CN203746900U - White light LED - Google Patents

White light LED Download PDF

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Publication number
CN203746900U
CN203746900U CN201420056783.0U CN201420056783U CN203746900U CN 203746900 U CN203746900 U CN 203746900U CN 201420056783 U CN201420056783 U CN 201420056783U CN 203746900 U CN203746900 U CN 203746900U
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CN
China
Prior art keywords
white light
transparency carrier
negative pole
wafer
blue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420056783.0U
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Chinese (zh)
Inventor
肖文玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Shengxiang Photoelectric Lighting Science And Technology Ltd Of Zhongshan City
Original Assignee
Hong Shengxiang Photoelectric Lighting Science And Technology Ltd Of Zhongshan City
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Filing date
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Application filed by Hong Shengxiang Photoelectric Lighting Science And Technology Ltd Of Zhongshan City filed Critical Hong Shengxiang Photoelectric Lighting Science And Technology Ltd Of Zhongshan City
Priority to CN201420056783.0U priority Critical patent/CN203746900U/en
Application granted granted Critical
Publication of CN203746900U publication Critical patent/CN203746900U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model belongs to the technical field of LED light emitting structures, and especially relates to a white light LED. The white light LED comprises a transparent substrate and a number of blue chips which are fixedly arranged on the transparent substrate and has six light emitting faces. A circuit layer is arranged on the transparent substrate. Each blue chip is respectively electrically connected with the circuit layer. A positive electrode terminal and a negative electrode terminal are arranged on the transparent substrate. The positive electrode terminal and the negative electrode terminal are respectively electrically connected with the circuit layer. The white light LED further comprises a glass tube, wherein the tube wall is embedded with yellow fluorescent powder. The glass tube comprises a cavity. The blue chips and the transparent substrate are arranged in the cavity. The end part of the glass tube is welded at the end part of the transparent substrate. A glass sintering process is used. The yellow fluorescent powder is embedded into the glass tube. The distribution of the fluorescent powder is uniform. The distribution consistency of the fluorescent powder on the blue chips is improved. Light intensity loss is reduced. The performance of the fluorescent powder is not affected by heat produced the light emitting blue chips, which enhances the illumination effect if the white light LED.

