CN105674068B - LED filament packaging structure - Google Patents
LED filament packaging structure Download PDFInfo
- Publication number
- CN105674068B CN105674068B CN201610016927.3A CN201610016927A CN105674068B CN 105674068 B CN105674068 B CN 105674068B CN 201610016927 A CN201610016927 A CN 201610016927A CN 105674068 B CN105674068 B CN 105674068B
- Authority
- CN
- China
- Prior art keywords
- led light
- substrate
- light source
- packaging structure
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000013013 elastic material Substances 0.000 claims abstract description 4
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
Abstract
The utility model provides a LED filament packaging structure, includes base plate, LED light source and two electrode tips, the LED light source set up on this base plate and with this base plate hot link, these two electrode tips are made by the heat conduction material, these two electrode tips all include connecting portion, connecting portion set up on this base plate and with the LED light source electricity is connected, connecting portion and this base plate hot link, these two electrode tips are made by elastic material, and the middle part of every electrode tip is equipped with the pars contractilis, and this pars contractilis is "nearly" font structure for buckling. The electrode end further comprises a communicating part connected with the connecting part, the communicating part is used for being thermally connected with an external heat radiating piece, and a through hole is formed in the middle of the communicating part. The LED filament packaging structure has a good heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of LED lighting, in particular to an LED filament packaging structure.
Background
In recent years, LED lamps are gradually replacing traditional lighting lamps due to rapid development of LED industry. Because the LED light has the characteristics of point light sources, directivity and the like, the LED lamp is difficult to completely replace the traditional incandescent lamp, and the full light distribution illumination is realized. An existing LED filament is formed by packaging a group of LED chips on a transparent substrate, 360-degree full-angle light emission can be achieved, and then a plurality of filaments are connected to form a light emitting effect similar to a tungsten filament lamp. At present, the LED filament does not have the radiator basically, and the base plate is the very poor glass material of thermal conductivity usually, and the electrode also has not thermal conductivity, and the LED filament can't carry out heat-conduction heat dissipation, so hardly go out the heat conduction that the LED chip produced, and the heat can only be depending on the convection current of radiation and inside gas to carry out heat conduction and heat dissipation, causes thermal piling up easily for the life-span of LED filament shortens.
Disclosure of Invention
In view of the above, it is desirable to provide an LED filament package structure with good heat dissipation.
The utility model provides a LED filament packaging structure, includes base plate, LED light source and two electrode ends, the LED light source set up on this base plate and with this base plate hot link, its characterized in that, these two electrode ends are made by the heat conduction material, these two electrode ends all include connecting portion, connecting portion set up on this base plate and with the LED light source electricity is connected, connecting portion and this base plate hot link, these two electrode ends are made by elastic material, and the middle part of every electrode end is equipped with the pars contractilis, and this pars contractilis is "nearly" font structure for buckling. The electrode end further comprises a communicating part connected with the connecting part, the communicating part is used for being thermally connected with an external heat radiating piece, and a through hole is formed in the middle of the communicating part.
Compared with the prior art, the two electrode ends are connected on the substrate, heat generated by the LED light sources can be effectively conducted out through the good heat conduction performance of the two electrode ends, the heat generated by the LED light sources is prevented from being accumulated on the substrate, and the LED filament packaging structure has a good heat dissipation effect.
Drawings
Fig. 1 is a perspective view of a first embodiment of the LED filament package structure of the present invention.
Fig. 2 is another perspective view of the LED filament package structure shown in fig. 1.
Fig. 3 is a schematic exploded perspective view of the LED filament package structure shown in fig. 1.
Fig. 4 is a perspective view of the electrode terminals in the LED filament package structure shown in fig. 1.
Description of reference numerals:
10 substrate 20 LED light source
30 electrode terminal 31 connecting part
32 expansion part 33 communication part
332 rough microstructure 40 encapsulation layer
50 metal layer 60 heat conducting layer
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 4, the LED filament package structure includes a substrate 10, LED light sources 20 and two electrode terminals 30, wherein the LED light sources 20 are disposed on the substrate 10 and thermally connected to the substrate 10.
