according to claim 1, it is characterised in that: described LED light source is arranged on the front of this substrate, and the back side of this substrate is additionally provided with heat-conducting layer, a part for this heat-conducting layer and this connecting portion thermally coupled.
10. Large-angle emission LED lamp silk lamp according to claim 9, it is characterized in that: described substrate is made up of transparent or semitransparent material, a part of light that described LED light source sends outwards penetrates through this substrate, and the position of described LED light source is deviateed in the position of this heat-conducting layer.
11. Large-angle emission LED lamp silk lamp according to claim 10, it is characterised in that: described substrate is made up of heat conduction glass ceramic, high or sapphire material, and this heat-conducting layer is the metallic silver layer or the metal copper layer that are attached to this substrate back.
12. Large-angle emission LED lamp silk lamp according to claim 1, it is characterized in that: also include circuit board, this circuit board is arranged on the top of this heat transfer plate, and the corresponding described connecting portion of this circuit board is provided with resigning hole, on this circuit board, corresponding each light source board is additionally provided with electrode terminal, one end of described electrode terminal electrically connects with this circuit board, the other end of described electrode terminal is provided with elastic contact blade, the bottom of the substrate in each light source board is respectively equipped with electrode, the elastic contact blade of described electrode terminal electrically connects with realization with the abutting of the electrode elastic on described light source board respectively.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610031425.8A CN105805579A (en) | 2016-01-18 | 2016-01-18 | Large-angle light-emitting LED filament lamp |
| PCT/CN2016/102248 WO2017124784A1 (en) | 2016-01-18 | 2016-10-17 | Wide-angle light emitting led filament lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610031425.8A CN105805579A (en) | 2016-01-18 | 2016-01-18 | Large-angle light-emitting LED filament lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105805579A true CN105805579A (en) | 2016-07-27 |
Family
ID=56466336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610031425.8A Pending CN105805579A (en) | 2016-01-18 | 2016-01-18 | Large-angle light-emitting LED filament lamp |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105805579A (en) |
| WO (1) | WO2017124784A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106382513A (en) * | 2016-11-16 | 2017-02-08 | 漳州立达信光电子科技有限公司 | Electric connector and led lamp |
| CN106523946A (en) * | 2016-11-16 | 2017-03-22 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN106895276A (en) * | 2017-04-01 | 2017-06-27 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| WO2017124784A1 (en) * | 2016-01-18 | 2017-07-27 | 漳洲立达信光电子科技有限公司 | Wide-angle light emitting led filament lamp |
| CN107781668A (en) * | 2017-11-21 | 2018-03-09 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN108826036A (en) * | 2018-08-22 | 2018-11-16 | 雷加炎 | A kind of bulb lamp of adjustable lighting angle |
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- 2016-01-18 CN CN201610031425.8A patent/CN105805579A/en active Pending
- 2016-10-17 WO PCT/CN2016/102248 patent/WO2017124784A1/en active Application Filing
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| JP2013225587A (en) * | 2012-04-20 | 2013-10-31 | Stanley Electric Co Ltd | Led bulb |
| CN103883895A (en) * | 2013-03-15 | 2014-06-25 | 立达信绿色照明股份有限公司 | LED lamp with large light emission angle |
| CN103353071A (en) * | 2013-07-05 | 2013-10-16 | 立达信绿色照明股份有限公司 | LED lamp emitting light in large angle |
| CN104359023A (en) * | 2014-10-30 | 2015-02-18 | 四川联恺环保科技有限公司 | LED bulb |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017124784A1 (en) * | 2016-01-18 | 2017-07-27 | 漳洲立达信光电子科技有限公司 | Wide-angle light emitting led filament lamp |
| CN106382513A (en) * | 2016-11-16 | 2017-02-08 | 漳州立达信光电子科技有限公司 | Electric connector and led lamp |
| CN106523946A (en) * | 2016-11-16 | 2017-03-22 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN106895276A (en) * | 2017-04-01 | 2017-06-27 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN107781668A (en) * | 2017-11-21 | 2018-03-09 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN108826036A (en) * | 2018-08-22 | 2018-11-16 | 雷加炎 | A kind of bulb lamp of adjustable lighting angle |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017124784A1 (en) | 2017-07-27 |
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