Description

A kind of white light LEDs
Technical field
The utility model belongs to LED luminescence technology field, relates in particular to a kind of white light LEDs.
Background technology
LED is a kind of semiconductor device that can be visible ray by electric energy conversion, it adopts electroluminescence, utilize compound-material to make the photoelectric device of P-N knot, change the luminous principle luminous with electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, light-emitting diode has advantages of that the life-span is long, light efficiency is high, radiationless and low energy consumption, be widely used in illumination and the light decoration technical field of society, the spectrum of LED almost all concentrates on visible light frequency band, the brightness of LED and the lighting angle of LED have inevitable contacting, and the less brightness of lighting angle of LED is less.
Existing white light LEDs mainly adopts following structure, on blue wafer, apply the fluorescent material that can send gold-tinted, the part blue light that blue wafer sends is absorbed and sends gold-tinted by fluorescent material, the yellow light mix that another part blue light and fluorescent material send, thereby can obtain white light, at present, on luminescent wafer, applying fluorescent material takes conventionally by glue (epoxy resin, silica gel, silicones etc.) mix with fluorescent material after, by point gum machine manually or automatically, the mixture of fluorescent material and glue is covered on luminescent wafer, but, because glue-spread is restive, and fluorescent material is easy to precipitation, crawling is even, the consistency that causes fluorescent material to distribute at luminescent wafer is bad, light intensity loss is large, in addition, luminescent wafer produces heat in luminous, the fluorescent material that is coated in luminescent wafer surface produces color displacement because temperature raises, therefore, the light can not be well sending with luminescent wafer is mixed into white light, cause white light LEDs bright dipping weak effect.
Utility model content
The purpose of this utility model is to provide a kind of white light LEDs, is intended to solve that existing white light LEDs light intensity loss is large, the problem of bright dipping weak effect.
For solving the problems of the technologies described above, the utility model provides a kind of technical scheme of white light LEDs to be, comprise transparency carrier and be fixedly arranged on multiple on described transparency carrier and there are six luminous blue wafers, described transparency carrier is provided with a circuit layer, described circuit layer has first anodal and the first negative pole, described blue wafer has second anodal and the second negative pole, described second anodal and the described first anodal electric connection, described the second negative pole and described the first negative pole are electrically connected, on described transparency carrier, be also provided with positive terminal and negative terminal, described positive terminal and the described first anodal electric connection, described negative terminal and described the first negative pole are electrically connected, also comprise the glass tube that is embedded with yellow fluorescent powder on tube wall, described glass tube has a cavity, described blue wafer, described transparency carrier is all installed in described cavity, the end of described glass tube is fused to the end of described transparency carrier.
Particularly, described in adjacent two, blue wafer tandem connects, and is positioned at described second positive pole at head and the tail two ends, described the second negative pole and is electrically connected with described the first positive pole, described the first negative pole respectively.
Or the second positive pole of each described blue wafer is connected together altogether and forms and the described first anodal positive terminal being electrically connected, described the second negative pole is connected together altogether and forms the negative pole end being electrically connected with described the first negative pole.
Further, also comprise multiplely showing the red wafer of index for promoting, each described red wafer is fixedly arranged on described transparency carrier and with described blue wafer-shaped become to be connected in series or be connected in parallel, each described red wafer respectively with described circuit layer electric connection.
Preferably, described transparency carrier is sapphire substrate or glass substrate.
Preferably, described circuit layer is nickel dam or silver layer.
Preferably, described positive terminal and described negative terminal are welded in respectively the two ends of described transparency carrier.
The utility model provides a kind of beneficial effect of white light LEDs to be: by sintering process, yellow fluorescent powder is embedded and in glass, is fired into glass tube, yellow fluorescent powder distributes more even, improve the consistency that fluorescent material distributes in glass tube, reduce light intensity loss, when blue wafer is luminous, with yellow fluorescent powder mixing bright dipping, form white light, in addition, fluorescent material is embedded in glass tube, the heat that blue wafer produces in luminescence process can not affect the service behaviour of fluorescent material, eliminate in prior art, be coated in and when fluorescent material on luminescent wafer is heated, produce color displacement, affect white light LEDs and go out light effect, therefore, the white light LEDs bright dipping that the utility model provides is more even, simultaneously, in white light LEDs, six luminous blue wafers are fixedly arranged on transparency carrier, effectively utilize six light-emitting areas of blue wafer, reach the light effect that of all-round optic angle degree, luminous flux and the light extraction efficiency of LED light source are promoted widely, light emission rate can reach 200lm/W, solve the problem that occurs brightness disproportionation on light irradiating object,
Brief description of the drawings
The schematic perspective view of the white light LEDs that Fig. 1 provides for the utility model embodiment mono-;
Fig. 2 is the left view of Fig. 1;
The white light LEDs internal structure schematic diagram that Fig. 3 provides for the utility model embodiment mono-;
The white light LEDs internal structure schematic diagram that Fig. 4 provides for the utility model embodiment bis-.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Below in conjunction with specific embodiment, the utility model is described in detail.
Embodiment mono-