Wherein the substrate 10 is made of a transparent or translucent material. The LED light sources 20 are disposed on the front surface of the substrate 10, a heat conductive layer 60 (shown in fig. 3) is further disposed on the front surface of the substrate 10, the heat conductive layer 60 is thermally connected to the front surface of the substrate 10, the heat conductive layer 60 is disposed at a distance from the LED light sources 20, and at least one of the two electrode terminals 30 is thermally connected to the heat conductive layer 60. The heat conductive layer 60 may be a mercury layer provided on the front surface of the substrate 10, and the electrode terminals 30 may be soldered to the heat conductive layer 60 at the same time as being soldered to the substrate 10. The heat conductive layer 60 serves to transfer heat on the substrate 10 to the electrode terminals 30 more quickly. A metal layer 50 is disposed on the back surface of the substrate 10, and the metal layer 50 is thermally connected to the back surface of the substrate 10. The LED light sources 20 are arranged parallel to each other. The metal layer 50 is disposed at a position on the back surface of the substrate 10 away from the LED light sources 20, so as to avoid the projection of the LED light sources 20 on the back surface of the substrate 10, and allow the light emitted by the LED light sources 20 to pass through the substrate 10 and be emitted outward, thereby enlarging the light emitting angle of the LED filament package structure, allowing the back surface to have light, and allowing the light emitting angle to be greater than 180 degrees. Of course, it can be understood that there are many ways to make the light emitting angle of the LED filament package structure greater than 180 degrees, for example, LED light sources can be disposed on both sides of the substrate 10. The metal layer 50 can increase the thermal conductivity of the substrate 10, so that more heat can be conducted to the electrode terminals 30, thereby preventing heat from accumulating in the central portion of the substrate 10.
Wherein, the two electrode terminals 30 are respectively soldered on the substrate 10 so as to realize thermal connection with the substrate 10, and the LED light sources 20 are respectively electrically connected with the two electrode terminals 30 by gold wires. The two electrode terminals 30 are made of a heat conductive material, each of the two electrode terminals 30 is provided with a connecting portion 31 at one end, the connecting portions 31 are disposed on the substrate 10 and electrically connected to the LED light sources 20, and the connecting portions 31 are thermally connected to the substrate 10. In this embodiment, the two electrode terminals 30 are made of an elastic material, the middle of each electrode terminal 30 is provided with a flexible portion 32, and the other end of each electrode terminal 30 is provided with a communicating portion 33. The connecting portion 31, the expansion portion 32, and the communication portion 33 are integrally molded. The expansion part 32 has a bent zigzag structure, and the communication part 33 is thermally connected to an external heat sink. When the LED filament packaging structure works, expansion with heat and contraction with cold can occur when the LED filament packaging structure is heated, but the telescopic part 32 can be deformed in a telescopic mode, so that the problem that the LED filament is bent or broken due to stress can be solved. The lower surface of the connecting portion 33 is provided with a rough microstructure 332, and the rough microstructure 332 may be a plurality of dots, squares, crosses, triangles, etc. arranged at intervals so as to increase contact neps with solder paste. The middle part of the communicating part 33 is provided with a through hole, so that the soldering tin paste can better flow in to remove air wrapped by the center of the communicating part when contacting the soldering tin paste, and the contact thermal resistance is reduced. Of course, the connection portion 31 and the communication portion 33 may be integrally molded without providing the expansion portion 32.
The LED filament package structure further includes a package layer 40, wherein the package layer 40 covers the LED light source 20 on the substrate 10 and the connecting portions 31 of the two electrode terminals 30. The encapsulation layer 40 is provided with a fluorescent material, and the fluorescent material is disposed corresponding to the LED light sources 20. The fluorescent material may cooperate with the LED light sources 20 to emit white light.
In summary, the two electrode terminals 30 are connected to the substrate 10, and the heat generated by the LED light sources 20 can be effectively conducted out through the good heat-conducting properties of the two electrode terminals 30, so that the heat generated by the LED light sources 20 is prevented from being accumulated on the substrate 10, and the LED filament packaging structure has a good heat dissipation effect.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, and any person skilled in the art can use the above disclosed technical content to make equivalent variations without departing from the technical scope of the present invention. However, any modification, equivalent replacement, improvement and the like of the above embodiments according to the technical spirit of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a LED filament packaging structure, includes base plate, LED light source and two electrode ends, the LED light source sets up on this base plate and with this base plate thermal connection, its characterized in that, these two electrode ends are made by the heat conduction material, these two electrode ends all include connecting portion, connecting portion set up on this base plate and with LED light source electricity is connected, connecting portion and this base plate thermal connection, these two electrode ends are made by elastic material, and the middle part of every electrode end is equipped with the pars contractilis, and this pars contractilis is "nearly" font structure for buckling, the electrode end still includes the intercommunication portion of being connected with this connecting portion, and this intercommunication portion is used for with external heat-sink thermal connection, and the middle part of this intercommunication portion is equipped with the through-hole that runs through.
2. The LED filament packaging structure of claim 1, wherein: the LED light source is characterized by further comprising an encapsulation layer, wherein the encapsulation layer covers the LED light source on the substrate and the connecting parts of the two electrode ends.
3. The LED filament packaging structure of claim 2, wherein: and fluorescent materials are arranged on the packaging layer and correspond to the LED light source.
4. The LED filament packaging structure of claim 1, wherein: the substrate is made of a transparent or translucent material.
5. The LED filament packaging structure of claim 4, wherein: the LED light source is arranged on the front surface of the substrate, the back surface of the substrate is provided with a metal layer, and the metal layer is thermally connected with the back surface of the substrate.
6. The LED filament packaging structure of claim 5, wherein: the LED light sources are arranged in parallel, and the metal layer is arranged on the back surface of the substrate at a position deviating from the LED light sources.
