CN204005448U - The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger - Google Patents
The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger Download PDFInfo
- Publication number
- CN204005448U CN204005448U CN201420383168.0U CN201420383168U CN204005448U CN 204005448 U CN204005448 U CN 204005448U CN 201420383168 U CN201420383168 U CN 201420383168U CN 204005448 U CN204005448 U CN 204005448U
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- led
- substrate
- lamp bar
- die bond
- led lamp
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- 239000000758 substrate Substances 0.000 title claims abstract description 58
- 239000013078 crystal Substances 0.000 claims abstract description 42
- 239000003292 glue Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000009413 insulation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 24
- 239000010949 copper Substances 0.000 description 24
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005170 crystalloluminescence Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The application provides a kind of LED substrate and has adopted the LED lamp bar of this substrate, this LED substrate is offered loophole in the side of each die bond position, when encapsulation, LED crystal is fixed on die bond position, note fixing glue thereon simultaneously, and fixing glue is filled in loophole, the light sending due to LED crystal will be first through fixing glue again outgoing to air, after these light can partly be refracted on the interface of fixing glue and air time directly outgoing to air, part is reflected back toward in fixing glue and is sent to the another side of substrate through loophole, from the another side outgoing of substrate, thereby significantly reduce the restriction of substrate to LED crystal emission of light, even if substrate is nontransparent material, LED crystal emission of light also can see through substrate and launch, realize 360 degree luminous.
Description
Technical field
The application relates to LED encapsulation technology field, particularly the LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger.
Background technology
Along with the development of electronic semi-conductor's technology, the occasion of more and more throwing light on adopts LED light fixture to replace traditional lighting light fixture.Because illumination occasion is varied, the structure of LED light fixture is also varied.But basic structure still adopts fixing, packaged LED crystal on substrate, powers so that LED crystallo-luminescence realizes illumination to LED crystal by substrate.The immediate problem that this structure is brought is exactly the restriction that the light that sends of LED crystal can be subject to substrate, and lighting angle is little.But in many illumination occasions, light-emitting component is all required to larger light emitting anger, or even require 360 degree luminous.For example publication number is the disclosed LED of CN 302478047S patent document wick column, and it be as wick, by the ray structure of a class incandescent lamp of these wick compositions, by the alternative traditional tungsten filament of LED lamp bar by many small-sized LED lamp bars.Self-explantory, LED lamp bar must 360 the luminous illumination effect that can reach similar tungsten filament of degree, otherwise the luminous of final whole lamp will be extremely inhomogeneous.
To this, the solution adopting in the industry is at present to substitute traditional nontransparent substrate with transparent substrate, if publication number is the disclosed a kind of LED chip packaging body taking glass as substrate of CN 203553207U, it has utilized the light transmission of transparency carrier, reduced the restriction of substrate LED crystallo-luminescence, thereby it is luminous to realize 360 degree.Can expand light emitting anger although substitute nontransparent substrate with transparency carrier, but, because transparency carrier is generally glass, pottery or PC material, than non-transparent material such as traditional metals, there are problems in transparency carrier: (1) ductility and toughness are poor, easily in production and use procedure, produce fracture, particularly in undersized striplight bar structure (wick); (2) heat dispersion is poor, in LED lamp group, LED crystal can produce a large amount of heats, these caloric requirements are outwards conducted by substrate, and glass, pottery or PC material thermal conductivity can be poor, the heat that is difficult to effectively LED crystal can be produced is derived, and easily causes LED crystal temperature effect fast rise and damages; (3) complex process because glass, pottery or PC material itself do not possess electric conductivity, therefore need to arrange repeatedly and electroplate and manufacture electrode, conducting wire on substrate, causes complex process.
Summary of the invention
The application's object is to avoid above-mentioned weak point of the prior art and a kind of LED substrate is provided and adopts the LED lamp bar of this substrate, even this substrate can by nontransparent making in the situation that, also can ensure LED lamp bar can 360 degree luminous, thereby avoid the series of problems because using transparency carrier to bring.
The application's object is achieved through the following technical solutions:
A kind of LED substrate for LED lamp bar, comprise base material, described base material comprises conductive line structure and crystal bonding area, the obverse and reverse of described crystal bonding area is provided with the die bond position for fixed L ED wafer, described conductive structure is for powering to described LED wafer, and the side of each die bond position is provided with the loophole that penetrates described base material.