As shown in Figures 1 and 2, the utility model embodiment provides a kind of white light LEDs 1, comprise transparency carrier 11 and there are six luminous blue wafers 12, blue wafer 12 is fixedly arranged on transparency carrier 11, transparency carrier 11 is provided with a circuit layer 13, circuit layer 13 has first anodal and the first negative pole, blue wafer 12 has second anodal and the second negative pole, second anodal and the first anodal electric connection, the second negative pole and the first anodal electric connection, be that each blue wafer 12 forms and is electrically connected with circuit layer 13 respectively, on transparency carrier 11, be also provided with positive terminal 14 and negative terminal 15, positive terminal 14 and the first anodal electric connection, negative terminal 15 and the first negative pole are electrically connected, be that positive terminal 14 and negative terminal 15 form and are electrically connected with circuit layer 13 respectively, white light LEDs 1 also comprises glass tube 16, glass tube 16 utilizes glass sintering technique that yellow fluorescent powder is embedded in glass and fires and form, fluorescent material and glass tube 16 are fired into one, fluorescent material is evenly distributed in the tube wall of glass tube 16, improve the consistency that fluorescent material distributes in glass tube 16, glass tube 16 is hollow tubular, glass tube 16 has a cavity 161, blue wafer 12, transparency carrier 11 is all installed in cavity 161, due to blue wafer 13 be six luminous, the gold-tinted that the blue light that blue wafer 13 sends sends with the yellow fluorescent powder on glass tube 16 mixes cavity 161 is interior, form white light, mix more even, simultaneously, fluorescent material is arranged on glass tube 16, no longer be coated on blue wafer 13, the heat of blue wafer 13 luminous generations, can not affect the service behaviour of fluorescent material, solve in prior art fluorescent material because excess Temperature produces color displacement, cause white light LEDs bright dipping weak effect, simultaneously, transparency carrier 11 effectively utilizes six exiting surfaces of blue wafer 13, improve traditional LED light source directive property strong, the problem that rising angle is little, promote luminous flux and the light extraction efficiency of LED light source, light extraction efficiency can reach 200lm/W, avoid LED light source to be radiated at the phenomenon that brightness disproportionation appears in body surface, more meet user's request, in addition, the end of glass tube 16 forms melting with the end of transparency carrier 11 and is connected, due to the both ends open of glass tube 16, transparency carrier 11, blue wafer 12 is installed in glass tube 16, need the opening of sealed glass tubes 16, by the two ends sintering of glass tube 16, link together with the end melting of glass substrate 11, without using packaging plastic, keep the inner sealing of glass tube 16, guarantee the white light forming after blue wafer 12 mixes with yellow fluorescent powder, can not leak from the end of glass tube 16, further improve light emission rate.
As shown in Figures 1 and 3, adjacent two blue wafers 12 are connected in series, the second positive pole of a blue wafer 12 is connected in series with the second corresponding negative pole of another blue wafer 12 by the first wire 17, all blue wafers 12 are connected in turn, form series circuit, the blue wafer 12 of being located at series circuit head end draw the second blue wafer 12 anodal and that be located at series circuit tail end draw the second negative pole respectively with the first positive pole of circuit layer 13, the first negative pole is electrically connected, work as positive terminal, negative terminal and external power source are connected, each blue wafer 12 is simultaneously luminous, white light LEDs bright dipping is soft, and the two ends of glass tube 16 are unshadowed.
As shown in Figure 1, in white light LEDs, also comprise multiple red wafers 18, red wafer 18 can be used for promoting the demonstration index of white light LEDs, red wafer 18 is fixedly arranged on transparency carrier 11, and form and be connected in series or be connected in parallel with blue wafer 12, each red wafer 18 is electrically connected with circuit layer 13 respectively, and the light that red wafer 18, blue wafer 12 and the yellow fluorescent powder of setting up sends bright dipping after mixing is softer, improves white light LEDs and on irradiating object, there will be the problem that high light is dazzling.
As shown in Figures 1 and 2, on transparency carrier 11, utilize and electroplate the circuit forming surface layer 13 of evaporation process at transparency carrier 11, particularly, circuit layer 13 can be silver layer or nickel dam, circuit layer 13 is as electric conductor, circuit layer 13 is communicated with external power source, make it normally luminous to blue wafer 12 power supplies, certainly, circuit layer 13 also can select other conducting metals to make, transparency carrier 11 is packaged in cavity 161, protective circuit layer 13 is avoided the impact of external environment condition, and ensure that the light that blue wafer 12 sends fully mixes with the light that the yellow fluorescent powder on glass tube 16 sends, avoid external interference, realize the uniform effect of bright dipping, blue wafer 12 by polymer adhesive on circuit layer 13, bonding should firmly and not skew, in enforcement bonding process, should guarantee that adhesive can not smear to other positions of transparency carrier 11, in order to avoid affect the normal work of LED, certainly, also can adopt and cover brilliant technique, guarantee, in white light LEDs use procedure, the problems such as blue wafer 12 can not come off.
As shown in Figure 1, adopt soldering tin technique that positive terminal 14 and negative terminal 15 are welded on the two ends of transparency carrier 11, and with circuit layer 13 conductings, positive terminal 14, negative terminal 15 are electrically connected by circuit layer 13 and the second positive pole, second negative pole of blue wafer 12, positive terminal 14 and negative terminal 15 are communicated with external power source, circuit layer 13 sends electric current to blue wafer 12, makes it normally luminous, ensures the normal bright dipping of white light LEDs.
As shown in Figure 1, transparency carrier 11 is glass substrate or sapphire substrate, transparency carrier 11 is as blue wafer 12, the supporting body of red wafer 18, transparency carrier 11 selects the material with high transmission rate to make, after the yellow light mix that the light that blue wafer 12 sends and fluorescent material send, form white light, high transmission rate is convenient to the outgoing of light, the material of selecting should be conducive to the bright dipping of blue wafer 12, blue wafer 12 and the surface etch line construction at transparency carrier 11 are installed, select glass or sapphire as transparency carrier 11, bright dipping better effects if, and can effectively utilize six exiting surfaces of blue wafer 12, reach the light effect that of all-round optic angle degree, promote widely luminous flux and the light extraction efficiency of LED light source, light emission rate can reach 200lm/W.
Embodiment bis-
As shown in Figure 4, embodiment bis-is basic identical with the concrete structure of embodiment mono-, and both differences are, the second positive pole of each blue wafer 12 formation positive terminal that is connected together altogether, positive terminal and the first anodal electric connection, the second negative pole of each blue wafer 12 formation negative pole end that is connected together altogether, negative pole end and the first negative pole are electrically connected, be each blue wafer 12 by the second wire 19 formation parallel circuits that is connected in parallel, when positive terminal 14, negative terminal 15 is connected with external power source, each blue wafer 12 is simultaneously luminous, even if on a rare occasion a blue wafer 12 breaks down, can not affect the normally luminous of white light LEDs yet, improve the functional reliability of white light LEDs.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims (7)