7. The LED filament packaging structure of claim 1, wherein: the LED light source is arranged on the front face of the substrate, the front face of the substrate is also provided with a heat conduction layer, the heat conduction layer is thermally connected with the front face of the substrate, the heat conduction layer and the LED light source are arranged at intervals, and at least one of the two electrode ends is thermally connected with the heat conduction layer.
8. The LED filament packaging structure of claim 1, wherein: the two electrode ends are respectively welded on the substrate, and the LED light source is respectively electrically connected with the two electrode ends through gold wires.
9. The LED filament packaging structure of claim 1, wherein: the electrode end further comprises a communicating part connected with the connecting part, the communicating part is used for being thermally connected with an external heat radiating piece, and a rough microstructure is arranged on the lower surface of the communicating part.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610016927.3A CN105674068B (en) | 2016-01-11 | 2016-01-11 | LED filament packaging structure |
| PCT/CN2016/102247 WO2017121154A1 (en) | 2016-01-11 | 2016-10-17 | Led filament packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610016927.3A CN105674068B (en) | 2016-01-11 | 2016-01-11 | LED filament packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105674068A CN105674068A (en) | 2016-06-15 |
| CN105674068B true CN105674068B (en) | 2020-08-25 |
Family
ID=56300031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610016927.3A Active CN105674068B (en) | 2016-01-11 | 2016-01-11 | LED filament packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105674068B (en) |
| WO (1) | WO2017121154A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674068B (en) * | 2016-01-11 | 2020-08-25 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
| CN106369366B (en) * | 2016-11-16 | 2020-01-21 | 漳州立达信光电子科技有限公司 | LED filament assembly and LED filament lamp |
| CN109099324A (en) * | 2018-08-27 | 2018-12-28 | 广东华辉煌光电科技有限公司 | A kind of metal wire built-in filament and filament lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203784711U (en) * | 2014-04-21 | 2014-08-20 | 史杰 | Lamp with LED filament packaged by bent COB |
| CN204005448U (en) * | 2014-07-11 | 2014-12-10 | 木林森股份有限公司 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
| CN204118125U (en) * | 2014-10-30 | 2015-01-21 | 杭州庄诚进出口有限公司 | A kind of New LED filament encapsulating structure |
| CN104505453A (en) * | 2014-11-14 | 2015-04-08 | 浙江英特来光电科技有限公司 | LED (Light Emitting Diode) lamp filament without bonding wire |
| CN204387750U (en) * | 2014-12-30 | 2015-06-10 | 宁波海奈特照明科技有限公司 | A kind of LED silk bulb |
| CN205488193U (en) * | 2016-01-11 | 2016-08-17 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
| CN201113123Y (en) * | 2007-10-16 | 2008-09-10 | 迈迪克(上海)照明科技有限公司 | Straight pipe fluorescent lamp elastic lamp holder |
| CN103134004A (en) * | 2011-11-27 | 2013-06-05 | 王凯 | High luminous efficiency sodium lamp with lamp anti-explosion structure |
| TWM457299U (en) * | 2013-03-15 | 2013-07-11 | Unity Opto Technology Co Ltd | Omni-directional light-emitting element featuring high heat dissipation efficiency |
| CN204227118U (en) * | 2014-11-14 | 2015-03-25 | 浙江英特来光电科技有限公司 | A kind of Novel LED light source structure |
| CN204301010U (en) * | 2014-11-19 | 2015-04-29 | 哈尔滨鎏霞光电技术有限公司 | A kind of omnidirectional luminous LED lamp silk for automatic spot |
| CN204879597U (en) * | 2015-08-28 | 2015-12-16 | 深圳市源磊科技有限公司 | LED bulb and LED filament that has terminal structure thereof |
| CN105674068B (en) * | 2016-01-11 | 2020-08-25 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
-
2016
- 2016-01-11 CN CN201610016927.3A patent/CN105674068B/en active Active
- 2016-10-17 WO PCT/CN2016/102247 patent/WO2017121154A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203784711U (en) * | 2014-04-21 | 2014-08-20 | 史杰 | Lamp with LED filament packaged by bent COB |
| CN204005448U (en) * | 2014-07-11 | 2014-12-10 | 木林森股份有限公司 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
| CN204118125U (en) * | 2014-10-30 | 2015-01-21 | 杭州庄诚进出口有限公司 | A kind of New LED filament encapsulating structure |
| CN104505453A (en) * | 2014-11-14 | 2015-04-08 | 浙江英特来光电科技有限公司 | LED (Light Emitting Diode) lamp filament without bonding wire |
| CN204387750U (en) * | 2014-12-30 | 2015-06-10 | 宁波海奈特照明科技有限公司 | A kind of LED silk bulb |
| CN205488193U (en) * | 2016-01-11 | 2016-08-17 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105674068A (en) | 2016-06-15 |
| WO2017121154A1 (en) | 2017-07-20 |
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