Preferably, the conductive structure of described base material comprises the first electrode and the second electrode, described the first electrode is connected with described crystal bonding area, described the second electrode and the insulation of described crystal bonding area, described the first electrode is for connecting a utmost point of described LED wafer, and described the second electrode is for connecting another utmost point of described LED wafer.
Preferably, described crystal bonding area is the rectangular sheet region arranging taking a major axis as symmetry axis almost symmetry, described die bond position arranges one by one along described major axis, and die bond position is symmetrical arranged taking described major axis as symmetry axis, the both sides of each die bond position are provided with described loophole, and described two loopholes are symmetrical arranged taking described major axis as symmetry axis.
Preferably, described base material is strip sheet metal.
Preferably, described each die bond position offers a through hole.
A kind of LED lamp bar of large light emitting anger, include LED substrate, any one LED substrate described in described substrate, described die bond is fixed with LED wafer on position, on described LED wafer, be coated with fixing glue, the side of each die bond position is provided with the loophole that penetrates described base material, and described fixing glue covers described loophole.
Preferably, the die bond position in front, described crystal bonding area and the die bond position of reverse side shift to install.
Preferably, the outer surface of described fixing glue is the convex surface taking the centre normal of described die bond position as rotating shaft.
Preferably, described fixing glue is fluorescent glue.
Preferably, described fixing glue is transparent adhesive tape, and described LED substrate is arranged with fluorescent tube cover outward.
The application's beneficial effect: the application provides a kind of LED substrate and adopted the LED lamp bar of this substrate, this LED substrate is offered loophole in the side of each die bond position, when encapsulation, LED crystal is fixed on die bond position, note fixing glue thereon simultaneously, and fixing glue is filled in loophole, the light sending due to LED crystal will be first through fixing glue again outgoing to air, after these light can partly be refracted on the interface of fixing glue and air time directly outgoing to air, part is reflected back toward in fixing glue and is sent to the another side of substrate through loophole, from the another side outgoing of substrate, thereby significantly reduce the restriction of substrate to LED crystal emission of light, even if substrate is nontransparent material, LED crystal emission of light also can see through substrate and launch, realize 360 degree luminous.
Brief description of the drawings
Utilize accompanying drawing to be described further the application, but embodiment in accompanying drawing does not form any restriction to the application, for those of ordinary skill in the art, is not paying under the prerequisite of creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the decomposition texture schematic diagram of the application's embodiment 1.
Fig. 2 is another decomposing state schematic diagram of the application's embodiment 1.
Fig. 3 is the structural representation of the application's embodiment 1.
Fig. 4 is the structural representation at another visual angle of the application's embodiment 1.
In Fig. 1 to Fig. 4, include:
1---LED substrate, 11---anodal copper sheet, 12---negative pole copper sheet, 13---collets, 14---lug, 15---die bond position, 16---loophole, 17---through hole, 2---fluorescent tube.
Detailed description of the invention
With the following Examples the application is further described.
embodiment 1
One of detailed description of the invention of the application, as shown in Figures 1 to 4, the present embodiment is example for the light-carrier canal product that forms LED wick column (seeing background technology), and it is by LED substrate 1, and LED crystal 3, fixing glue 4 and fluorescent tube 2 form.
LED substrate 1 is strip, comprise anodal copper sheet 11, negative pole copper sheet 12 and collets 13, anodal copper sheet 11 is connected with collets 13 respectively with negative pole copper sheet 12, thereby make anodal copper sheet 11 and in negative pole copper sheet 12 structures, be connected but electric upper insulation, anodal copper sheet 11 and negative pole copper sheet 12 are equivalent to the first electrode and second electrode of LED substrate 1.Anodal copper sheet 11 is for example connected with other light-carrier canals or is connected with power supply with the lug 14(that negative pole copper sheet 12 all includes for being connected external circuit).In the present embodiment, the obverse and reverse of negative pole copper sheet 12 has crystal bonding area, crystal bonding area is also rectangular sheet region, crystal bonding area is taking major axis X as the setting of symmetry axis almost symmetry, the front of crystal bonding area arranges multiple die bonds position 15 along major axis X, and each die bond position 15 is symmetrical arranged taking major axis X as symmetry axis, the both sides of each die bond position 15 are provided with loophole 16, and these two loopholes 16 are also symmetrical arranged taking described major axis as symmetry axis.In addition, each die bond position 15 also offers a through hole 17.