1. a white light LEDs, comprise transparency carrier and be fixedly arranged on multiple on described transparency carrier and there are six luminous blue wafers, described transparency carrier is provided with a circuit layer, described circuit layer has first anodal and the first negative pole, described blue wafer has second anodal and the second negative pole, described second anodal and the described first anodal electric connection, described the second negative pole and described the first negative pole are electrically connected, on described transparency carrier, be also provided with positive terminal and negative terminal, described positive terminal and the described first anodal electric connection, described negative terminal and described the first negative pole are electrically connected, it is characterized in that: also comprise the glass tube that is embedded with yellow fluorescent powder on tube wall, described glass tube has a cavity, described blue wafer, described transparency carrier is all installed in described cavity, the end of described glass tube is fused to the end of described transparency carrier.
2. a kind of white light LEDs as claimed in claim 1, is characterized in that: described in adjacent two, blue wafer tandem connects, and is positioned at described second positive pole at head and the tail two ends, described the second negative pole and is electrically connected with described the first positive pole, described the first negative pole respectively.
3. a kind of white light LEDs as claimed in claim 1, it is characterized in that: the second positive pole of each described blue wafer is connected together altogether and forms and the described first anodal positive terminal being electrically connected, and described the second negative pole is connected together altogether and forms the negative pole end being electrically connected with described the first negative pole.
4. a kind of white light LEDs as claimed in claim 1, it is characterized in that: also comprise multiple for promoting the red wafer that shows index, each described red wafer is fixedly arranged on described transparency carrier and with described blue wafer-shaped become to be connected in series or be connected in parallel, and each described red wafer is electrically connected with described circuit layer respectively.
5. a kind of white light LEDs as described in any one in claim 1 to 4, is characterized in that: described transparency carrier is sapphire substrate or glass substrate.
6. a kind of white light LEDs as claimed in claim 5, is characterized in that: described circuit layer is nickel dam or silver layer.
7. a kind of white light LEDs claimed in claim 1, is characterized in that: described positive terminal and described negative terminal are welded in respectively the two ends of described transparency carrier.
CN201420056783.0U 2014-01-29 2014-01-29 White light LED Expired - Fee Related CN203746900U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420056783.0U CN203746900U (en) 2014-01-29 2014-01-29 White light LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420056783.0U CN203746900U (en) 2014-01-29 2014-01-29 White light LED

Publications (1)

Publication Number Publication Date
CN203746900U true CN203746900U (en) 2014-07-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420056783.0U Expired - Fee Related CN203746900U (en) 2014-01-29 2014-01-29 White light LED

Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241501A (en) * 2014-09-22 2014-12-24 四川柏狮光电技术有限公司 All-direction plant growth lamp LED filament and manufacturing method thereof
CN106090650A (en) * 2016-07-29 2016-11-09 广州依恩施节能科技有限公司 A kind of LED fluorescent lamp and manufacture method thereof
CN110246952A (en) * 2019-05-08 2019-09-17 格瑞电子(厦门)有限公司 A kind of LED wafer color-changing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241501A (en) * 2014-09-22 2014-12-24 四川柏狮光电技术有限公司 All-direction plant growth lamp LED filament and manufacturing method thereof
CN106090650A (en) * 2016-07-29 2016-11-09 广州依恩施节能科技有限公司 A kind of LED fluorescent lamp and manufacture method thereof
CN110246952A (en) * 2019-05-08 2019-09-17 格瑞电子(厦门)有限公司 A kind of LED wafer color-changing device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140730

Termination date: 20170129

CF01 Termination of patent right due to non-payment of annual fee