It should be noted that, crystal bonding area can also be arranged on anodal copper sheet 11, or is arranged on negative pole copper sheet 12, is also arranged on anodal copper sheet 11, and those skilled in the art can adjust flexibly.And, crystal bonding area is to refer to that taking major axis X as the setting of symmetry axis almost symmetry the primary structure of crystal bonding area is taking major axis X as the setting of symmetry axis almost symmetry, but the structure of detail can be not strict symmetrical.As for the through hole 17 of die bond position 15, be mainly in order to make the light that crystal bottom sends also can part printing opacity LED substrate 1, further improve translucent effect, certainly do not offer this through hole 17 and only offer loophole 16 and be fine yet.
In addition, the present embodiment is to offer loophole 16 in the both sides of crystal bonding area simultaneously, and this is because the LED substrate 1 in the present embodiment only has a row die bond position 15, ensures that 15 both sides, each die bond position have loophole 16 can make bright dipping more even.
For LED substrate 1, can adopt same copper sheet to cut and form anodal copper sheet 11 and negative pole copper sheet 12(negative pole copper sheet 12, die-cut formation die bond position 15 and loophole 16 simultaneously), and then the method for injection mo(u)lding collets 13 is made production, concrete can adjust flexibly with reference to the patent document of CN 102788284A and in conjunction with the design feature of this product, does not repeat them here.
LED crystal 3 is fixed on die bond position 15, and its negative pole is connected with negative pole copper sheet 12 conductions, and positive pole is connected with anodal copper sheet 11 conductions through lead-in wire, thereby can be luminous to realize from external electricity.Certainly, multiple LED crystal 3 can be connected or parallel connection after be connected to again anodal copper sheet 11 and/or negative pole copper sheet 12.
As shown in Figure 4, fixing glue 4 covers on LED wafer, fixing glue 4 is also filled in loophole 16 simultaneously, after fixing glue 4 can adopt silica gel to fill, curing method forms, the convex surface of the outer surface of the fixing glue 4 in the present embodiment taking the centre normal of die bond position 15 as rotating shaft, the shape of this fixing glue 4 is mountain peak shapes of corresponding die bond position, summit 15 central points.Can further ensure so abundant light in the time arriving the interface of fixing glue 4 and air, be transmitted to loophole 16 in and pass from loophole 16 other ends.But those skilled in the art also can adjust in conjunction with existing lens arrangement technology the shape of fixing glue 4 flexibly, as long as can ensure abundant light and be passed to the another side of LED substrate 1 from loophole 16.In addition, this fixing glue 4 can be only also to cover on loophole 16 and be not filled to the inside, mainly light can be guided in loophole.
Fluorescent tube 2 is cylindric body, is sheathed on LED substrate 1, and the crystal bonding area of LED substrate 1 is covered by fluorescent tube 2, and it is outer so that be connected with external world's point that lug 14 is exposed to fluorescent tube 2.Fluorescent tube 2 internal coats have fluorescent material, and the light that LED wafer sends like this can be absorbed by fluorescent material in the time arriving at fluorescent tube 2 inner surface and excitated fluorescent powder sends the light of other colors, thereby meet different application demands.
Certainly, as the ordinary skill in the art, the application's technical scheme can also adopt fluorescent material is mixed in fixing glue 4 so that fixing glue 4 becomes fluorescent glue, and this also can reach similar effect, apply fluorescent material without the inner surface at fluorescent tube 2 simultaneously, even can cancel fluorescent tube 2.
embodiment 2
Two of the application's detailed description of the invention, the main technical schemes of the present embodiment is identical with embodiment 1, and unaccounted feature in the present embodiment adopts the explanation in embodiment 1, no longer repeats at this.The difference of the present embodiment and embodiment 1 is, the die bond position 15 in front, described crystal bonding area and the die bond position 15 of reverse side shift to install.In other words, the die bond position 15 of the odd bits such as 1,3,5 is fixed on LED crystal 3 in the front of LED substrate 1, and LED crystal 3 is fixed on the reverse side of LED substrate 1 in the die bond position 15 that the even numbers such as 2,4,8 are.Can reach so the luminous object more uniformly on LED substrate 1 two sides.
Finally should be noted that; above embodiment is only in order to illustrate the application's technical scheme; but not restriction to the application's protection domain; although the application has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the application's technical scheme, and not depart from essence and the scope of present techniques scheme.
Claims (10)
1. the LED substrate for LED lamp bar, comprise base material, described base material comprises leads crystal bonding area and electric line structure, the obverse and reverse of described crystal bonding area is provided with the die bond position for fixed L ED wafer, described conductive structure, for to described LED wafer power supply, is characterized in that: the side of each die bond position is provided with the loophole that penetrates described base material.
2. a kind of LED substrate for LED lamp bar as claimed in claim 1, it is characterized in that: the conductive structure of described base material comprises the first electrode and the second electrode, described the first electrode is connected with described crystal bonding area, described the second electrode and the insulation of described crystal bonding area, described the first electrode is for connecting a utmost point of described LED wafer, and described the second electrode is for connecting another utmost point of described LED wafer.
3. a kind of LED substrate for LED lamp bar as claimed in claim 1, it is characterized in that: described crystal bonding area is the rectangular sheet region arranging taking a major axis as symmetry axis almost symmetry, described die bond position arranges one by one along described major axis, and die bond position is symmetrical arranged taking described major axis as symmetry axis, the both sides of each die bond position are provided with described loophole, and described two loopholes are symmetrical arranged taking described major axis as symmetry axis.
4. a kind of LED substrate for LED lamp bar as claimed in claim 1, is characterized in that: described base material is strip sheet metal.
5. a kind of LED substrate for LED lamp bar as claimed in claim 1, is characterized in that: described each die bond position offers a through hole.
6. the LED lamp bar of a large light emitting anger, include LED substrate, it is characterized in that: described substrate is as described in any one claim in claim 1 to 5, and described die bond is fixed with LED wafer on position, on described LED wafer, be coated with fixing glue, described fixing glue covers described loophole.
7. the LED lamp bar of a kind of large light emitting anger as claimed in claim 6, is characterized in that: the die bond position in front, described crystal bonding area and the die bond position of reverse side shift to install.
8. the LED lamp bar of a kind of large light emitting anger as claimed in claim 6, is characterized in that: the outer surface of described fixing glue is the convex surface taking the centre normal of described die bond position as rotating shaft.
9. the LED lamp bar of a kind of large light emitting anger as claimed in claim 6, is characterized in that: described fixing glue is fluorescent glue.
10. the LED lamp bar of a kind of large light emitting anger as claimed in claim 6, is characterized in that: described fixing glue is transparent adhesive tape, described LED substrate is arranged with fluorescent tube cover outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420383168.0U CN204005448U (en) | 2014-07-11 | 2014-07-11 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420383168.0U CN204005448U (en) | 2014-07-11 | 2014-07-11 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204005448U true CN204005448U (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420383168.0U Expired - Lifetime CN204005448U (en) | 2014-07-11 | 2014-07-11 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204005448U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104075170A (en) * | 2014-07-11 | 2014-10-01 | 木林森股份有限公司 | LED substrate for LED light bar and LED light bar with large light emitting angle |
| CN105674068A (en) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
-
2014
- 2014-07-11 CN CN201420383168.0U patent/CN204005448U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104075170A (en) * | 2014-07-11 | 2014-10-01 | 木林森股份有限公司 | LED substrate for LED light bar and LED light bar with large light emitting angle |
| CN105674068A (en) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
| CN105674068B (en) * | 2016-01-11 | 2020-08-25 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170329 Address after: 343000 Ji'an city open area entrepreneurial Avenue Patentee after: JIANGXI MULINSEN LIGHTING CO.,LTD. Address before: Limited by Share Ltd No. 1 road 528415 Guangdong Linsen wood Linsen Zhongshan City Xiaolan Town Patentee before: MLS Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 343000 Business Avenue of Jingkai District, Ji'an City, Jiangxi Province Patentee after: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. Address before: 343000 Business Avenue of Jingkai District, Ji'an City, Jiangxi Province Patentee before: JIANGXI MULINSEN LIGHTING CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 343000 Ji'an city open area entrepreneurial Avenue Patentee after: Ji'an Mulinsen Industrial Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Patentee before: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190808 Address after: 343000 No. 288 Nantang Road, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Ji'an Mulinsen Lighting Devices Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Patentee before: Ji'an Mulinsen Industrial Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141210 |